Samsung HT-E4530 Schematic

Blu-rayHomeTheater System

ModelNameHT-E4530

ModelCodeHT-E4530/ZC

SERVICE

Blu-rayHomeTheaterSystem

MANUAL

Contents

1.Precaution

2.ProductSpecication

3.DisassemblyandReassembly

4.Troubleshooting

5.PCBDiagram

6.SchematicDiagram

HT-E4530

RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.

Contents

Contents

1.Precaution........................................................................................................................................1−1

1.1.SafetyPrecautions...................................................................................................................1−1

1.2.ServicingPrecautions...............................................................................................................1−3

1.3.PrecautionsforElectrostaticallySensitiveDevices(ESDs)..............................................................1−4

2.ProductSpecication.........................................................................................................................2−1

2.1.ProductFeature.......................................................................................................................2−1

2.2.Specications..........................................................................................................................2−2

2.2.1.HT-E4200/HT–ES4200Specications.............................................................................2−2

2.2.2.HT-E45xxSpecications...............................................................................................2−4

2.3.SpecicationsAnalysis.............................................................................................................2−7

2.4.DiskandFormatCompatibility...................................................................................................2−8

2.4.1.Disctypesandcontentsyourproductcanplay..................................................................2−8

2.4.2.Disctypesyourproductcannotplay................................................................................2−9

2.4.3.RegionCode...............................................................................................................2−10

2.5.LogosofDiscstheproductcanplay............................................................................................2−11

2.5.1.SupportedFormats.......................................................................................................2−12

2.6.Accessories............................................................................................................................2−14

2.6.1.SuppliedAccessories...................................................................................................2−14

3.DisassemblyandReassembly..............................................................................................................3−1

3.1.OverallDisassemblyandReassembly..........................................................................................3−1

4.Troubleshooting................................................................................................................................4−1

4.1.CheckpointsbyErrorMode.......................................................................................................4−1

4.1.1.NoPower...................................................................................................................4−2

4.1.2.NoSound...................................................................................................................4−7

4.1.3.DiscLoadingError......................................................................................................4−8

4.1.4.Remotedoesn’twork...................................................................................................4−10

4.1.5.NoPicture(HDMI)......................................................................................................4−12

4.1.6.NoLogo(HDMI)........................................................................................................4−16

4.1.7.NoLogo(Composite)...................................................................................................4−19

4.1.8.Discskipsorfreezing...................................................................................................4−22

4.1.9.NoDiscReadingError.................................................................................................4−23

4.1.10.NetworkError.............................................................................................................4−24

4.2.Initialization&UpgradeMethods...............................................................................................4−25

4.2.1.HowtocheckF/Wversion............................................................................................4−25

4.2.2.Howtoupdatermware................................................................................................4−26

4.2.3.ColdStartMethod(InitializeSetup)................................................................................4−29

4.3.Buyer-RegionCodeSettingMethod............................................................................................4−30

4.3.1.InsertingtheRegionCodeafterreplacingtheMainPCB.....................................................4−30

iCopyright©1995-2012SAMSUNG.Allrightsreserved.

Contents

5.PCBDiagram...................................................................................................................................5−1

5.1.WiringDiagram.......................................................................................................................5−1

5.2.FRONTPCBTop....................................................................................................................5−2

5.2.1.PinConnection...........................................................................................................5−3

5.2.2.TestPointWaveForm..................................................................................................5−4

5.3.FRONTPCBBottom...............................................................................................................5−5

5.4.MAINPCBTop......................................................................................................................5−6

5.4.1.PinConnection...........................................................................................................5−7

5.4.2.TestPointWaveForm..................................................................................................5−9

5.5.MAINPCBBottom..................................................................................................................5−10

5.6.SMPSPCBTop.......................................................................................................................5−11

5.7.SMPSPCBBottom..................................................................................................................5−12

6.SchematicDiagram...........................................................................................................................6−1

6.1.OverallBlockDiagram.............................................................................................................6−1

6.2.FRONT.................................................................................................................................6−2

6.2.1.TestPointWaveForm..................................................................................................6−3

6.3.PWM_V ARIABLE_F AN..........................................................................................................6−4

6.4.POWER_AMP........................................................................................................................6−5

6.5.DC-DCPOWER......................................................................................................................6−6

6.6.AUDIO/VIDEO/IPODOUTCEC...............................................................................................6−7

6.6.1.TestPointWaveForm..................................................................................................6−8

6.7.USB/ETHERNET....................................................................................................................6−9

6.8.USBHUB_IPODCERTI..........................................................................................................6−10

6.9.FRONTMICOM.....................................................................................................................6−11

6.10.DIR/ADC/RXSWITCHING/D.IN..............................................................................................6−12

6.11.HDMIOUT_RX......................................................................................................................6−13

6.11.1.TestPointWaveForm..................................................................................................6−14

6.12.DDR3INTERF ACE.................................................................................................................6−15

6.13.INTERFACE/SATABLOCK.....................................................................................................6−16

6.14.FLASHMEMORY..................................................................................................................6−17

6.15.FIRENCEPOWERJTAGDEBUG.............................................................................................6−18

6.16.F_END_MORTORDRIVER.....................................................................................................6−19

6.17.F_END_SC7300......................................................................................................................6−20

6.18.SMPS....................................................................................................................................6−21

Copyright©1995-2012SAMSUNG.Allrightsreserved.ii

1.Precaution

DEVICE
UNDER

TES T

LEAKAGE

CUR RE NT

TES TER

TES T ALL

EXPO SED ME TAL

SU RFACES

2-WIRE C ORD

ALSO TE S T WITH

PLUG REVERSE D

(US ING AC

ADAPTER PLUG

AS R EQ UIRED)

EARTH

GR OUND

(RE ADING
SH OULD NOT BE
ABOVE 0.5m A)

1.Precaution

FollowthesesafetyinstructionswhileservicingtheESDtopreventdamageandtoprotectagainstpotentialhazards
suchaselectricalshockandX-rays.

1.1.SafetyPrecautions

1)Whenreinstallingthechassisanditsassemblies,besuretorestorealloftheprotectivedevices,includingthecontrol
knobsandthecompartmentcovers.

2)Makesurethattherearenocabinetopeningsthroughwhichpeople(particularlychildren)canmakecontactwith
dangerousinternalcomponents.

3)DesignAlterationWarning:Neveralteroraddtothemechanicalorelectricaldesignoftheunit.
Example:Donotaddauxiliaryaudioorvideoconnectors.Suchalterationsmightcreateasafetyhazard.Also,any
designchangesoradditionswillvoidthemanufacturer’swarranty.

4)LeakageCurrentHotCheckFigure1.1

ACLeakageTest:

WARNING

Donotuseanisolationtransformerduringthistest.Usealeakage-currenttesterorameteringsystemthatcomplies
withAmericanNationalStandardsInstitute(ANSIC101.1,LeakageCurrentforAppliances),andUnderwriters
Laboratories(ULPublicationUL1410,59.7).

Withtheunitcompletelyreassembled,plugtheACcorddirectlyintoa120VACoutlet.Withtheunit’spowerswitched
fromtheONtotheOFFposition,measurethecurrentbetweenaknowngroundandallexposedmetalparts.
KnownGrounds-Earth
KnownMetalparts-Screwheads,MetalCabinets,etc.

Figure1.1ACLeakageT est

1-1Copyright©1995-2012SAMSUNG.Allrightsreserved.

5)InsulationResistanceColdCheck:

Ante nn a

Term ina l

ohm

Expo se d

Meta l Pa rt

Ohmme te r

(1)Withtheunit’sACplugdisconnectedfromtheACsource,connectanelectricaljumperacrossthetwoACprongs.
(2)SetthepowerswitchtoON.
(3)MeasuretheresistancebetweentheshortedACplugandanyexposedmetallicparts.

Example:Screwheads,MetalCabinets,AntennaPort,etc.Ifanyoftheexposedmetallicpartshasareturnpathto
thechassis,themeasuredresistanceshouldbebetween1and5.2megohms.Ifthereisnoreturnpath,themeasured
resistanceshouldbe“innite”.Iftheresistanceisoutsidetheselimits,ashockhazardmightexist.
SeeFigure1.2

Figure1.2InsulationResistanceTest

InsulationResistanceTest

1.Precaution

6)Components,partsandwiringthatappeartohaveoverheatedorthatareotherwisedamagedshouldbereplacedwith
partsthatmeettheoriginalspecications.Alwaysdeterminethecauseofdamageoroverheating,andcorrectany
potentialhazards.

7)Observetheoriginalleaddress,especiallynearthefollowingareas:
Antennawiring,sharpedges,andespeciallytheACandhighvoltagepowersupplies.Alwaysinspectforpinched,
out-of-place,orfrayedwiring.Donotchangethespacingbetweencomponentsandtheprintedcircuitboard.Checkthe
ACpowercordfordamage.Makesurethatnowiresorcomponentstouchthermallyhotparts.

8)ProductSafetyNotice:
Someelectricalandmechanicalpartshavespecialsafety-relatedcharacteristicswhichmightnotbeobviousfromvisual
inspection.Thesesafetyfeaturesandtheprotectiontheygivemightbelostifthereplacementcomponentdiffersfrom
theoriginal–evenifthereplacementisratedforhighervoltage,wattage,etc.

9)Componentsthatarecriticalforsafetyareindicatedinthecircuitdiagrambyshading,

or.
Usereplacementcomponentsthathavethesameratings,especiallyforameresistanceanddielectricstrength
specications.Areplacementpartthatdoesnothavethesamesafetycharacteristicsastheoriginalmightcreate
shock,reorotherhazards.

Copyright©1995-2012SAMSUNG.Allrightsreserved.1-2

1.Precaution

1.2.ServicingPrecautions

1)Servicingprecautionsareprintedonthecabinet.Followthem.

2)Alwaysunplugtheunit’sACpowercordfromtheACpowersourcebeforeattemptingto:
(a)Removeorreinstallanycomponentorassembly ,(b)Disconnectanelectricalplugorconnector,(c)Connecta
testcomponentinparallelwithanelectrolyticcapacitor.

3)Somecomponentsareraisedabovetheprintedcircuitboardforsafety.Aninsulationtubeortapeissometimesused.
Theinternalwiringmaybeclampedtopreventcontactwiththermallyhotcomponents.Reinstallallsuchelements
totheiroriginalposition.

4)Afterservicing,alwayscheckthatthescrews,componentsandwiringhavebeencorrectlyreinstalled.Makesurethat
theportionaroundtheservicedparthasnotbeendamaged.

5)ChecktheinsulationbetweenthebladesoftheACplugandaccessibleconductiveparts(examples:metalpanels,
inputterminalsandearphonejacks).

6)InsulationCheckingProcedure:
DisconnectthepowercordfromtheACsource.Connectaninsulationresistancemeter(500V)tothebladesofthe
ACplug.TheinsulationresistancebetweeneachbladeoftheACplugandaccessibleconductiveparts(seeabove)
shouldbegreaterthan1megohm.

7)NeverdefeatanyoftheB+voltageinterlocks.DonotapplyACpowertotheunit(oranyofitsassemblies)unlessall
solid-stateheatsinksarecorrectlyinstalled.

8)Alwaysconnectatestinstrument’sgroundleadtotheinstrumentchassisgroundbeforeconnectingthepositivelead;
alwaysremovetheinstrument’sgroundleadlast.

CAUTION

Firstreadthe“SafetyPrecautions”sectionofthismanual.Ifsomeunforeseencircumstancecreatesaconictbetweenthe
servicingandsafetyprecautions,alwaysfollowthesafetyprecautions.

1-3Copyright©1995-2012SAMSUNG.Allrightsreserved.

1.Precaution

1.3.PrecautionsforElectrostaticallySensitiveDevices(ESDs)

Somesemiconductor(“solidstate”)devicesareeasilydamagedbystaticelectricity.
SuchcomponentsarecalledElectrostaticallySensitiveDevices(ESDs).
Examplesincludeintegratedcircuitsandsomeeld-effecttransistors.
Thefollowingtechniqueswillreducetheoccurrenceofcomponentdamagecausedbystaticelectricity:

1)Immediatelybeforehandlinganysemiconductorcomponentsorassemblies,draintheelectrostaticchargefromyour
bodybytouchingaknownearthground.Alternatively,wearadischargingwrist-strapdevice.(Besuretoremoveit
priortoapplyingpower–thisisanelectricshockprecaution.)

2)AfterremovinganESD-equippedassembly,placeitonaconductivesurfacesuchasaluminumfoiltoprevent
accumulationofelectrostaticcharge.

3)Donotusefreon-propelledchemicals.ThesecangenerateelectricalchargesthatdamageESDs.

4)Useonlyagrounded-tipsolderingironwhensolderingorunsolderingESDs.

5)Useonlyananti-staticsolderremovaldevice.Manysolderremovaldevicesarenotratedas“anti-static”(thesecan
accumulatesufcientelectricalchargetodamageESDs).

6)DonotremoveareplacementESDfromitsprotectivepackageuntilyouarereadytoinstallit.
MostreplacementESDsarepackagedwithleadsthatareelectricallyshortedtogetherbyconductivefoam,aluminum
foilorotherconductivematerials.

7)ImmediatelybeforeremovingtheprotectivematerialfromtheleadsofareplacementESD,touchtheprotectivematerial
tothechassisorcircuitassemblyintowhichthedevicewillbeinstalled.

8)MinimizebodymotionswhenhandlingunpackagedreplacementESDs.Motionssuchasbrushingclothestogether,or
liftingafootfromacarpetedoorcangenerateenoughstaticelectricitytodamageanESD.

Copyright©1995-2012SAMSUNG.Allrightsreserved.1-4

2.ProductSpecication

2.ProductSpecication

2.1.ProductFeature

■Featuresfor2012modelBDHTS

•BD-LIVEfromthebeginningoftheMassProduction

•DTS-HDMasterAudiodecodingfromthebeginningoftheMassProduction

•MP3,MKV,MP4,WMA,WMV,Divx-HD(excludeZA,ZCbuyers)

•Block-Buster,Netix,Pandora,Y outube,Widget,VUDU

•1USBport(Front–USB/iPod/iPhone)

•SupportingiPod/iPhone

•WirelessReady

•VariousV ideoSetups

-ProgressiveMode

-StillMode

-BDWise

-PictureControl

•3DSound

•1HDMIOut(1.4withARC)

•DLNA

•SmartHub

•Allshare

•DisctoDigital

2-1Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.2.Specications

2.2.1.HT-E4200/HT–ES4200Specications

■BasicSpecication

2.ProductSpecication

Weight

Dimensions

General

OperatingT emperatureRange

OperatingHumidityRange10%to75%

Signal/noiseratio55dB

Usablesensitivity12dB FMT uner

Totalharmonicdistortion0.5%

BD

(Blu-rayDisc)

DVD

(DigitalV ersatileDisc)

Disc

CD:12cm/5inches

(COMPACTDISC)

2.54kg

7.7Ibs

430(W)x55(H)x255.8(D)mm

16.9(W)x2.3(H)x10.1(D)inches

+5°Cto+35°C

+41°Fto+95°F

ReadingSpeed:9.834m/sec

ReadingSpeed:6.98~7.68m/sec.

Approx.PlayTime(SingleSided,SingleLayerDisc):135min.

ReadingSpeed:4.8~5.6m/sec.

MaximumPlayTime:74min.

Video

Output

Video/AudioHDMI

Amplier

CD:8cm/31/2inches

(COMPACTDISC)

CompositeVideo

Frontspeakeroutput165Wx2(3Ω)

Subwooferspeakeroutput170W(3Ω)

Frequencyresponse

S/NRatio70dB

Channelseparation60dB

Inputsensitivity(AUX)500mV

ReadingSpeed:4.8~5.6m/sec.

MaximumPlayTime:20min.

1channel:1.0Vp-p(75Ωload)

Blu-rayDisc:576i/480i(America:480i)

DVD:576i/480i(America:480i)

1080p,1080i,720p,576p/480p(America:480i)

PCMmultichannelaudio,Bitstreamaudio,PCMaudio

Analoginput20Hz~20kHz(±3dB)

Digitalinput20Hz~40kHz(±4dB)

Copyright©1995-2012SAMSUNG.Allrightsreserved.2-2

2.ProductSpecication

■HT-E4200SpeakerSpecication

Speaker

■HT-ES4200SpeakerSpecication

Speakersystem

Impedance3Ω3Ω

Frequencyrange140Hz~20kHz40Hz~160Hz

Outputsoundpressurelevel87dB/W/M88dB/W/M

Ratedinput165W170W

Maximuminput330W340W

Dimensions

(WxHxD)

Weights

Speakersystem

Impedance3Ω3Ω

Front:90x207.5x68.5mm

Subwoofer:168x350x285mm

Front:0.71kg

Subwoofer:2.6kg

FrontSubwoofer

FrontSubwoofer

2.1chspeakersystem

2.1chspeakersystem

Frequencyrange140Hz~20kHz40Hz~160Hz

Outputsoundpressurelevel87dB/W/M88dB/W/M

Speaker

NOTE

•Networkspeedsequaltoorbelow10Mbpsarenotsupported.

•SamsungElectronicsCo.,Ltdreservestherighttochangethespecicationswithoutnotice.

•Weightanddimensionsareapproximate.

•Designandspecicationsaresubjecttochangewithoutpriornotice.

•ForthepowersupplyandPowerConsumption,refertothelabelattachedtotheproduct.

Ratedinput165W170W

Maximuminput330W340W

Dimensions

(WxHxD)

Weights

Front:90x1050x70mm(Standbase:240x240mm)

Subwoofer:168x350x285mm

Front:10.4kg

Subwoofer:2.6kg

2-3Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.2.2.HT-E45xxSpecications

■BasicSpecication

2.ProductSpecication

Weight

Dimensions

General

OperatingT emperatureRange

OperatingHumidityRange10%to75%

Signal/noiseratio55dB

Usablesensitivity12dB FMT uner

Totalharmonicdistortion0.5%

BD

(Blu-rayDisc)

DVD

(DigitalV ersatileDisc)

Disc

CD:12cm/5inches

(COMPACTDISC)

2.54kg

7.7Ibs

430(W)x55(H)x255.8(D)mm

16.9(W)x2.3(H)x10.1(D)inches

+5°Cto+35°C

+41°Fto+95°F

ReadingSpeed:9.834m/sec

ReadingSpeed:6.98~7.68m/sec.

Approx.PlayTime(SingleSided,SingleLayerDisc):135min.

ReadingSpeed:4.8~5.6m/sec.

MaximumPlayTime:74min.

Video

Output

Video/AudioHDMI

Amplier

CD:8cm/31/2inches

(COMPACTDISC)

CompositeVideo

Frontspeakeroutput165Wx2(3Ω)

Centerspeakeroutput170W(3Ω)

Surroundspeakeroutput165Wx2(3Ω)

Subwooferspeakeroutput170W(3Ω)

Frequencyresponse

S/NRatio70dB

Channelseparation60dB

Inputsensitivity(AUX)500mV

ReadingSpeed:4.8~5.6m/sec.

MaximumPlayTime:20min.

1channel:1.0Vp-p(75Ωload)

Blu-rayDisc:576i/480i(America:480i)

DVD:576i/480i(America:480i)

1080p,1080i,720p,576p/480p(America:480i)

PCMmultichannelaudio,Bitstreamaudio,PCMaudio

Analoginput20Hz~20kHz(±3dB)

Digitalinput20Hz~40kHz(±4dB)

Copyright©1995-2012SAMSUNG.Allrightsreserved.2-4

2.ProductSpecication

■HT-E4500SpeakerSpecication

Speakersystem

Impedance3Ω3Ω3Ω3Ω

Frequencyrange140Hz~20kHz140Hz~20kHz140Hz~20kHz40Hz~160Hz

Outputsoundpressure
level

Ratedinput165W165W170W170W

Speaker

Maximuminput330W330W340W340W

Dimensions

(WxHxD)

Weights

FrontSurroundCenterSubwoofer

87dB/W/M87dB/W/M87dB/W/M88dB/W/M

Front:90x139x70mm/3.54x5.47x2.75inches

Surround:77x107x68mm/3.03x4.21x2.67inches

Center:228x77x70mm/8.97x3.03x2.75inches

Subwoofer:168x350x285mm/6.61x13.78x11.22inches

Front:0.36kg/10.4Ibs

Surround:0.31kg/1.28Ibs

Center:0.46kg/1.26Ibs

Subwoofer:2.6kg/12.6Ibs

5.1chspeakersystem

■HT-E4530SpeakerSpecication

Speaker

Speakersystem

Impedance3Ω3Ω3Ω3Ω

Frequencyrange140Hz~20kHz140Hz~20kHz140Hz~20kHz40Hz~160Hz

Outputsoundpressure
level

Ratedinput165W165W170W170W

Maximuminput330W330W340W340W

Dimensions

(WxHxD)

Weights

FrontSurroundCenterSubwoofer

87dB/W/M87dB/W/M87dB/W/M88dB/W/M

Front:90x1050x70mm(Standbase:240x240)

Surround:77x107x68mm

Center:228x77x70mm

Subwoofer:168x350x285mm

Front:3.05kg

Surround:0.31kg

Center:0.46kg

Subwoofer:2.6kg

5.1chspeakersystem

2-5Copyright©1995-2012SAMSUNG.Allrightsreserved.

■HT-E4550SpeakerSpecication

2.ProductSpecication

Speakersystem

Impedance3Ω3Ω3Ω3Ω

Frequencyrange140Hz~20kHz140Hz~20kHz140Hz~20kHz40Hz~160Hz

Outputsoundpressure
level

Ratedinput165W165W170W170W

Speaker

Maximuminput330W330W340W340W

Dimensions

(WxHxD)

Weights

FrontSurroundCenterSubwoofer

87dB/W/M87dB/W/M87dB/W/M88dB/W/M

Front:90x1050x70mm(Standbase:240x240)

Surround:90x1050x70mm(Standbase:240x240)

Center:228x77x70mm

Subwoofer:168x350x285mm

Front:3.05kg

Surround:3.05kg

Center:0.46kg

Subwoofer:2.6kg

5.1chspeakersystem

NOTE

•Networkspeedsequaltoorbelow10Mbpsarenotsupported.

•SamsungElectronicsCo.,Ltdreservestherighttochangethespecicationswithoutnotice.

•Weightanddimensionsareapproximate.

•Designandspecicationsaresubjecttochangewithoutpriornotice.

•ForthepowersupplyandPowerConsumption,refertothelabelattachedtotheproduct.

Copyright©1995-2012SAMSUNG.Allrightsreserved.2-6

2.ProductSpecication

2.3.SpecicationsAnalysis

ModelNameHT-E4xxxHT-D4500

Photo

ProleBlu-ray2.0fromthebeginningBlu-ray2.0fromthebeginning

DVD,CDOO

MP3,JPG

USBHOSTOO

iPod/iPhone

DivX

MemorySlotInternalStorageSupportInternalStorageSupport

DLNA,Widget

2D/3D2D2D

SMPS

DECKDrawtypePlasticCoverDrawtypePlasticCover

PickUp6GVEPickup6GVEPickup

FrontMicomSANYOSANYO

(MP4,MKV,WMA,WMV)

(OnlyDigitalUSBAUDIOsupport)

(DivX-HDsupport)

Stand-ByPowerConsumption0.7W

DualFreeV oltage

O

(MP4,MKV,WMA,WMV)

O

(OnlyDigitalUSBAUDIOsupport)

O

(DivX-HDsupport)

O

(SmartHub)

1trans

Stand-ByPowerConsumption0.7W

DualFreeV oltage

O

O

O

O

(SmartHub)

1trans

MAINChipSAMSUNGSOCSAMSUNGSOC

WirelessRearSpeakerHT-E4500doesnotsupportwireless.HT-D4500doesnotsupportwireless.

Wi-FiLANDongleReadyReady

HDMIINX/X/XX/X/X

Main↔LoaderOneBoard(S-A T A)OneBoard(S-ATA)

TIP

O:FeatureIncluded

X:NotIncluded

2-7Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.4.DiskandFormatCompatibility

2.4.1.Disctypesandcontentsyourproductcanplay

MediaDiscTypeDetails

2.ProductSpecication

Blu-rayDisc,

3DBlu-rayDisc

VIDEO

MUSIC

PHOTO

NOTE

•TheproductmaynotplaycertainCD-RW/-RandDVD-Rbecauseofthedisctypeorrecordingconditions.

•IfaDVD-RW/-RdischasnotbeenrecordedproperlyinDVDvideoformat,itwillnotbeplayable.

•YourproductwillnotplaycontentthathasbeenrecordedonaDVD-Ratabitratethatexceeds10Mbps.

•YourproductwillnotplaycontentthathasbeenrecordedonaBD-RorUSBdeviceatabitratethatexceeds30Mbps.

•Playbackmaynotworkforsometypesofdiscs,orwhenyouusespecicoperations,suchasanglechangeandaspectratio
adjustment.Informationaboutthediscsiswrittenindetailonthediscbox.Pleaserefertothisifnecessary.

DVD-VIDEO,DVD-RW,

DVD-R,DVD+RW ,

DVD+R

CD-RW/-R,DVD-RW/-R,

BD-RE/-R

CD-RW/-R,DVD-RW/-R,

BD-RE/-R

BD-ROMorBD-RE/-RdiscrecordedintheBD-REformat.

DVD-VIDEO,recordedDVD+RW/DVD-RW(V)/DVDR/+Rdiscsthathave
beenrecordedandnalized,oraUSBstoragemediacontainingDivX,MKV ,
MP4contents.

MusicrecordedonCD-RW/-R,DVD-RW/-R,BD-RE/-RdiscsoraUSB
storagemediacontainingMP3orWMAcontents.

PhotosrecordedonCD-RW/-R,DVD-R W/-R,BD-RE/-RdiscsoraUSB
storagemediacontainingJPEGcontents.

•WhenyouplayaBD-Jtitle,loadingmaytakelongerthananormaltitleorsomefunctionsmayperformslowly.

Copyright©1995-2012SAMSUNG.Allrightsreserved.2-8

2.ProductSpecication

2.4.2.Disctypesyourproductcannotplay

•HDDVD

•DVD-ROM/PD/MV-Disc,

etc

•DVD-RAM

•SuperAudioCD

(exceptCDlayer)

•DVD-RW(VRmode)

•CVD/CD-ROM/CDV/

CD-G/CD-I/LD

•3.9GBDVD-RDiscfor

Authoring.

(CD-Gsplayaudioonly,
notgraphics.)

NOTE

•ThisproductmaynotrespondtoalloperatingcommandsbecausesomeBlu-rayDisc,DVD,andCDdiscsallowspecicor
limitedoperationandprovideonlycertainfeaturesduringplayback.Pleasenotethatthisisnotadefectintheproduct.

•SamsungcannotguaranteethatthisproductwillplayeverydiscbearingtheBlu-rayDisc,DVDorCDlogobecausedisc
formatsevolve,andproblemsanderrorsmayoccurduringthecreationofBlu-rayDisc,DVD,andCDsoftwareand/or
themanufactureofdiscs.

•PleasecontacttheSAMSUNGCustomerCareCentre,ifyouhavequestionsorencounterdifcultywhenplayingBlu-ray
Disc,DVD,orCDdiscsinthisproduct.Also,refertorestofthisusermanualforadditionalinformationonplayback
restrictions.

•SomecommercialdiscsandDVDdiscspurchasedoutsideyourregionmaynotplayonthisproduct.

2-9Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.4.3.RegionCode











Bothproductsanddiscsarecodedbyregion.
Theseregionalcodesmustmatchforadisctoplay.Ifthecodesdonotmatch,thediscwillnotplay.
TheRegionNumberforthisproductisdisplayedontherearpaneloftheproduct.

DiscTypeRegionCodeArea

NorthAmerica,CentralAmerica,SouthAmerica,Korea,Japan,T aiwan,HongKong
andSouthEastAsia

2.ProductSpecication

Blu-rayDisc

DVD-VIDEO

Europe,Greenland,Frenchterritories,MiddleEast,Africa,AustraliaandNew
Zealand

India,China,Russia,CentralandSouthAsia

TheU.S.,U.S.territoriesandCanada

Europe,Japan,theMiddleEast,Egypt,SouthAfrica,Greenland

Taiwan,Korea,thePhilippines,Indonesia,HongKong

Mexico,SouthAmerica,CentralAmerica,Australia,NewZealand,PacicIslands,
Caribbean

Russia,EasternEurope,India,mostofAfrica,NorthKorea,Mongolia

China

NOTE

•IftheRegionnumberofaBlu-rayDisc/DVDsdoesnotcorrespondtotheRegionnumberofthisproduct,theproduct

cannotplaythedisc.

Copyright©1995-2012SAMSUNG.Allrightsreserved.2-10

2.ProductSpecication

2.5.LogosofDiscstheproductcanplay

Blu-rayDisc3DBlu-rayDisc

BD-LIVEDolby

DTSDivX

NTSCbroadcastsystemin

U.S.A,Canada,Korea,Japan

Java

PALbroadcastsystemin

U.K,France,Germany,etc.

2-11Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.5.1.SupportedFormats

■MusicFileSupport

FileExtensionContainerAudioCodecSupportRange

*.mp3MP3MP3-

CompliantwithWMAversion10

*.wmaWMAWMA

■VideoFileSupport

*Samplingrates(inkHz)-8,11,16,22,32,44.1,48

*Bitrates-Allbitratesintherange5kbpsto384kbps

2.ProductSpecication

FileExtensionContainerVideoCodecResolution

DivX3.11/4.x

/5.1/6.0

*.aviA VI

*.mkvMKV

*.asfASF

H.264

BP/MP/HP

MPEG4
SP/ASP

DivX3.11/4.x

/5.1/6.0

H.264

BP/MP/HP

MPEG4
SP/ASP

DivX3.11/4.x

/5.1/6.0

H.264

BP/MP/HP

MPEG4
SP/ASP

Framerate

(fps)

1920x10806~308

1920x10806~3025

1920x10806~308

1920x10806~308

1920x10806~3025

1920x10806~308

1920x10806~308

1920x10806~3025

1920x10806~308

Bitrate
(Mbps)

AudioCodec

MP3

AC3

LPCM

DTSCore

MP3

AC3

LPCM

DTSCore

MP3

AC3

LPCM

WMA

*.wmvASF

*.mp4MP4

*.3gp3GPP

*.vro

Copyright©1995-2012SAMSUNG.Allrightsreserved.2-12

VRO

VOB

WindowMedia

Videov9

H.264

BP/MP/HP

MPEG4
SP/ASP

H.264

BP/MP/HP

MPEG4
SP/ASP

MPEG21920x108024/25/3025

MPEG11920x108024/25/3025

1920x10806~3025WMA

1920x10806~3025

1920x10806~308

1920x10806~3025

1920x10806~308

MP3

AAC

AAC

AC3

MPEG

LPCM

2.ProductSpecication

FileExtensionContainerVideoCodecResolution

MPEG11920x108024/25/3025

*.mpg

*.mpeg

*.ts

*.tp

*.trp

PS

TS

MPEG21920x108024/25/3025

H.2641920x10806~3025

MPEG21920x108024/25/3025

H.2641920x10806~3025

VC11920x10806~3025

Framerate

(fps)

Bitrate
(Mbps)

Limitations

•Evenwhenaleisencodedbyasupportedcodeslistedabove,thelemightnotbeplayedifitscontenthasaproblem.

•Normalplaybackisnotguaranteedifthele’scontainerinformationiswrongortheleitselfiscorrupted.

•Fileshavinghigherbitorframeratesthanstandardmaystutterwhenplayedback.

AudioCodec

AC3

MPEG

LPCM

AAC

AC3

AAC

MP3

DD+

2-13Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.6.Accessories

2.6.1.SuppliedAccessories

2.ProductSpecication

AccessoriesItemItemcodeRemark

RemoteControlAH59-02408A

FerriteCore3301-000144

Batteries(AAAsize)4301-000116

VideoCableAH39-40001T

FMAntennaAH42-00021A

User’sManualAH68-02472A

LocalSamsungDealer

Copyright©1995-2012SAMSUNG.Allrightsreserved.2-14

3.DisassemblyandReassembly

3.DisassemblyandReassembly

3.1.OverallDisassemblyandReassembly

CAUTION

•Becarefultofollowthedisassemblysequencedescribedinthemanual.Otherwise,theproductmaybedamaged.

•BesuretocarefullyreadandunderstandthesafetyinstructionsbeforeperforminganyworkastheICchipson
thePCBarevulnerabletostaticelectricity.

•Inordertoassemblereversetheorderofdisassembly.

DescriptionDescriptionPhoto

1.Unfastenthescrewsof3pointsonthebacksideofSET.

:BH,+,B,M3,L10,ZPC(BLK),SWRCH18A

2.PulltheCOVER-TOPtothebacksideabout40mm.

CAUTION

Becarefulnottomakeanyscratchesasyouremovethem.

3.LifttheCOVER-TOPata45degreeangle.

4.DisconnecttheFRONT-PCBcablefromtheMAIN-PCB.

3-1Copyright©1995-2012SAMSUNG.Allrightsreserved.

DescriptionDescriptionPhoto

5.Takeoffthe3hooksoftheCOVER-FRONTfromthe
COVER-BOTTOM.

6.Takeoffthehooksofbothsideswhilepullingthemlittlebit
outsideandthenlifttheCOVER-FRONTata45degreeangle
upward.

3.DisassemblyandReassembly

7.The4hooksonthetopsidecanbeloosednaturally.

8.DisconnecttheDECKcablefromtheMAIN-PCB.

9.RemovetheDECKfromtheCOVER-BOTTOM.

Copyright©1995-2012SAMSUNG.Allrightsreserved.3-2

3.DisassemblyandReassembly

DescriptionDescriptionPhoto

10.Unfastenthescrewsof2pointsonthebacksideof
COVER-BOTTOMinordertoremovetheMAINPCB.
:BH,+,B,M3,L10,ZPC(BLK),SWRCH18A

11.DisconnecttheSMPScable,theFANcableandPOWERcable
fromtheMAIN-PCB,andthenunfastentheallscrewsofthe
MAINPCBandSMPS.

12.RemovetheMAIN-PCBandSMPSfromtheCOVER-BOTTOM.
:BH,+,-,B,M3,L6,ZPC(WHT),SWRCH18A,RF

3-3Copyright©1995-2012SAMSUNG.Allrightsreserved.

4.Troubleshooting

4.1.CheckpointsbyErrorMode

OscilloscopeSettingValuesNormalVoltage24MHz32.768KHz

V oltage/DIV1V/div200mV/div500mV/div

TIME/DIV100ms/div100ns/div100us/div

4.Troubleshooting

Copyright©1995-2012SAMSUNG.Allrightsreserved.4-1

4.Troubleshooting

Yes

Yes

Re place Fus e (F P 8 01S )

or SMPS P C B.

Che ck MAIN ASS 'Y

- S pe cially che ck a round
MICOM IC. (Vcc)

Che ck prima ry si de.

Fuse (FP8 01S ) → OK?

Che ck D-DC IC

(ICM823) sh ort tes t pin 7

to p in 1, 2 , 3, 4 , 5, 6 , 8 → OK

(me ans not sh ort)?

(1)

3.4 V Out put Che ck

(CNA821, P in 10 , 11 )

→ 3.4 V ~ 3 .6 V

(3)

Re place IC (ICA80 1)

or SMPS P C B.

(4)

Re place FET (MA801)

or SMPS P C B.

Che ck Che ck FE T

(MA801) a ll pins a re not shorte d to

ea ch oth e r.

Che ck Sw itch ing

IC (ICA801) sho rt te st p in 8 to

pin 1, 2, 3, 4 , 5, 6, 7 → OK

(means not sh ort)?

YesNo

No

No

No

No

(5)

Re place DIODE (DRA821 ,

DM824) or S MP S P CB.

(2)

Re place DC-DC IC (ICM823)

or SMPS P C B.

(6)

Re place DC-DC IC (ICM822)

or SMPS P C B.

Re place S MP S PCB.

No

No

Yes

Yes

Yes

Yes

Che ck D-DC IC

(ICM822) short tes t pin 3 to

pin 1, 2, 4, 5 → OK
(means not sh ort)?

Che ck DRA821 , DM824

short test Ano de to ca thode .

No Power De te cted

(Stand by LED OFF)

* Re fer to wa ve pa tter n

image of Fig. 4-1 .

* Re fer to wa ve pa tter n

image of Fig. 4-2 .

* Re fer to wa ve pa tter n

image of Fig. 4-3 .

* Re fer to wa ve pa tter n

image of Fig. 4-3 .

* Re fer to wa ve pa tter n

image of Fig. 4-4 .

* Re fer to wa ve pa tter n

image of Fig. 4-4 .

4.1.1.NoPower

4-2Copyright©1995-2012SAMSUNG.Allrightsreserved.

N11V

N11V

N11V

3.4 V

3.4 V

R12 V

28V_3 4V

28V_3 4V
28V_3 4V

28V_3 4V

28V_3 4V

AH62-30 122A

HEATSINK

SS

EN

VIN

BT PH

VSNS

COMP

GND

GND

GND

GND
GND

VPS

GND

GND

GND
GND
GND

R12 V

P-O N

3.4V_S

TP7

TP8

R12 V_S

TP5

TP1TP2

20

18
17
16
15
14

VPS

1N5819 40V

DM830

25V

470UF

CM836

1N5819 40V

DM829

1MF

25V

CM828

330KOHM 1/10W

RM839

1/10W

18KOHM

RM837

LM822

GND_01_S

1/10W

2.1KOHM

RM829

1

2

3

4

5

1/4W10KOHM

RM828

GND_01_S

EY826

EY828

SRC1203S

TRM821

22NF

CM829

TPS 54331D

ICM823

1

2

3

4

5

6

7

8

100NF

50V

CM846

DM831

GND_01_S

10UH

LM823

GND_01_ S

10UF

10V

CM833

1MF
10V

CM834

GND_01 _S

16V

1UF

CM845

3857S T

FBM821

470UF

10V

CM835

GDZJ 4.3B

ZDM822

KLG123E

LED851

1.8KOHM

1/10W

RM841

TP13

TP14

GND_01 _S

TP11 TP12

TP6

TP10

TP9

TWG-P2 3P-A1

CNA82 1

1

2

3

4

5

6

7

8

9

10

11

12

13

19

21

22

23

TP3 TP4

FB

GND

OUT

SDVIN

E

B

C

VSEN

SESS

GND

PH

COMPEN

VIN

BOOT

122 A

HEATSINK

SS

EN

VIN

BT PH

VSNS

COMP

GND

GND

GND

GND
GND

VPS

GND

GND

GND
GND
GND

R12 V

P-O N

1N5819 40V

25V

470UF

1N5819 40V

1MF

25V

330KOHM 1/10W

1/10W

18KOHM

GND_01_S

1/10W

2.1KOHM

GND_01_S

SRC1203S

22NF

TPS 54331D

100NF

50V

GND_01_S

10UH

GND_01_S

10UF

10V

1MF
10V

GND_01 _S

16V

1UF

3857S T

470UF

10V

GDZJ 4.3B

KLG123E

1.8KOHM

1/10W

GND_01 _S

TWG-P2 3P-A1

DM830

CM836

DM829

CM828

RM839

RM837

LM822

RM829

RM828

EY826

EY828

TRM821

CM829

ICM823

CM846

DM831

LM823

CM833

CM834

CM845

FBM821

CM835

ZDM822

LED851

RM841

TP13

TP14

TP11 TP12

TP6

TP10

TP9

CNA82 1

TP3 TP4

VPS

20

18
17
16
15
14

1

2

3

4

5

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

9

10

11

12

13

19

21

22

23

FB

GND

OUT

SDVIN

E

B

C

VSENS ESS

GND

PH

COMPEN

VIN

BOOT

* 6.18 . S MP S

* 5.6. S MPS P CB Top

<Fig. 4-1>

(1)

(1)

4.Troubleshooting

Copyright©1995-2012SAMSUNG.Allrightsreserved.4-3

4.Troubleshooting

SS

EN

VIN

BT PH

VSNS

COMP

GND

1MF

25 V

CM82 8

1UF

CM83 0

1/1 0W

62 KOHM

RM84 0

33 0KOHM 1/1 0W

RM83 9

GND_0 1_S

22 NF
50 V

CM82 9

30 KOHM

1/1 0W

RM83 3

TP S54 331D

ICM823

1

2

3

4

5

6

7

8

10 0NF

50 V

CM84 6

50 V

1NF

CM83 1

DM831

GND_0 1_S

10 UH

LM823

GND_0 1_S

10 UF

10 V

CM83 3

1MF
10 V

CM83 4

GND_0 1_S

16 V

1UF

CM84 5

38 57 S T

FBM82 1

47 0UF

10 V

CM83

GND_0 1_S

VS

ENS ESS

GND

PH

COMPEN

VIN

BOOT

SS

EN

VIN

BT PH

VSNS

COMP

GND

1MF

25 V

1UF

1/1 0W

62 KOHM

33 0KOHM 1/1 0W

GND_0 1_S

22 NF
50 V

30 KOHM

1/1 0W

TP S54 331D

10 0NF

50 V

50 V

1NF

GND_0 1_S

10 UH

GND_0 1_S

10 UF

10 V

1MF
10 V

GND_0 1_S

16 V

1UF

38 57 S T

47 0UF

10 V

GND_0 1_S

CM82 8

CM83 0

RM84 0

RM83 9

CM82 9

RM83 3

ICM823

CM84 6

CM83 1

DM831

LM823

CM83 3

CM83 4

CM84 5

FBM82 1

CM83

1

2

3

4

5

6

7

8

VSENS ESS

GND

PH

COMPEN

VIN

BOOT

* 6.18 . S MP S

* 5.7. S MPS P CB Bottom

<Fig. 4-2>

(2)

(2)

4-4Copyright©1995-2012SAMSUNG.Allrightsreserved.