Samsung HW-F550 Service manual

CrystalSurroundAir Track(ActiveSpeaker System)

ModelNameHW-F550

ModelCodeHW-F550/EN

SERVICE

CrystalSurroundAirTrack

(ActiveSpeakerSystem)

MANUAL

Contents

1.Precaution

2.ProductSpecication

3.Disassembly&Reassembly

4.Troubleshooting

5.PCBDiagram

6.SchematicDiagram

HW-F550

RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.

Contents

1.Precaution........................................................................................................................................1−1

1.1.SafetyPrecautions...................................................................................................................1−1

1.2.ServicingPrecautions...............................................................................................................1−3

1.3.PrecautionsforElectrostaticallySensitiveDevices(ESDs)..............................................................1−4

2.ProductSpecication.........................................................................................................................2−1

2.1.ProductFeature.......................................................................................................................2−1

2.2.Specications..........................................................................................................................2−2

2.3.SpecicationsAnalysis.............................................................................................................2−3

2.4.Accessories............................................................................................................................2−5

2.4.1.SuppliedAccessories...................................................................................................2−5

3.Disassembly&Reassembly................................................................................................................3−1

3.1.OverallDisassemblyandReassembly..........................................................................................3−1

4.Troubleshooting................................................................................................................................4−1

4.1.CheckpointsbyErrorMode.......................................................................................................4−1

4.1.1.NoPower...................................................................................................................4−1

4.1.2.NoSoundoutput(Digital).............................................................................................4−2

4.1.3.NoSoundoutput(Analog)............................................................................................4−6

4.2.MeasurestobetakenwhentheProtectionCircuitoperates...............................................................4−9

4.2.1.AMPPre-InspectionrelatingtoPowerProtection..............................................................4−9

4.3.Initialization&Update.............................................................................................................4−10

4.3.1.HowtochecktheFirmwareversion................................................................................4−10

4.3.2.Howtoinitialize..........................................................................................................4−10

4.3.3.USBUpdateprocedure.................................................................................................4−11

5.PCBDiagram...................................................................................................................................5−1

5.1.WiringDiagram.......................................................................................................................5−1

5.2.MAINPCBTop......................................................................................................................5−2

5.2.1.PinConnection...........................................................................................................5−3

5.2.2.TestPointWaveForm..................................................................................................5−4

5.3.MAINPCBBottom..................................................................................................................5−5

5.3.1.PinConnection...........................................................................................................5−6

5.3.2.TestPointWaveForm..................................................................................................5−7

5.4.HDMIPCBTop......................................................................................................................5−8

5.4.1.PinConnection...........................................................................................................5−9

5.4.2.TestPointWaveForm..................................................................................................5−10

5.5.HDMIPCBBottom..................................................................................................................5−11

5.5.1.PinConnection...........................................................................................................5−12

5.6.IRPCBTop............................................................................................................................5−13

5.6.1.PinConnection...........................................................................................................5−14

Contents

5.7.IRPCBBottom.......................................................................................................................5−15

6.SchematicDiagram...........................................................................................................................6−1

6.1.OverallBlockDiagram.............................................................................................................6−1

6.2.MAIN-1.................................................................................................................................6−2

6.3.MAIN-2.................................................................................................................................6−3

6.4.MAIN-3.................................................................................................................................6−4

6.4.1.TestPointWaveForm..................................................................................................6−5

6.5.MAIN-4.................................................................................................................................6−6

6.5.1.TestPointWaveForm..................................................................................................6−7

6.6.HDMI...................................................................................................................................6−8

6.6.1.TestPointWaveForm..................................................................................................6−9

6.7.IR.........................................................................................................................................6−10

1.Precaution

DEVICE UNDER

TES T

LEAKAGE

CUR RE NT

TES TER

TES T ALL

EXPO SED ME TAL

SU RFACES

2-WIRE COR D

ALSO TE S T WITH

PLUG REVER S ED

(US ING AC

ADAPTER P LUG

AS R EQ UIRED )

EARTH

GR OUND

(RE ADING SH OULD NOT BE ABOVE 0.5m A)

1.Precaution

FollowthesesafetyinstructionswhileservicingtheESDtopreventdamageandtoprotectagainstpotentialhazards suchaselectricalshockandX-rays.

1.1.SafetyPrecautions

1)Whenreinstallingthechassisanditsassemblies,besuretorestorealloftheprotectivedevices,includingthecontrol knobsandthecompartmentcovers.

2)Makesurethattherearenocabinetopeningsthroughwhichpeople(particularlychildren)canmakecontactwith dangerousinternalcomponents.

3)DesignAlterationW arning:Neveralteroraddtothemechanicalorelectricaldesignoftheunit. Example:Donotaddauxiliaryaudioorvideoconnectors.Suchalterationsmightcreateasafetyhazard.Also,any designchangesoradditionswillvoidthemanufacturer’swarranty.

4)LeakageCurrentHotCheckFigure1.1

ACLeakageTest:

WARNING

Donotuseanisolationtransformerduringthistest.Usealeakage-currenttesterorameteringsystemthatcomplies withAmericanNationalStandardsInstitute(ANSIC101.1,LeakageCurrentforAppliances),andUnderwriters Laboratories(ULPublicationUL1410,59.7).

Withtheunitcompletelyreassembled,plugtheACcorddirectlyintoa120VACoutlet.Withtheunit’spowerswitched fromtheONtotheOFFposition,measurethecurrentbetweenaknowngroundandallexposedmetalparts. KnownGrounds-Earth KnownMetalparts-Screwheads,MetalCabinets,etc.

Figure1.1ACLeakageTest

5)InsulationResistanceColdCheck:

Ante nna

Term inal

ohm

Expo s ed

Meta l Pa rt

Ohmmet er

(1)Withtheunit’sACplugdisconnectedfromtheACsource,connectanelectricaljumperacrossthetwoACprongs. (2)SetthepowerswitchtoON. (3)MeasuretheresistancebetweentheshortedACplugandanyexposedmetallicparts.

Example:Screwheads,MetalCabinets,AntennaPort,etc.Ifanyoftheexposedmetallicpartshasareturnpathto thechassis,themeasuredresistanceshouldbebetween1and5.2megohms.Ifthereisnoreturnpath,themeasured resistanceshouldbe“innite”.Iftheresistanceisoutsidetheselimits,ashockhazardmightexist. SeeFigure1.2

Figure1.2InsulationResistanceT est

InsulationResistanceTest

1.Precaution

6)Components,partsandwiringthatappeartohaveoverheatedorthatareotherwisedamagedshouldbereplacedwith partsthatmeettheoriginalspecications.Alwaysdeterminethecauseofdamageoroverheating,andcorrectany potentialhazards.

7)Observetheoriginalleaddress,especiallynearthefollowingareas: Antennawiring,sharpedges,andespeciallytheACandhighvoltagepowersupplies.Alwaysinspectforpinched, out-of-place,orfrayedwiring.Donotchangethespacingbetweencomponentsandtheprintedcircuitboard.Checkthe ACpowercordfordamage.Makesurethatnowiresorcomponentstouchthermallyhotparts.

8)ProductSafetyNotice: Someelectricalandmechanicalpartshavespecialsafety-relatedcharacteristicswhichmightnotbeobviousfromvisual inspection.Thesesafetyfeaturesandtheprotectiontheygivemightbelostifthereplacementcomponentdiffersfrom theoriginal–evenifthereplacementisratedforhighervoltage,wattage,etc.

9)Componentsthatarecriticalforsafetyareindicatedinthecircuitdiagrambyshading,

or. Usereplacementcomponentsthathavethesameratings,especiallyforameresistanceanddielectricstrength specications.Areplacementpartthatdoesnothavethesamesafetycharacteristicsastheoriginalmightcreate shock,reorotherhazards.

1.Precaution

1.2.ServicingPrecautions

1)Servicingprecautionsareprintedonthecabinet.Followthem.

2)Alwaysunplugtheunit’sACpowercordfromtheACpowersourcebeforeattemptingto: (a)Removeorreinstallanycomponentorassembly ,(b)Disconnectanelectricalplugorconnector,(c)Connecta testcomponentinparallelwithanelectrolyticcapacitor.

3)Somecomponentsareraisedabovetheprintedcircuitboardforsafety.Aninsulationtubeortapeissometimesused. Theinternalwiringmaybeclampedtopreventcontactwiththermallyhotcomponents.Reinstallallsuchelements totheiroriginalposition.

4)Afterservicing,alwayscheckthatthescrews,componentsandwiringhavebeencorrectlyreinstalled.Makesurethat theportionaroundtheservicedparthasnotbeendamaged.

5)ChecktheinsulationbetweenthebladesoftheACplugandaccessibleconductiveparts(examples:metalpanels, inputterminalsandearphonejacks).

6)InsulationCheckingProcedure: DisconnectthepowercordfromtheACsource.Connectaninsulationresistancemeter(500V)tothebladesofthe ACplug.TheinsulationresistancebetweeneachbladeoftheACplugandaccessibleconductiveparts(seeabove) shouldbegreaterthan1megohm.

7)NeverdefeatanyoftheB+voltageinterlocks.DonotapplyACpowertotheunit(oranyofitsassemblies)unlessall solid-stateheatsinksarecorrectlyinstalled.

8)Alwaysconnectatestinstrument’sgroundleadtotheinstrumentchassisgroundbeforeconnectingthepositivelead; alwaysremovetheinstrument’sgroundleadlast.

CAUTION

Firstreadthe“SafetyPrecautions”sectionofthismanual.Ifsomeunforeseencircumstancecreatesaconictbetweenthe servicingandsafetyprecautions,alwaysfollowthesafetyprecautions.

1.Precaution

1.3.PrecautionsforElectrostaticallySensitiveDevices(ESDs)

Somesemiconductor(“solidstate”)devicesareeasilydamagedbystaticelectricity. SuchcomponentsarecalledElectrostaticallySensitiveDevices(ESDs). Examplesincludeintegratedcircuitsandsomeeld-effecttransistors. Thefollowingtechniqueswillreducetheoccurrenceofcomponentdamagecausedbystaticelectricity:

1)Immediatelybeforehandlinganysemiconductorcomponentsorassemblies,draintheelectrostaticchargefromyour bodybytouchingaknownearthground.Alternatively,wearadischargingwrist-strapdevice.(Besuretoremoveit priortoapplyingpower–thisisanelectricshockprecaution.)

2)AfterremovinganESD-equippedassembly,placeitonaconductivesurfacesuchasaluminumfoiltoprevent accumulationofelectrostaticcharge.

3)Donotusefreon-propelledchemicals.ThesecangenerateelectricalchargesthatdamageESDs.

4)Useonlyagrounded-tipsolderingironwhensolderingorunsolderingESDs.

5)Useonlyananti-staticsolderremovaldevice.Manysolderremovaldevicesarenotratedas“anti-static”(thesecan accumulatesufcientelectricalchargetodamageESDs).

6)DonotremoveareplacementESDfromitsprotectivepackageuntilyouarereadytoinstallit. MostreplacementESDsarepackagedwithleadsthatareelectricallyshortedtogetherbyconductivefoam,aluminum foilorotherconductivematerials.

7)ImmediatelybeforeremovingtheprotectivematerialfromtheleadsofareplacementESD,touchtheprotectivematerial tothechassisorcircuitassemblyintowhichthedevicewillbeinstalled.

8)MinimizebodymotionswhenhandlingunpackagedreplacementESDs.Motionssuchasbrushingclothestogether,or liftingafootfromacarpetedoorcangenerateenoughstaticelectricitytodamageanESD.

2.ProductSpecication

2.1.ProductFeature

■HW-F550

•310W(80Wx2+150W)

•2.1CH,WirelessSubwoofer(Aactive)

-DolbyDigital,DTS2.0

-1Analog/1Optical

-HDMIOUT1/HDMIIN1

-SmartV olumeII

-VirtualSurround(Music/News/Movie/Drama/Game/Sports/Off)

-3DSOUNDPlus

-BLUETOOTH

-USBHOST

-AirTrackOn

-SoundShare

2.ProductSpecication

2.2.Specications

■BasicSpecication

PowersupplyDC24V

Standbypowerconsumption0.45W

Power consumption

USB5V/0.5A

General

Weight

Dimensions (WxHxD)

Operatingtemperaturerange+41°Fto+95°F

Operatinghumidityrange10%to75%

Ratedoutput power

Amplier

S/Nratio(analoginput)65dB

Separation(1kHz)65dB

NOTE

•S/Nratio,distortion,separationandusablesensitivityarebasedonmeasurementusingAES(AudioEngineeringSociety) guidelines.

•SamsungElectronicsCo.,Ltdreservestherighttochangethespecicationswithoutnotice.

•Weightanddimensionsareapproximate.

Mainunit30W

Subwoofer20W

Mainunit4.85Ibs

Subwoofer16.31Ibs

Mainunit37.13x2.17x2.36inches

Subwoofer11.42x14.57x11.42inches

Mainunit80W/CH,3OHM,THD=10%,1kHz

Subwoofer150W,3OHM,THD=10%,100Hz

2.ProductSpecication

2.3.SpecicationsAnalysis

ModelNameHW-F550HW-E550

Photo

Compatible

Output

Power

Media

Extra

Features

DVD

(Video)

DSP

RMS(10%THD), REF:1ch

OutputPower(ch)80Wx2+150W80Wx2+150W

DiscplaybackN/AN/A

iPodDock (selectedregiononly)

WirelessReady--

AirTrackOnOX

SoundShareOX

USBHOSTOO

BluetoothOO

ProgressiveScan (NT/PAL)

VirtualSurroundOO

3DSOUND3DSoundPlus3DSound

ASC--

SmartV olumeSmartVolumeIISmartVolumeII

310W310W

AudioUpscale--

PowerBass--

DolbyDigital/PlusDolbyDigital2.0DolbyDigital2.0

DolbyT rueHDN/AN/A Audio

Decoding

In/Out

Optical

Jack

HeadphoneHeadphoneJack(3.5Φ)--

DTS/DTS-HD (HR/MA)

Componentout--

HDMIOut(CEC)OO Video

HDMIInputOO

MiniJackAudioInAUX1(3.5φ)AUX1(3.5φ) Audio

RCAInput--

In(DigitalIn)O(1)O(1)

DTSDTS

ModelNameHW-F550HW-E550

Photo

2.ProductSpecication

O:FeatureIncluded

X:NotIncluded

Tuner

FM--

PresetMemory--

InternalType

Speaker

Type(Sat/T allboy)

(MainFrameBuilt-InType)

2way3spk

InternalType

(MainFrameBuilt-InType)

2way3spk

Active(Powered)S/WWirelessActiveWirelessActive

TIP

2.ProductSpecication

POWER

TV POWER

AH59-02546B

REPEAT

TV VOL TV CH

AUDIO SYNC

SOURCE

AUTO POWER

SPEAKER

TV SOURCE

TV PRE-CH

TV EXIT

SMART VOLUMESOUND EFFECT

S/W

LEVEL

S/W LEVEL

VOL

3D SOUND

PLUS

DRC

TV INFOTV MUTE

SoundShare

MUTE

(S cre w:2 EA)

olde r-s cre w:2EA)

2.4.Accessories

2.4.1.SuppliedAccessories

AccessoriesItemItemcodeRemark

RemoteControlAH59-02546B

Batteries(AAAsize)4301-000116

UserManualAH68-02647X

Bracket-WallMountAH61-03627A

Screw

USBConverterAH59-02572A

PowerCord3903-000525

AdapterBN44-00639A

AUXCableBN39-01286A

AH61-03342A

6001-001961

LocalSamsungDealer

USBcableAH39-01178A

Toroidalferritecore3301-000144

3.Disassembly&Reassembly

3.1.OverallDisassemblyandReassembly

CAUTION

•Becarefultofollowthedisassemblysequencedescribedinthemanual.Otherwise,theproductmaybedamaged.

•BesuretocarefullyreadandunderstandthesafetyinstructionsbeforeperforminganyworkastheICchipson thePCBarevulnerabletostaticelectricity.

•Inordertoassemblereversetheorderofdisassembly .

DescriptionDescriptionPhoto

1.Loosen7screwsattheRearCover. :M,3X10,B

CAUTION

Becarefulnottomakeanyscratchesasyouremovethem.

2.Loosen9screwsattheRearCover. :M,3X10,B

3.Open2JackCoversattheRearCover.

4.PulltheRearCoverSlowly.

5.Loosen5screwsattheRearCover. :M,3X10,B,M,3X5,S

UnplugAllConnectorsontheMainPCB.

6.PulltheLeftSpeaker.

RemovetheHDMIPCB

7.RemovetheMainASSY.

8.Loosen3screwsattheIRPCBandOLEDDisplay. :M,3X10,B

3.Disassembly&Reassembly

DescriptionDescriptionPhoto

9.RemovetheIRPCBandOLEDDisplay.

10.PulltheRightSpeaker.

11.Finish.

4.Troubleshooting

Check if 23.5V is

me asu red on th e Main P CB

PCN1 pin 1.

Yes

Check if 23.5V is

mea sur ed at the Adap ter

pin 1 .

Main PC B P CN1 cha nge .

No No No

Yes

The powe r doe s n ot tu rn on .

Change the Main PC B.

Yes

Check if “H(3.4v )” is

me asu red a t the pin 6 2 of the

UIC2 whe n Subwoo fer Main P CB

power is turn ed o n.

Re place the AC C ord .

Re place the Micom (UIC2).

Check Ada pte r an d re pla ce

Ada pte r.

Check the AC Cord o utpu t.

Yes

4.1.CheckpointsbyErrorMode

V oltage/DIV1V/div

TIME/DIV500ms/div

4.1.1.NoPower

4.Troubleshooting

OscilloscopeSettingV alues

4.Troubleshooting

(1)

Che ck if signa l is

me a s u re d a t pin No.

69 , 70 , 71, 74 of IC30 02 on

the MAIN PCB.

Check if 3.3 V po we r is

measured at pin 95 of IC3 002

on the Main PCB.

Ye s

Cha nge the MAIN P C B.

No output

Ye s

Che ck S P DIF O utpu t.

Che ck DS P INPUT/O UP UT

Cha nge s pe a ke r co nne ctor.

Che ck if 3.3V powe r is

me a s u re d a t pin 1 of OP T1

on th e

MAIN P C B.

(2)

Che ck if signa l is

me a s u re d a t pin No.

32, 35 of IC400 2 on the

MAIN P C B.

Che ck the MAIN P C B ACN1, ACN2 s pe a ke r

output signal

* Re fer to wa ve pa tte rn

image of Fig. 4-2.

(3)

Cha nge S pe a ke r.

Ye s

Spea ke r outp ut che ck.

* Re fer to wa ve pa tte rn

image of Fig. 4-1.

* Re fer to wa ve pa tte rn

image of Fig. 4-3.

Ye s

Cha nge the MAIN P C B.

Ye s

4.1.2.NoSoundoutput(Digital)

+ 35 hidden pages