Samsung HT-Q9 User Manual

DVD RECEIVER AMP

BASIC MODEL : HT-Q9

SERVICE

Manual

DVD RECEIVER AMP SYSTEM Features

* Multi-Disc Playback & FM Tuner
* Dolby Pro Logic II
* DTS (Digital Theater Systems)
* TV Screen Saver Function
* Power Saving Function
* Customized TV Screen Display

- Confidential -

MODEL : HT-Q9

© Samsung Electronics Co.,Ltd. AUG.2006

Printed in Korea
Code no.AH68-01893Q

ELECTRONICS

Ch1 Precautions

1-1. Safety Precautions 1-1
1-2. Servicing Precautions 1-2
1-3. Precautions for Electrostatically

Sensitive Device (ESDs) 1-3

1-4. Special Precations and Waring

Lables for Laser Products 1-4

1-5. Special Precautions for HDD 1-5

INDEX

Ch2 Product Descriptions

1. Product Feature 2-1

2. Specifications 2-2

3. Accessories 2-3

Ch3 Product Functions

1. Connecting the Speakers 3-1

2. Basic Functions 3-3

3. New Functions 3-10

Ch4 Adjustments

No Reference

Ch5 How to disassemble

How to disassemble 5-1

Ch6 Troubleshooting

1.Main (Power) 6-1

2.Output Failure (for 2Ch Analog Input) 6-2

Ch7

Exploded View & Parts List

1.Total Exploded View 7-1

2. Parts List 7-2

Ch8 Electrical Parts List

Electrical Parts List 8-1

Ch9 Block Diagram

1. MAIN BLOCK DIAGRAM 9-1

Ch10 Wiring Diagram

No Reference

Ch11 PCB Diagram

1. PCB Layout 11-1

Ch12 Schematic Diagram

1. MAIN-1 12-1

2. MAIN-2 12-2

3. AMP 12-3

4. FUNCTION 12-4

5.RF 12-5

6. SMSP 12-6

Ch13 Circuit Description

1.

Description

13-1

2. Function Description 13-3

Ch14 HTS Reference

1. HTS (Home Thater Sytsem) 14-1

2. About “Sound” 14-2

3. 5.1 Channel Sound 14-3

4. HTS Sonud Format 14-4

5. HTS Devices 14-5

1. Precautions

Follow these safety, servicing and ESD precautions to prevent damage and protect against potential hazards
such as electrical shock and X-rays.

Samsung Electronics 1-1

1-1 Safety Precautions

1. Be sure that all of the built-in protective
devices are replaced.

2. When reinstalling the chassis and its
assemblies, be sure to restore all protective
devices, including control knobs and
compartment covers.

3. Make sure that there are no cabinet
openings through which people-­particularly children--might insert fingers
and contact dangerous voltages. Such
openings include the spacing between the
picture tube and the cabinet mask,
excessively wide cabinet ventilation slots,
and improperly fitted back covers.

4. Design Alteration Warning:
Never alter or add to the mechanical or
electrical design of the unit. Example: Do
not add auxiliary audio or video connec­tors. Such alterations might create a safety
hazard. Also, any design changes or addi­tions will void the manufacturer's warran­ty.

5. Leakage Current Hot Check (Figure 1-1):
Warning: Do not use an isolation
transformer during this test. Use a leakage­current tester or a metering system that
complies with American National Standards
Institute (ANSI C101.1, Leakage Current for
Appliances), and Underwriters Laboratories
(UL Publication UL1410, 59.7).

With the unit completely reassembled, plug
the AC line cord directly into a 120V AC
outlet. With the unit's AC switch first in
the ON position and then OFF, measure the
current between a known earth ground
(metal water pipe, etc.) and all exposed
metal parts. Examples: Handle brackets,
metal cabinets, screwheads and control
shafts. The current measured should not
exceed 0.5 milliamp. Reverse the power­plug prongs in the AC outlet and repeat.

6. Insulation Resistance Cold Check:
(1) With the unit's AC plug disconnected
from the AC source, connect an electrical
jumper across the two AC prongs. (2) Set
the power switch to ON. (3) Measure the
resistance between the shorted AC plug and
any exposed metallic parts. Example:
Screwheads, antenna, control shafts or
handle brackets.

If any of the exposed metallic parts has a
return path to the chassis, the measured
resistance should be between 1 and 5.2
megohms. If there is no return path, the
measured resistance should be "infinite." If
the resistance is outside these limits, a shock
hazard might exist. See Figure 1-2

Fig. 1-1 AC Leakage Test

Fig. 1-2 Insulation Resistance Test

Samsung Electronics1-2

1-1 Safety Precautions (Continued)

7. Components, parts and wiring that appear
to have overheated or that are otherwise

damaged should be replaced with parts
that meet the original specifications.
Always determine the cause of damage or
overheating, and correct any potential
hazards

8. Observe the original lead dress, especially

near the following areas: Antenna
wiring, sharp edges, and especially the
AC and high voltage power supplies.
Always inspect for pinched, out-of-place,
or frayed wiring. Do not change the
spacing between components and the
printed circuit board. Check the AC
power cord for damage. Make sure that
no wires or components touch thermally
hot parts.

9. Product Safety Notice:
Some electrical and mechanical parts

have special safety-related characteristics
which might not be obvious from visual
inspection. These safety features and the
protection they give might be lost if the
replacement component differs from the
original--even if the replacement is rated
for higher voltage, wattage, etc.

10 Components that are critical for safety are

indicated in the circuit diagram by

shading, or . Use replacement

components that have the same ratings,

especially for flame resistance and

dielectric strength specifications. A

replacement part that does not have the

same safety characteristics as the original

might create shock, fire or other hazards.

1-2 Servicing Precautions

1. Servicing precautions are printed on the
cabinet. Follow them.

2. Always unplug the unit's AC power cord
from the AC power source before
attempting to: (a) Remove or reinstall any
component or assembly, (b) Disconnect an
electrical plug or connector, (c) Connect a
test component in parallel with an
electrolytic capacitor.

3. Some components are raised above the
printed circuit board for safety. An
insulation tube or tape is sometimes used.
The internal wiring may be clamped to
prevent contact with thermally hot
components. Reinstall all such elements to
their original position.

4. After servicing, always check that the
screws, components and wiring have been
correctly reinstalled. Make sure that the
portion around the serviced part has not
been damaged.

5. Check the insulation between the blades of
the AC plug and accessible conductive parts
(examples: metal panels, input terminals
and earphone jacks).

6. Insulation Checking Procedure: Disconnect
the power cord from the AC source and
turn the power switch ON. Connect an
insulation resistance meter (500V) to the
blades of the AC plug.

The insulation resistance between each
blade of the AC plug and accessible
conductive parts (see above) should be
greater than 1 megohm.

7. Never defeat any of the B+ voltage
interlocks. Do not apply AC power to the
unit (or any of its assemblies) unless all
solid-state heat sinks are correctly installed.

8. Always connect a test instrument's ground
lead to the instrument chassis ground
before connecting the positive lead; always
remove the instrument's ground lead last.

Precautions

Warning1: First read the "Safety Precautions" section of this manual. If some unforeseen circumstance creates a conflict

between the servicing and safety precautions, always follow the safety precautions.

Samsung Electronics 1-3

1-3 Precautions for Electrostatically Sensitive Devices (ESDs)

1-4 Special Precautions and Warning Labels for Laser Products

1. Some semiconductor ("solid state") devices
are easily damaged by static electricity.
Such components are called Electrostatically
Sensitive Devices (ESDs). Examples include
integrated circuits and some field-effect
transistors. The following techniques will
reduce the occurrence of component
damage caused by static electricity.

2. Immediately before handling any
semiconductor components or assemblies,
drain the electrostatic charge from your
body by touching a known earth ground.
Alternatively, wear a discharging
wrist-strap device. (Be sure to remove it
prior to applying power--this is an electric
shock precaution.)

3. After removing an ESD-equipped assembly,
place it on a conductive surface such as
aluminum foil to prevent accumulation of
electrostatic charge.

4. Do not use freon-propelled chemicals.
These can generate electrical charges that
damage ESDs.

5. Use only a grounded-tip soldering iron
when soldering or unsoldering ESDs.

6. Use only an anti-static solder removal
device. Many solder removal devices are
not rated as "anti-static" (these can
accumulate sufficient electrical charge to
damage ESDs).

7. Do not remove a replacement ESD from its
protective package until you are ready to
install it. Most replacement ESDs are
packaged with leads that are electrically
shorted together by conductive foam,
aluminum foil or other conductive
materials.

8. Immediately before removing the protective
material from the leads of a replacement
ESD, touch the protective material to the
chassis or circuit assembly into which the
device will be installed.

9. Minimize body motions when handing
unpackaged replacement ESDs. Motions
such as brushing clothes together, or lifting
a foot from a carpeted floor can generate
enough static electricity to damage an ESD.

Precautions

UL : Manufactured for U.S.A. Market.
CSA : Manufactured for Canadian Market.
EU : Manufactured for European Market.
SCAN : Manufactured for Scandinavian

Market.

This Product Complies with
DHHS Rules 21CFR, Sub
chapter J.At date of Manu­facture

(UL)

(UL,CSA,SCAN)

(EU)

CERTIFIED ONLY TO CANADIAN
ELECTRICAL CODE.

CERTIFIE EN VERTU DU CODE
CANADIAN DE LELETRICITE
SEULEMENT

(CSA)

CLASS 1
LASER PRODUCT

(UL,CSA,EU)

Fig. 1-3 Warning Labels (Location: Enclosure Block)

Fig. 1-4 Warning Labels (Location: Disc Clamper, Inner Side of Unit Door or Nearby Unit Chassis )

CAUTION :

INVISIBLE LASER RADIATION WHEN OPEN

AND INTERLOCKS DEFEATEO AVOIDEXPOSURE TO BEAM

ADVARSEL:USYNLIG LASERSTRÅLING VED ABNING

NÅR SIKKERHEDSAFBRYDERE ER UDE AF FUNKTION

UNDGA UDSAETTELSE FOR STRALING

VARO:AVATTAESSA JA SUOJALUKITUS OHITETTAESSA

OLET ALTTINA NAKYMATTÖMALLE LASERSATEILYLLE ALA
KATSO SATEESEEN!

VARNING:

OSYNLIG LASERSTRÅLNING NAR DENNA DEL
AR OPPNAD OCH SPARREN AR URKOPPLAD BETRAKTA
EJSTRÅLEN!

Samsung Electronics1-4

1-4 Special Precautions and Warning Labels for Laser Products (Continued)

1-4-1 Warnings

1. When servicing, do not approach the LASER
exit with the eye too closely. In case it is
necessary to confirm LASER beam emission,
be sure to observe from a distance of more
than 30 cm from the surface of the objective
lens on the optical pick-up block.

2. Do not attempt to handle the objective lens
when the DISC is not on the tray.

1-4-2 Laser Diode Specifications

Material: GaAs+ GaAlAs
Wavelength: 760-800 nm
Emission Duration: Continuous

Laser Output: 0.2 mw (measured at a

1.6 mm distance from the objective lens
surface on the optical pick-up block.)

1-4-3 Handling the Optical Pick-up

1. Static electricity from clothing or the body
may cause electrostatic breakdown of the
laser diode in the Optical Pickup. Follow
this procedure:

2. Place a conductive sheet on the work bench
(i.e., the black sheet used for wrapping

repair parts.) Note: The surface of the work

bench should be covered by a copper

ground plane, which is grounded.

3. The repair technician must wear a wrist
strap which is grounded to the copper sheet.

4. To remove the Optical Pickup block:
Place the set on the conductive sheet, and
momentarily touch the conductive sheet

with both hands. (While working, do not

allow any electrostatic sources--such as
clothes--to touch the unit.)

5. Ground the "Short Terminal" (located on the
PCB, inside the Pickup Assembly) before
replacing the Pickup. This terminal should
be shorted whenever the Pickup Assembly

is lifted or moved.

6. After replacing the Pickup, reopen the Short
Terminal. See diagrams below:

Precautions

1-5 Special Precautions for HDD

* HDD Data Maintenance Step

1. Since the data on the HDD is weak to mechanical shock, place the HDD in a safe
location that is free from mechanical shock once it is removed from the main unit.

2. In order to safe keep the data on the HDD, back up the data before the repair or
make sure not to place the HDD near any electrical appliance that generates a strong
magnetic field.

2. Product Descriptions

1. Product Feature

Product Feature

Multi-Disc Playback &
FM Tuner

Dolby Pro Logic II

DTS
(Digital Theater Systems)

TV Screen Saver
Function

Power Saving Function
Customized TV Screen

Display

■

The HT-Q9 combines the convenience of multi-disc playback capability,
including DVD-VIDEO, VCD, CD, MP3-CD, WMA-CD, DivX, CD-R/RW,
and DVD-R/RW, with a sophisticated FM tuner, all in a single player.

■

Dolby Pro Logic II is a new for m of multi-channel audio signal
decoding technology that improves upon existing Dolby Pro Logic.

■

DTS is an audio compression format developed by Digital Theater
Systems Inc. It delivers full-frequency 5.1 channel sound.

■

The HT-Q9 automatically br ightens and darkens your TV screen after 3
minutes in the stop mode.The HT-Q9 automatically switches itself into
the power saving mode after 20 minutes in the screen saver mode.

■

The HT-Q9 automatically shuts itself off after 20 minutes in stop mode.

■

The HT-Q9 allows you to select your favorite image dur ing JPEG,
DVD or VCD playback and set it as your background wallpaper.

2-1 Samsung Electronics

2. Specifications

Samsung Electronics 2-2

Speaker system
Impedance

Frequency range
Output sound pressure level
Rated input
Maximum input

Dimensions (W x H x D)

Weights

S
P
E
A
K
E
R

Subwoofer speaker

8Ω
35Hz~140Hz
85dB/W/M
30W
60W

130 x 320 x 314 mm

3.3 kg

Front/Rear
Center

92 x 102x 96.5 mm

0.5 Kg/0.5 Kg

0.5 Kg

Front/Rear
Center

Front/Center/Rear speaker

4Ω
140Hz~20KHz
85dB/W/M
30W
60W

5.1ch speaker system

Power Consumption
Weight
Dimensions (W x H x D)
Operating Temperature Range
Operating Humidity Range
Usable Sensitivity
S/N Ratio
Distortion
Composite Video

Component Video

Front speaker output
Center speaker output
Rear speaker output
Subwoofer speaker output
Frequency range
S/N Ratio
Channel separation
Input sensitivity

G
E
N
E
R
A

L

T
U
N
E
R

F

M

O
U

T
P

U

T

V

I
D
E

O

A

M

P
L

I

F

I

E

R

20W

2.6Kg
430 x 65.5 x 256.5 mm
+5°C~+35°C

10% ~ 75%
10dB
60dB

0.5%

1.0Vp-p(75Ω load)
Y:1.0Vp-p(75Ω load)
Pr:0.70Vp-p(75Ω load)
Pb:0.70Vp-p(75Ω load)
30W x 2(4Ω)
30W(4Ω)
30W x 2(4Ω)
30W(8Ω)
20Hz~20KHz
75dB
60dB
(AUX)500mV

Accessories Name Code No.

3. Accessories

2-3 Samsung Electronics

AH59-01657A

Remote control

AH39-40001Y

Audio Cable

AH42-00021A

FM antenna

6. Troubleshooting

1. Main (Power)

6-1Samsung Electronics

2. Output Failure (for 2Ch Analog Input)

Samsung Electronics6-2

7-1 Samsung Electronics

7.Exploded View & Par ts List

1.Total Exploded View

AK250

AD502

AR011

AR011

AK170

AC025

AD510

AC080

AB030

AC010

AL180

AK290

AS260

AK420

AD370

Samsung Electronics 7-2

2. Parts List

AK250
AD502
AR011
AB030
AC010
AL180
AK290
AS260
AK420
AD370
AK170
AC025
AD510

-

-

-

-

AC080

A
B
C
D

KNOB-MIC

DOOR-DVD
RUBBER-FOOT
BADGE-BRAND

CABINET-FRONT
LENS-STAND BY

KNOB-POWER

SPRING-DOOR

KNOB-VOL

DECO-VOL

KNOB-FUNCTION

CABINET-BOTTOM

DOOR-TRAY

HOLDER-MECHA

HOLDER-VFD

HOLDER-IC

H-SINK AMP

CABINET-TOP

TAPTITE SCREW
TAPTITE SCREW
TAPTITE SCREW
TAPTITE SCREW

SNA

SNA
SNA
SNA

SNA
SNA
SNA

LOC. PART NAME

AH64-03687B
AH64-04017A
AH73-00005A
AH64-03746A
AH64-04014A
AH67-00438A
AH64-04016A
AH61-02122B
AH64-04030A
AH64-03789A
AH64-04015A
AH64-04012A
AH64-02320B
AH61-02182A
AH61-02181A
AH61-02183A
AH62-00146B
AH64-04013A

6003-001499
6003-001561
6003-000280
6003-000275

PART CODE

REMARK

2
1
2
1
1
1
1
1
1
2
1
1
1
1
1
1
1
1

3
2
4
3

Q'TY

ABS
ABS

RUBBER

AL

HIPS

PMMA

ABS

SUS304

ABS

PC

ABS

SECC 0.6T

ABS
ABS
ABS

ABS+GF30%

AL

SECC 0.5T

BWH 3*10 SILVER

BH 3 *6 YEL

BH 3*25 YEL

BH 3*10 BLACK

MATERAIL SPEC

8. Electrical Parts List

Location no. Code no. Description & Specification Remarks

*** HT-Q9 Parts List ***

AC2 2401-000651 C-AL;2.2uF,20%,50V,GP,TP,4x7,5
AC23 2203-002398 C-CER,CHIP;22nF,10%,50V,X7R,1608
AC7 2203-000626 C-CER,CHIP;0.022nF,5%,50V,C0G,1608
ACR24 2007-000081 R-CHIP;2.7Kohm,5%,1/10W,TP,1608
AD510 AH64-02320A DOOR-TRAY;HT-DB300,ABS,-,-,-,-,NTR,-

ADIC3 1002-001392 IC-A/D CONVERTER;WM8775EDS,24BIT,SSOP,28
AIC2 1201-002342 IC-AUDIO AMP;S1S4001,SSOPH,56P,18.4x7.5m
AIC3 1204-002548 IC-MODULATOR;S5M0061,TQFP,64P,10x10mm,PL
AIC4 0801-002455 IC-CMOS LOGIC;74LV74,DUAL D F/F,TSSOP,14
AIC5 0801-001055 IC-CMOS LOGIC;74VHC08,AND GATE,SOP,14,15

AR1 2007-000130 R-CHIP;39Kohm,5%,1/10W,TP,1608
AR11 2007-000309 R-CHIP;10ohm,5%,1/10W,TP,1608
AR15 2007-000072 R-CHIP;47ohm,5%,1/10W,TP,1608
AR3 2007-000086 R-CHIP;5.6Kohm,5%,1/10W,TP,1608
AR33 2007-000102 R-CHIP;100Kohm,5%,1/10W,TP,1608

AR34 2007-000121 R-CHIP;820ohm,5%,1/10W,TP,1608
AR8 2007-000091 R-CHIP;12Kohm,5%,1/10W,TP,1608
C1P 2203-000257 C-CER,CHIP;10nF,10%,50V,X7R,1608
C1S 2305-000412 C-FILM,LEAD-PEF;470nF,5%,63V,TP,-,5mm
C2P 2401-000847 C-AL;220uF,20%,35V,GP,TP,10x12mm,5m

C2RR 2203-000783 C-CER,CHIP;0.33nF,5%,50V,C0G,1608
C37 2401-001508 C-AL;47uF,20%,16V,GP,TP,6.3x5,5
C3A 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5
C3S 2203-000260 C-CER,CHIP;10nF,10%,50V,X7R,2012
C4P 2203-001537 C-CER,CHIP;1nF,10%,50V,X7R,TP,2012

CD000 AH61-01741A BASE-MAIN;K100,ABS,-,-,-,-,­CD300 AH66-00217A GEAR-TRAY;CMS-SD100,POM,-,-,-,BLACK,-,-,
CD340 AH66-00262A LEVER-LIFT;-,ABS,-,-,-,-,BLK,­CD380 AH66-00215A PULLEY MOTOR;CMS-SD100,POM,-,WHITE,-,-,­CD520 3409-001138 SWITCH-DETECTOR;5V DC,1A,DPST,30GF,-

CK1 2402-000008 C-AL,SMD;47uF,20%,16V,GP,TP,6.6x6.6x5.4
CK11 2203-000716 C-CER,CHIP;3.3nF,10%,50V,X7R,2012
CK14 2401-001952 C-AL;4.7uF,20%,50V,GP,TP,5x7mm,5mm
CK16 2401-000480 C-AL;10uF,20%,50V,GP,TP,5x11,5
CK19 2401-000918 C-AL;22uF,20%,16V,GP,-,6.3x7,5

CK21 2401-001887 C-AL;0.1uF,20%,50V,-,TP,4x7mm,5
CK23 2402-000130 C-AL,SMD;2.2uF,20%,50V,GP,TP,4.3x4.3x5.
CK26 2203-000595 C-CER,CHIP;0.22nF,5%,50V,C0G,2012
CK7 2203-005550 C-CER,CHIP;82nF,10%,50V,X7R,TP,2012,­CK9 2203-001058 C-CER,CHIP;0.56NF,5%,50V,C0G,TP,2012

CN1 3711-000483 HEADER-BOARD TO CABLE;BOX,5P,1R,2mm,STRA
CNP1 3711-000471 HEADER-BOARD TO CABLE;3WALL,4P,1R,2mm,ST
CNP1- AH39-00754A LEAD CONNECTOR;HT-P50,4P,2mm,70mm,1007#2
CP11 2401-001102 C-AL;330uF,20%,16V,GP,TP,8x11.5mm,5
CP18 2402-001198 C-AL,SMD;330UF,20%,6.3V,GP,TP,6.6X6.6X7

CP20 2401-001364 C-AL;470uF,20%,16V,GP,TP,10x12.5,5
DC18 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608
DC30 2203-000189 C-CER,CHIP;100nF,+80-20%,25V,Y5V,1608
DD1 0407-000116 DIODE-ARRAY;DAP202K,80V,100mA,CK2-3,SOT­DD2 0403-001062 DIODE-ZENER;UDZ4.7B,4.55-4.75V,200MW,SOD

DDA1 0404-000156 DIODE-SCHOTTKY;RB441Q,40V,350MA,DO-34,TP
DIC2 1201-001842 IC-OP AMP;TL3472CD,SO,TP,8P,-,DUAL,-,PAL
DR27 2007-000124 R-CHIP;2.2Kohm,5%,1/10W,TP,1608
DR28 2007-000109 R-CHIP;1Mohm,5%,1/10W,TP,1608
DR281 2007-000075 R-CHIP;220ohm,5%,1/10W,TP,1608

DR29 2007-000120 R-CHIP;680ohm,5%,1/10W,TP,1608
DR30 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608
DR31 2007-000458 R-CHIP;18Kohm,5%,1/10W,TP,1608
DR55 2007-000134 R-CHIP;33Kohm,5%,1/10W,TP,1608
DR57 2007-000082 R-CHIP;3.3Kohm,5%,1/10W,TP,1608

DR64 2007-000483 R-CHIP;1OHM,5%,1/8W,TP,2012
EJACK 3722-000363 JACK-PHONE;9P,AU,BLK,ANGLE
ER1 2007-000682 R-CHIP;3.3Kohm,1%,1/8W,TP,2012
ER2 2007-000931 R-CHIP;470ohm,5%,1/8W,TP,2012
FL1 AH07-00190A VF DISPLAY;HNV-08SS71,HT-Q9,75x18.5x6.8,

FS01 3404-000165 SWITCH-TACT;12V,50mA,160gf,6x6mm,SPST
FUSEC 3602-000147 FUSE-CLIP;250V,7.5A,30mohm
HC20 2203-001640 C-CER,CHIP;0.39nF,10%,50V,X7R,1608
HC23 2203-000315 C-CER,CHIP;0.12nF,5%,50V,C0G,1608

Location no. Code no. Description & Specification Remarks

HC26 2203-001052 C-CER,CHIP;0.56nF,10%,50V,X7R,TP,1608

HEATS AH62-00062G HEAT SINK-TR;HT-DS400,AL EXTR,-,-,-,-,-,
HEATS AH62-00146B HEAT SINK-AMP;COMMON,AL,.,38,62,-,-,-,36
HEATS AH62-30061F HEAT SINK-TR;-,AL,-,15,40,-,-,-,­HL23 2703-001254 INDUCTOR-SMD;1.8uH,10%,2012
IC HO AH61-02183A HOLDER-IC;HT-Q9,ABS+GF30%,-,-,-,-,-

KIC2 1201-001572 IC-PREAMP;2011,SIP,8P,19.2x6.5mm,SINGLE,
KR1 2007-001198 R-CHIP;820ohm,1%,1/8W,TP,2012
KR2 2007-000468 R-CHIP;1Kohm,5%,1/8W,TP,2012
KR3 2007-000221 R-CHIP;1.2Kohm,5%,1/8W,TP,2012
KR4 2007-000241 R-CHIP;1.5Kohm,5%,1/8W,TP,2012

KR5 2007-000267 R-CHIP;1.8Kohm,5%,1/8W,TP,2012
KR6 2007-000493 R-CHIP;2.2Kohm,5%,1/8W,TP,2012
L1SS 2702-001028 INDUCTOR-RADIAL;22UH,10%,10.3X18MM
L2P 3301-000297 BEAD-AXIAL;25ohm,3.6x1.2x5.7mm,-,TP,-,-,
L5P 3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,150mA,,,,

LD1 0601-001238 LED;LTL-1CHESS-UA,ROUND,RED,3.1mm,697nm
MC10 2203-000815 C-CER,CHIP;0.033nF,5%,50V,C0G,1608
MC16 2203-000972 C-CER,CHIP;47nF,10%,16V,X7R,1608
MC18 2203-000998 C-CER,CHIP;0.047nF,5%,50V,C0G,1608
MC29 2402-001009 C-AL,SMD;100uF,20%,6.3V,GP,TP,5.3x5.3x5

MC31 2203-001656 C-CER,CHIP;0.47nF,5%,50V,NP0,1608
MC40 2203-001103 C-CER,CHIP;6.8nF,10%,50V,X7R,1608
MC43 2203-000646 C-CER,CHIP;0.024NF,5%,50V,C0G,TP,1608
MC45 2203-000440 C-CER,CHIP;1nF,10%,50V,X7R,1608
MC5 2203-005221 C-CER,CHIP;15nF,10%,50V,X7R,1608

MC50 2402-001049 C-AL,SMD;10uF,20%,16V,GP,TP,3.3x3.3x5.4
MC52 2203-005065 C-CER,CHIP;1000nF,+80-20%,10V,Y5V,1608
MC53 2401-000042 C-AL;100uF,20%,16V,GP,TP,6.3x7,5
MC6 2203-006170 C-CER,CHIP;220nF,10%,16V,X7R,1608
MCON8 AH40-00129A TUNER;KST-MW004FV1-E50LKOR,HT-Q40,FM

MD3 0403-000509 DIODE-ZENER;MTZJ5.6B,5.4-5.7V,500MW,DO-3
MDIC1 1003-001450 IC-MOTOR DRIVER;BA5954FM,SOP,28P,300MIL,
MDIC2 1003-001508 IC-MOTOR DRIVER;FAN8082DTF,SOP,8P,200MIL
MIC1 0801-002683 IC-CMOS LOGIC;74HCT245,TRANSCEIVER,TSSOP
MIC1_ 1002-001448 IC-A/D CONVERTER;AK5358ET,24,TSSOP,16P,5

MIC2 1204-002233 IC-VOLUME/TONE CONT.;PT2399S,SO,16P,300M
MIC3 1107-001505 IC-FLASH MEMORY;49BV162AT,16Mbit,1Mx16/2
MIC4 1204-002224 IC-PAL/NTSC DECODER;ES6698FD,PQFP,208P,2
MIC6 1103-001334 IC-EEPROM;K524A60X81,1KX8BIT,SOP,8P,5X4M
MIC8 1105-001535 IC-DRAM;M12L128168A-7T,-,128MBIT,4X2MX

MJ4 3708-002023 CONNECTOR-FPC/FFC/PIC;6P,1MM,SMD-S,TIN,N
MQ1_1 0504-000156 TR-DIGITAL;KSR2103,PNP,200MW,22K/22K,SOT
MQ2 0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP
MR29 2007-000100 R-CHIP;68Kohm,5%,1/10W,TP,1608
MR30 2007-000093 R-CHIP;20Kohm,5%,1/10W,TP,1608

MR32 2007-000087 R-CHIP;6.8Kohm,5%,1/10W,TP,1608
MR35 2007-000962 R-CHIP;5.1Kohm,1%,1/10W,TP,1608
MR54 2007-000694 R-CHIP;3.3ohm,5%,1/8W,TP,2012
MR63 2011-000651 R-NET;10ohm,5%,1/16W,L,CHIP,8P,TP,32
MR65 2007-000643 R-CHIP;270ohm,5%,1/10W,TP,1608

MR66 2007-000077 R-CHIP;470ohm,5%,1/10W,TP,1608
MR93 2007-000118 R-CHIP;390ohm,5%,1/10W,TP,1608
MREG1 1203-002425 IC-POSI.FIXED REG.;AP1117,SOT-223,3P,138
MREG2 1203-002935 IC-POSI.ADJUST REG.;AIC1117ACE,TO-252,3P
MV1 2101-001068 VR-ROTARY;10KB,-,1/20W,SIDE

PB7 3301-001495 BEAD-SMD;120ohm,2012,2500mA,TP,115ohm/1
PC2 2402-001042 C-AL,SMD;100uF,20%,16V,GP,TP,6.6x6.6x5.
PC24 2401-001975 C-AL;47uF,20%,16V,GP,TP,5x11mm,5mm
PS300 AH59-01687C SPEAKER SYSTEM;PS-Q9,XSH,FRONT,REAR,CENT
PS300 AH59-01731C SPEAKER SYSTEM;PS-Q9,XSH,SUB W/F SPEAKER

Q4 0501-000303 TR-SMALL SIGNAL;KSA733,PNP,250mW,TO-92,T
Q5 0501-000369 TR-SMALL SIGNAL;KSC2331-Y,NPN,1000mW,TO­R1P 2007-000502 R-CHIP;2.2ohm,5%,1/8W,TP,2012
R24 2007-000116 R-CHIP;120ohm,5%,1/10W,TP,1608
R2P 2007-001806 R-CHIP;1.5ohm,5%,1/10W,BK,1608

R2RR 2007-000462 R-CHIP;18ohm,5%,1/8W,TP,2012
R39 2007-000094 R-CHIP;22Kohm,5%,1/10W,TP,1608
R3RR 2007-000518 R-CHIP;2.7Kohm,5%,1/8W,TP,2012
R5SS 2007-000253 R-CHIP;1.5ohm,5%,1/4W,TP,3216
R7FL 2007-000695 R-CHIP;3.3ohm,5%,1/10W,TP,1608

RAC1 2003-000587 R-METAL OXIDE(S);22ohm,5%,1W,AA,TP,3.3x9

Samsung Electronics 8-1

Location no. Code no. Description & Specification Remarks Location no. Code no. Description & Specification Remarks

RAU2 2007-000119 R-CHIP;560ohm,5%,1/10W,TP,1608
RC1 2203-000681 C-CER,CHIP;0.027nF,5%,50V,C0G,1608
RC10 2203-000491 C-CER,CHIP;2.2nF,10%,50V,X7R,1608
RC15 2203-001222 C-CER,CHIP;0.82nF,10%,50V,X7R,1608

RC2 2203-000888 C-CER,CHIP;4.7nF,10%,50V,X7R,1608
RC25 2203-000357 C-CER,CHIP;0.15nF,5%,50V,C0G,1608
RC27 2203-000575 C-CER,CHIP;220nF,10%,25V,X7R,2012
RC31 2203-000975 C-CER,CHIP;47nF,10%,25V,X7R,TP,1608,­RC40 2203-001634 C-CER,CHIP;33nF,10%,50V,X7R,1608

RC5 2402-000167 C-AL,SMD;100uF,20%,10V,-,-,6.6x6.6x5.7m
RCN1 3708-001765 CONNECTOR-FPC/FFC/PIC;24P,0.5mm,SMD-S,SN
REM1 0609-001198 MODULE REMOCON;VERTICAL,19MM,TR
REN1 3406-001109 SWITCH-ROTARY;5V,0.5mA,SPDT,12mm
RFG1 2007-000033 R-CHIP;0ohm,5%,1/4W,TP,3216

RG3 2007-000300 R-CHIP;10Kohm,5%,1/8W,TP,2012
RIC1 1201-002059 IC-RF AMP;ES6603SF,LQFP,64P,10X10MM,SING
RK1 2007-001071 R-CHIP;6.8Kohm,5%,1/8W,TP,2012
RK12 2007-000029 R-CHIP;0ohm,5%,1/8W,TP,2012
RK14 2007-000981 R-CHIP;5.6Kohm,5%,1/8W,TP,2012

RK17 2007-000766 R-CHIP;330ohm,5%,1/8W,TP,2012
RK20 2007-000477 R-CHIP;1Mohm,5%,1/8W,TP,2012
RK21 2007-000123 R-CHIP;1.5Kohm,5%,1/10W,TP,1608
RK23 2007-000822 R-CHIP;390ohm,5%,1/8W,TP,2012
RK37 2007-000872 R-CHIP;4.7Kohm,5%,1/8W,TP,2012

RK5 2007-001177 R-CHIP;8.2Kohm,5%,1/8W,TP,2012
RK8 2007-000409 R-CHIP;15Kohm,5%,1/8W,TP,2012
RL2 3301-001069 BEAD-SMD;120ohm,1.6x0.8x0.8mm,200mA,TP,
RP16 2007-000824 R-CHIP;390ohm,5%,1/4W,TP,3216
RPW6 2007-000113 R-CHIP;33ohm,5%,1/10W,TP,1608

RQ5 0501-000632 TR-SMALL SIGNAL;2SB1197K,PNP,200mW,SOT-2
RR17 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608
RR34 2007-000071 R-CHIP;22ohm,5%,1/10W,TP,1608
RR6 2007-000308 R-CHIP;10ohm,5%,1/8W,TP,2012
RR9 2007-000122 R-CHIP;1.2Kohm,5%,1/10W,TP,1608

SMBC0 AC27-92001M COIL-INDUCTOR;RH3.5X6.5RS,BEAD(RADIAL),­SMBD0 0402-000003 DIODE-BRIDGE;DF06M,600V,1A,DIP-4,ST
SMC01 2201-000987 C-CERAMIC,DISC;2.2NF,20%,400V,Y5U,BK,12.
SMC03 2201-002213 C-CERAMIC,DISC;0.47nF,10%,400V,Y,-,9.5X7
SMC04 2401-003472 C-AL;100UF,20%,250V,GP,BK,16X31.5MM

SMC08 2301-000474 C-FILM,LEAD-PEF;8.2nF,10%,50V,TP,6.5x12x
SMC09 2301-000449 C-FILM,LEAD-PEF;47nF,10%,50V,TP,9.5x12.5
SMC10 2401-002300 C-AL;47uF,20%,50V,GP,TP,6.3x11,5
SMC11 2301-000375 C-FILM,LEAD-PEF;100nF,5%,50V,TP,11x12.5x
SMC16 2305-001016 C-FILM,LEAD-PEF;10nF,10%,630V,TP,12.5x6.

SMC18 2201-000551 C-CERAMIC,DISC;0.47NF,10%,1KV,Y5P,TP,6.3
SMC41 2401-003139 C-AL;1000uF,20%,25V,WT,TP,10*20,5mm
SMC43 2401-003378 C-AL;1000uF,20%,10V,WT,-,10x12.5,5
SMC44 2401-001020 C-AL;3.3UF,20%,50V,GP,TP,4X7,5
SMC46 2401-000357 C-AL;100uF,20%,50V,GP,-,8x11.5,3.5m

SMC48 2401-000804 C-AL;220uF,20%,16V,GP,TP,8x9mm,5
SMC49 2401-001355 C-AL;470uF,20%,10V,GP,TP,8x11.5mm,5
SMC50 2401-000118 C-AL;1000uF,20%,10V,GP,TP,10x12.5,5
SMC60 2201-000129 C-CERAMIC,DISC;0.1nF,10%,1000V,Y5P,-,7x4
SMC61 2401-000740 C-AL;2200uF,20%,50V,LZ,TP,18x40,7.5

SMC64 2401-000598 C-AL;1uF,20%,50V,GP,TP,4x7,5
SMCM0 2301-001220 C-FILM,LEAD-PPF;100nF,10%,275V,BK,18x6x1
SMD02 0402-001148 DIODE-RECTIFIER;1N4936,400V,1.0A,DO-41,T
SMD04 0402-000012 DIODE-RECTIFIER;UF4007,1KV,1A,DO-41,TP
SMD41 0402-001377 DIODE-RECTIFIER;UG4D,200V,4A,TO-220F,TP

SMD43 0402-000268 DIODE-RECTIFIER;SB360,60V,3A,DO-201AD,TP
SMD50 0401-000005 DIODE-SWITCHING;1N4148,75V,150mA,DO-35,T
SMFU0 3601-000301 FUSE-CARTRIDGE;250V,6.3A,TIME-LAG,GLASS,
SMIC0 1203-003336 IC-PWM CONTROLLER;KA5M0365,TO-220F-4L,4P
SMIC0 1203-004084 IC-PWM CONTROLLER;FSDM0365RNB,DIP,8P,9.8

SMIC4 1203-000294 IC-POSI.FIXED REG.;7808,TO-220,3P,-,PLAS
SMIC4 1203-001586 IC-POSI.FIXED REG.;278R33,TO-220F,4P,-,P
SMIC4 1203-001589 IC-POSI.FIXED REG.;278R05,TO-220F,4P,-,P
SMIC4 1203-000165 IC-POSI.ADJUST REG.;78R12,TO-220,4P,-,PL
SMIC4 AC14-12006D IC;KA431Z,TO-92,TAPING

SMLF0 AH29-00013A FILTER LINE;HT-Q9,SQE-2424(SM100S,HM5A,­SMPC0 0604-000117 PHOTO-COUPLER;TR,130-260%,200mW,DIP-4,ST
SMPN0 3711-000190 HEADER-BOARD TO CABLE;1WALL,2P,1R,7.92MM
SMQ01 0501-000630 TR-SMALL SIGNAL;KTA1268,PNP,300MW,TO-92,
SMR01 2001-000242 R-CARBON;1.5MOHM,5%,1/4W,AA,TP,2.4X6.4M

SMR04 2001-000302 R-CARBON;10OHM,5%,1/8W,AA,TP,1.8X3.2MM
SMR05 2001-000786 R-CARBON;47KOHM,5%,1/8W,AA,TP,1.8X3.2MM
SMR08 2003-000738 R-METAL OXIDE(S);56Kohm,5%,2W,AA,TP,4x12
SMR43 2007-000830 R-CHIP;39Kohm,5%,1/8W,TP,2012
SMR44 2007-001043 R-CHIP;56ohm,5%,1/8W,TP,2012

SMR46 2007-000030 R-CHIP;560ohm,5%,1/8W,TP,2012

SMR49 2007-000781 R-CHIP;33ohm,5%,1/8W,TP,2012
SMR51 2001-000440 R-CARBON;1OHM,5%,1/8W,AA,TP,1.8X3.2MM
SMR62 2007-000457 R-CHIP;18Kohm,5%,1/8W,TP,2012
SMR64 2007-000290 R-CHIP;100ohm,5%,1/8W,TP,2012

SMR68 2007-000586 R-CHIP;22Kohm,5%,1/8W,TP,2012
SMT01 AH26-00338A TRANS POWER;-,HT-Q9,1.2mH,15,-,VARIABLE,
SMT02 AH26-00337A TRANS POWER;EER2828(PL-5,PM5),HT-Q9,620,
SMTH0 2006-001004 R-CEMENT;2.7OHM,5%,2W,CB,BK,11X20.5X7.5
SMVR0 1405-000001 VARISTOR;470V,1250A,14x7.5mm,TP

SMZD0 0403-001170 DIODE-ZENER;MTZJ9.1C,8.89-9.29V,500MW,DO
SPK1 3716-001243 TERMINAL-BLOCK;-,12P,14mm,-,­UC12 2401-000240 C-AL;100uF,20%,10V,GP,TP,5x11,5
UC16 2203-000206 C-CER,CHIP;100nF,10%,50V,X7R,2012
UC18 2203-000236 C-CER,CHIP;0.1nF,5%,50V,C0G,1608

UC2 2401-000759 C-AL;220nF,20%,50V,GP,TP,5x11mm,5mm
UC6 2409-000123 C-EDL;47000uF,4uA,5.5V,-,BK,-,5mm
UC8 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608
UD10 0401-001090 DIODE-SWITCHING;1SS355,80V,100MA,SOD-323
UIC1 AH09-00111A IC MICOM;GMS87C2020,HT-Q9,64PIN,2.7V~5.

UQ1 0501-000341 TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOT­UR11 2007-000065 R-CHIP;2.2Mohm,5%,1/10W,TP,1608
UR12 2007-000402 R-CHIP;150ohm,5%,1/10W,TP,1608
UR17 2007-000084 R-CHIP;4.7Kohm,5%,1/10W,TP,1608
UR19 2007-000052 R-CHIP;10Kohm,1%,1/10W,TP,1608

UR24 2007-000074 R-CHIP;100ohm,5%,1/10W,TP,1608
UR46 2007-000106 R-CHIP;220Kohm,5%,1/10W,TP,1608
UR51 2007-000449 R-CHIP;180ohm,5%,1/8W,TP,2012
UR6 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608
UR9 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608

UX1 2802-000188 RESONATOR-CERAMIC;8MHz,0.5%,TP,10.0x5.0x
VC2 2401-000303 C-AL;100uF,20%,25V,GP,TP,6.3x11,5
VC38 2401-001092 C-AL;330uF,20%,10V,GP,-,8x11.5,2.5m
VC49 2203-000280 C-CER,CHIP;0.01nF,0.5pF,50V,C0G,1608
VFD H AH61-02181A HOLDER-VFD;HT-Q9,ABS,-,-,-,-,-

VJ5 3722-002027 JACK-PIN;6P/6C,SN,YEL/GN/WH/BL/RD,ANGLE
VL29 2703-000272 INDUCTOR-SMD;1.2uH,10%,2012
VQ3 0501-000002 TR-SMALL SIGNAL;KSA812,PNP,150MW,SOT-23,
VR17 2007-000076 R-CHIP;330ohm,5%,1/10W,TP,1608
VR51 2007-001134 R-CHIP;68ohm,5%,1/10W,TP,1608

VR56 2007-001167 R-CHIP;75ohm,5%,1/10W,TP,1608
VR7 2007-000115 R-CHIP;82ohm,5%,1/10W,TP,1608
WC5 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5
WC9 2203-000727 C-CER,CHIP;3.9nF,10%,50V,X7R,2012
X2 2801-004284 CRYSTAL-SMD;27MHZ,10PPM,28-AAN,20PF,30OH

XD9 0401-001099 DIODE-SWITCHING;1N4148WS,75V,150mA,SOD-3
ZD5 0403-000355 DIODE-ZENER;UZ5.1BSB,5-5.2V,500MW,DO-35,

3101-001300 MOTOR-DC;2670RPM,9G.CM,3.9V,160MA
AH59-01592A DECK-CD;-,CMS-S75RB,MAGNET,23.2mm,3V,S
3301-001760 CORE-FERRITE;-,33x12x8mm,-,-

3809-001627 CABLE-FLAT;30V,80C,90mm,6P,1mm,UL20696
3809-001630 CABLE-FLAT;30V,80C,175mm,24P,0.5mm,UL206
AH39-00884A LEAD CONNECTOR-ASSY;SDM-D12,-,-,5P,150mm
AH61-01742A BODY CLAMPER-UPPER;-,POM,0.8,-,-,-,WHT,­AH61-01743A BODY CLAMPER-LOWER;-,POM,0.8,-,-,-,WHT,-

AH63-00695A TRAY-DISK;SDM-D11,ABS,-,-,-,-,GRAY,­AH63-00905A FELT-DECK;SDM-D12,FELT,0.8,10,18,-,DOUBL
AH66-00261A CAM-SLIDE;K100,POM,-,-,WHT,-,-,-,­AH73-00058A SILICON/RUBBER-DECK;CMS-SD100,SILICON,D1
AH61-02182A HOLDER-MEHCA;HT-Q9,ABS,-,-,-,-,-

3301-000132 CORE-FERRITE;AC,28.8x19.3x7.5mm,1400,290
6902-000360 BAG PE;HDPE,T0.03,L360,W250,TRP,8,1,P
AH39-00257J CBF-POWER CORD;DVC90,-,CP2(5.0),250V,2.5
AH39-40001V CABLE-AUDIO CABLE;-,-,1P-1P,3000MM,-,-,­AH42-00021A ANT FM T;T18011F-1,75 ohm,1800mm

AH59-01615E DECK-1DVD MECHA;AH59-01615E,HT-Q20,T TYP
AH59-01657A REMOCON-ASSY;HT-Q9,SAMSUNG,50,200,-,60,­AH92-02518C ASSY PCB-MAIN3;HT-Q9/XEU,MAIN,ENGLAND

8-2 Samsung Electronics

Samsung Electronics

- This Document can be used without Samsung’s authorization -

9-1

9. BLOCK DIAGRAM

1-1. MAIN

9-1. MAIN BLOCK DIAGRAM

Samsung Electronics

- This Document can be used without Samsung’s authorization -

10-1

10. Wiring Diagram

1-1. MAIN

Samsung Electronics

- This Document can be used without Samsung’s authorization -

11-1

11. PCB Diagram

1-1. MAIN

11-1. PCB Layout

Samsung Electronics

- This Document can be used without Samsung’s authorization -

12-1

12. Schematic Diagram

1-1. MAIN

1. MAIN-1

Samsung Electronics12-2

2. MAIN-2

- This Document can be used without Samsung’s authorization -

12-3Samsung Electronics

3. AMP

- This Document can be used without Samsung’s authorization -

Samsung Electronics12-4

4. FUNCTION

- This Document can be used without Samsung’s authorization -

12-5Samsung Electronics

5. RF

- This Document can be used without Samsung’s authorization -

Samsung Electronics12-6

6. SMSP

- This Document can be used without Samsung’s authorization -

Samsung Electronics 13-1

13. Circuit Description

1. Description (HT-Q9)

DECK

MPEG

TUNER

AMP

MAIN

SMPS

FRONT

2. Function Description

Samsung Electronics

13-2

14-1 Samsung Electronics

1. Definition of Home Theater

What is Home Theater?

Home theater system is the proper combination of audio and video system at home which enable
you to enjoy more dynamic sound and vivid image in a wide screen of movie theater.

This effect can be implemented with wide screen, high quality projector, Dolby digital and DTS
sound effects.

Now you can enjoy surround sound field wieh realistic presence and Dolby digital at your home as if
you are in a movie theater.

As time goes by, home theater system has become recognized as a system that helps listen sound
closer to the original sound rather than video.In this 21st centur y, most movie and animation films
will be produced for home theater and reproduce sound closer to original sound.

Samsung Electronics

14-2

2. Concept of Sound

What is Sound Range?

People can listen to the sounds with frequency between 200Hz~20.000Hz

As time goes by, home theater system has become recognized as a system that helps listen sound
closer to the original sound rather than video.In this 21st centur y, most movie and animation films
will be produced for home theater and reproduce sound closer to original sound.

What is Sound Pressure?

* A measure of how well speaker converts electr ic signal it receives to sound
* Unit of sound pressure is decibel and mainly measures the size of sound at 1 m away after

sending 1 W power from speaker.

❋ High sound pressure doesn't necessary mean good performance

What is Timbre?

* How well the unique sound of musical instrument is expressed
* Better if violin and cello sound are accurately distinguished. Good timbre means high quality.

14-3 Samsung Electronics

2. Concept of Sound

By reproducing standard channels used during soundtrack recording of movie,
it outputs 3 sounds of movie (words / music / sound effects) from 6 different
speakers and provides surround dynamic sound effects so that you can even
feel the direction of sound.

5 channel

0.1 channel

* Power amp is embedded in active sub woofer
* Require separate amp since there is no amp in passive sub woofer

❋ No difference in performance of active sub woofer and passive sub woofer

Center Speaker :Voice ( over 95%)
Front Speaker (L/R) : Music Sound
Rear Speaker (L/R) : Sound Effect

A

B

C

Subwoofer : Low Sound Effect

D

Samsung Electronics

14-4

4. Home Theater Sound Format

Overview

* As home theater has recently penetrated deep into consumer's market in Korea, Dolby digital and

DTS, the sound format for 5.1 channel home theater, are the mainstream in the market.

* Expanded type of 6.1 channel or 7.1 channel are recently released in the market, but there are

not much DVD title that can suppor t expanded type.

Home theater format...

Stereo

Is used in general audio and analog TV and and consists of 2
channels, at front left/right

Dolby Surround

In this sound format, 4 audio channels (Front left / right / center /
surround) are entered in 2 channel and reproduce in 4 channels
through device with Dolby decoder.

Center channel is not completely separated so that it forms virtual
center channel with help of front left / right channel.

1958 1Ch Mono/ 2Ch Stereo
1982 Matrix 3Ch Dolby Surround
1987 Matrix 4Ch Dolby Pro Logic
1995 5.1Ch Dolby Digital
1997 DTS (Digital Theater System)
1999 Matrix 6.1Ch Dolby Digital Sourround EX

Dolby Prologic

– Provide 4 channels (Front Left/Right/Center/Surround)
– Reinforced from Dolby Surround

① Center channel is completely separated
➁ Separation between channels gets higher

Dolby Digital

– Provide completely separate 5.1 channel

(Front Left/Right, Center, Rear Left/Right, Sub Woofer)
– Main sound format of home theater
– Reinforced from Dolby Prologic
– Rear surround left/right channels give different sound
– Support sub woofer reinforcing Bass

❋ Dolby Digital is also called AC-301

AC-3(Audo-Coding-3) :3rd digital audio coding Dolby Research Center has

developed.

DTS(Digital Theater System)

– Technology of providing 5.1 channel sound, higher quality than

Dolby Digital
– Home appliance produced to apply system installed at 1,800 the-

aters throughout the world.

✪ Comparison of DTS and Dolby Digital(DD)

14-5 Samsung Electronics

Samsung Electronics

14-6

Dolby Prologic

– Latest technology reproducing music CD recorded in 2 channel,

cassette tape and video tape made in Dolby Prologic into 5.1

channel.
– Surround speaker that makes you feel more natural, deeper and

wider than existing Dolby Prologic.

(Ex-Profound sound adds more realistic presence from 5 speakers

and sub woofer when you watch soccer match.)

DTS (Digital Theater System)

THX (Abbreviation of Tomlison Holman's Experiment)

– THX is not a sound format like a Dolby or DTS, but is a standard of sound.Like standard KS mark

in Korea, THX means good certification in sound effects.

– THX issues certificate when a movie, theater or home theater system satisfy proper standards.

14-7 Samsung Electronics

5. Home Theater Components

Amp / Receiver

Amp: Device of raising output after tuning signal of CD player or DVD into

unique sound timbre

Various Types and Usages of Amplifier

- For Listening to Music ¡æ For Music+ Movie

- ① AV Receiver (Dedicated Lamp for Home Theater) : Preferred by Home Theater mania.
➁ DVD Receiver (DVD Player+ Amp+ Radio Tuner) : Suitable for beginner of Home Theater

- Many A/V companies adopt DVD receiver type for expansion of easy and economic Home Theater
system.

Popular Korean Products

- Popular for those who pursue relatively good sound quality at low price

- Product priced between 400,000 won~600,000 won are popular.

Samsung Electronics

14-8

Popular Foreign Products

– Popular for those who prefer profound sound volume/output(Hi-fi mania, Home Theater mania)
– Products in the range of middle and low price such as Denon, Yamaha, Onkyo (900,000~1.1 mil-

lion won) are popular.

– There is very expensive product over 10 million won among foreign audio markers such as

Merdian, Mcintosh, Krell.

Type of Amp/Receiver

* Pre Amp

A device that receives, adjusts and sends signal from source devices (tape deck, CD player, radio
tuner, etc.) to power amplifier.

* Power Amp

A device that amplifies the signal from Pre Amp into big sound so that speaker can vibrate.

* Integrated Amp

A device that combines pre-amp and power amp into one.

* Receiver

A device that contains tuner for radio broadcasting and integrated amp.

A/V Receiver

General Amplifier

– Support 2 channels (Left, Right Speaker)
– Mainly reproduce music
– No decoder : cannot cope with various sound formats

A/V Receiver

– Support multi-channel (suppor t 5.1 channel)

Launch products supporting 6.1 channel and 7.1 channel

recently.
– Reproduce music and movie sound realistically
– Has decoder

Can cope with various sound formats such as Dolby Digital.
DTS

– Rich input/output
– Use digital signal type and has no sound

A/V Receiver

A device of implementing home theater more conveniently with
radio and A/V receiver embeded in DVD player.

14-9 Samsung Electronics

How to Select Amp/Receiver

- Select the products that can support both Dolby Digital and DTS since they require both for vivid
sound

- Performance of amp gets better in output(W) but high output is a burden in narrow house.

- Important to match output(W) and capacity(§Ù) of amp and speaker.

- It is advantageous for beginners to purchase DVD receiver type that has amp and radio tuner in
DVD player

- If the budget is tight, it is recommended to continue to upgrade after purchasing a low-priced sys­tem.

* Computer will be of no use when it is outdated.
* But, home theater system can be utilized in various ways due to feature of A/V device.

Speaker

Speaker system consists of speaker unit and enclosure.
The type and price range are diverse from expensive big speaker to miniature thin speaker.
Difference between famous speaker and big A/V speaker

- Speaker units are similar(there are a few several speaker unit makers in the world)

- Design, finishing, assembling and tuning process of enclosure are different.

(Prestige speakers are made manually in whole processes of manufacturing)

Famous speaker brands: B&W, JBL, BOSE, Definitve, B&O, etc.

Samsung Electronics

14-10

Speaker Structure

Speaker Unit

- Divided into for high tone, middle tone and low tong

- Tweeter : for high pitch
Smallest unit suitable for feature of high tone reproduction

- Mid-Range : for middle tone
Mid sound reproduction ability is the most critical standard
of speaker evaluation

- Woofer : for low tone
Much bigger size than other speaker unit

Enclosure

- Case of speaker unit

- Enclosure sways sound quality of reproduction

- Low tone is almost acattered without enclosure, and only
high sound tone is heard.

Type of Speaker System

Full Range Speaker

A speaker system producing sound with one speaker unit.

2 Wa y T ype

A speaker system designed using units of 2 woofers for bass and tweeter for high tone.

3 Wa y T ype

Difference between foreign prestige speaker and big A/V maker's speaker.