Page 1
5.1CH Digital
Home Theater System
Model Name : HT-C553
Model Code : HT-C553/NWT
Speaker PS-C553
Front PS-FC553
Center PS-CC553
Rear PS-RC553
Subwoofer PS-WC553
SERVICE
Manual
5.1CH Blu-ray Home Theater System
HT-C553
CONTENTS
1. Precaution
2. Product Specification
3. Disassembly & Reassembly
4. Troubleshooting
5. Exploded View & Part List
6. PCB Diagram
7. Schematic Diagram
Refer to the service manual in the GSPN (see the rear cover) for the more information.
Page 2
GSPN (Global Service Partner Network)
Area Web Site
North America service.samsungportal.com
Latin America latin.samsungportal.com
CIS cis.samsungportal.com
Europe europe.samsungportal.com
China china.samsungportal.com
Asia asia.samsungportal.com
Mideast & Africa mea.samsungportal.com
This Service Manual is a property of Samsung Electronics
Co.,Ltd. Any unauthorized use of Manual can be punished
under applicable International and/or domestic law.
© Samsung Electronics Co.,Ltd.
Printed in Korea
Apr. 2010
Page 3
Contents
1. Precaution
1-1 Safety Precautions ...........................................................................................1-1
1-2 Servicing Precautions ......................................................................................
1-3 Precautions for Electrostatically Sensitive Devices (ESDs) .............................
2. Product Specification
2-1 Product Feature ...............................................................................................2-1
2-2 Specifications ...................................................................................................
2-3 Specifications Analysis .....................................................................................
2-4 Accessories ......................................................................................................
3. Disassembly & Reassembly
3-1 Overall Disassembly & Reassembly ................................................................3-1
1-3
1-4
2-2
2-4
2-7
4. Troubleshooting
4-1 Checkpoints by Error Mode.............................................................................. 4-1
4-2 Measures to be taken when the Protection Circuit operates ...........................
4-3 MICOM, MPEG Initialization & Update ............................................................
4-4 Buyer-Region Code Setting Method ................................................................
5. Exploded View & Part List
5-1 Product Exploded View ....................................................................................5-1
5-2 Speaker System ...............................................................................................
5-3 Electrical Part List ............................................................................................
6. PCB Diagram
6-1 Wiring Diagram ................................................................................................6-1
6-2 FRONT PCB Top ..............................................................................................
6-3 FRONT PCB Bottom ........................................................................................
6-4 KEY PCB Top ...................................................................................................
6-5 KEY PCB Bottom .............................................................................................
6-6 MAIN PCB
6-7 MAIN PCB Bottom ...........................................................................................
6-8 SMPS PCB Top ................................................................................................
6-9 SMPS PCB Bottom ..........................................................................................
Top ................................................................................................. 6-8
4-17
4-18
4-21
5-3
5-4
6-2
6-4
6-5
6-6
6-11
6-12
6-13
Page 4
Contents
7. Schematic Diagram
7-1 Overall Block Diagram .....................................................................................7-1
7-2 FRONT .............................................................................................................
7-3 TOUCH KEY ....................................................................................................
7-4 MAIN ................................................................................................................
7-5 MPEG
7-6 MICOM .............................................................................................................
7-7 AV I/O ...............................................................................................................
7-8 AMP .................................................................................................................
7-9 Audio AMP-1 ....................................................................................................
7-10 Audio AMP-2 ....................................................................................................
7-11 Audio AMP-3 ....................................................................................................
7-12 SMPS ...............................................................................................................
7-2
7-3
7-4
...............................................................................................................7-5
7-6
7-7
7-8
7-9
7-10
7-11
7-12
Page 5
Disassembly & Reassembly
X
3. Disassembly & Reassembly
3-1 Overall Disassembly & Reassembly
- Be careful to follow the disassembly sequence described in the manual. Otherwise, the product
may be damaged.
- Be sure to carefully read and understand the safety instructions before performing any work as
the IC chips on the PCB are vulnerable to static electricity.
- In order to assemble reverse the order of disassembly.
No. Description Description Photo
1 1) Side 2 points and rear 3 point screws uncrew.
2 1) Screws 3point and wire seperation.
Samsung Electronics 3-1
Page 6
3-2 Samsung Electronics
Disassembly & Reassembly
No. Description Description Photo
3 1) Pull out the wire from cabinet-front and main.
4 1) Pull out the cabinet-front.
5 1) Pull out the wire between PCB.
Page 7
Disassembly & Reassembly
No. Description Description Photo
6 1) Uncrew the screws on the PCB.
2) Uncrew the screws on the SMPS PCB.
7 1) Uncrew the rear screws.
8 1) Disassemble complete.
ONLY DUAL SMPS
Samsung Electronics 3-3
Page 8
MEMO
3-4 Samsung Electronics
Page 9
5-1 Samsung Electronics
Exploded View & Part List
This Document can not be used without Samsung’s authorization.
W390
MK01A
HDM01
M0014
D001A
P001A
T001
W391
W391
W391
W391
W391
W391
MF01A
CBR01
M0081
M0081
5. Exploded View & Part List
5-1 Product Exploded View
Page 10
Exploded View & Part List
Part List
Loc. No. Part No. Description;Specification Q’ty SNA Remark
CBR01 AH63-02058P COVER-BOTTOM-REAR;HT-C550,EGI-SECC,0.6T, 1 SNA
D001A AH96-00011B ASSY DECK-CKD;MAX-DG35,NEW TRAY,CABLE R 1 SA
HDM01 AH61-03038A HOLDER-MECHA.REA;HT-C350,ABS,10,20,10,BL 1 SNA
M0014 AH94-02467D ASSY PCB MAIN;HT-C550,HOME THEATER,CIS,E 1 SA
M0081 6003-001375 SCREW-TAPTYPE;BH,+,-,B,M3,L8,ZPC(WHT),SW 8 SA
MF01A AH94-02471E ASSY PCB FRONT;HT-C550,FRONT K-OK ASSY 1 SA
MK01A AH94-02520A ASSY PCB KEY;HT-C550/C650 1 SNA
P001A AH94-02517A ASSY PCB SMPS;HT-C650W/C550,EUR/ASIS 1 SA
T001 AH63-02059A COVER-TOP;HT-C350,SECC,0.6,500,500,BLACK 1 SA
W390 6003-000276 SCREW-TAPTYPE;BH,+,-,B,M3,L10,ZPC(WHT),S 10 SA
W391 6003-000275 SCREW-TAPTYPE;BH,+,B,M3,L10,ZPC(BLK),SWR 9 SA
Samsung Electronics 5-2
This Document can not be used without Samsung’s authorization.
Page 11
5-3 Samsung Electronics
Exploded View & Part List
This Document can not be used without Samsung’s authorization.
iPod
DIGITAL
AUDIO IN
OPTICAL
5-2 Speaker System
Front Speaker (R)
1
5
3
4
6
Center Speaker
Front Speaker (L)
2
5
3
6
4
Rear Speaker (R) Rear Speaker (L)
Subwoofer
Part List
Loc. No. Code No. Description;Specification Qty. SNA Remark
Front Speaker (R) AH81-05822A FRONT_RIGHT SPEAKER,PS-C553 1 SA
Front Speaker (L) AH81-05823A FRONT_LEFT SPEAKER,PS-C553 1 SA
1 AH81-05722A SPEAKER ASSY-TOP,CHANNEL: FRONT_RIGHT 1 SA
2 AH81-05723A SPEAKER ASSY-TOP,CHANNEL: FRONT_LEFT, 1 SA
3 AH81-05711A STAND PILLAR ASSY,FOR T0 1 SA
4 AH81-05710A STAND ASUCER ASSY,FOR T0 1 SA
5 AH81-05992A SCREW,5*15BA,BK,TALLBOY 1 SA
6 AH81-05991A SCREW,4*15BA,BK,TALLBOY 4 SA
Rear Speaker (R) AH81-05824A REAR_RIGHT SPEAKER,PS-C553 1 SA
Rear Speaker (L) AH81-05825A REAR_LEFT SPEAKER,PS-C553 1 SA
Center Speaker AH81-05826A CENTER SPEAKER,PS-C553 1 SA
Subwoofer AH81-05827A PS-C553,SUBWOOFER SPEAKER,XAC 1 SA
Speaker Wire AH81-02177B PS-Q20,SPK CORDCONNECTOR,FRONT/SUB 1 SA
Page 12
Exploded View & Part List
5-3 Electrical Part List
Loc. No. Part No. Description Specification Qty. SNA Remark
MK01A AH94-02520A ASSY PCB KEY HT-C550/C650 1 SNA
AC510 3708-001925 CONNECTOR-FPC/FFC/PIC 7p,1mm,SMD-S,SnPd, 1 SNA
AR30 2007-000074 R-CHIP 100ohm,5%,1/10W,TP,1608 2 SA
CER04 2007-000084 R-CHIP 4.7Kohm,5%,1/10W,TP,1608 2 SA
FL06 3809-002549 FFC CABLE-FLAT 30V,80C,70mm,7P,1mm,UL207 1 SA
FL06 3809-002550 FFC CABLE-FLAT 30V,80C,150mm,32P,1mm,UL2 1 SA
FMR4 2007-000080 R-CHIP 2Kohm,5%,1/10W,TP,1608 1 SA
IS01 1209-001912 IC-SENSOR NTS1124N,QFN,40P,5x5x0.85mm,PL 1 SNA
KAR21 2007-000070 R-CHIP 0ohm,5%,1/10W,TP,1608 1 SA
L0405 0601-002422 LED SMD,White,1.50mm,1.6X 3.2mm 2 SA
PC7 2203-002709 C-CER,CHIP 100nF,+80-20%,16V,Y5V,1005 2 SA
PR24 2007-002970 R-CHIP 56ohm,5%,1/16W,TP,1005 5 SA
R104 2007-000148 R-CHIP 10Kohm,5%,1/16W,TP,1005 2 SA
VC37 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,TP,1005 4 SNA
0406-001128 DIODE-TVS MLVS-0603-E08,50V 6 SA
2007-002797 R-CHIP 560ohm,5%,1/16W,TP,1005 9 SNA
2007-002797 R-CHIP 560ohm,5%,1/16W,TP,1005 1 SNA
2007-007785 R-CHIP 249Kohm,1%,1/10W,TP,1608 1 SA
2007-008035 R-CHIP 160Kohm,1%,1/10W,TP,1608 2 SA
AH41-01322C PCB-KEY HT-C550/C650,FR-4,2,0,1.6,192mm* 1 SNA
AH97-05136A ASSY SMD HT-C550,KEY_SMD,AH94-02520A 1 SNA
AH97-05309A ASSY MICOM-TOUCH KEY (NTS1124N)HT-C550_ 1 SNA
MF01A AH94-02471E ASSY PCB FRONT HT-C550,FRONT K-OK ASSY 1 SA
AAC1 2203-005249 C-CER,CHIP 100nF,10%,50V,X7R,TP,1608 6 SA
AB335 AH61-03042B BRACKET-TOP HT-C550,PBS,0.3T,15,6 2 SNA
AC14 2203-000189 C-CER,CHIP 100nF,+80-20%,25V,Y5V,TP,1608 1 SA
AC28 2203-001607 C-CER,CHIP 0.22nF,5%,50V,NP0,1608 2 SA
AC510 3708-001925 CONNECTOR-FPC/FFC/PIC 7p,1mm,SMD-S,SnPd, 1 SNA
AC510 3708-001939 CONNECTOR-FPC/FFC/PIC 32P,1mm,STRAIGHT,S 1 SA
AD480 2203-000979 C-CER,CHIP 47nF,10%,50V,X7R,TP,2012 1 SNA
AD480 2203-006336 C-CER,CHIP 10000nF,10%,25V,X5R,3216 1 SA
AF020 AH63-01537C FILTER-VFD HT-C550,PC,0.5,55,40,VIOLET,- 1 SNA
AH410 AH61-03036A HOLDER-VFD HT-C350,ABS,5,50,100,BLACK 1 SNA
AQ7 0504-000128 TR-DIGITAL FJV3103R,NPN,200mW,22K/22Kohm 1 SA
AQ8 0504-000156 TR-DIGITAL KSR2103,PNP,200MW,22K/22K,SOT 1 SA
AR108 2007-000097 R-CHIP 47Kohm,5%,1/10W,TP,1608 1 SA
AR150 2007-000078 R-CHIP 1Kohm,5%,1/10W,TP,1608 1 SA
AR164 2007-000076 R-CHIP 330ohm,5%,1/10W,TP,1608 3 SA
AR30 2007-000074 R-CHIP 100ohm,5%,1/10W,TP,1608 3 SA
AVC08 2203-002398 C-CER,CHIP 22nF,10%,50V,X7R,1608 1 SA
C 2402-001260 C-AL,SMD 100uF,20%,10V,WT,REEL,6.3X5.7 1 SA
C125 2203-006361 C-CER,CHIP 10000nF,10%,10V,X5R,TP,2012 1 SA
C134 2203-000257 C-CER,CHIP 10nF,10%,50V,X7R,TP,1608 3 SA
C258 2203-000236 C-CER,CHIP 0.1nF,5%,50V,C0G,1608 1 SA
C745 2203-005171 C-CER,CHIP 1000nF,10%,16V,X7R,2012 2 SNA
CEC02 2402-001178 C-AL,SMD 10uF,20%,16V,WT,TP,4.3x4.3x5.8m 1 SA
CER04 2007-000084 R-CHIP 4.7Kohm,5%,1/10W,TP,1608 4 SA
Samsung Electronics 5-4
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Page 13
5-5 Samsung Electronics
Exploded View & Part List
This Document can not be used without Samsung’s authorization.
Loc. No. Part No. Description Specification Qty. SNA Remark
CN2 3722-002313 JACK-USB 4P/1C,AU30U,BLK,STRAIGHT,A TYPE 1 SA
CQ3 0501-002184 TR-SMALL SIGNAL KTD1304,NPN,200mW,SOT-23 1 SA
D1 0401-001099 DIODE-SWITCHING 1N4148WS,75V,150mA,SOD-3 2 SA
EC13 AH39-01106A LEAD CONNECTOR HT-C350/550,Flat Connecto 1 SNA
EV01 AK07-00073B VF DISPLAY HNV-07SS82T,HT-C550,78.4x16.2 1 SA
FU1 1003-002129 IC-VFD PT6315A,LQFP,44P,10x10mm,-40/-15m 1 SA
HB01A 3711-000471 HEADER-BOARD TO CABLE 3WALL,4P,1R,2mm,ST 1 SA
HDC24 2402-000008 C-AL,SMD 47uF,20%,16V,GP,TP,6.6x6.6x5.4 3 SNA
HJ1 3722-001588 JACK-PHONE 7P,AG,BLK,STRAIGHT 1 SA
IDR23 2007-000116 R-CHIP 120ohm,5%,1/10W,TP,1608 1 SA
KAR11 2007-000124 R-CHIP 2.2Kohm,5%,1/10W,TP,1608 2 SA
KAR21 2007-000070 R-CHIP 0ohm,5%,1/10W,TP,1608 2 SA
MIC1 1201-001572 IC-PREAMP 2011,SIP,8P,19.2x6.5mm,SINGLE, 1 SA
MR122 2007-000094 R-CHIP 22Kohm,5%,1/10W,TP,1608 1 SA
MROP1 2007-000090 R-CHIP 10Kohm,5%,1/10W,TP,1608 6 SA
PR6 2007-000072 R-CHIP 47ohm,5%,1/10W,TP,1608 1 SA
R830 2007-000101 R-CHIP 82Kohm,5%,1/10W,TP,1608 1 SA
S.N.A 0202-001459 SOLDER-CREAM S3X58-M405,D20~38um,96.5Sn/ 0.154 SNA
S.N.A 0202-001492 SOLDER-WIRE FLUX HSE-02 LFM48 SR-34 S,-, 0.095 SNA
S1H0220 2402-000120 C-AL,SMD 10UF,20%,50V,GP,TP,6.6X6.6X5.4M 3 SA
UIC2 0609-001189 MODULE REMOCON HORIZONTAL,16.4mm,TR 1 SC
VR3 2007-000766 R-CHIP 330ohm,5%,1/8W,TP,2012 1 SA
ZC165 2203-000815 C-CER,CHIP 0.033nF,5%,50V,C0G,1608 2 SA
ZR24 2007-000109 R-CHIP 1Mohm,5%,1/10W,TP,1608 1 SA
ZVL3 3301-001495 BEAD-SMD 120ohm,2012,2500mA,TP,115ohm/10 3 SA
0403-001785 DIODE-ZENER NZH5V1B,4.94/5.2V,500mW,SOD- 1 SA
0406-001128 DIODE-TVS MLVS-0603-E08,50V 3 SA
2007-000039 R-CHIP 0ohm,1%,1/10W,TP,1608 2 SA
3002-001134 BUZZER-PIEZO 85dB,12V,2K-4KHz,BK 1 SA
3722-003068 JACK-PHONE 9P/1P,SN,BLK 2 SA
AH41-01323B PCB DISPLAY-FRONT HT-C550,CEM-3,1,0,1.6, 1 SNA
AH63-01953A SHEET-EVA HT-WS1,EVA T4.0,4,20,44 1 SNA
AH97-05285A ASSY SMD HT-C550,FRONT_SMD_MIC,AH94-0247 1 SNA
AH97-05286A ASSY MANUAL INSERT HT-C550,FRONT_MANUAL_ 1 SNA
M0014 AH94-02467D ASSY PCB MAIN HT-C550,HOME THEATER,CIS,E 1 SA
6MC22 2203-000975 C-CER,CHIP 47nF,10%,25V,X7R,TP,1608,- 2 SA
AAC1 2203-005249 C-CER,CHIP 100nF,10%,50V,X7R,TP,1608 65 SA
AAC14 2203-000888 C-CER,CHIP 4.7nF,10%,50V,X7R,TP,1608 1 SA
AAL2 AH27-00067A COIL FILTER MAX-DA75,22.4uH,50m Ohm,19.0 1 SNA
AAR11 2007-000312 R-CHIP 10ohm,5%,1/4W,TP,3216 1 SA
AC109 2203-000783 C-CER,CHIP 0.33nF,5%,50V,C0G,1608 4 SA
AC139 2203-000491 C-CER,CHIP 2.2nF,10%,50V,X7R,1608 6 SA
AC2 2203-002711 C-CER,CHIP 100nF,10%,25V,X7R,1608 7 SA
AC2 2203-002711 C-CER,CHIP 100nF,10%,25V,X7R,1608 1 SA
AC28 2203-001607 C-CER,CHIP 0.22nF,5%,50V,NP0,1608 3 SA
AC510 3708-001939 CONNECTOR-FPC/FFC/PIC 32P,1mm,STRAIGHT,S 1 SA
AC6 2402-001049 C-AL,SMD 10uF,20%,16V,GP,TP,3.3x3.3x5.4 12 SA
Page 14
Exploded View & Part List
Loc. No. Part No. Description Specification Qty. SNA Remark
ACC2 2203-001408 C-CER,CHIP 0.27nF,5%,50V,NP0,1608 6 SA
AD1 0407-000116 DIODE-SWITCHING KDS181,DAP202K,SDS2836,8 1 SA
AD480 2203-000203 C-CER,CHIP 100nF,10%,16V,X7R,TP,2012,2mm 2 SA
AD480 2203-001386 C-CER,CHIP 100nF,10%,100V,X7R,TP,3216,3. 7 SNA
AD480 2203-002494 C-CER,CHIP 470nF,10%,16V,X7R,2012 2 SNA
AD480 2203-005934 C-CER,CHIP 10000nF,10%,6.3V,X7R,3216 4 SA
AD480 2203-006024 C-CER,CHIP 2200nF,10%,10V,X7R,2012 5 SNA
AD480 2203-006333 C-CER,CHIP 10000nF,20%,16V,X5R,TP,3216 2 SNA
AD480 2203-006336 C-CER,CHIP 10000nF,10%,25V,X5R,3216 17 SA
AD480 2203-006698 C-CER,CHIP 1000nF,10%,25V,X7R,1608 8 SA
AD480 2203-006706 C-CER,CHIP 2200nF,10%,50V,X7R,3225 2 SNA
AD480 2203-007132 C-CER,CHIP 10000nF,10%,25V,X7R,TP,3216(1 1 SA
AD480 2203-007176 C-CER,CHIP 10000nF,10%,16V,X5R,TP,2012 ( 2 SNA
AD480 2203-007233 C-CER,CHIP 22000nF,10%,16V,X5R,TP,3216 1 SA
AH025 AH62-00221B HEAT SINK-AMP HT-C550,AL,5,13,131,--,--, 1 SNA
AH260 AH61-02854A HOLDER-HEATSINK HT-BD1250,HIPS V0,2.0mm, 3 SNA
AQ7 0504-000128 TR-DIGITAL FJV3103R,NPN,200mW,22K/22Kohm 9 SA
AQ8 0504-000156 TR-DIGITAL KSR2103,PNP,200MW,22K/22K,SOT 2 SA
AR108 2007-000097 R-CHIP 47Kohm,5%,1/10W,TP,1608 14 SA
AR150 2007-000078 R-CHIP 1Kohm,5%,1/10W,TP,1608 14 SA
AR161 2007-001167 R-CHIP 75ohm,5%,1/10W,TP,1608 16 SA
AR164 2007-000076 R-CHIP 330ohm,5%,1/10W,TP,1608 2 SA
AR174 2007-000129 R-CHIP 27Kohm,5%,1/10W,TP,1608 15 SA
AR30 2007-000074 R-CHIP 100ohm,5%,1/10W,TP,1608 4 SA
AR30 2007-001306 R-CHIP 150ohm,5%,1/16W,TP,1005 1 SA
AR42 2007-000939 R-CHIP 47Kohm,1%,1/10W,TP,1608 10 SA
AR43 2007-000155 R-CHIP 27Kohm,5%,1/16W,TP,1005 1 SA
AR49 2007-000140 R-CHIP 1Kohm,5%,1/16W,TP,1005 29 SNA
AR61 2007-000869 R-CHIP 4.7Kohm,1%,1/10W,TP,1608 1 SA
ARR2 2007-000102 R-CHIP 100Kohm,5%,1/10W,TP,1608 9 SA
AS074 AH63-02184A SHEET-EMI HT-C550,EMI SHEET,0.1,55,18,YE 1 SNA
AVC08 2203-002398 C-CER,CHIP 22nF,10%,50V,X7R,1608 1 SA
AVR73 2007-000142 R-CHIP 2.7Kohm,5%,1/16W,TP,1005 4 SNA
C 2401-000038 C-AL 470uF,20%,25V,GP,TP,10x12.5mm, 1 SA
C 2402-001257 C-AL,SMD 470uF,20%,16V,TP,8.3x10mm 8 SA
C 2402-001313 C-AL 330uF,20%,16V,WT,TP,8x10mm 1 SA
C 2402-001326 C-AL,SMD 220uF,20%,16V,LZ,8.3x8.3x6.2mm 1 SA
C 2402-001326 C-AL,SMD 220uF,20%,16V,LZ,8.3x8.3x6.2mm 1 SA
C 2401-004106 C-AL 680uF,20%,50V,-,BK,12.5 x 35,5 6 SNA
C100 2203-005065 C-CER,CHIP 1000nF,+80-20%,10V,Y5V,1608 1 SA
C102 2203-006158 C-CER,CHIP 100nF,10%,16V,X7R,1005 17 SNA
C125 2203-006361 C-CER,CHIP 10000nF,10%,10V,X5R,TP,2012 50 SA
C134 2203-000257 C-CER,CHIP 10nF,10%,50V,X7R,TP,1608 13 SA
C212 2203-000440 C-CER,CHIP 1nF,10%,50V,X7R,TP,1608 8 SA
C24 2203-005565 C-CER,CHIP 1nF,5%,50V,NP0,TP,1608 18 SA
C258 2203-000236 C-CER,CHIP 0.1nF,5%,50V,C0G,1608 2 SA
C3 2203-000384 C-CER,CHIP 0.015nF,5%,50V,C0G,1608 5 SA
C745 2203-005171 C-CER,CHIP 1000nF,10%,16V,X7R,2012 1 SNA
Samsung Electronics 5-6
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Page 15
5-7 Samsung Electronics
Exploded View & Part List
This Document can not be used without Samsung’s authorization.
Loc. No. Part No. Description Specification Qty. SNA Remark
C802 2203-006348 C-CER,CHIP 1000nF,10%,25V,X5R,TP,1608 1 SA
CEIC1 AK09-00159A IC MICOM MC80C0316-MC015 D32,44,2.7~5.5, 1 SNA
CEQ2 0505-000110 FET-SILICON 2N7002,N,60V,115mA,7.5ohm,0. 3 SA
CER02 2007-000071 R-CHIP 22ohm,5%,1/10W,TP,1608 2 SA
CER04 2007-000084 R-CHIP 4.7Kohm,5%,1/10W,TP,1608 6 SA
CER04 2007-000084 R-CHIP 4.7Kohm,5%,1/10W,TP,1608 1 SA
CIS3 AH40-00156A TUNER TT-705FM/RDS,MAX-DG35,FM. RDS,75 o 1 SA
CN8 3708-001616 CONNECTOR-FPC/FFC/PIC 9P,1mm,STRAIGHT,SN 1 SA
CN906 0603-001164 CONNECTOR-OPTICAL 5V,16Mb/s,0m,0dB,650nm 1 SA
CON23- 3708-002403 CONNECTOR-FPC/FFC/PIC 23P,1mm,SMD-S,SN,N 1 SA
CQ3 0501-002184 TR-SMALL SIGNAL KTD1304,NPN,200mW,SOT-23 3 SA
D0254 0402-001090 DIODE-SCHOTTKY MBRS1100,100V,1000MA,DO-2 1 SNA
D0254 0402-000553 DIODE-SCHOTTKY SS24/B240,40V,2000mA,DO-2 5 SA
D1 0401-001099 DIODE-SWITCHING 1N4148WS,75V,150mA,SOD-3 3 SA
D1103 0406-001239 DIODE-TVS RClamp0502B,6/-/-V,125W,SOT-52 1 SA
DC18 2203-005138 C-CER,CHIP 1.8nF,10%,50V,X7R,1005 12 SA
DR01A 0402-001427 DIODE-RECTIFIER ES1D,200V,1A,DO-214AC,TP 6 SA
DR1 2007-001301 R-CHIP 68ohm,5%,1/16W,TP,1005 1 SA
DR1 2007-000023 R-CHIP 120ohm,5%,1/8W,TP,2012 1 SA
DR10 2007-000113 R-CHIP 33ohm,5%,1/10W,TP,1608 3 SA
DR37 2007-000932 R-CHIP 470ohm,5%,1/16W,TP,1005 2 SNA
DR39 2007-000162 R-CHIP 100Kohm,5%,1/16W,TP,1005 18 SA
DR6 2007-000831 R-CHIP 39Kohm,5%,1/16W,TP,1005 1 SA
DS01A 0401-001166 DIODE-SWITCHING BAV20WS-V,150V,250mA,SOD 6 SA
DU501 1203-001824 IC-VOL. DETECTOR 7042,SOT-89,3P,PLASTIC, 1 SA
EC28 AH69-02892A PAD-THEAMAI HT-C350,OTHER,3,10,30 2 SNA
ER19 2007-002899 R-CHIP 10ohm,1%,1/10W,TP,1608 7 SA
FAR22 2007-000082 R-CHIP 3.3Kohm,5%,1/10W,TP,1608 2 SA
FD7 0601-001226 LED SMD(TOP VIEW),RED,1.2x0.8mm,660nm,1. 1 SNA
FR18 2007-000982 R-CHIP 5.6Kohm,5%,1/16W,TP,1005 1 SA
HDC24 2402-000008 C-AL,SMD 47uF,20%,16V,GP,TP,6.6x6.6x5.4 1 SNA
HDC24 2402-000008 C-AL,SMD 47uF,20%,16V,GP,TP,6.6x6.6x5.4 1 SNA
HDMI 3701-001313 CONNECTOR-HDMI 19P,2R,PLUG,ANGLE,AU30U 1 SA
HDR7 2007-000139 R-CHIP 220ohm,5%,1/16W,TP,1005 7 SNA
HDR8 2007-007095 R-CHIP 390ohm,5%,1/16W,TP,1005 2 SA
HQ4 0505-001930 FET-SILICON MCH3319,P,-12V,-2.6A,0.255oh 1 SNA
HR10 2007-001320 R-CHIP 1.8Kohm,5%,1/16W,TP,1005 2 SA
HRP2 2011-001344 R-NETWORK 100ohm,5%,1/16W,L,CHIP,8P,TP,2 8 SA
IC012 1203-006057 IC-POSI.ADJUST REG. KIA1085FP00,D2PAK,3P 1 SA
IC11 1001-001305 IC-ANALOG SWITCH 74HC4066PW,TSSOP,14P,5. 1 SA
IC112 1103-001410 IC-EEPROM S-24CS08AFJ-TB-1GE,8Kbit,1Kx8, 3 SNA
IC520 0903-001565 IC-MICROCONTROLLER LC87F5NC8AVU,QFP,100P 1 SNA
J1002 3722-002027 JACK-PIN 6P/6C,SN,YEL/GN/WH/BL/RD,ANGLE 1 SNA
KAC5 2203-001126 C-CER,CHIP 0.68nF,10%,50V,X7R,1608 1 SNA
KAR11 2007-000124 R-CHIP 2.2Kohm,5%,1/10W,TP,1608 12 SA
KAR21 2007-000070 R-CHIP 0ohm,5%,1/10W,TP,1608 28 SA
KAR7 2007-000120 R-CHIP 680ohm,5%,1/10W,TP,1608 1 SA
KAR9 2007-000093 R-CHIP 20Kohm,5%,1/10W,TP,1608 2 SA
KOP1 1201-000163 IC-OP AMP 4560,SOP,8P,173MIL,DUAL,100V/m 4 SA
Page 16
Exploded View & Part List
Loc. No. Part No. Description Specification Qty. SNA Remark
KQ6 0501-000341 TR-SMALL SIGNAL KSC1623-L,NPN,200mW,SOT- 1 SA
MC15 2203-000560 C-CER,CHIP 220nF,+80-20%,25V,Y5V,1608 1 SNA
MD1 0404-001089 DIODE-SCHOTTKY RB551V-30,20V,500MA,SOD-3 6 SA
MIC1 1003-001978 IC-MOTOR DRIVER AM5766,HSOP28H,28P,17.9x 1 SA
MIC10 0801-002391 IC-CMOS LOGIC 74LCX00,NAND GATE,TSSOP,14 2 SNA
MIC2 1105-001573 IC-DRAM K4S281632,-,128Mbit,8Mx16Bit,TSO 1 SA
MR103 2007-000308 R-CHIP 10ohm,5%,1/8W,TP,2012 4 SA
MR112 2007-000309 R-CHIP 10ohm,5%,1/10W,TP,1608 29 SA
MR122 2007-000094 R-CHIP 22Kohm,5%,1/10W,TP,1608 7 SA
MR13 2007-000157 R-CHIP 47Kohm,5%,1/16W,TP,1005 12 SA
MR16 2007-000168 R-CHIP 470Kohm,5%,1/16W,TP,1005 1 SA
MR16 2007-000098 R-CHIP 56Kohm,5%,1/10W,TP,1608 1 SA
MR16 2007-000168 R-CHIP 470Kohm,5%,1/16W,TP,1005 1 SA
MR166 2007-000119 R-CHIP 560ohm,5%,1/10W,TP,1608 1 SA
MR17 2007-000566 R-CHIP 220Kohm,5%,1/16W,TP,1005 9 SNA
MR19 2007-000087 R-CHIP 6.8Kohm,5%,1/10W,TP,1608 10 SA
MR2 2007-000130 R-CHIP 39Kohm,5%,1/10W,TP,1608 2 SA
MR306 2007-000141 R-CHIP 2.2Kohm,5%,1/16W,TP,1005 5 SNA
MR31 2007-001305 R-CHIP 120ohm,5%,1/16W,TP,1005 1 SA
MR36 2007-000153 R-CHIP 22Kohm,5%,1/16W,TP,1005 5 SA
MR39 2007-000242 R-CHIP 1.5Kohm,5%,1/16W,TP,1005 3 SNA
MR9 2007-000455 R-CHIP 18Kohm,1%,1/10W,TP,1608 1 SA
MROP1 2007-000090 R-CHIP 10Kohm,5%,1/10W,TP,1608 38 SA
MX1 2801-004284 CRYSTAL-SMD 27MHz,10ppm,28-AAN,20pF,30oh 1 SA
ND51C2 2007-000066 R-CHIP 20Kohm,1%,1/10W,TP,1608 6 SA
OTR1 2007-001292 R-CHIP 33ohm,5%,1/16W,TP,1005 17 SNA
P803T 1404-001483 THERMISTOR-PTC 470ohm,50%,32V,TP 2 SA
PC69 2203-006818 C-CER,CHIP 47000nF,20%,6.3V,X5R,3216 4 SA
PCW2 3711-003359 HEADER-BOARD TO CABLE BOX,10P,1R,2.5mm,S 1 SA
PCW3 3711-006142 HEADER-BOARD TO CABLE BOX,15P,1R,2mm,STR 1 SA
PL1 2703-003408 INDUCTOR-SMD 10uH,20%,7070 1 SNA
PPC2 2203-005148 C-CER,CHIP 100nF,10%,16V,X7R,TP,1608 74 SA
PPD1 0402-000309 DIODE-RECTIFIER 1SR154-400,400V,1A,SOD-1 7 SA
PPR2 2007-000343 R-CHIP 120ohm,1%,1/10W,TP,1608 1 SA
PR2 2007-000651 R-CHIP 27Kohm,1%,1/10W,TP,1608 1 SA
PR4 2007-000052 R-CHIP 10Kohm,1%,1/10W,TP,1608 1 SA
PR6 2007-000583 R-CHIP 22Kohm,1%,1/10W,TP,1608 1 SA
Q1 0501-000479 TR-SMALL SIGNAL KST42,NPN,350mW,SOT-23,T 3 SA
Q101 0501-000445 TR-SMALL SIGNAL KTC3875S-Y,NPN,150mW,SOT 2 SA
Q1040 0501-000457 TR-SMALL SIGNAL MMBT2222A/KST2222A,NPN,3 2 SA
Q301 0501-000481 TR-SMALL SIGNAL KST92,PNP,350mW,SOT-23,T 3 SA
Q4 0501-000632 TR-SMALL SIGNAL 2SB1197K,PNP,200mW,SOT-2 2 SA
Q409 0505-001170 FET-SILICON FDS9933A,P,-20V,3.8A,0.075oh 1 SA
Q409 0505-002365 FET-SILICON IRF6645,N,100V,5.7A,0.035ohm 12 SNA
Q806 0504-000152 TR-DIGITAL KSR2101,PNP,200mW,4.7K/4.7Koh 1 SA
R1 2007-002425 R-CHIP 1ohm,5%,1/10W,TP,1608 17 SA
R102 2007-000149 R-CHIP 12Kohm,5%,1/16W,TP,1005 2 SA
R104 2007-000148 R-CHIP 10Kohm,5%,1/16W,TP,1005 29 SA
Samsung Electronics 5-8
This Document can not be used without Samsung’s authorization.
Page 17
5-9 Samsung Electronics
Exploded View & Part List
This Document can not be used without Samsung’s authorization.
Loc. No. Part No. Description Specification Qty. SNA Remark
R105 2007-000138 R-CHIP 100ohm,5%,1/16W,TP,1005 46 SA
R109 2007-000293 R-CHIP 100ohm,5%,1/4W,TP,3216 1 SNA
R111 2007-000171 R-CHIP 0ohm,5%,1/16W,TP,1005 29 SA
R123 2007-000159 R-CHIP 56Kohm,5%,1/16W,TP,1005 2 SA
R16 2007-001313 R-CHIP 330ohm,5%,1/16W,TP,1005 4 SNA
R1P151 2007-000121 R-CHIP 820ohm,5%,1/10W,TP,1608 7 SA
R227 2007-000086 R-CHIP 5.6Kohm,5%,1/10W,TP,1608 2 SA
R299 2007-000772 R-CHIP 33Kohm,1%,1/10W,TP,1608 1 SA
R319 2007-000143 R-CHIP 4.7Kohm,5%,1/16W,TP,1005 26 SA
R326 2007-001325 R-CHIP 3.3Kohm,5%,1/16W,TP,1005 7 SNA
R3A08 2007-000091 R-CHIP 12Kohm,5%,1/10W,TP,1608 6 SA
R419 2007-000882 R-CHIP 4.7ohm,5%,1/10W,TP,1608 4 SA
R505 2007-000496 R-CHIP 2.2Kohm,5%,1/4W,TP,3216 6 SA
R509 2007-000170 R-CHIP 1Mohm,5%,1/16W,TP,1005 4 SA
R509 2007-001179 R-CHIP 8.2Kohm,5%,1/10W,TP,1608 3 SA
R510 2007-000108 R-CHIP 510Kohm,5%,1/10W,TP,1608 1 SNA
R813 2007-000643 R-CHIP 270ohm,5%,1/10W,TP,1608 6 SNA
R893B 2007-000122 R-CHIP 1.2Kohm,5%,1/10W,TP,1608 6 SA
RC34 2203-000280 C-CER,CHIP 0.01nF,0.5pF,50V,C0G,1608 5 SA
RIC1 1201-001842 IC-OP AMP TL3472CD,SO,TP,8P,-,DUAL,-,PAL 1 SA
RR2 2007-000075 R-CHIP 220ohm,5%,1/10W,TP,1608 2 SA
S1I0240 2007-001119 R-CHIP 680ohm,5%,1/16W,TP,1005 1 SNA
T0052 2703-002238 INDUCTOR-SMD 1UH,5%,2012 4 SNA
T0052 2703-003362 INDUCTOR-SMD 4.7uH,20%,7070 1 SA
T0052 2703-003768 INDUCTOR-SMD 330uH,20%,6060 1 SNA
T0087 1203-002835 IC-POSI.FIXED REG. KIA7805AF,DPAK,3P,6.6 1 SA
T0087 1203-003695 IC-POSI.FIXED REG. NCP1117ST33T3G,SOT-22 1 SA
T0087 1203-003695 IC-POSI.FIXED REG. NCP1117ST33T3G,SOT-22 2 SA
T0122 2802-001165 RESONATOR-CERAMIC 4MHz,0.5%,TP,4.5x2.0x1 1 SNA
T0415 3716-001243 TERMINAL-BLOCK WIRE TYPE,12P,14mm,0V,0A 1 SA
T0568 3301-001404 BEAD-SMD 30ohm,2012,TP,15.9OHM/30MHz 28 SA
T0568 3301-001404 BEAD-SMD 30ohm,2012,TP,15.9OHM/30MHz 7 SA
T702 3722-001373 JACK-SCART 21P,SN,BLACK 1 SA
U1502 1203-001212 IC-VOL. DETECTOR 7029,SOT-89,3P,-,PLASTI 1 SA
UX2 2802-001174 RESONATOR-CERAMIC 10MHZ,0.5%,BK,8X3.5X3M 1 SA
VL6 2703-000398 INDUCTOR-SMD 10uH,10%,3225 2 SA
W390 6003-000276 SCREW-TAPTYPE BH,+,-,B,M3,L10,ZPC(WHT),S 3 SA
WC31 2305-000407 C-FILM,LEAD-PEF 470nF,5%,100V,TP,10.5x6x 6 SA
ZC35 2203-000681 C-CER,CHIP 0.027nF,5%,50V,C0G,1608 2 SA
ZIC3 1107-001709 IC-FLASH MEMORY MX25L1605DM2I-12G,16Mbit 1 SNA
ZRN10 2011-001261 R-NETWORK 33ohm,5%,1/16W,L,CHIP,8P,TP,2. 5 SA
0403-001052 DIODE-ZENER RD8.2MB,7.7-8.7V,200mW,SOT-2 1 SA
0403-001441 DIODE-ZENER MMSZ5239B,5%,500MW,SOD-123,T 2 SA
0403-001483 DIODE-ZENER UDZS18B,17.56-18.35V,200mW,S 2 SA
0406-001128 DIODE-TVS MLVS-0603-E08,50V 6 SA
0501-000150 TR-SMALL SIGNAL 2SA1037,PNP,200mW,SOT-23 1 SA
0504-000105 TR-DIGITAL DTA114EU,PNP,200MW,10K/10K,SC 1 SA
0504-000105 TR-DIGITAL DTA114EU,PNP,200MW,10K/10K,SC 1 SA
Page 18
Exploded View & Part List
Loc. No. Part No. Description Specification Qty. SNA Remark
1001-001298 IC-ANALOG SWITCH L10X,10P,2.1x1.6,1,1.65 1 SNA
1003-002161 IC-DRIVER PI3HDMI101,TQFN,42P,9x3.5mm,SI 1 SA
1003-002268 IC-GATE DRIVER IRS2053MTRPBF,MLPQ,48P,7X 2 SA
1201-002982 IC-VIDEO AMP THS7374IPWR,TSSOP,14P,5x4.4 1 SA
1203-006013 IC-DC/DC CONVERTER AOZ1031AI,SO-8,8P,4.9 1 SA
1203-006067 IC-POWER SUPERVISOR TPS2553DBVR,SOT-23,6 1 SNA
1203-006105 IC-DC/DC CONVERTER MAX5033DUSA,SO,8P,4.9 1 SNA
1204-003179 IC-PAL/NTSC DECODER ES8398SCDVA,LQFP,216 1 SA
2007-000146 R-CHIP 6.8Kohm,5%,1/16W,TP,1005 1 SA
2007-000253 R-CHIP 1.5ohm,5%,1/4W,TP,3216 2 SA
2007-000336 R-CHIP 120Kohm,1%,1/10W,TP,1608 2 SA
2007-000501 R-CHIP 2.2ohm,1%,1/10W,TP,1608 2 SA
2007-001319 R-CHIP 1.2Kohm,5%,1/16W,TP,1005 3 SA
2007-001329 R-CHIP 7.5Kohm,5%,1/16W,TP,1005 1 SNA
2007-001333 R-CHIP 18Kohm,5%,1/16W,TP,1005 1 SNA
2007-002797 R-CHIP 560ohm,5%,1/16W,TP,1005 1 SNA
2007-007065 R-CHIP 10ohm,5%,1W,TP,6432 6 SA
2007-007306 R-CHIP 100ohm,1%,1/16W,TP,1005 1 SNA
2007-007313 R-CHIP 6.8Kohm,1%,1/16W,TP,1005 6 SA
2007-007316 R-CHIP 3.3Kohm,1%,1/16W,TP,1005 1 SNA
2007-007528 R-CHIP 1.5Kohm,1%,1/16W,TP,1005 1 SA
2007-007671 R-CHIP 11Kohm,1%,1/16W,TP,1005 1 SA
2007-007723 R-CHIP 75Kohm,1%,1/10W,TP,1608 1 SA
2301-001760 C-FILM,MPEF 100nF,10%,250V,TP,B5xH13.5x1 6 SA
2402-001166 C-AL,SMD 22UF,20%,50V,GP,TP,6.3MMX5.4MM 2 SNA
2402-001185 C-AL,SMD 2.2UF,20%,50V,WT,TP,4.3X4.3X6MM 1 SA
3709-001592 CONNECTOR-CARD EDGE 22P,1.27mm,ANGLE,SN, 1 SNA
AH27-00078A COIL FILTER 1016P-01-220L,22uH,0.1,18.5, 5 SNA
AH41-01320E PCB MAIN HT-C550,FR-4,2,0,1.6,168X247,1 1 SNA
AH62-00062R HEAT SINK-MEPG HT-C550,AL,2.8,50,35,--,- 1 SNA
AH97-04402A ASSY AUTO HT-C550,MAIN_AUTO_CIS,AH94-024 1 SNA
AH97-04403A ASSY SMD HT-C550,MAIN_SMD_CIS,AH94-02467 1 SNA
AH97-04405A ASSY MANUAL INSERT HT-C550,MAIN_MANUAL_C 1 SNA
AH97-05307D ASSY MICOM-IC MICOM HTD-C550WWM-1003.2,2 1 SNA
AH97-05310C ASSY MICOM-NOR-FLASH HTD-C550WWB-1006.2, 1 SNA
P001A AH94-02517A ASSY PCB SMPS HT-C650W/C550,EUR/ASIS 1 SA
AAC1 2203-005249 C-CER,CHIP 100nF,10%,50V,X7R,TP,1608 5 SA
AAR39 2007-000123 R-CHIP 1.5Kohm,5%,1/10W,TP,1608 1 SA
AC28 2203-001607 C-CER,CHIP 0.22nF,5%,50V,NP0,1608 1 SA
AD480 2203-000178 C-CER,CHIP 100nF,+80-20%,25V,Y5V,1608 1 SNA
AD480 2203-000455 C-CER,CHIP 1nF,5%,50V,C0G,2012 2 SNA
AD480 2203-001386 C-CER,CHIP 100nF,10%,100V,X7R,TP,3216,3. 1 SNA
AD480 2203-002180 C-CER,CHIP 1000nF,10%,50V,X7R,3216 1 SA
AD480 2203-006698 C-CER,CHIP 1000nF,10%,25V,X7R,1608 2 SA
AE40 2401-001363 C-AL 470uF,20%,16V,GP,TP,10x12.5,5 2 SA
AH020 AH62-00201E HEAT SINK HT-Z320,AL,40,20,40 1 SNA
AH020 AH62-00201G HEAT SINK HT-C550,AL,35,16,anodizin(blac 1 SNA
Samsung Electronics 5-10
This Document can not be used without Samsung’s authorization.
Page 19
5-11 Samsung Electronics
Exploded View & Part List
This Document can not be used without Samsung’s authorization.
Loc. No. Part No. Description Specification Qty. SNA Remark
AQ7 0504-000128 TR-DIGITAL FJV3103R,NPN,200mW,22K/22Kohm 1 SA
AR150 2007-000078 R-CHIP 1Kohm,5%,1/10W,TP,1608 4 SA
ARR2 2007-000102 R-CHIP 100Kohm,5%,1/10W,TP,1608 2 SA
BD707 3301-000297 BEAD-AXIAL 25ohm,3.6x1.2x5.7mm,-,TP,-,-, 3 SA
C 2401-000038 C-AL 470uF,20%,25V,GP,TP,10x12.5mm, 2 SA
C 2401-000360 C-AL 100uF,20%,50V,GP,TP,8x11.5,5 1 SA
C 2401-000970 C-AL 22uF,20%,50V,WT,TP,5x11,5 1 SA
C 2401-003139 C-AL 1000uF,20%,25V,WT,TP,10*20,5mm 1 SA
C116 2203-001683 C-CER,CHIP 0.068nF,5%,50V,NP0,1608 1 SA
C1S09 2401-001573 C-AL 47uF,20%,50V,GP,TP,6.3x11,2.5 1 SA
C2A4 2401-001020 C-AL 3.3UF,20%,50V,GP,TP,4X7,5 1 SA
C338 2203-000609 C-CER,CHIP 22nF,10%,50V,X7R,TP,2012 1 SNA
C3S09 2401-001324 C-AL 0.47UF,20%,50V,GP,BK,3X5,2.5 1 SA
C745 2203-005171 C-CER,CHIP 1000nF,10%,16V,X7R,2012 1 SNA
CER04 2007-000084 R-CHIP 4.7Kohm,5%,1/10W,TP,1608 2 SA
CF1 2301-001796 C-FILM,LEAD-PPF 0.56nF,5%,1000V,23x12mm 1 SA
CX2 2301-001511 C-FILM,LEAD-PEF 330NF,10%,275V,BK,16X18X 2 SA
CY5 2305-001016 C-FILM,LEAD-PEF 10nF,10%,630V,TP,12.5x6. 3 SA
D1 0401-001099 DIODE-SWITCHING 1N4148WS,75V,150mA,SOD-3 7 SA
D1SS12 0402-001439 DIODE-RECTIFIER SHK75-11,100V,3A,DO-201A 2 SA
DR01A 0402-000274 DIODE-RECTIFIER UF4004,400V,1A,DO-41,TP 2 SA
DR01A 0402-001427 DIODE-RECTIFIER ES1D,200V,1A,DO-214AC,TP 1 SA
DR01A 0402-001604 DIODE-RECTIFIER MUR420,200V,4A,DO-201AD, 1 SA
EC11 AH39-01098A HARNESS POWER HT-C550/C5500,Flat Connect 1 SA
EC11 AH39-01099A HARNESS POWER HT-C550/C5500,Flat Connect 1 SA
FAR22 2007-000082 R-CHIP 3.3Kohm,5%,1/10W,TP,1608 1 SA
IC1 1203-004788 IC-PWM CONTROLLER ICE2QS01,DIP,8P,9.52X6 1 SA
JP21 3811-001868 WIRE-NO SHEATH CU SnCuFe,52mm,GRY 30 SNA
JP21 3811-001868 WIRE-NO SHEATH CU SnCuFe,52mm,GRY 1 SNA
KAR11 2007-000124 R-CHIP 2.2Kohm,5%,1/10W,TP,1608 1 SA
KAR7 2007-000120 R-CHIP 680ohm,5%,1/10W,TP,1608 1 SA
KQ6 0501-000341 TR-SMALL SIGNAL KSC1623-L,NPN,200mW,SOT- 1 SA
KQ6 0501-000341 TR-SMALL SIGNAL KSC1623-L,NPN,200mW,SOT- 1 SA
LF2_1 AH29-00015A FILTER LINE HT-Z110,SQ2424,1.1 OHM,9mH,2 1 SA
LF2_1 AH29-00016B FILTER LINE HT-Z320,TR16 4.0mH,0.08,4.0m 1 SA
M3501 0505-002302 FET-SILICON AP9575GP,P,-60V,-16A,0.07ohm 1 SA
MD1 0404-001089 DIODE-SCHOTTKY RB551V-30,20V,500MA,SOD-3 2 SA
MR103 2007-000308 R-CHIP 10ohm,5%,1/8W,TP,2012 2 SA
MR13 2007-000092 R-CHIP 15Kohm,5%,1/10W,TP,1608 4 SA
MROP1 2007-000090 R-CHIP 10Kohm,5%,1/10W,TP,1608 5 SA
ND53D1 0403-001079 DIODE-ZENER UDZ3.9B,7%,200MW,SOD-323,TP 1 SA
PADT1 0402-001562 DIODE-BRIDGE TS6P05G,600V,6A,SIP-4,ST 1 SA
PCD02 2201-000963 C-CERAMIC,DISC 1NF,20%,400V,Y5U,TP,9.5X6 3 SA
PCNS2 3711-000203 HEADER-BOARD TO CABLE 1WALL,2P/3P,1R,7.9 1 SA
PDS11 0402-000012 DIODE-RECTIFIER UF4007,1000V,1A,DO-41,TP 5 SA
PICS1 0604-001028 PHOTO-COUPLER TR,50-600%,250mW,DIP-4,ST 4 SC
PICS2 AC14-12006D IC KA431Z,TO-92,TAPING 2 SA
PLS31 AC27-12001N COIL CHOKE RA,K-30,Q80,150KHZ,150KHZ 1 SA
Page 20
Exploded View & Part List
Loc. No. Part No. Description Specification Qty. SNA Remark
PRS13 2003-000994 R-METAL OXIDE(S) 33Kohm,5%,2W,AF,TP,3.9x 4 SA
PTD1 AK26-00021A TRANS SWITCHING DVD-HD1080,120V,+8V,-8V, 1 SA
Q1 0501-000479 TR-SMALL SIGNAL KST42,NPN,350mW,SOT-23,T 1 SA
Q1042 0501-000462 TR-SMALL SIGNAL MMBT2907A,PNP,350mW,SOT- 1 SA
Q1042 0501-000462 TR-SMALL SIGNAL MMBT2907A,PNP,350mW,SOT- 1 SA
Q1P107 0501-000362 TR-SMALL SIGNAL KSC2328A-Y,NPN,1000mW,TO 2 SA
Q409 0505-001981 FET-SILICON SPA11N80C3,N,800V,11A,0.45OH 1 SA
R1 2002-001115 R-COMPOSITION 1.5Mohm,5%,1/2W,AA,TP,4x12 1 SA
R1005 2007-000300 R-CHIP 10Kohm,5%,1/8W,TP,2012 1 SA
R15 2007-000134 R-CHIP 33Kohm,5%,1/10W,TP,1608 4 SNA
R1P110 2001-000449 R-CARBON 2.2Kohm,5%,1/8W,AA,TP,1.8x3.2mm 1 SA
R1S36 2007-000493 R-CHIP 2.2Kohm,5%,1/8W,TP,2012 2 SA
R2007 2007-000803 R-CHIP 36Kohm,1%,1/10W,TP,1608 1 SA
R3512 2007-001206 R-CHIP 82Kohm,1%,1/10W,TP,1608 1 SNA
RR17 2007-007549 R-CHIP 4.99Kohm,1%,1/10W,TP,1608 1 SA
T0010 AH27-00068A COIL CHOKE BARX20, 2.9UH,HT-Z320,2.9uH,2 2 SA
T0086 1203-005211 IC-PWM CONTROLLER ICE3BR4765J,DIP,8P,9.4 1 SA
T0900 1404-001195 THERMISTOR-NTC 5.1ohm,3.84A,3000K,21mW/C 1 SA
U3 1203-000119 IC-NEGA.FIXED REG. 7905,TO-220,3P,PLASTI 1 SNA
UC24 2401-001364 C-AL 470uF,20%,16V,GP,TP,10x12.5,5 1 SNA
V1233 2203-000575 C-CER,CHIP 220nF,10%,25V,X7R,TP,2012 2 SNA
V8932 2007-000857 R-CHIP 4.3Kohm,1%,1/10W,TP,1608 2 SA
VD11 0403-001083 DIODE-ZENER UDZSNP9.1B,8.85/9.23V,200mW, 2 SNA
VQ4 0501-000002 TR-SMALL SIGNAL KSA812,PNP,150mW,SOT-23, 1 SNA
W390 6003-000276 SCREW-TAPTYPE BH,+,-,B,M3,L10,ZPC(WHT),S 3 SA
WE08 2401-003850 C-AL 1000UF,20%,50V,WT,TP,12.5 X 25,5 4 SA
ZC165 2203-000815 C-CER,CHIP 0.033nF,5%,50V,C0G,1608 2 SA
0403-001062 DIODE-ZENER UDZSNP4.7B,4.55/4.75V,200mW, 2 SA
0404-001489 DIODE-SCHOTTKY SBR20A200CTFP,200V,20000m 2 SA
0501-002656 TR-SMALL SIGNAL 2N5401AT,PNP,625mW,TO-92 1 SNA
0501-002657 TR-SMALL SIGNAL 2N5551AT,NPN,625mW,TO-92 1 SNA
1405-000152 VARISTOR 560V,2500A,14x8.5mm,TP 1 SA
2003-002053 R-METAL OXIDE(S) 1.1ohm,5%,1W,AF,TP,2.5x 1 SA
2003-002456 R-METAL OXIDE 0.18ohm,5%,2W,AF,TP,3.9x12 2 SNA
2007-000415 R-CHIP 15ohm,5%,1/8W,TP,2012 2 SA
2007-000575 R-CHIP 220ohm,5%,1/4W,TP,3216 1 SA
2007-000656 R-CHIP 27Kohm,5%,1/4W,TP,3216 1 SNA
2007-000689 R-CHIP 3.3Mohm,5%,1/8W,TP,2012 1 SA
2007-000774 R-CHIP 33Kohm,5%,1/8W,TP,2012 2 SA
2007-000883 R-CHIP 4.7ohm,5%,1/4W,TP,3216 1 SNA
2201-000152 C-CERAMIC,DISC 10NF,+80-20%,1KV,Y5V,TP,2 2 SA
2201-002213 C-CERAMIC,DISC 0.47nF,10%,400V,Y5P,8.0X6 1 SNA
2301-001220 C-FILM,LEAD-PPF 100nF,10%,275V,BK,18x6x1 1 SA
2301-002000 C-FILM,LEAD 1nF,10%,300V,BK,12.5x4x10mm 2 SNA
2401-000556 C-AL 1uF,20%,100V,GP,TP,5*11,5mm 1 SNA
2401-003849 C-AL 1500UF,20%,16V,WT,TP,10X20,5 1 SA
2401-004681 C-AL 330uF,20%,450V,BK,30x35,10mm 1 SNA
3601-001491 FUSE-RADIAL LEAD 250V,6.3A,TIME DELAY,RE 1 SA
6042-000001 EYELET ID2.2,OD2.7,L3.1,NI+SN,BSP3-1/2H 26 SNA
Samsung Electronics 5-12
This Document can not be used without Samsung’s authorization.
Page 21
Exploded View & Part List
Loc. No. Part No. Description Specification Qty. SNA Remark
AH26-00338A TRANS POWER -,HT-Q9,1.2mH,15,-,VARIABLE, 1 SA
AH26-00355A TRANS SWITCHING ER-4220,HT-Z320,VARIABLE 1 SA
AH41-01311A PCB-SMPS HT-C5500,FR-1,1,00,T1.6,195*122 1 SNA
AH63-01844A EARTH HT-Z320,C2680R-1/2H,0.5,NO 3 SNA
AH97-05128A ASSY AUTO HT-C550,SMPS_AUTO_EUR,AH94-025 1 SNA
AH97-05129A ASSY SMD HT-C550,SMPS_SMD_EUR,AH94-02517 1 SNA
AH97-05130A ASSY MANUAL INSERT HT-C650W/C550,SMPS_MA 1 SNA
AH91-00120G ASSY SHIELD HT-C550 1 SNA
T0268 3903-000396 CBF-POWER CORD AT,EU,CP2,HOUSING(2P),250 1 SA
ACCE1 AH92-03463M ASSY ACCESSORY HT-C550/C553/C555 1 SNA
REMO2 AH59-02293A REMOCON TM1051,MULTI 24P,49,3V,C550-3 1 SA
AH96-00536M ASSY ACCESSORY-MANUAL HT-C550/C553/C555 1 SNA
CARD 6801-001634 CARD-REGISTRATION Russia,XER,NWT,Russia, 1 SNA
AH30-00099A MICROPHONE-ASSY-ASC MIC 10V,150 to 450uA 1 SNA
C-AUDI AH39-40001V CABLE-AUDIO CABLE -,-,1P-1P,3000mm,-,-,- 1 SA
M0025 AH42-00021A ANT FM T T18011F-1,75 ohm,1800mm 1 SA
BN68-01925G MANUAL FLYER-WARRANTY CARD comm,Samsung, 1 SNA
T0120 4301-000121 BATTERY-MN 1.5V,R03,10.5x44.5m,HOLDER,7. 2 SNA
T0527 BN68-00513A LABEL-E,PASS ALL MODEL,YUPO(110G),50X15, 1 SNA
AH68-02269P MANUAL USERS HT-C550,XER,RUS/UKR/KAZ,MOJ 1 SNA
T0524 6902-000110 BAG PE LDPE,T0.05,W250,L400,TRP,28,2,9.2 1 SNA
AH68-02295N MANUAL USERS HT-C550,XER,ENG/RUS/UKR/KAZ 1 SNA
AH92-03471J ASSY P/MATERIAL HT-C550 1 SNA
S.N.A 0203-001100 TAPE-OPP MASKING OPP/W75/CLR,T0.075,W75, 1.5 SNA
SP04A AH96-00314K ASSY SPEAKER P-SATELLITE PS-C553,SOUTEAS 1 SA
SP03A AH96-00315K ASSY SPEAKER P-SUBWOOFER PS-C553,SOUTEAS 1 SA
NITRON 6902-000062 BAG PE HDPE/NITRON/HDPE,T0.02/0.5/T0.02, 1 SNA
AH69-02997A CUSHION-SET ht-c453,ht-c455,25,110,400,1 1 SNA
BN81-01918A RESIN EPS,SG-302,-,-,-,-,-,- 0.087 SNA
AH92-03278K ASSY LABEL HT-C550 1 SNA
CCM1 AH68-01929G LABEL RATING HT-A100,XTL,SILVER PET,48,3 1 SNA
AH68-02277Z LABEL-POP STAND HT-C550/XER,SER,ART PAPE 1 SNA
AH92-03538P ASSY BOX HT-C550 1 SNA
5-13 Samsung Electronics
This Document can not be used without Samsung’s authorization.
Page 22
6. PCB Diagram
FRONT PCB
TOUCH PANEL
4)CN1:7P SMD
CONN STR
MAIN PCB
2) CN9 : 32P FFC DIP STR
AUX
USB
60MM
150MM
8)CN5:15P
CONN
7)ACON1:1
0P CONN
SMPS
CON3:15P
WIRE
CON2:10P
CONN
5)CN2: 9P
DIP CON
DECK
6)CN1: 23P
SMT CON
DECK
1
3)U1:7P SMD STR1) FCON1 : 32P FFC DIP STR
=> TO MAIN
1
1
#1 pin start
position
CON1:2P
POWER
1
6-1 Wiring Diagram
PCB Diagram
Samsung Electronics 6-1
Page 23
PCB Diagram
FCON1
UIC2
KIC2
U1
6-2 FRONT PCB Top
2
1
6-2 Samsung Electronics
Page 24
6-2-1 Pin Connection
PCB Diagram
1 FCON1
TO MAIN FFC(ST)
Pin No. Signal Pin No. Signal
1 VP30V 17 DGND
2 VFD_N27V 18 ST5V
3 VFD_N27V 19 TEST
4 VFD_CLK 20 NC
5 VFD_DO 21 REMC
6 VFD_CE 22 D_P
7 VFD_GND 23 D_N
8 D5V 24 AUX_SENS
9 D5V 25 MIC_SENS
10 DGND 26 AGND
11 KEY_SCL 27 12V
12 KEY_SDA 28 MIC_MUTE
2 U1
TO TOUCH KEY (ST)
Pin No. Signal
1 TM+
2 TM-
3 ND
4 OPSW
5 CLSW
6 SL-
9 SP-
13 KET_INT 29 BUZZER
14 N_RESET 30 MIC_SIG
15 AUX_L 31 MIC_SIG
16 AUX_R 32 AGND
Samsung Electronics 6-3
Page 25
PCB Diagram
6-3 FRONT PCB Bottom
6-4 Samsung Electronics
Page 26
6-4 KEY PCB Top
PCB Diagram
Samsung Electronics 6-5
Page 27
PCB Diagram
CN1
IC1
6-5 KEY PCB Bottom
1
6-6 Samsung Electronics
Page 28
6-5-1 Pin Connection
2 CN1
FROM FRONT (ST)
Pin No. Signal
1 ST5V
2 N_RESET
3 TEST
4 KEY_INT
5 KEY_SCL
6 KEY_SDA
7 DGND
PCB Diagram
Samsung Electronics 6-7
Page 29
PCB Diagram
CN9
CN4
IC15
IC10
IC11
IC21
IC7
CN1
CN2
AIC4
AIC19
CN5
ACON1
IC36
6-6 MAIN PCB Top
TP4
TP6
TP5
TP7
TP3
TP2
TP3
TP1
TP4
TP5
5
TP6
1
2
TP1
4
3
6-8 Samsung Electronics
Page 30
6-6-1 Pin Connection
PCB Diagram
1 CN1
FROM FRONT (ST)
Pin No. Signal
1 CDVR
2 MPD
3 CDLDO
4 DGND
5 SW
6 FOCUS_N
7 TRACK_N
8 TRACK_P
9 FOCUS_P
10 B
11 C
12 D
13 A
14 F
15 F
16 RF5.0V
17 MVREF
2 CN2
TO DECK
Pin No. Signal
1 LOADP_DCMOP
2 LOADN_DCMON
3 SLED_N
4 SLED_P
5 INSW
6 OUTSW
7 MGND
8 DCLOAD_P
9 DCLOAD_N
3 CN9
FROM FRONT FFC
Pin No. Signal Pin No. Signal
1 VP30V 17 DGND
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
VFD_N27V
VFD_N23.5V
VFD_CLK
VFD_DO
VFD_CE
VFD_GND
D5V
D5V
DGND
KEY_SCL
KEY_SDA
KET_INT
N_RESET
AUX_L
AUX_R
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
ST5V
TEST
REMC
D_P
D_N
AUX_SENS
MIC_SENS
AGND
12V
MIC_MUTE
BUZZER
MIC_SIG
MIC_SIG
AGND
NC
4 CN5
FROM SMPS
Pin No. Signal
1 GND
2
3
4
5
6
7
8
9
10
11
12
13
14
15
3.7V
3.7V
P-ON
GND
GND
GND
GND
5.4V
5.4V
5.4V
32V
12V
12V
5V
5 ACON1
FROM SMPS
Pin No. Signal
1 16V~32V
2 16V~32V
3 16V~32V
4 GND
5 GND
6 GND
7 16V~32V
8 16V~32V
9 16V~32V
10 REF
18 DGND
19 DVDVR
20 NC
21 DVDLDO
22 PUHRF
23 RF5.0V
Samsung Electronics 6-9
Page 31
PCB Diagram
6-6-2 Test Point Wave Form
TP1
TP2
TP3
TP6
TP7
TP4
TP5
6-10 Samsung Electronics
Page 32
6-7 MAIN PCB Bottom
IC2
IC20
IC35
IC16
IC3
IC8
IC1
AIC22
AIC16
PCB Diagram
Samsung Electronics 6-11
Page 33
PCB Diagram
CON1
6-8 SMPS PCB Top
6-12 Samsung Electronics
Page 34
6-9 SMPS PCB Bottom
CON2
CON3
PCB Diagram
Samsung Electronics 6-13
Page 35
MEMO
6-14 Samsung Electronics
Page 36
Precaution
1. Precaution
Follow these safety instructions while servicing the ESD to prevent damage and to protect against potential
hazards such as electrical shock and X-rays.
1-1 Safety Precautions
1. When reinstalling the chassis and its assemblies, be sure to restore all of the protective devices, including the
control knobs and the compartment covers.
2. Make sure that there are no cabinet openings through which people (particularly children) can make contact
with dangerous internal components.
3. Design Alteration Warning:
Never alter or add to the mechanical or electrical design of the unit.
Example: Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard.
Also, any design changes or additions will void the manufacturer’s warranty.
4. Leakage Current Hot Check (Fig. 1-1):
Warning: Do not use an isolation transformer during this
test. Use a leakage-current tester or a metering system
that complies with American National Standards Institute
(ANSI C101.1, Leakage Current for Appliances), and
Underwriters Laboratories (UL Publication UL1410,
59.7).
With the unit completely reassembled, plug the AC cord
directly into a 120V AC outlet. With the unit’s power
switched from the ON to the OFF position, measure the
current between a known ground and all exposed metal
DEVICE
UNDER
TEST
TEST ALL
EXPOSED METAL
SURFACES
2-WIRE CORD
ALSO TEST WITH
PLUG REVERSED
(USING AC
ADAPTER PLUG
AS REQUIRED)
<Fig. 1-1 AC Leakage Test>
LEAKAGE
CURRENT
TESTER
(READING
SHOULD NOT BE
ABOVE 0.5mA)
parts.
Known Grounds - Earth
Known Metal parts - screwheads, metal cabinets, etc.
EARTH
GROUND
5. Insulation Resistance Cold Check:
(1) With the unit’s AC plug disconnected from the AC
source, connect an electrical jumper across the two AC
Antenna
Terminal
prongs. (2) Set the power switch to ON. (3) Measure
the resistance between the shorted AC plug and any
Exposed
Metal Part
exposed metallic parts.
Example: screwheads, metal cabinets, antenna port
If any of the exposed metallic parts has a return path
<Fig. 1-2 Insulation Resistance Test>
ohm
Ohmmeter
to the chassis, the measured resistance should be
between 1 and 5.2 megohms. If there is no return path,
the measured resistance should be “infinite.” If the resistance is outside these limits, a shock hazard might
exist. See Fig. 1-2
Samsung Electronics 1-1
Page 37
1-2 Samsung Electronics
Precaution
6. Components, parts and wiring that appear to have overheated or that are otherwise damaged should be
replaced with parts that meet the original specifications. Always determine the cause of damage or overheating,
and correct any potential hazards
7. Observe the original lead dress, especially near the following areas: Antenna wiring, sharp edges, and
especially the AC and high voltage power supplies. Always inspect for pinched, out-of-place, or frayed wiring.
Do not change the spacing between components and the printed circuit board. Check the AC power cord for
damage. Make sure that no wires or components touch thermally hot parts.
8. Product Safety Notice:
Some electrical and mechanical parts have special safety-related characteristics which might not be obvious
from visual inspection. These safety features and the protection they give might be lost if the replacement
component differs from the original--even if the replacement is rated for higher voltage, wattage, etc.
9. Components that are critical for safety are indicated in the circuit diagram by shading,
or . Use
replacement components that have the same ratings, especially for flame resistance and dielectric strength
specifications. A replacement part that does not have the same safety characteristics as the original might
create shock, fire or other hazards.
Page 38
Precaution
1-2 Servicing Precautions
1. Servicing precautions are printed on the cabinet. Follow them.
2. Always unplug the unit’s AC power cord from the AC power source before attempting to: (a) Remove or reinstall
any component or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a test component in
parallel with an electrolytic capacitor.
3. Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes
used. The internal wiring may be clamped to prevent contact with thermally hot components. Reinstall all such
elements to their original position.
4. After servicing, always check that the screws, components and wiring have been correctly reinstalled.
Make sure that the portion around the serviced part has not been damaged.
5. Check the insulation between the blades of the AC plug and accessible conductive parts (examples: metal
panels, input terminals and earphone jacks).
6. Insulation Checking Procedure: Disconnect the power cord from the AC source. Connect an insulation
resistance meter (500V) to the blades of the AC plug.
The insulation resistance between each blade of the AC plug and accessible conductive parts (see above)
should be greater than 1 megohm.
7. Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies)
unless all solid-state heat sinks are correctly installed.
8. Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the positive
lead; always remove the instrument’s ground lead last.
First read the “Safety Precautions” section of this manual. If some unforeseen circumstance
creates a conflict between the servicing and safety precautions, always follow the safety
precautions.
Samsung Electronics 1-3
Page 39
Precaution
1-3 Precautions for Electrostatically Sensitive Devices (ESDs)
Some semiconductor (“solid state”) devices are easily damaged by static electricity.
Such components are called Electrostatically Sensitive Devices (ESDs).
Examples include integrated circuits and some field-effect transistors. The following techniques will reduce the
occurrence of component damage caused by static electricity:
1. Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from
your body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to
remove it prior to applying power--this is an electric shock precaution.)
2. After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent
accumulation of electrostatic charge.
3. Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs.
4. Use only a grounded-tip soldering iron when soldering or unsoldering ESDs.
5. Use only an anti-static solder removal device. Many solder removal devices are not rated as “anti-static” (these
can accumulate sufficient electrical charge to damage ESDs).
6. Do not remove a replacement ESD from its protective package until you are ready to install it.
Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam,
aluminum foil or other conductive materials.
7. Immediately before removing the protective material from the leads of a replacement ESD, touch the protective
material to the chassis or circuit assembly into which the device will be installed.
8. Minimize body motions when handling unpackaged replacement ESDs. Motions such as brushing clothes
together, or lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.
1-4 Samsung Electronics
Page 40
Product Specification
2. Product Specification
2-1 Product Feature
USB Host
- Instant Entertainment through USB
- Directly rip the music in our CD’s to your USB external device
- MTP type file is also ready for play
Playability
- Never fail, Play without trouble. Just press play and enjoy
- Rolling actuator technology adjusts the lens angle to the curved disc surface
- Defect Disc Recovery Solution can deliver a clear picture despite of scratches or other defects on the disc.
ASC
- Using ASC, simply make sweet spot anywhere in your room
Touch Sensor
- Emotional values by using the touch sensor button
Portable Connection
- Easy Connectivity
- Walkman, ipod, MD etc. DRM Free
- Connect with any kinds of Portable Audio device
- Stereo Input in Front
- Made for iPod
- Easy connection w/ ipod
- Improvement : video & iPhone support
Samsung Electronics 2-1
Page 41
Product Specification
2-2 Specifications
2-2-1
Specications
Basic Specification
Power Requirements
Power Consumption
GENERAL
FM Tuner
DISC
Weight 6.1 Ibs
Dimensions 16.9 (W) x 2.3 (H) x 10.8 (D) inches
Operating Temperature Range
Operating Humidity Range
Signal/noise ratio
Usable sensitivity
Total harmonic distortion
DVD (Digital Versatile Disc)
CD: 12 cm
(COMPACT DISC)
AC 120V, 60Hz
75 W
+41°F to +95°F
10% to 75%
70 dB
10 dB
0.5 %
Reading Speed: 3.49 ~ 4.06 m/sec.
Approx. Play Time (Single Sided, Single Layer Disc):
135 min.
Reading Speed: 4.8 ~ 5.6 m/sec.
Maximum Play Time: 74 min.
VIDEO
OUTPUT
VIDEO/
AUDIO
CD: 8 cm
(COMPACT DISC)
Composite Video
Component Video
HDMI 1080p, 1080i, 720p, 480p
Reading Speed: 4.8 ~ 5.6 m/sec.
Maximum Play Time: 20 min.
480i
1 channel: 1.0 Vp-p (75Ω load)
480i
Y: 1.0 Vp-p (75Ω load)
Pr: 0.70 Vp-p (75Ω load)
Pb: 0.70 Vp-p (75Ω load)
2-2 Samsung Electronics
Page 42
Product Specification
Front speaker output
Center speaker output
Rear speaker output
Subwoofer output
AMPLIFIER
Frequency range
S/N Ratio
Channel separation
Input sensitivity
Speaker Specification
Speaker system
Impedance
Frequency range
Output sound pressure level
166W x 2 (3Ω)
166W (3Ω)
166W x 2 (3Ω)
170W (3Ω)
20Hz ~ 20kHz
70dB
60dB
(AUX) 400mV
5.1ch Speaker System
Front/Rear Center Subwoofer
3Ω 3Ω 3Ω
140Hz ~ 20KHz 140Hz ~ 20KHz 40Hz ~ 160Hz
86dB/W/M 86dB/W/M 88dB/W/M
SPEAKER
Rated input
Maximum input
Dimensions (W x H x D)
Weights
166W 166W 170W
332W 332W 330W
Front: 3.54 x 51.18 x 4.49 inches
Rear: 3.54 x 5.57 x 2.7 inches
Center: 14.17 x 2.93 x 2.7 inches
Subwoofer: 6.1 x 13.78 x 11.22 inches
Front: 6.11 Ibs, Center: 1.2 Ibs
Rear: 1.28 Ibs, Subwoofer: 8.38 Ibs
Samsung Electronics 2-3
Page 43
Product Specification
2-3 Specifications Analysis
Model Name HT-C553 HT-Z320
Photo
Output
Power
General
RMS (10% THD), REF: 1ch
Output Power (ch)
Subwoofer: 170W (3Ω)
HDMI CEC
Calliope X X
Deck 1 DISC 1 DISC
DVD Disc Capacity
Front Display
Sleep
Dimmer
CD/CD-R/CD-RW
VCD/SVCD X X
DVD/DVD-R/DVD-RW
MP3
1000W 1000W
Front: 166W x 2 (3Ω)
Center: 166W (3Ω)
Rear: 166W x 2 (3Ω)
1 DVD 1 DVD
1Color-VFD 1Color-VFD
Front: 166W x 2 (3Ω)
Center: 166W (3Ω)
Rear: 166W x 2 (3Ω)
Subwoofer: 170W (3Ω)
Compatible
A/V
DVD (Video)
JPEG Viewer
DVD-Audio X X
DVD-OK X X
WMA
Divx3.11~Divx5.1, XviD Divx3.11~Divx5.1, XviDi
DIVX
SACD X X
WIRELESS
USB HOST
Anynet Anynet+ Anynet+
Progressive Scan (NT/PAL)
Logo copy
NTSC ↔ PAL
PAL M (Brazil)
V1/V2/V3/V7 V1/V2/V3/V7
O (only NTSC) O (only NTSC)
X X
: Feature Included, X: Not Included
2-4 Samsung Electronics
Page 44
Product Specification
Model Name HT-C553 HT-Z320
Photo
Sound Mode EQ/DSP 3Mode / 5Mode 3Mode / 5Mode
Sound effect
Audio Decoding
Video Inputs
MP3ENHANCE/P.BASS
Dolby Digital
Dolby ProLogic-II
Dolby ProLogic-IIX
DTS
Dolby Digital EX
DTS ES Discrete 6.1
DTS 96/24
THX
DTS Neo 6
Component
Composite
S-Video
HDMI In
Component
Composite
X
X X
X X
X X
X X
X X
X X
X X
X X
X X
X X
O O
O O
Video Outputs
Audio in/out
Optical jack
Coaxial jack
Headphone/
MIC Jack
HDMI Out
S-Video
SCART Out
In
Line In
Multi ch Out
Out
In (Digital In)
Out
In
Out
i-Link
Headphone Jack (3.5Φ)
2 MIC Jack (6.5Φ)
O O
X X
O (only Europe) O (only Europe)
X X
O (AUX) O (AUX)
X X
X X
O (*1) O (*1)
X X
X X
X X
X X
X O
O (only MIC BUYER) O (only MIC BUYER)
: Feature Included, X: Not Included
Samsung Electronics 2-5
Page 45
Product Specification
Model Name
FM
RDS
Tuner
AM
Preset Memory
Universal (MBR)
Remote Key
Key
Dual Voltage
Type (Sat/Tallboy)
Stand
Speaker
Impedance (Sat/Woofer)
Active (Powered) S/W
Net Weight Set
HT-C553 HT-Z320
Photo
O O
O (only Europe) O (only Europe)
O (Brazil only) X
15 15
O O
49 Key 60 Key
O (Brazil only) X
Sat / Tall Sat
O O
3Ω/ 3Ω 3Ω/ 3Ω
X X
5.5 Ibs 7.7 Ibs
: Feature Included, X: Not Included
2-6 Samsung Electronics
Page 46
2-4 Accessories
2-4-1 Supplied Accessories
Accessories Item Item code Remark
Product Specification
Remote Control
Battery
ASC Microphone AH30-00099A
Vidio Cable AH39-40001V
FM Antenna AH42-00021A
User’s Manual AH68-02289X
AH59-02293A
4301-000116
Local Samsung Dealer
Samsung Electronics 2-7
Page 47
MEMO
2-8 Samsung Electronics
Page 48
7. Schematic Diagram
Flash
AT26DF161
Motor
Driver
AM5766
Pick-up / Loader
SDRAM
12L128168A
THS7374
NTS1124N
HDMI
Power AMP
A- VIDEO
USB
Optic IN
AUX2
MIC
TUNER
i-Pod
AUX1
LC87C5N
SPI
I2C
D+/D-
SPDIF
CEC
M80F0316
UART
EEPROM
24C08
I2C
EEPROM
24C08
I2C
WIRELESS
I2S
4066
4560
FSA2257
SA2011
Touch key
VFD
4WIRE
EEPROM
24C08
I2C
ES8398
VIDEO
PWM
(DAC)
SERVO
ADC
DIR/
USB
TUENR
I2C
I2S
DIGITAL VIDEO
ANALOG VIDEO
PWM 6CH
I2C
DSP
1매
IRS2053
IRF6645
F
L
F
R
IRS2053
IRF6645
C
T
S
W
IRS2053
IRF6645
R
L
R
R
Flash
AT26DF161
Motor
Driver
AM5766
Pick-up / Loader
SDRAM
12L128168A
THS7374
NTS1124N
HDMI
Power AMP
A- VIDEO
USB
Optic IN
AUX2
MIC
TUNER
i-Pod
AUX1
LC87C5N
SPI
I2C
D+/D-
SPDIF
CEC
M80F0316
UART
EEPROM
24C08
I2C
EEPROM
24C08
I2C
WIRELESS
I2S
4066
4560
FSA2257
SA2011
Touch key
VFD
4WIRE
EEPROM
24C08
I2C
ES8398
VIDEO
PWM
(DAC)
SERVO
ADC
DIR/
USB
TUENR
I2C
I2S
DIGITAL VIDEO
ANALOG VIDEO
PWM 6CH
I2C
DSP
1매
IRS2053
IRF6645
F
L
F
R
IRS2053
IRF6645
F
L
F
R
IRS2053
IRF6645
C
T
S
W
IRS2053
IRF6645
C
T
S
W
IRS2053
IRF6645
R
L
R
R
IRS2053
IRF6645
R
L
R
R
7-1 Overall Block Diagram
Schematic Diagram
The loader reads disc data and it goes through SERVO part in MPEG ic(ES8393). The data from loader will be
decoded by MPEG processing and Video data and Audio data will go out.
The firmware of MPEG ic is programmed to FLASH.
When MPEG is boot up, the data from FLASH is dumpped to SDRAM.
EEPROM will save back-up information from MPEG ic.
The video data goes out in two different ways. Analog video data is going out to composite and component jack via
buffer ic(THS7374), and HDMI video data goes to HDMI jack directly.
The Audio data is going out to Power AMP block. The amp block will process the audio data from MPEG ic and the
sound goes throgh speakers.
AUX2, AUX1, ipod, Tuner and mic data will go through ADC block in MPEG ic. The data from ADC will do the same
processing like SERVO.
USB data from USB device and SPDIF data from optical jack also do the same things.
Audio Micom(LC87C5N) is the HOST controller of the system.
It will control MPEG ic, CEC micom, VFD, Touch key ic, tuner pack, and wireless module.
Samsung Electronics 7-1
This Document can not be used without Samsung’s authorization.
Page 49
Schematic Diagram
7-2 FRONT
POWER
AUDIO
7-2 Samsung Electronics
This Document can not be used without Samsung’s authorization.
Page 50
7-3 TOUCH KEY
POWER
Schematic Diagram
Samsung Electronics 7-3
This Document can not be used without Samsung’s authorization.
Page 51
Schematic Diagram
7-4 MAIN
POWER
AUDIO
7-4 Samsung Electronics
This Document can not be used without Samsung’s authorization.
Page 52
7-5 MPEG
POWER
AUDIO
TP2
Schematic Diagram
TP2
TP6
TP5
TP4
TP3
TP3
TP5
TP4 TP6
Samsung Electronics 7-5
This Document can not be used without Samsung’s authorization.
Page 53
Schematic Diagram
7-6 MICOM
POWER
AUDIO
7-6 Samsung Electronics
This Document can not be used without Samsung’s authorization.
Page 54
7-7 AV I/O
POWER
AUDIO
Schematic Diagram
TP3
TP3
TP4
TP6
TP5
TP4
TP5
TP6
Samsung Electronics 7-7
This Document can not be used without Samsung’s authorization.
Page 55
Schematic Diagram
DTP3
LTDL-RX16S01B
1
JA4
A_GND
PWM_C_P
PWM_SW_P
PWM_RL_P
PWM_RR_P
PWM_FL_P
PWM_FR_P
PWM3_L
PWM3_R
AR23
100OHM
1/16W
10V
1/16W
470OHM
DTP1
DTP2
0.01OHM
5000MA
C257
10UF
2
R340
L45
3.3KOHM
1/16W
FAN_CHK
10OHM
C330
16V
1UF
5267-02A
1SS355-TE-17
2
A_GND
1/16W
10V
10UF
R504
1/16W
FAN_SD
1/16W
10UF
C305
R464
16V
10UF
16V
C307
1/16W
47KOHM
R476
1/16W
R478
IC35
4.7KOHM
C313
16V
18KOHM
S4560
D30
1SS355-TE-17
80V 80V
100KOHM
1/16W
R501
A_GND
R502
33KOHM
1/16W
6
5
3
1
10UF
+12V
R485
4.7KOHM
R503
2SC1008-Y
R465
A_GND
4
LHPR5
10KOHM
1/10W
1/16W
1/16W
LHPR13
1NF
1/16W
LHPC1
LHPR3
1/16W
10KOHM
LHPR8
4.7KOHM
1.8KOHM
LHPR4
1/16W
LHPR12
7.5KOHM
LHPC7
1/16W
50V
680PF
S4560
6
5
2
LHPR14
220UH
1/16W
VAA+5V
8
LHPC9
10UF
1/16W
10KOHM
A_GND
100PF
50V
LHPC12
LHPR15
100PF
50V
LHPC13
7
100OHM
VSS-5V
IC32
LHPC11
A_GND
10UF
22UF
3
DGND
LHPL1
R516
R515
R514
2
1
CN12
C320
R500
8
7
D34
R468
Q29
LHPR16
LHPL2LHPR18
LHPR17
LHPC10
LHPC6
4
3
1
LHPR10
LHPC8
LHPR11
LHPC5
LHPR9
LHPC2
AR20
AR21
AR22
AR24
AR25
1/16W
1W
1/16W
SPDIF_IN
680PF
6.3V
33OHM
4.7KOHM
16V
220UH
A_GND
4.7KOHM
A_GND
1.8KOHM
25V
7.5KOHM
1/16W
1/16W
1/16W
47KOHM
A_GND
100OHM
1/16W
0OHM
1/16W
4.7KOHM
+12V
33OHM
1/16W
PWM1_R
PWM1_L
50V
D5V
1/16W
1/16W
1/16W
100OHM
100OHM
100OHM
1/16W
PWM2_R
PWM2_L
50V
LINE_O_L
LINE_O_R
50V
27OHM
+12V
16V
1/2W
15KOHM
1/16W
1/16W
33KOHM
100OHM
22UF
4.7KOHM
10KOHM
1/16W
A_GND
6.3V
1NF
10UF
3
2
1
VOUT
GND
VCC
IN2+
VEE
OUT2
VCC
IN2-
IN1+
IN1-
OUT1
EBC
IN2+
VEE
OUT2
VCC
IN2-
IN1+
IN1-
OUT1
E
B
C
7-8 AMP
POWER
AUDIO
TP1
TP1
7-8 Samsung Electronics
This Document can not be used without Samsung’s authorization.
Page 56
7-9 Audio AMP-1
POWER
AUDIO
Schematic Diagram
Samsung Electronics 7-9
This Document can not be used without Samsung’s authorization.
Page 57
Schematic Diagram
7-10 Audio AMP-2
POWER
AUDIO
TP1
TP1
7-10 Samsung Electronics
This Document can not be used without Samsung’s authorization.
Page 58
7-11 Audio AMP-3
POWER
AUDIO
Schematic Diagram
TP1
TP1
Samsung Electronics 7-11
This Document can not be used without Samsung’s authorization.
Page 59
Schematic Diagram
7-12 SMPS
7-12 Samsung Electronics
This Document can not be used without Samsung’s authorization.
Page 60
4. Troubleshooting
4-1 Checkpoints by Error Mode
4-1-1 Main Power
No power detected
(Stand by LED off)
Troubleshooting
FR1 is OK?
Yes
CON3 Pin 12, 13, 14 is 5.4V?
Check Main PCB
No
No
Change fuse
ICFB5401 Pin 1 is 2.5V
Check Main PCB
No
Change SMPS.
Samsung Electronics 4-1
Page 61
Troubleshooting
4-1-2 No Sound
No Sound
Check jack Input.
Check JA5 input signals.
Refer to wave pattern
image of Fig. 4-1.
Check AIC4, AIC19 input signals
(AC54, AC55, AC56,
AC1, AC2, AC3)
Refer to wave pattern
image of Fig. 4-2 and
Fig. 4-3.
Check MPEG DAC output
(1.7v offset) (pin 83, 84, 85, 88, 89, 90
of IC10 ES8398)
1
(1khz signal)
No
2
No
3
Check AMP input.
Check MPEG Ouput.
Yes
Yes
Yes
Check speakers.
(speaker change)
Replace AMP IC.
(AIC4, AIC19)
Check DAC output signal lines
between IC10 and AIC4 and
AIC19
Refer to wave pattern
image of Fig. 4-4.
Check DAC3.3V of IC10
Check Power Lines.
(Check IC36).
No
(pin 86)
No
Check MPEG DAC
Power.
Yes
Replace IC10.
4-2 Samsung Electronics
Page 62
Troubleshooting
A_GND
3.3KOHM
1/16W
FAN_CHK
10OHM
C330
16V
1UF
5267-02A
1SS355-TE-17
2
1/16W
10V
10UF
R504
IC35
C313
16V
18KOHM
S4560
1/16W
R501
A_GND
R502
33KOHM
1/16W
6
5
3
1
10UF
+12V
4.7KOHM
R503
4
LHPR13
4.7KOHM
LHPC7
1/16W
50V
680PF
S4560
6
5
2
LHPR14
220UH
1/16W
VAA+5V
8
LHPC9
10UF
1/16W
10KOHM
A_GND
100PF
50V
LHPC12
LHPR15
100PF
50V
LHPC13
7
IC32
LHPC11
22UF
LHPL1
R516
R515
R514
2
1
CN12
C320
R500
8
7
D34
LHPR16
LHPL2LHPR18
LHPR17
LHPC10
4
3
1
LHPC8
1W
6.3V
33OHM
220UH
A_GND
25V
1/16W
1/16W
47KOHM
A_GND
+12V
33OHM
1/16W
50V
27OHM
+12V
1/2W
15KOHM
1/16W
1/16W
33KOHM
22UF
4.7KOHM
10KOHM
1/16W
A_GND
6.3V
1NF
IN2+
VEE
OUT2
VCC
IN2-
IN1+
IN1-
OUT1
EBC
IN2+
VEE
OUT2
VCC
IN2-
IN1+
IN1-
OUT1
ACON1
1
AMP, page 7-8
1
1
MAIN PCB Top, page 6-8
<Fig. 4-1>
Samsung Electronics 4-3
Page 63
IC11
CN1
CN2
AIC4
AIC19
Troubleshooting
2
AUDIO AMP-2, page 7-10
2
2
MAIN PCB Top, page 6-8
<Fig. 4-2>
4-4 Samsung Electronics
Page 64
AIC19
CN5
ACON1
2
Troubleshooting
AUDIO AMP-3, page 7-11
2
2
MAIN PCB Top, page 6-8
<Fig. 4-3>
Samsung Electronics 4-5
Page 65
Troubleshooting
CN4
IC10
IC11
AIC4
IC36
3
MPEG, page 7-5
3
3
MAIN PCB Top, page 6-8
<Fig. 4-4>
4-6 Samsung Electronics
Page 66
4-1-3 Composit (Video out)
Composit (Video out)
Check MPEG output
Troubleshooting
1
Check if VDAC output is
measured at the pin 77 of
IC10 ES8398
Yes
Refer to wave pattern
image of Fig. 4-5.
Check Video switch.
Check if output
is measured at the pin 14
of IC36 THS7374
Yes
Check JACK Output
2
Check if composite video output is
measured at the JA1.
No
No
No
Check if VDD of 3.3V
is measured at the pin 82,
78, 72 of IC10
Yes
Replace the IC10 IC
Check if VDD of
3.3V is measured at the pin
10 of IC36.
Yes
Replace the IC36.
Check the JA1 connectivity
and replace.
No
No
Check if the pin 7, 8
of IC23 are 3.3V.
Replace the IC23 IC.
Check 3.3V power lines
from IC23 to IC36.
Refer to wave pattern
image of Fig. 4-6.
Samsung Electronics 4-7
Page 67
Troubleshooting
CN4
IC10
IC11
CN1
AIC4
IC36
1
MPEG, page 7-5
1
1
MAIN PCB Top, page 6-8
<Fig. 4-5>
4-8 Samsung Electronics
Page 68
IC11
2
Troubleshooting
2
AV I/O, page 7-7
2
MAIN PCB Top, page 6-8
<Fig. 4-6>
Samsung Electronics 4-9
Page 69
Troubleshooting
4-1-4 Component (Y, Pb, Pr)
Component (Y, Pb, Pr)
Check MPEG output
1/2/3
Check if YDAC,CADC
and UDAC output is measured
at the pin 76, 80 and 81 of
IC10 ES8398.
No
Check if VDD of 3.3V is
measured at the pin 82, 78,
72 of IC10.
No
Check if the pin 7, 8 of
IC23 are 3.3V.
Refer to wave pattern
Yes
image of Fig. 4-7 and
Fig. 4-8.
Check Video switch.
4/5/6
Check if output is measured
at the pin of 11,13 and 12 of
IC36 THS7374.
Refer to wave pattern
Yes
Check if component
video output is measured at
the JA1.
image of Fig. 4-9 and
Fig. 4-10.
Check JACK Output
No
No
Yes
Replace the IC10 IC.
Check if VDD of 3.3V
is measured at the pin
10 of IC36.
Yes
Replace the IC36.
Check the JA1 connectivity
and replace.
No
Replace the IC23 IC.
Check 3.3V power lines
from IC23 to IC36.
4-10 Samsung Electronics
Page 70
IC10
IC11
AIC4
IC36
2
Troubleshooting
1
2
1
MPEG, page 7-5
1
2
MAIN PCB Top, page 6-8
<Fig. 4-7>
Samsung Electronics 4-11
Page 71
Troubleshooting
IC10
IC11
AIC4
IC36
3
MPEG, page 7-5
3
3
MAIN PCB Top, page 6-8
<Fig. 4-8>
4-12 Samsung Electronics
Page 72
IC11
IC36
5
Troubleshooting
4
5
AV I/O, page 7-7
4
4
5
MAIN PCB Top, page 6-8
<Fig. 4-9>
Samsung Electronics 4-13
Page 73
Troubleshooting
IC11
IC36
6
6
AV I/O, page 7-7
6
MAIN PCB Top, page 6-8
<Fig. 4-10>
4-14 Samsung Electronics
Page 74
4-1-5 HDMI Video
Troubleshooting
Analog (Composite)
Video OK but HDMI
Check jack Input.
Check Pin 117, 118, 120,
121, 123, 124, 126, 127
Refer to wave pattern
image of Fig. 4-11.
Check IC11 power
Check if 480p output
1
of IC10
No
(3.3V)
No
Is ok.
Yes
Check AMP input.
Yes
Check MPEG Ouput.
Yes
Check HDMI POWER
supply.
(PLL_3.3V, VDD1.2v)
Check 3.3V power lines
Replace MPEG IC
No
Check Voltage pin110
pin of IC10
(1.5V~1.8V)
No
Replace MPEG IC
Yes
Yes
Check PLL3.3V lines and
VDD1.2V lines and R150,
R151, R152 value.
Please, Call to Samsung
A/S Center.
Samsung Electronics 4-15
Page 75
Troubleshooting
IC10
IC11
AIC4
IC36
1
3
3
1
MPEG, page 7-5
1
MAIN PCB Top, page 6-8
<Fig. 4-11>
4-16 Samsung Electronics
Page 76
Troubleshooting
4-2 Measures to be taken when the Protection Circuit operates
4-2-1 SMPS Protection
The Condition of Power Protection Active.
1. Voltage of SMPS’s +, - PVDD (+30V, -30V) is higher or lower than Standards
Normal Condition Voltage Range: PVDD (+30V, -30V): about +30V, -30V
2. Over-current occurs to FET (Over-output or Output short)
3. FET’s temperature exceed 150°C.
4. No supply voltage on GATE DRIVER.
4-2-2 AMP Pre-Inspection relating to Power Protection
If you think, there are problems at the AMP PCB, you can check the pcb without disassemble the set.
(Caution!!: Do not connect the power cord during bellow test!)
Measurement Resistance using Tester
C550
F/R CH
CENTER
SUBWOOFER
<Table 4-1>
If Measured Resistance is very different from above numbers. There is a Problem.
→AMPPCBProblem
1.8Ω 1.8Ω 1.8Ω
1.8Ω 1.8Ω 1.8Ω
1.8ΩΩ 1.8Ω 1.8Ω
C650 C450
5.1CH SPEAKER OUTPUT
FRONT R CENTER FRONT L
GND
- Approximately
REAR R REAR L
Samsung Electronics 4-17
SUBWOOFER
Page 77
Troubleshooting
4-3 MICOM, MPEG Initialization & Update
Micom initial
In no Disc condition, press ‘STOP’ button of Main Unit more than 5 seconds, VF Display will happen to INIT and M
int. Then Initialization complete.
Micom Update
1. Prepare or Make a DISC-CD or DVD or USB that contains “C550WWM.SSP’ file for update.
2. Play the USB, then “updating” will appear on the screen, then Power will go out after showing ‘complete’ on the
screen.
3. Press “Power” key and Press ‘Stop’ button of the remote control more than 5 seconds in No Disc.
<Fig. 4-12 Connecting USB>
<Fig. 4-13 TV Display (On Updating)>
<Fig. 4-14 Update Start>
4-18 Samsung Electronics
Page 78
Checking out MICOM & MPEG flash Version
1. On Root state, Select ‘Set up’.
2. Press “Enter” and move Support.
3. Press “Enter”.
4. Check product information: “SW ver” on TV Display and “Micom SW Ver” on Front ASS’y VFD.
Troubleshooting
<Fig. 4-15 Connecting USB>
<Fig. 4-16 TV Display (On Updating)>
<Fig. 4-17 Update Start>
Samsung Electronics 4-19
Page 79
Troubleshooting
DVD flash Initialization & Update
1. Prepare a DISC-CD or DVD or USB that contains ‘C550WWB.ROM’ file for Update.
2. Play the DISC or USB, then ‘Updating’ will appear on the screen, then Power will go out and on.
3. Then DISC-TRAY will open, then remove the DISC or USB, making the Unit as ‘NO DISC’ state.
4. Press ‘STOP’ button of Main Unit for more than 5 seconds, Display Indicator shows ‘INITIALIZE’ then Power
goes out.
<Fig. 4-18 Connecting USB>
<Fig. 4-19 TV Display (On Updating)>
<Fig. 4-20 Update Start>
4-20 Samsung Electronics
Page 80
4-4 Buyer-Region Code Setting Method
4-4-1 The inserting method of Region Code after replacing the Main PBA
[Reference]
- When replacing the Main PBA and System Micom should be inserted the region code.
- The set is not working properly if you don't insert the region code.
- The region code is inserted by the remote control.
1. Press the “AUX” button on the remote control.
Troubleshooting
2. Press the "TUNER MEMORY" button on the remote control during
4~5 seconds.
3. After step (2), you can see “TEST” on the VFD.
4. When you see “TEST” on VFD, Insert number “4”, “6” to start
Region Code setting mode.
TEST
Samsung Electronics 4-21
Page 81
Troubleshooting
5. Afterstep(4),youcansee“−−”ontheVFD.
Insert the Region Code (Below table) corresponding model with
“0 ~ 9” buttons on the remote control.
Option Table
− −
Area
HT-C550
Region Code
Africa / Pakistan 00
Brazil 01
Canada 02
China (semi_mic) 03
Europe 04
Indonesia / Hongkong 05
Japan 06
Korea 07
Latin American 08
Mexico 09
Philippines 10
Russia (full_mic) 11
Russia (semi_mic) 12
HT-C650
Region Code
30
31
32
33
34
35
36
37
38
39
40
41
42
HT-C450
Region Code
60
61 C460 - 90
62
63
64
65
66
67
68
69
70
71
72
Remark
South Africa 13
Taiwan 14
USA 15
Newzealand 16
England 17
Australia 18
Iran (HACO) 19
India 20
Israel 21
Middle Asia 22
Asia 23
Singapore 24
43
44
45
46
47
48
49
50
51
52
53
54
<Table 4-2>
73
74
75 C460 - 91
76
77
78
79
80
81
82
83
84
4-22 Samsung Electronics
Page 82
Troubleshooting
6. After step (5), you can see “15 USA” on the VFD.
It means that currently System Micom program is installed by USA
specification.
7. Turn the Power off.
[Tip]
In case of System Micom and EEPROM problem, you can apply to this.
For example, during Updating program of System Micom, if Updating fail is happened, it is impossible to turn on
the system from stand-by status.
The system will keep the stand-by status continuously, and the touch-key function will never work.
In this case, you have to change System Micom, and set up the Buyer Region code again.
In case of EEPROM, you don't need to care about it.
After set-up the Region code, System Micom will store the information of the region code to EEPROM
automatically.
15 USA
Samsung Electronics 4-23
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