Samsung HPL63H1XXAA D52A Schematic

PLASMA DISPLAY TV
Chassis : D52A Model: HPL63H1X/XAA
PLASMA DISPLAY TV CONTENTS
Precautions
Reference Information
Specifications
Alignment and Adjustments
Circuit Operation Description
Troubleshooting
Handling Description
Glossary
Schematic Diagrams
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
ELECTRONICS
© Samsung Electronics Co., Ltd. JAN. 2003
Printed in Korea
AA82-00355A
1. Precautions
1-1 Safety Precautions
1. Be sure that all of the built-in protective devices are replaced. Restore any missing protective shields.
2. When reinstalling the chassis and its assemblies, be sure to restore all protective devices, including: nonmetallic control knobs and compartment covers.
3. Make sure that there are no cabinet openings through which people—particularly children—might insert fingers and contact dangerous voltages. Such openings include the spacing between fornt cabinet and back cabinet, excessively wide cabinet
ventilation slots, and improperly fitted back
covers.
4. Leakage Current Hot Check (Figure 1-1): Warning: Do not use an isolation transformer during this test. Use a leakage­current tester or a metering system that complies with American National Standards Institute (ANSI C101.1, Leakage Current for Appliances), and Underwriters Laboratories (UL Publication UL1950.5.2).
5. With the unit completely reassembled, plug the AC line cord directly into the power outlet. With the unit’s AC switch first in the ON position and then OFF, measure the current between a known earth ground (metal water pipe, conduit, etc.) and all exposed metal parts, including: antennas, handle brackets, metal cabinets, screwheads and control shafts. The current measured should not exceed 3.5 milliamp. Reverse the power­plug prongs in the AC outlet and repeat the test.
Fig. 1-1 AC Leakage Test
6. Antenna Cold Check: With the unit’s AC plug disconnected from the AC source, connect an electrical jumper across the two AC prongs. Connect one lead of the ohmmeter to an AC prong. Connect the other lead to the coaxial connector.
Precautions
Samsung Electronics 1-1
LEAKAGE CURRENT
TESTER
DEVICE UNDER
TEST
TEST ALL
EXPOSED METAL
SURFACES
3-WIRE CORD
ALSO TEST WITH PLUG REVERSED
(USING AC ADAPTER
PLUG AS REQUIRED)
EARTH
GROUND
(READING SHOULD
NOT BE ABOVE
3.5mA)
Follow these safety, servicing and ESD precautions to prevent damage and protect against potential hazards such as electrical shock and X-rays.
1-2 Safety Precautions (Continued)
7. High voltage is maintained within specified limits by close-tolerance, safety-related components and adjustments. If the high voltage exceeds the specified limits, check each of the special components.
8. Design Alteration Warning: Never alter or add to the mechanical or electrical design of this unit. Example: Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard. Also, any design changes or additions will void the manufacturer’s warranty.
9. Hot Chassis Warning: Some TV receiver chassis are electrically connected directly to one conductor of the AC power cord. If an isolation transformer is not used, these units may be safely serviced only if the AC power plug is inserted so that the chassis is connected to the ground side of the AC source.
To confirm that the AC power plug is inserted correctly, do the following: Using an AC voltmeter, measure the voltage between the chassis and a known earth ground. If the reading is greater than 1.0V, remove the AC power plug, reverse its polarity and reinsert. Re-measure the voltage between the chassis and ground.
10. Some TV chassis are designed to operate with 85 volts AC between chassis and ground, regardless of the AC plug polarity. These units can be safely serviced only if an isolation transformer inserted between the receiver and the power source.
11. Some TV chassis have a secondary ground system in addition to the main chassis ground. This secondary ground system is not isolated from the AC power line. The two ground systems are electrically separated by insulating material that must not be defeated or altered.
12. Components, parts and wiring that appear to have overheated or that are otherwise damaged should be replaced with parts that meet the original specifications. Always determine the cause of damage or overheat­ing, and correct any potential hazards.
13. Observe the original lead dress, especially near the following areas: Antenna wiring, sharp edges, and especially the AC and high
voltage power supplies. Always inspect for pinched, out-of-place, or frayed wiring. Do not change the spacing between components and the printed circuit board. Check the AC power cord for damage. Make sure that leads and components do not touch thermally hot parts.
14. Product Safety Notice: Some electrical and mechanical parts have special safety-related characteristics which might not be obvious from visual inspection. These safety features and the protection they give might be lost if the replacement compo­nent differs from the original—even if the replacement is rated for higher voltage, wattage, etc.
Components that are critical for safety are indicated in the circuit diagram by shading, ( ) or ( ).
Use replacement components that have the same ratings, especially for flame resistance and dielectric strength specifications. A replacement part that does not have the same safety characteristics as the original might create shock, fire or other hazards.
15. Littum battery replace warning: Danger of explosion if battery is incorrectly replaced, Replace only with the same or eqivalent type.
Precautions
1-2 Samsung Electronics
“CAUTION, Double-pole/neutral fusing”
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by the manufacturer. Dispose of used batteries according to the man­ufacturer’s instructions.
1-3 Servicing Precautions
1. Servicing precautions are printed on the cabinet. Follow them.
2. Always unplug the unit’s AC power cord from the AC power source before attempting to: (a) Remove or reinstall any component or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a test component in parallel with an electrolytic capacitor.
3. Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes used. The internal wiring is sometimes clamped to prevent contact with thermally hot components. Reinstall all such elements to their original position.
4. After servicing, always check that the screws, components and wiring have been correctly reinstalled. Make sure that the portion around the serviced part has not been damaged.
5. Check the insulation between the blades of the AC plug and accessible conductive parts (examples: metal panels, input terminals and earphone jacks).
6. Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies) unless all solid-state heat sinks are correctly installed.
7. Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the positive lead; always remove the instrument’s ground lead last.
8. Plasma display panels have partial afterim­ages when a same picture continues to be dis­played for a certain time. This happens due to the degradation of brightness caused by a scale-down effect. To prevent such afterimages when displaying a same picture for a certain time, be sure to reduce the level of brightness and contrast. ex) Contrast : 50 or 75, Brightness : 25
9. Plasma display is an array of pixels(cells). Therefore, if at least 99.9% pixels keep normal, the appropriate panel is judged as ‘approved product.’ Even though some of pixels keep luminescent or always light off, do not worry because the panel is approved.
Precautions
Samsung Electronics 1-3
Warning 1 : First read the “Safety Precautions” section of this manual. If some unforeseen circumstance creates a
conflict between the servicing and safety precautions, always follow the safety precautions.
Warning 2 : An electrolytic capacitor installed with the wrong polarity might explode.
1-4 Precautions for Electrostatically Sensitive Devices (ESDs)
1. Some semiconductor (“solid state”) devices are easily damaged by static electricity. Such components are called Electrostatically Sensitive Devices (ESDs); examples include integrated circuits and some field-effect transistors. The following techniques will reduce the occurrence of component damage caused by static electricity.
2. Immediately before handling any semicon ductor components or assemblies, drain the electrostatic charge from your body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to remove it prior to applying power— this is an electric shock precaution.)
3. After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent accumulation of electrostatic charge.
4. Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs.
5. Use only a grounded-tip soldering iron when soldering or unsoldering ESDs.
6. Use only an anti-static solder removal device. Many solder removal devices are not rated as “anti-static”; these can accumulate sufficient electrical charge to damage ESDs.
7. Do not remove a replacement ESD from its protective package until you are ready to install it. Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam, aluminum foil or other conductive materials.
8. Immediately before removing the protective material from the leads of a replacement ESD, touch the protective material to the chassis or circuit assembly into which the device will be installed.
9. Minimize body motions when handling unpackaged replacement ESDs. Motions such as brushing clothes together, or lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.
Precautions
1-4 Samsung Electronics
CAUTION
These servicing instructions are for use by qualified service personnel only. To reduce the risk of electric shock do not perform any servicing other than that contained in the operating instructions unless you are qualified to do so.
Reference Information
Samsung Electronics 2-1
2. Reference Information
2-1 Tables of Abbreviations and Acronyms
A Ah Å dB dBm
°C °F °K F G GHz g H Hz h ips kWh kg kHz k km km/h kV kVA kW I MHz
Ampere Ampere-hour Angstrom Decibel Decibel Referenced to One Milliwatt Degree Celsius Degree Fahrenheit degree Kelvin Farad Gauss Gigahertz Gram Henry Hertz Hour Inches Per Second Kilowatt-hour Kilogram Kilohertz Kilohm Kilometer Kilometer Per Hour Kilovolt Kilovolt-ampere Kilowatt Liter Megahertz
MV MW M m µA µF µH µm µs µW mA mg mH mI mm ms mV nF
pF Ib rpm rps s V VA W Wh
Megavolt Megawatt Megohm Meter Microampere Microfarad Microhenry Micrometer Microsecond Microwatt Milliampere Milligram Millihenry Milliliter Millimeter Millisecond Millivolt Nanofarad Ohm Picofarad Pound Revolutions Per Minute Revolutions Per Second Second (Time) Volt Volt-ampere Watt Watt-hour
Table 2-1 Abbreviations
Reference Information
2-2 Samsung Electronics
Table 2-2 Table of Acronyms
ABL AC ACC AF AFC AFT AGC AM ANSI APC APC A/V AVC BAL BPF B-Y CATV CB CCD CCTV Ch CRT CW DC DVM EIA ESD ESD FBP FBT FF FM FS GND G-Y H HF HI-FI IC IC IF
Automatic Brightness Limiter Alternating Current Automatic Chroma Control Audio Frequency Automatic Frequency Control Automatic Fine Tuning Automatic Gain Control Amplitude Modulation American National Standards Institute Automatic Phase Control Automatic Picture Control Audio-Video Automatic Volume Control Balance Bandpass Filter Blue-Y Community Antenna Television (Cable TV) Citizens Band Charge Coupled Device Closed Circuit Television Channel Cathode Ray Tube Continuous Wave Direct Current Digital Volt Meter Electronics Industries Association Electrostatic Discharge Electrostatically Sensitive Device Feedback Pulse Flyback Transformer Flip-Flop Frequency Modulation Fail Safe Ground Green-Y High High-Frequency High Fidelity Inductance-Capacitance Integrated Circuit Intermediate Frequency
I/O L L LED LF MOSFET MTS NAB NEC NTSC OSD PCB PLL PWM QIF R RC RF R-Y SAP SAW SIF SMPS S/N SW TP TTL TV UHF UL UV VCD VCO VCXO VHF VIF VR VTR VTVM TR
Input/output Left Low Light Emitting Diode Low Frequency Metal-Oxide-Semiconductor-Field-Effect-Tr Multi-channel Television Sound National Association of Broadcasters National Electric Code National Television Systems Committee On Screen Display Printed Circuit Board Phase-Locked Loop Pulse Width Modulation Quadrature Intermediate Frequency Right Resistor & Capacitor Radio Frequency Red-Y Second Audio Program Surface Acoustic Wave(Filter) Sound Intermediate Frequency Switching Mode Power Supply Signal/Noise Switch Test Point Transistor Transistor Logic Television Ultra High Frequency Underwriters Laboratories Ultraviolet Variable-Capacitance Diode Voltage Controlled Oscillator Voltage Controlled Crystal Oscillator Very High Frequency Video Intermediate Frequency Variable Resistor Video Tape Recorder Vacuum Tube Voltmeter Transistor
Specifications
Samsung Electronics 3-1
3. Specifications
MODEL
SCREEN SIZE
3-1 Display(PDP Monitor)
Display
Remote Control
Display
Remote Control
Power Consumption
Voltage
RGB input
VIDEO input
Dimensions
(mm/inch)
Weight
HPL6315
1393(H) x 783(V)/54.86 x 30.84
1566(W) x 89(D) x 912.5(H) mm/61.65(W) x 3.5(D) x 35.93(H) Inches
54(W) x 31.5(D) x 220(H)mm/2.13(W) x 1.24(D) x 8.66(H) Inches
72Kg/158.73Ibs
150g(including batteries)/0.33Ibs
AC120V 60Hz
725W
RGB1 : MINI D-SUB 15P
RBG2 : BNC (R/G/B H(CS)/V)
VIDEO : ANALOG 0.714VPP/75 (Terminated)
SYNC(H,V)
VIDEO : 1.0VPP/75 (BNC)
S-VIDEO : Y -> 1.0VPP/75
C -> 0.28V
PP/75
COMPONENT (Y/Pb/Pr) : Y -> 1.0V
PP/75
Pb -> 0.7vPP/75
Pr -> 0.7VPP/75
3-2 Samsung Electronics
MEMO
Alignment and Adjustments
Samsung Electronics 5-1
5. Alignment and Adjustments
5-1 Service Mode
5-1-1 SERVICE MODE ENTRY METHOD (General Transmitter)
1. Turn off the power to make the SET STAND-BY mode.
2. In order to enter the Service Mode, select MUTE-1-8-2-POWER.
In case entry into SERVICE MODE is unsuccessful, repeat the procedures above.
5-1-2 Initial DISPLAY State in times of SERVICE MODE Switch overs
PW364
INITIAL DISPLAY
SDA92 80 VPC3230 SDA9400
1, PW
364
2, SD
A9280
3, V
PC3230
4, SD
A9400
5, C
XA2101
6, A
D9884
7, O
SD POSITION
8, O
PTION
9, R
ESET
10, A
GING
H
orizonta lSize
V
er tical Horizontal Ve r t i ca l
Si
ze
Pos
Pos
CTIT
HRESH
CTIT
RAWID
Y- D
ELAY
L
PF GA IN
B
PF GAIN
H
PF GA IN
PH
ACOM
C
OR
B
RIGHT YUV
C
ONT YUV
I
FCOMP
ChromaB
and
L
uma LPF
H
PLL Speed
L
uma Delay
3230 Bri
ght
3230 C
ontr ast
HL
PF Y/ C
L
PF Chroma
HHPeak Fil
ter
PeakingG
ain
C
oaring off/ on
O
UT DELAY
TNRCLY
CLY
TNRCLC
CLY
ST
OP MODE
Alignment and Adjustments
5-2 Samsung Electronics
5-1-3 Buttons Operations within SERVICE MODE
#Notice
The existing service data may be deleted after downloading a program. Be sure to make a backup copy of your data before downloading and then restore the data after completing the download.
Menu
Channel UP/DOWN
Volume UP/DOWN
Entire menu display Cursor move to select items Enable to increase and decrease the data of the selected items
Limit Level Sys tem D-Color R-DRIVE
-DRIVE
G
-DRIVE
B R-Cutoff G-Cutoff
-Cut off
B ABL MODE ABL TH HSEPSEL CONT RAST BRI GHT CR OFFSET CB
OFFS ET1
CXA2101 AD9884
DRIVE SUB BRIGHT SUB CONT SUB COLOR SUB HUE SUB SHP R-Y/R R-Y/B GG-Y/R
-Y/B
P
ABL LEVEL
SHP FO PRE/OVER CTI LEVEL
1
LTI LEVEL DC - TRAN D-PIC
RED
Gain GREEN BLUE
OFFSET
RED GREEN BLUE GAIN DRIVE OFFSET DIRVE V CONTRAST V BRIGHT PHASE
CHANGE PUMP
Gain
Gain
OFFSET
OFFSET
OSD
POSITION
HORIZ VE RT
OP TION
1, BACK GR OUN D COLOR
SHIFT PIXEL
2,
PIXEL SHIFT
3,
PIXEL SHIFT
4,
FAN PROTECT
5,
TEMP
6, 7, 8, BASE LANGUAGE
PROTECT
SHARPNESS
MIN SEC
Alignment and Adjustments
Samsung Electronics 5-3
5-1-4 White Balance Adjust Method
1. Press MUTE-1-8-2-POWER to enter the factory mode.
2. Enter AD9884
3. Adjust LOW coordinates as R, B OFFSET and HIGH coordinates as R, B GAIN.(GREEN is fixed.)
4. In AD9884, adjust brightness with V CONTRAST / V BRIGHT for VIDEO / DTV, and adjust with GAIN DRIVE / OFFSET DRIVE for PC.
1. VIDEO MODE (SPR-3100, input TOSHIBA PATTERN)
2. DTV MODE (SPR-3100, input TOSHIBA PATTERN)
A
dj ustme
nt
Adjustme
nt
Coor dinates
Coor dinates
Value
Deviation
A
dj ustme
nt
Adjustme
nt
Coor dinates
Coor dinates
Value
Deviation
H
-LIGHT
-LIGHT
x:286 y
:
274
Y
:
18.7(fL)
3 3 3
L
H-LIGHT
-LIGHT
L
x:278 y
:
272
Y
:0.53(f L)
(f L)
5 5
0. 1
x:288 y
:
277
Y: 16.1
Y:
3 3 3
x:280 y
:277
0.71
5 5
0. 1
- W/B Adjustment SPEC (Suwom Factory Toshiba PATTERN)
Alignment and Adjustments
5-4 Samsung Electronics
2. PC MODE (VG828, input TOSHIBA PATTERN)
A
dj ustme
nt
Adjustme
nt
Coor dinates
Coor dinates
Value
Deviation
H-LIGHT
-LIGHT
L
x:287 y:288 Y: 21.3(fL)
Y:
x:287 y:294
2.17
3 3 3
5 5
0. 1
Alignment and Adjustments
Samsung Electronics 5-5
5-1-5 SCALAR FACTORY DATA DEFAULT VALUES
Alignment and Adjustments
5-6 Samsung Electronics
Alignment and Adjustments
Samsung Electronics 5-7
5-8 Samsung Electronics
Alignment and Adjustments
HPL6315
VGA
1
2 3 4
5 6 7
8 9
10
11 12 13
14
Video signal Dot X Line
640 X 350
640 X 400
VGA
WVGA
720 X 400
640 X 480
848 X 480
Vertical
Frequency (Hz)
70.086
85.080
85.080
70.087
85.039
59.940
72.809
75.000
85.008
60.000
72.000
75.000
85.000
56.250
Horizontal
Frequency (kHz)
31.469
37.861
37.861
31.469
37.927
31.469
37.861
37.500
43.269
29.838
35.156
36.072
37.650
42.925
Vertical
polarity
N
N
P
P
P
N
N
N
N
P
P
P
P
N/P
Horizontal
polarity
P
P
N
N
N
N
N
N
N
N
N
N
N
N/P
15 16
17 18 19
20 21 22
23 24
25
26 27
SVGA
XGA
WXGA
SXGA
800 X 600
1024 X 768
1152 X 864
1280 X 768
1280 X 1024
60.317
72.188
75.000
85.061
60.004
70.069
75.029
84.997
75.000
60
75
60.020
75.025
37.879
48.077
46.875
53.674
48.363
56.476
60.023
68.677
67.500
47.700
60.150
63.981
79.976
P
P
P
P
N
N
P
P
P
P
P
P
P
P
P
P
P
N
N
P
P
P
N
N
P
P
Alignment and Adjustments
Samsung Electronics 5-9
5-2 Adjusting the Discharge Voltage Of the Main Unit While Replacing ASS'Y (Body Part)
Turning the variable resistor clockwise reduces voltage except VG, V9, and VR(6).
SMPS
OUT PUT Voltage(V)
1. V A
1. V FAN
3. SIGNAL
V5D
VFAN
VAMP
1. V SB
4. V 5A
11. V 12A
12. V 5D1
1. V 5D
3. V 5D
V5D1
VSET
VSCAN
VA
1. V A
2. V A
2. V A
1. V 5D
3. V G
5. V SCAN
7. V E
11. V S
12. V S
13. V S
VE
1. V 5D
3. V G
5. V E
7. V SCAN
10. V S
11. V S
12. V S
VS
VS 168 VE 183 VA 70
VSET 190
VSCAN 80
V5D 5
VFAN 12
VAMP 9
V5D1 5
V5A 5
V12A 12
VSB 5
V12A
V5A
VSB
1. V 5A
3. V 9A
4. V 12A
6. V AMP
7. V AMP
Alignment and Adjustments
5-10 Samsung Electronics
Alignment and Adjustments
5-3 Fault Finding Using MULTI METER
Parts defects can be found for DIODE TRANSISTOR IC, using MULTI TEST including Forward/Reverse direction Multi Test. Of course, in case resistance of several ohms and COIL are connect­ed in parallel circuit, the lock out circuit parallel connected to part must be severed.
1.DIODE
2. TRANSISTOR
For NPN(KSC815-Y, 2SC2068, 2SC2331-Y)
For PNP(KSA539-Y)
Forward Direction Hundreds of ohms
Reverse Direction
Infinity
Between Anode and Cathode
C (COLLECTOR)
E
B(BASE)
BC
C (COLLECTOR)
E
B(BASE)
BC
E (EMITTER)
E (EMITTER)
Forward Direction Hundreds of ohms Hundreds of ohms
Infinity
Reverse Direction
Infinity Infinity Infinity
Between B and E
Between B and C
Between E and C
Forward Direction Hundreds of ohms Hundreds of ohms
Infinity
Reverse Direction
Infinity Infinity Infinity
Between B and E
Between B and C
Between E and C
+- +-
Alignment and Adjustments
Samsung Electronics 5-11
Alignment and Adjustments
3. IC (INTEGRATED CIRCUIT)
IC has built in DIODE against overvoltage in PIN. Generally, except for internal circuit defects, IC defects can be found, by measuring the DIODE.
Defects have SHORT(0 ohm) for both forward and reverse direction.
Hundreds of ohms
Forward Direction
Reverse Direction
Varying depending on IC but generally normal Infinity in DIODE TEST MODE
5-12 Samsung Electronics
MEMO
Circuit Operation Description
Samsung Electronics 6-1
6. Circuit Description
6-1 Power supply
6-1-1 Outline(PDP SMPS)
Considering various related conditions, the switching regulator with good efficiency and allowing for its small size and light weight was used as the power supply for PDP 50inch, VS requiring high power con­sumption used forward converter and 12VSAMP used the simple flyback converter and other high voltage (VSCAN,VSET,VE)used DC/DC converter. To comply with the international harmonics standards and improve the power factor, active PFC(Power Factor Correction) was used to rectify AC input into +400V DC output, which in turns used as input to the switching regulator.
6-1-2 63"HD SMPS Specification
(1) Input
The PDP-PS-421S board should be designed so that the AC power supply within the 100VAC (common) to 150VAC and the input frequency within 50/60Hz can be applied.
(2) Output
The PDP-PS-421S board converts the AC Voltages (+165Vs1, +75Va, +185Ve, +5Vd, +12Vcc, +6Vsp,
+9Vsp, +9Vcc, +12Vfan, +5Vd1, +5Va, +220Vset, +75Vscan, +18Vg) into the DC Voltages. The usage and specification of each output is as shown in Table 1. Table 1 shows the power supplies for PDP SMPS.
Table1. Specifications of Output Power Supplies for PDP SMPS
165Vs 75Va 185Ve 220Vset 75Vscan 5Vd 18Vg 5Vdl 5Va 9Vcc 12Vcc 6Vsp 12Vfan 5Vsb
165V ± 1%
75V ± 1% 185V ± 1% 220V ± 1%
75V ± 1%
5.2V ± 1% 18V ± 5%
5.2V ± 1%
5.2V ± 1%
9.2V ± 5%
12.2V ± 5% 6V ± 5%
11V ~ 14V
5.2V ± 1%
160V ~ 190V
60V ~ 85V 170V ~ 200V 200V ~ 250V
60V ~ 90V
4.5V ~ 5.5V
-
4.5V ~ 5.5V
-
-
-
3V ~ 24V
-
5.0V ~ 5.4V
0.2
0.2
0.01
0.01
0.01
0.3
0.07
0.2
0.1
0.07
0.07
0.25
0.1
0.1
2.0
2.0
0.1
→ → → → → → → →
2.5
1.0
0.2
0.2
0.01
0.01
0.01
0.3
0.07
0.2
0.1
0.07
0.07
0.25
0.1
0.1
Output
Voltage
(V)
Voltage Setting
(Normal Load)
Output
Voltage
Variable Point
Output Current(A)
Min Non Max
Circuit Operation Description
6-2 Samsung Electronics
(3) FUNCTION OF BOARD
1) Remote control Using 120V/10A relay, the board makes remote control available.
2) Voltage The board designed so that input voltage can be used within 100 VAC to 150VAC.
3) Improvement of power factor The board is designed using PFC circuit so that PF (Power Factor) can be over 0.95, because low PF can be a problem in high voltage power.
4) Protection The OCP (Over Current Protection), the OVP (Over voltage Protection), and the Short Circuit Protection functions are added against system malfunction.
(4) BLOCK DIAGRAM
This product can be defined as a power supply device (Input power: AC110/220V), consists of
Inrush Current Limit Circuit on Input and Power Factor Correction circuits, VS, VA, and VI Block, providing the power (current) required for PDP Panel discharges and external circuits. PFC circuit utilizes Discontinuous Current Mode ( DCM) that produces a high efficiency. And, an input EMI filter circuit is equipped on the exterior.
1) PFC Block Boost Discontinuous Current Mode (DCM) PFC circuit is used for PFC (Power Factor Correction), where a common PWM IC gives an easy control, a simple circuit onfiguration, and a high efficiency. The circuit operates as described as following:RELAY is to be operated by inputting initial Relay “ON” while the resistance for Inrush Current Limit charges a capacitor of PFC Output Terminal. If the charged voltage of the capacitor goes over 340V, a comparator of PFC circuit controller activates VA Block and Relay for Inrush Current Limit. Thereafter, PFC circuit initiates a normal operation. PFC circuit has output, voltage, current limit circuits for placing a restriction on switching current, and protective (safeguard) circuits against output over-voltage. The over-voltage induces input Terminal Relay to be “OFF” with the set shut down.
2) Vs Block supplies the sustain power closely related to PDP Panel and includes 165Vs and 185Ve employing a Full-bridge circuit as Topology. In order to insulate gate signal, Driver at the secondary side based on properties of the pulse type of load. 185Ve power utilizes a variable Regulator for sub-output of 165Vs power, which is supplied to the load being added to 165Vs power. 70kHz is applied for switching frequency that has the Sequence operated after rising 5Vd power.
Table 2. Security function SPEC required for PDP SMPS
Division
+165Vs + 75Va
OCP Current
5 ~ 7A 3 ~ 4A
OVP Voltage
190 ~ 220V
85 ~ 100V
UVP Voltage
135 ~ 145V
50 ~ 65V
Short Circuit
OK OK
Circuit Operation Description
Samsung Electronics 6-3
Vs Switching Pulse(Pulse for power board operation only)
Va Switching Pulse(Pulse for Set ON)
Circuit Operation Description
6-4 Samsung Electronics
3) Va Block Va Block consists of address voltage suppliers (75Va, 220Vset, and 75Vscan), VCCs that supply a power to logic circuit, and 12V fan; the power of cooling Fan of 18Vg. PDP Set that provides Gate voltages of drive circuit. It utilizes a Forward circuit mode as TOpology. 75Vscan uses 75Va power to construct not only stable but, if needed, also variable DC/DC Converter while 220Vset, also variable if wanted, is applied by adding 165Vs power to the power generated from Buck Converter with 75Va power. 5Vd and 12Vsp power can be generated by Buck Converter with the power gained through Coupling in Transformer, and 18Vg by Linear Regulator. The switching frequency is 70kHz.
Va Switching Pulse(Pulse for Set ON)
4) Block VI Block consists of voltage suppliers for image circuits (5Va, 9Vcc, 12Vcc, and 5Vd1), and a Flyback circuit mode is applied as Topology. Feedback for voltage stability is designed for 5Vd1, 5Va, 9Vcc, 12Vcc, and 5Vd1 powers anr generated by using each Linear Regulator for the power gained through Coupling in Transformer. The switching frequency is 100kHz.
Circuit Operation Description
Samsung Electronics 6-5
VI Switching Pulse(Pulse for power board operation only)
VI Switching Pulse(Pulse for Set ON)
Circuit Operation Description
6-6 Samsung Electronics
6-1-3 Pin Assignment
Image Board
NO OUT PUT
1 2 3
4 5 6
7 8 9
10 11 12
13
+5V
GND(D)
GND(D)
+5V
RELAY
THDET
FAN GND GND
N.C +12V
+5V
N.C
LOC
VSB
V5(D)
V12
V5(D)
SX(X Driver)
OUT PUT
NO
1 +5V 2 3 4
5
6 7
8
9 10 11 12
13
GND +18V GND
70V
GND
230V N.C
GND GND 165V 165V
165V
LOC
V5(D)
VG
VSCAN
VS VS
VS
SY (Y Drive)
NO
OUT PUT
1 +5V(D) 2 3 4
5
6 7
8
9 10 11 12
GND(D)
+18V
GND
200V
GND
70V GND GND
165V 165V
165V
LOC
V5(D)
VG
VE
VSCAN
VS VS VS
Speaker
NO OUT PUT
1 2
3 4 +12V V12
5 GND 6 VSAMP 7 VSAMP 8
9
+5V GND
+9V
+6V +6V
GND GND
LOC LOC
V9
Buffer(2EA) SL(Logic)
NO OUT PUT
1 2 3 4
NO OUTPUT
1 +12V VFAN 2 GND
+70V +70V
GND GND
Fan(3EA)
VA VA
LOC
NO
1 2
3 4
OUT PUT
+70V +70V
GND GND
LOC
Circuit Operation Description
Samsung Electronics 6-7
6-1-4 SMPS Block diagram
AC
INPUT
PFC
VS
BLOCK
VA
BLOCK
Reg.
DC/DC
DC/DC
Reg.
BUCK
BUCK
GND
GND
GND
GND
GND
GND
GND
GND
GND
185VE
165VS
220VET
75VSCAN
75VA
18VG
5VD
6VSP
12VFAN
AC
INPUT
VI
BLICK
Reg.
Reg.
Reg.
GND
GND
GND
GND
GND
5VD1
5VA
9VCC
12VCC
5VSB
Circuit Operation Description
6-8 Samsung Electronics
6-2 Driver circuit
6-2-1 Driver circuit overview
6-2-1(A) WHAT IS THE DRIVER CIRCUIT
It is a circuit generating an appropriate pulse (High voltage pulse) and then driving the panel to implement images in the external terminals (X electrode group, Y electrode group and address electrode), and this high voltage switching pulse is generated by a combination of MOSFETs.
6-2-1(B) PANEL DRIVING PRINCIPLES AND TYPES OF DISCHARGE BY DRIVE PULSE
In PDP, images are implemented by impressing voltage on the X electrode, Y electrode and address electrode, components of each pixel on the panel, under appropriate conditions. Currently, ADS (Address & Display Separate: Driving is made by separating address and sustaining sections) is most widely used to generate the drive pulse. Discharges conducted within PDP pixels using this method can largely be classified into 3 types, as follows:
Address discharge: This functions to generate wall voltage within pixels to be lighted by addressing information to them (i.e., impressing data voltage)
Sustaining discharge: This means a display section where only pixels with wall voltage by the address discharge display self-sustaining discharge by the support of such wall voltage. (Optic out­puts realizing images are generated.)
Ramp reset discharge: To have address discharge occur selectively in pixels, all pixels in the panel must have the same conditions (i.e., the same state of wall and space electric discharges). The ramp reset discharge section, therefore, is important to secure the drive margin, and methods most widely used to date include wall voltage controlling by ramp pulse.
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