Samsung HPL63H1X Schematic

PLASMA DISPLAY TV

Chassis : D52A Model: HPL63H1X/XAA

PLASMA DISPLAY TV CONTENTS

Precautions

Reference Information

Specifications

Exploded View and Parts List

Alignment and Adjustments

Circuit Operation Description

Troubleshooting

Handling Description

Glossary

Schematic Diagrams

1.

2.

3.

4.

5.

6.

7.

8.

9.

10.

ELECTRONICS

Printed in Korea

AA82-00355A

1. Precautions

1-1 Safety Precautions

1. Be sure that all of the built-in protective devices are replaced. Restore any missing protective shields.

2. When reinstalling the chassis and its assemblies, be sure to restore all protective devices, including: nonmetallic control knobs and compartment covers.

3. Make sure that there are no cabinet openings through which people—particularly children—might insert fingers and contact dangerous voltages. Such openings include the spacing between fornt cabinet and back cabinet, excessively wide cabinet

ventilation slots, and improperly fitted back

covers.

4. Leakage Current Hot Check (Figure 1-1): Warning: Do not use an isolation transformer during this test. Use a leakagecurrent tester or a metering system that complies with American National Standards Institute (ANSI C101.1, Leakage Current for Appliances), and Underwriters Laboratories (UL Publication UL1950.5.2).

5. With the unit completely reassembled, plug the AC line cord directly into the power outlet. With the unit’s AC switch first in the ON position and then OFF, measure the current between a known earth ground (metal water pipe, conduit, etc.) and all exposed metal parts, including: antennas, handle brackets, metal cabinets, screwheads and control shafts. The current measured should not exceed 3.5 milliamp. Reverse the powerplug prongs in the AC outlet and repeat the test.

Fig. 1-1 AC Leakage Test

6. Antenna Cold Check: With the unit’s AC plug disconnected from the AC source, connect an electrical jumper across the two AC prongs. Connect one lead of the ohmmeter to an AC prong. Connect the other lead to the coaxial connector.

Precautions

Samsung Electronics 1-1

LEAKAGE CURRENT

TESTER

DEVICE UNDER

TEST

TEST ALL

EXPOSED METAL

SURFACES

3-WIRE CORD

ALSO TEST WITH PLUG REVERSED

(USING AC ADAPTER

PLUG AS REQUIRED)

EARTH

GROUND

(READING SHOULD

NOT BE ABOVE

3.5mA)

Follow these safety, servicing and ESD precautions to prevent damage and protect against potential hazards such as electrical shock and X-rays.

1-2 Safety Precautions (Continued)

7. High voltage is maintained within specified limits by close-tolerance, safety-related components and adjustments. If the high voltage exceeds the specified limits, check each of the special components.

8. Design Alteration Warning: Never alter or add to the mechanical or electrical design of this unit. Example: Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard. Also, any design changes or additions will void the manufacturer’s warranty.

9. Hot Chassis Warning: Some TV receiver chassis are electrically connected directly to one conductor of the AC power cord. If an isolation transformer is not used, these units may be safely serviced only if the AC power plug is inserted so that the chassis is connected to the ground side of the AC source.

To confirm that the AC power plug is inserted correctly, do the following: Using an AC voltmeter, measure the voltage between the chassis and a known earth ground. If the reading is greater than 1.0V, remove the AC power plug, reverse its polarity and reinsert. Re-measure the voltage between the chassis and ground.

10. Some TV chassis are designed to operate with 85 volts AC between chassis and ground, regardless of the AC plug polarity. These units can be safely serviced only if an isolation transformer inserted between the receiver and the power source.

11. Some TV chassis have a secondary ground system in addition to the main chassis ground. This secondary ground system is not isolated from the AC power line. The two ground systems are electrically separated by insulating material that must not be defeated or altered.

12. Components, parts and wiring that appear to have overheated or that are otherwise damaged should be replaced with parts that meet the original specifications. Always determine the cause of damage or overheating, and correct any potential hazards.

13. Observe the original lead dress, especially near the following areas: Antenna wiring, sharp edges, and especially the AC and high

voltage power supplies. Always inspect for pinched, out-of-place, or frayed wiring. Do not change the spacing between components and the printed circuit board. Check the AC power cord for damage. Make sure that leads and components do not touch thermally hot parts.

14. Product Safety Notice: Some electrical and mechanical parts have special safety-related characteristics which might not be obvious from visual inspection. These safety features and the protection they give might be lost if the replacement component differs from the original—even if the replacement is rated for higher voltage, wattage, etc.

Components that are critical for safety are indicated in the circuit diagram by shading, ( ) or ( ).

Use replacement components that have the same ratings, especially for flame resistance and dielectric strength specifications. A replacement part that does not have the same safety characteristics as the original might create shock, fire or other hazards.

15. Littum battery replace warning: Danger of explosion if battery is incorrectly replaced, Replace only with the same or eqivalent type.

Precautions

1-2 Samsung Electronics

“CAUTION, Double-pole/neutral fusing”

CAUTION

Danger of explosion if battery is incorrectly replaced.

Replace only with the same or equivalent type recommended by the manufacturer. Dispose of used batteries according to the manufacturer’s instructions.

1-3 Servicing Precautions

1. Servicing precautions are printed on the cabinet. Follow them.

2. Always unplug the unit’s AC power cord from the AC power source before attempting to: (a) Remove or reinstall any component or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a test component in parallel with an electrolytic capacitor.

3. Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes used. The internal wiring is sometimes clamped to prevent contact with thermally hot components. Reinstall all such elements to their original position.

4. After servicing, always check that the screws, components and wiring have been correctly reinstalled. Make sure that the portion around the serviced part has not been damaged.

5. Check the insulation between the blades of the AC plug and accessible conductive parts (examples: metal panels, input terminals and earphone jacks).

6. Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies) unless all solid-state heat sinks are correctly installed.

7. Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the positive lead; always remove the instrument’s ground lead last.

8. Plasma display panels have partial afterimages when a same picture continues to be displayed for a certain time. This happens due to the degradation of brightness caused by a scale-down effect. To prevent such afterimages when displaying a same picture for a certain time, be sure to reduce the level of brightness and contrast. ex) Contrast : 50 or 75, Brightness : 25

9. Plasma display is an array of pixels(cells). Therefore, if at least 99.9% pixels keep normal, the appropriate panel is judged as ‘approved product.’ Even though some of pixels keep luminescent or always light off, do not worry because the panel is approved.

Precautions

Samsung Electronics 1-3

Warning 1 : First read the “Safety Precautions” section of this manual. If some unforeseen circumstance creates a

conflict between the servicing and safety precautions, always follow the safety precautions.

Warning 2 : An electrolytic capacitor installed with the wrong polarity might explode.

1-4 Precautions for Electrostatically Sensitive Devices (ESDs)

1. Some semiconductor (“solid state”) devices are easily damaged by static electricity. Such components are called Electrostatically Sensitive Devices (ESDs); examples include integrated circuits and some field-effect transistors. The following techniques will reduce the occurrence of component damage caused by static electricity.

2. Immediately before handling any semicon ductor components or assemblies, drain the electrostatic charge from your body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to remove it prior to applying power— this is an electric shock precaution.)

3. After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent accumulation of electrostatic charge.

4. Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs.

5. Use only a grounded-tip soldering iron when soldering or unsoldering ESDs.

6. Use only an anti-static solder removal device. Many solder removal devices are not rated as “anti-static”; these can accumulate sufficient electrical charge to damage ESDs.

7. Do not remove a replacement ESD from its protective package until you are ready to install it. Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam, aluminum foil or other conductive materials.

8. Immediately before removing the protective material from the leads of a replacement ESD, touch the protective material to the chassis or circuit assembly into which the device will be installed.

9. Minimize body motions when handling unpackaged replacement ESDs. Motions such as brushing clothes together, or lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.

Precautions

1-4 Samsung Electronics

CAUTION

These servicing instructions are for use by qualified service personnel only. To reduce the risk of electric shock do not perform any servicing other than that contained in the operating instructions unless you are qualified to do so.

Reference Information

Samsung Electronics 2-1

2. Reference Information

2-1 Tables of Abbreviations and Acronyms

A Ah Å dB dBm

°C °F °K F G GHz g H Hz h ips kWh kg kHz kΩ km km/h kV kVA kW I MHz

Ampere Ampere-hour Angstrom Decibel Decibel Referenced to One Milliwatt Degree Celsius Degree Fahrenheit degree Kelvin Farad Gauss Gigahertz Gram Henry Hertz Hour Inches Per Second Kilowatt-hour Kilogram Kilohertz Kilohm Kilometer Kilometer Per Hour Kilovolt Kilovolt-ampere Kilowatt Liter Megahertz

MV MW MΩ m µA µF µH µm µs µW mA mg mH mI mm ms mV nF

Ω

pF Ib rpm rps s V VA W Wh

Megavolt Megawatt Megohm Meter Microampere Microfarad Microhenry Micrometer Microsecond Microwatt Milliampere Milligram Millihenry Milliliter Millimeter Millisecond Millivolt Nanofarad Ohm Picofarad Pound Revolutions Per Minute Revolutions Per Second Second (Time) Volt Volt-ampere Watt Watt-hour

Table 2-1 Abbreviations

Reference Information

2-2 Samsung Electronics

Table 2-2 Table of Acronyms

ABL AC ACC AF AFC AFT AGC AM ANSI APC APC A/V AVC BAL BPF B-Y CATV CB CCD CCTV Ch CRT CW DC DVM EIA ESD ESD FBP FBT FF FM FS GND G-Y H HF HI-FI IC IC IF

Automatic Brightness Limiter Alternating Current Automatic Chroma Control Audio Frequency Automatic Frequency Control Automatic Fine Tuning Automatic Gain Control Amplitude Modulation American National Standards Institute Automatic Phase Control Automatic Picture Control Audio-Video Automatic Volume Control Balance Bandpass Filter Blue-Y Community Antenna Television (Cable TV) Citizens Band Charge Coupled Device Closed Circuit Television Channel Cathode Ray Tube Continuous Wave Direct Current Digital Volt Meter Electronics Industries Association Electrostatic Discharge Electrostatically Sensitive Device Feedback Pulse Flyback Transformer Flip-Flop Frequency Modulation Fail Safe Ground Green-Y High High-Frequency High Fidelity Inductance-Capacitance Integrated Circuit Intermediate Frequency

I/O L L LED LF MOSFET MTS NAB NEC NTSC OSD PCB PLL PWM QIF R RC RF R-Y SAP SAW SIF SMPS S/N SW TP TTL TV UHF UL UV VCD VCO VCXO VHF VIF VR VTR VTVM TR

Input/output Left Low Light Emitting Diode Low Frequency Metal-Oxide-Semiconductor-Field-Effect-Tr Multi-channel Television Sound National Association of Broadcasters National Electric Code National Television Systems Committee On Screen Display Printed Circuit Board Phase-Locked Loop Pulse Width Modulation Quadrature Intermediate Frequency Right Resistor & Capacitor Radio Frequency Red-Y Second Audio Program Surface Acoustic Wave(Filter) Sound Intermediate Frequency Switching Mode Power Supply Signal/Noise Switch Test Point Transistor Transistor Logic Television Ultra High Frequency Underwriters Laboratories Ultraviolet Variable-Capacitance Diode Voltage Controlled Oscillator Voltage Controlled Crystal Oscillator Very High Frequency Video Intermediate Frequency Variable Resistor Video Tape Recorder Vacuum Tube Voltmeter Transistor

Specifications

Samsung Electronics 3-1

3. Specifications

MODEL

SCREEN SIZE

3-1 Display(PDP Monitor)

Display

Remote Control

Display

Remote Control

Power Consumption

Voltage

RGB input

VIDEO input

Dimensions

(mm/inch)

Weight

HPL6315

1393(H) x 783(V)/54.86 x 30.84

1566(W) x 89(D) x 912.5(H) mm/61.65(W) x 3.5(D) x 35.93(H) Inches

54(W) x 31.5(D) x 220(H)mm/2.13(W) x 1.24(D) x 8.66(H) Inches

72Kg/158.73Ibs

150g(including batteries)/0.33Ibs

AC120V 60Hz

725W

RGB1 : MINI D-SUB 15P

RBG2 : BNC (R/G/B H(CS)/V)

VIDEO : ANALOG 0.714VPP/75 Ω(Terminated)

SYNC(H,V)

VIDEO : 1.0VPP/75 Ω (BNC)

S-VIDEO : Y -> 1.0VPP/75 Ω

C -> 0.28V

PP/75 Ω

COMPONENT (Y/Pb/Pr) : Y -> 1.0V

PP/75 Ω

Pb -> 0.7vPP/75 Ω

Pr -> 0.7VPP/75 Ω

3-2 Samsung Electronics

MEMO

Alignment and Adjustments

Samsung Electronics 5-1

5. Alignment and Adjustments

5-1 Service Mode

5-1-1 SERVICE MODE ENTRY METHOD (General Transmitter)

1. Turn off the power to make the SET STAND-BY mode.

2. In order to enter the Service Mode, select MUTE-1-8-2-POWER.

In case entry into SERVICE MODE is unsuccessful, repeat the procedures above.

5-1-2 Initial DISPLAY State in times of SERVICE MODE Switch overs

PW364

INITIAL DISPLAY

SDA92 80 VPC3230 SDA9400

1, PW

364

2, SD

A9280

3, V

PC3230

4, SD

A9400

5, C

XA2101

6, A

D9884

7, O

SD POSITION

8, O

PTION

9, R

ESET

10, A

GING

H

orizonta lSize

V

er tical Horizontal Ve r t i ca l

Si

ze

Pos

CTIT

HRESH

CTIT

RAWID

Y- D

ELAY

L

PF GA IN

B

PF GAIN

H

PF GA IN

PH

ACOM

C

OR

B

RIGHT YUV

C

ONT YUV

I

FCOMP

ChromaB

and

L

uma LPF

H

PLL Speed

L

uma Delay

3230 Bri

ght

3230 C

ontr ast

HL

PF Y/ C

L

PF Chroma

HHPeak Fil

ter

PeakingG

ain

C

oaring off/ on

O

UT DELAY

TNRCLY

CLY

TNRCLC

CLY

ST

OP MODE

Alignment and Adjustments

5-2 Samsung Electronics

5-1-3 Buttons Operations within SERVICE MODE

#Notice

The existing service data may be deleted after downloading a program. Be sure to make a backup copy of your data before downloading and then restore the data after completing the download.

Menu

Channel UP/DOWN

Volume UP/DOWN

Entire menu display Cursor move to select items Enable to increase and decrease the data of the selected items

Limit Level Sys tem D-Color R-DRIVE

-DRIVE

G

-DRIVE

B R-Cutoff G-Cutoff

-Cut off

B ABL MODE ABL TH HSEPSEL CONT RAST BRI GHT CR OFFSET CB

OFFS ET1

CXA2101 AD9884

DRIVE SUB BRIGHT SUB CONT SUB COLOR SUB HUE SUB SHP R-Y/R R-Y/B GG-Y/R

-Y/B

P

ABL LEVEL

SHP FO PRE/OVER CTI LEVEL

1

LTI LEVEL DC - TRAN D-PIC

RED

Gain GREEN BLUE

OFFSET

RED GREEN BLUE GAIN DRIVE OFFSET DIRVE V CONTRAST V BRIGHT PHASE

CHANGE PUMP

Gain

OFFSET

OSD

POSITION

HORIZ VE RT

OP TION

1, BACK GR OUN D COLOR

SHIFT PIXEL

2,

PIXEL SHIFT

3,

PIXEL SHIFT

4,

FAN PROTECT

5,

TEMP

6, 7, 8, BASE LANGUAGE

PROTECT

SHARPNESS

MIN SEC

Alignment and Adjustments

Samsung Electronics 5-3

5-1-4 White Balance Adjust Method

1. Press MUTE-1-8-2-POWER to enter the factory mode.

2. Enter AD9884

3. Adjust LOW coordinates as R, B OFFSET and HIGH coordinates as R, B GAIN.(GREEN is fixed.)

4. In AD9884, adjust brightness with V CONTRAST / V BRIGHT for VIDEO / DTV, and adjust with GAIN DRIVE / OFFSET DRIVE for PC.

1. VIDEO MODE (SPR-3100, input TOSHIBA PATTERN)

2. DTV MODE (SPR-3100, input TOSHIBA PATTERN)

A

dj ustme

nt

Adjustme

nt

Coor dinates

Value

Deviation

A

dj ustme

nt

Adjustme

nt

Coor dinates

Value

Deviation

H

-LIGHT

x:286 y

:

274

Y

:

18.7(fL)

3 3 3

L

H-LIGHT

-LIGHT

L

x:278 y

:

272

Y

:0.53(f L)

(f L)

5 5

0. 1

x:288 y

:

277

Y: 16.1

Y:

3 3 3

x:280 y

:277

0.71

5 5

0. 1

- W/B Adjustment SPEC (Suwom Factory Toshiba PATTERN)

Alignment and Adjustments

5-4 Samsung Electronics

2. PC MODE (VG828, input TOSHIBA PATTERN)

A

dj ustme

nt

Adjustme

nt

Coor dinates

Value

Deviation

H-LIGHT

-LIGHT

L

x:287 y:288 Y: 21.3(fL)

Y:

x:287 y:294

2.17

3 3 3

5 5

0. 1

Alignment and Adjustments

Samsung Electronics 5-5

5-1-5 SCALAR FACTORY DATA DEFAULT VALUES

Alignment and Adjustments

5-6 Samsung Electronics

Alignment and Adjustments

Samsung Electronics 5-7

5-8 Samsung Electronics

Alignment and Adjustments

HPL6315

VGA

1

2

3

4

5

6

7

8

9

10

11

12

13

14

Video signal Dot X Line

640 X 350

640 X 400

VGA

WVGA

720 X 400

640 X 480

848 X 480

Ve rtical

Frequency (Hz)

70.086

85.080

70.087

85.039

59.940

72.809

75.000

85.008

60.000

72.000

75.000

85.000

56.250

Horizontal

Frequency (kHz)

31.469

37.861

31.469

37.927

31.469

37.861

37.500

43.269

29.838

35.156

36.072

37.650

42.925

Ve rtical

polarity

N

P

N

P

N/P

Horizontal

polarity

P

N

N/P

15

16

17

18

19

20

21

22

23

24

25

26

27

SVGA

XGA

WXGA

SXGA

800 X 600

1024 X 768

1152 X 864

1280 X 768

1280 X 1024

60.317

72.188

75.000

85.061

60.004

70.069

75.029

84.997

75.000

60

75

60.020

75.025

37.879

48.077

46.875

53.674

48.363

56.476

60.023

68.677

67.500

47.700

60.150

63.981

79.976

P

N

P

N

P

N

P

Alignment and Adjustments

Samsung Electronics 5-9

5-2 Adjusting the Discharge Voltage Of the Main Unit While Replacing ASS'Y (Body Part)

Turning the variable resistor clockwise reduces voltage except VG, V9, and VR(6).

SMPS

OUT PUT Voltage(V)

1. V A

1. V FAN

3. SIGNAL

V5D

VFAN

VAMP

1. V SB

4. V 5A

11. V 12A

12. V 5D1

1. V 5D

3. V 5D

V5D1

VSET

VSCAN

VA

1. V A

2. V A

1. V 5D

3. V G

5. V SCAN

7. V E

11. V S

12. V S

13. V S

VE

1. V 5D

3. V G

5. V E

7. V SCAN

10. V S

11. V S

12. V S

VS

VS 168

VE 183

VA 70

VSET 190

VSCAN 80

V5D 5

VFAN 12

VAMP 9

V5D1 5

V5A 5

V12A 12

VSB 5

V12A

V5A

VSB

1. V 5A

3. V 9A

4. V 12A

6. V AMP

7. V AMP

Alignment and Adjustments

5-10 Samsung Electronics

Alignment and Adjustments

5-3 Fault Finding Using MULTI METER

Parts defects can be found for DIODE TRANSISTOR IC, using MULTI TEST including Forward/Reverse direction Multi Test. Of course, in case resistance of several ohms and COIL are connected in parallel circuit, the lock out circuit parallel connected to part must be severed.

1.DIODE

2. TRANSISTOR

● For NPN(KSC815-Y, 2SC2068, 2SC2331-Y)

● For PNP(KSA539-Y)

Forward Direction

Hundreds of ohms

Reverse Direction

Infinity

Between Anode and Cathode

C (COLLECTOR)

E

B(BASE)

BC

C (COLLECTOR)

E

B(BASE)

BC

E (EMITTER)

Forward Direction Hundreds of ohms Hundreds of ohms

Infinity

Reverse Direction

Infinity Infinity Infinity

Between B and E

Between B and C

Between E and C

Forward Direction Hundreds of ohms Hundreds of ohms

Infinity

Reverse Direction

Infinity Infinity Infinity

Between B and E

Between B and C

Between E and C

+- +-

Alignment and Adjustments

Samsung Electronics 5-11

Alignment and Adjustments

3. IC (INTEGRATED CIRCUIT)

IC has built in DIODE against overvoltage in PIN. Generally, except for internal circuit defects, IC defects can be found, by measuring the DIODE.

✍ Defects have SHORT(0 ohm) for both forward and reverse direction.

Hundreds of ohms

Forward Direction

Reverse Direction

Varying depending on IC but generally normal

Infinity in DIODE TEST MODE

5-12 Samsung Electronics

MEMO

Circuit Operation Description

Samsung Electronics 6-1

6. Circuit Description

6-1 Power supply

6-1-1 Outline(PDP SMPS)

Considering various related conditions, the switching regulator with good efficiency and allowing for its small size and light weight was used as the power supply for PDP 50inch, VS requiring high power consumption used forward converter and 12VSAMP used the simple flyback converter and other high voltage (VSCAN,VSET,VE)used DC/DC converter. To comply with the international harmonics standards and improve the power factor, active PFC(Power Factor Correction) was used to rectify AC input into +400V DC output, which in turns used as input to the switching regulator.

6-1-2 63"HD SMPS Specification

(1) Input

The PDP-PS-421S board should be designed so that the AC power supply within the 100VAC (common) to 150VAC and the input frequency within 50/60Hz can be applied.

(2) Output

The PDP-PS-421S board converts the AC Voltages (+165Vs1, +75Va, +185Ve, +5Vd, +12Vcc, +6Vsp,

+9Vsp, +9Vcc, +12Vfan, +5Vd1, +5Va, +220Vset, +75Vscan, +18Vg) into the DC Voltages. The usage and specification of each output is as shown in Table 1. Table 1 shows the power supplies for PDP SMPS.

Table1. Specifications of Output Power Supplies for PDP SMPS

165Vs

75Va

185Ve

220Vset

75Vscan

5Vd

18Vg

5Vdl

5Va

9Vcc

12Vcc

6Vsp

12Vfan

5Vsb

165V ± 1%

75V ± 1%

185V ± 1%

220V ± 1%

75V ± 1%

5.2V ± 1%

18V ± 5%

5.2V ± 1%

9.2V ± 5%

12.2V ± 5%

6V ± 5%

11V ~ 14V

5.2V ± 1%

160V ~ 190V

60V ~ 85V

170V ~ 200V

200V ~ 250V

60V ~ 90V

4.5V ~ 5.5V

-

4.5V ~ 5.5V

-

3V ~ 24V

-

5.0V ~ 5.4V

0.2

0.01

0.3

0.07

0.2

0.1

0.07

0.25

0.1

2.0

0.1

→

2.5

→

1.0

0.2

0.01

0.3

0.07

0.2

0.1

0.07

0.25

0.1

Output

Voltage

(V)

Voltage Setting

(Normal Load)

Output

Voltage

Variable Point

Output Current(A)

Min Non Max

Circuit Operation Description

6-2 Samsung Electronics

(3) FUNCTION OF BOARD

1) Remote control Using 120V/10A relay, the board makes remote control available.

2) Voltage The board designed so that input voltage can be used within 100 VAC to 150VAC.

3) Improvement of power factor The board is designed using PFC circuit so that PF (Power Factor) can be over 0.95, because low PF can be a problem in high voltage power.

4) Protection The OCP (Over Current Protection), the OVP (Over voltage Protection), and the Short Circuit Protection functions are added against system malfunction.

(4) BLOCK DIAGRAM

This product can be defined as a power supply device (Input power: AC110/220V), consists of

Inrush Current Limit Circuit on Input and Power Factor Correction circuits, VS, VA, and VI Block, providing the power (current) required for PDP Panel discharges and external circuits. PFC circuit utilizes Discontinuous Current Mode ( DCM) that produces a high efficiency. And, an input EMI filter circuit is equipped on the exterior.

1) PFC Block Boost Discontinuous Current Mode (DCM) PFC circuit is used for PFC (Power Factor Correction), where a common PWM IC gives an easy control, a simple circuit onfiguration, and a high efficiency. The circuit operates as described as following:RELAY is to be operated by inputting initial Relay “ON” while the resistance for Inrush Current Limit charges a capacitor of PFC Output Terminal. If the charged voltage of the capacitor goes over 340V, a comparator of PFC circuit controller activates VA Block and Relay for Inrush Current Limit. Thereafter, PFC circuit initiates a normal operation. PFC circuit has output, voltage, current limit circuits for placing a restriction on switching current, and protective (safeguard) circuits against output over-voltage. The over-voltage induces input Terminal Relay to be “OFF” with the set shut down.

2) Vs Block supplies the sustain power closely related to PDP Panel and includes 165Vs and 185Ve employing a Full-bridge circuit as Topology. In order to insulate gate signal, Driver at the secondary side based on properties of the pulse type of load. 185Ve power utilizes a variable Regulator for sub-output of 165Vs power, which is supplied to the load being added to 165Vs power. 70kHz is applied for switching frequency that has the Sequence operated after rising 5Vd power.

Table 2. Security function SPEC required for PDP SMPS

Division

+165Vs

+ 75Va

OCP Current

5 ~ 7A

3 ~ 4A

OVP Voltage

190 ~ 220V

85 ~ 100V

UVP Voltage

135 ~ 145V

50 ~ 65V

Short Circuit

OK

Circuit Operation Description

Samsung Electronics 6-3

Vs Switching Pulse(Pulse for power board operation only)

Va Switching Pulse(Pulse for Set ON)

Circuit Operation Description

6-4 Samsung Electronics

3) Va Block Va Block consists of address voltage suppliers (75Va, 220Vset, and 75Vscan), VCCs that supply a power to logic circuit, and 12V fan; the power of cooling Fan of 18Vg. PDP Set that provides Gate voltages of drive circuit. It utilizes a Forward circuit mode as TOpology. 75Vscan uses 75Va power to construct not only stable but, if needed, also variable DC/DC Converter while 220Vset, also variable if wanted, is applied by adding 165Vs power to the power generated from Buck Converter with 75Va power. 5Vd and 12Vsp power can be generated by Buck Converter with the power gained through Coupling in Transformer, and 18Vg by Linear Regulator. The switching frequency is 70kHz.

Va Switching Pulse(Pulse for Set ON)

4) Block VI Block consists of voltage suppliers for image circuits (5Va, 9Vcc, 12Vcc, and 5Vd1), and a Flyback circuit mode is applied as Topology. Feedback for voltage stability is designed for 5Vd1, 5Va, 9Vcc, 12Vcc, and 5Vd1 powers anr generated by using each Linear Regulator for the power gained through Coupling in Transformer. The switching frequency is 100kHz.

Circuit Operation Description

Samsung Electronics 6-5

VI Switching Pulse(Pulse for power board operation only)

VI Switching Pulse(Pulse for Set ON)

Circuit Operation Description

6-6 Samsung Electronics

6-1-3 Pin Assignment

Image Board

NO OUT PUT

1 2 3

4 5 6

7 8 9

10 11 12

13

+5V

GND(D)

+5V

RELAY

THDET

FAN GND GND

N.C +12V

+5V

N.C

LOC

VSB

V5(D)

V12

V5(D)

SX(X Driver)

OUT PUT

NO

1 +5V 2 3 4

5

6 7

8

9 10 11 12

13

GND +18V GND

70V

GND

230V N.C

GND GND 165V 165V

165V

LOC

V5(D)

VG

VSCAN

VS VS

VS

SY (Y Drive)

NO

OUT PUT

1 +5V(D) 2 3 4

5

6 7

8

9 10 11 12

GND(D)

+18V

GND

200V

GND

70V GND GND

165V 165V

165V

LOC

V5(D)

VG

VE

VSCAN

VS VS VS

Speaker

NO OUT PUT

1 2

3 4 +12V V12

5 GND 6 VSAMP 7 VSAMP 8

9

+5V GND

+9V

+6V +6V

GND GND

LOC LOC

V9

Buffer(2EA) SL(Logic)

NO OUT PUT

1 2 3 4

NO OUTPUT

1 +12V VFAN 2 GND

+70V +70V

GND GND

Fan(3EA)

VA VA

LOC

NO

1 2

3 4

OUT PUT

+70V +70V

GND GND

LOC

Circuit Operation Description

Samsung Electronics 6-7

6-1-4 SMPS Block diagram

AC

INPUT

PFC

VS

BLOCK

VA

BLOCK

Reg.

DC/DC

Reg.

BUCK

GND

185VE

165VS

220VET

75VSCAN

75VA

18VG

5VD

6VSP

12VFAN

AC

INPUT

VI

BLICK

Reg.

GND

5VD1

5VA

9VCC

12VCC

5VSB

Circuit Operation Description

6-8 Samsung Electronics

6-2 Driver circuit

6-2-1 Driver circuit overview

6-2-1(A) WHAT IS THE DRIVER CIRCUIT

It is a circuit generating an appropriate pulse (High voltage pulse) and then driving the panel to implement images in the external terminals (X electrode group, Y electrode group and address electrode), and this high voltage switching pulse is generated by a combination of MOSFETs.

6-2-1(B) PANEL DRIVING PRINCIPLES AND TYPES OF DISCHARGE BY DRIVE PULSE

In PDP, images are implemented by impressing voltage on the X electrode, Y electrode and address electrode, components of each pixel on the panel, under appropriate conditions. Currently, ADS (Address & Display Separate: Driving is made by separating address and sustaining sections) is most widely used to generate the drive pulse. Discharges conducted within PDP pixels using this method can largely be classified into 3 types, as follows:

Address discharge: This functions to generate wall voltage within pixels to be lighted by addressing information to them (i.e., impressing data voltage)

Sustaining discharge: This means a display section where only pixels with wall voltage by the address discharge display self-sustaining discharge by the support of such wall voltage. (Optic outputs realizing images are generated.)

Ramp reset discharge: To have address discharge occur selectively in pixels, all pixels in the panel must have the same conditions (i.e., the same state of wall and space electric discharges). The ramp reset discharge section, therefore, is important to secure the drive margin, and methods most widely used to date include wall voltage controlling by ramp pulse.

Circuit Operation Description

Samsung Electronics 6-9

6-2-1(C) Discharge of Drive

Sustaining discharge 1(C). Kinds and detailed descriptions of driving discharge

Sustaining discharge means a self-sustaining discharge generated by the total of the sustaining pulse voltage (usually, 160~180V) alternately given to X and Y electrodes during the sustaining period and the wall voltage which varies depending upon pixels' previous discharge status. It is operated by the memory function (through this, the current status is defined by previous operation conditions) AC PDP basically possesses. That is, when there is existing wall voltage in pixels (in other words, when pixels remain ON), the total of wall voltage and a sustaining voltage to be impressed subsequently impresses a voltage equal to or above the discharge start voltage, thereby generating discharge again, but when there is no existing wall voltage in pixels (in other words, when pixels remain OFF), the sustaining voltage only does not reach the discharge start voltage, thus causing no discharge. The sustaining discharge is a section generating actual optic outputs used in displaying images.

Address discharge This means a discharge type generated by the difference between positive voltage of the address

electrode (usually, 60~70V) and GND of the Y electrode. The address discharge serves to generate wall voltage in pixels where images are to be displayed (that is, discharge is to be generated) prior to the sustaining discharge section. Namely, pixels with wall voltage by the address discharge will generate sustaining discharge by the following sustaining pulses.

Weak erasing discharge The purpose of resetting discharge is to make even wall voltage in all pixels on the panel.

Wall voltage which may vary depending upon the previous sustaining discharge status must be made even. That is, wall voltage generated by the sustaining discharge must surely be removed, by making discharges and then supplying ions or electrons. Wall voltage can be removed by making discharges and then setting a limitation on time for opposite polarity charging of the wall voltage or generating weak discharge (Low voltage erasing) to supply an appropriate quantity of ions or electrons and keep polarities from being charged oppositely. The weak discharge (Low voltage erasing) methods which have been known to date can largely be into two types:

1) the log pulse adopted by most companies including F Company, and

2) the ramp pulse adopted by Matsushita.

In both two methods, impression is made with a slow rising slope of the erasing pulse. Because the total of the existing wall voltage and a voltage on the rising pulse must be at least the drive start voltage to generate discharges, external impressed voltage is adjusted based on the difference in wall voltage between pixels. And, weak discharge is generated because of a small impressed voltage.

Circuit Operation Description

6-10 Samsung Electronics

6-2-2 Driver Circuit Block Diagram

(1) Y

(2) X

Fig. Driver Y-Bd

LOGIC SIGNAL INPUT

LOGIC SIGNAL BUFFER

FET GA TE DR IV ER

Reco very

Switching

Main

Switching

Reco very circuit

(Recovery Cap)

POWER SUPPLY INPUT

5V

17V

170V

Vs et

Switching

220V

75V

Vs ca n

Switching

LOGIC SIGNAL INPUT

LOGIC SIGNAL BUFFER

FET GATE DRIVER

Reco very

Switching

Reco very circuit

(Recovery Cap)

POWER SUPPLY INPUT

5V

17V

Main

Switching

200V

170V

Ve

Switching

(3) Key Requirements of the Driver Circuit Operations

1) Power Supply

- Power is supplied from the power board. The minimum value may differ from the following.

2) Logic Signals

- Logic signals are supplied from the logic board.

- Gate signals of each FET

(4) Diagram and Functional Description of the Driver Circuit

- Functional Description of Each Board

Circuit Operation Description

Samsung Electronics 6-11

X- Bu ffe r

(Upper Part)

X Driver Board

-Sustain waveforms

mp waveforms

a

(Energy Recove ry)

-Rising R

Y- Sub X - Sub

X- Bu ffe r

(Lower Part)

(6 block)

X electrode port

(Energy Recovery)

X Driver Board

- Sustain waveforms

- RisingRamp waveforms

-Vebias

COB

waveforms

(Energy Recover y)

Y Driver Board

- Sustain waveforms

- Rising Ramp waveforms

- Falling Ramp waveforms

- Vscan waveforms

(Energy Recovery)

Y Driver Board

- Sustain waveforms

- RisingRamp waveforms

- Fa lling Ramp

- Vscan waveforms

(6 block)

Y- Buffer

(Upper Part)

Y- Buffer

(Lower Part)

1) X Board I, II X Board I and II are connected to the X port on the panel to:

- Produce sustain voltage waveforms (including ERC)

- Produce X rising ramp waveforms

- Sustain Ve bias during the Scan.

2) Y Board I, II Y Board I and II are connected to the Y port on the panel to:

- Produce sustain voltage waveforms (including ERC)

- Produce Y rising ramp waveforms

- Sustain V scan bias.

3) X Buffer Board (Upper and Lower) The X buffer board applies Sustain waveforms to the X port. It consists of an upper and a lower board.

4) Y Buffer Board (Upper and Lower) The Y buffer board applies Scan waveforms to the Y port. It consists of an upper and a lower board. Each board is installed with 6 Scan driver ICs (STMicroelectronics STV7616: 64 or outputs).

5) X Sub Board The X sub board distributes and applies logic data to the X board I and II.

6) Y Sub Board The Y sub board distributes and applies logic data to the Y board I and II.

7) COB The COB applies Va waveforms to the Address electrodes during the Address stage to produce Address discharges by using the difference between the injection waveforms and the voltage applied to the Y electrode. ACOB is installed with 4 data drive ICs (STMicroelectronics STV7610A: 96 outputs). A total 22 COBs are required.

Circuit Operation Description

6-12 Samsung Electronics

Circuit Operation Description

Samsung Electronics 6-13

6-2-3 Driving Waveform Specs

6-2-3(A) Driving Waveform Diagram

Vs

Vscan

Xsustain

pulse

Vs

Ysustain

pulse

Y s can

pulse

Ve

Y falling

Ramp

Va

Addres s

pulse

Vs 160~170V Ve 190V~200V

Vs e t 210~225V Va 70~75V

Vs c a n 70~75V

Vs e t

Ve

Y r is ing

Ramp

X r is ing

Ramp

Y

X

RESET SCAN SUSTAI N

X Co mmon & Sus t a i n El e ct r ode

Ad d r e s s

A1 , 2 . . . . . Address( =Dat a) Elect rode

Y1 , 2 . . . . Scan &Sustain Electrode

Circuit Operation Description

6-14 Samsung Electronics

6-2-3(B) Functional Description of Each Waveform

(1) X Rising Ramp Waveform

The last Y electrode Sustain waveform is applied from the sub field before the XZ Rising Ramp

waveforms begin to be applied. The last waveform triggers the Sustain Discharge. Then, a positive wall charge occurs on the X electrodes and a negative wall chanrge on the Y electrodes. The X rising ramp eliminates the wall charge produced by the aforementioned Sustain Discharge waveform by triggering a low discharge.

(2) Y Rising Ramp Waveform

During the Y Rising Ramp stage, an external voltage of 390-400V is applied to the Y electrodes to adjust each Gap Voltage to the same initial voltage level before starting a low discharge. As the low discharge is sustained, a negative wall charge continues on the Y electrodes and a positive wall charge on the X and Address electrodes across the panel.

(3) Y Falling Ramp Waveform

During the Y Falling Ramp stage, most of the negative wall charges on the Y electrodes, with approximately 200V X bias, are used to eliminate the positive wall charges on the X electrodes. Most of the positive wall charges on the (OV) rising ramp section of the Address electrodes are sustained to form wall charges in preparation for an address discharge.

(4) Y Scan Wavdform

The Y Scan waveform is also calle an injection waveform. It selects Y electrodes one line at a time. Vscan is referred to as Scan bias voltage. About 70 Volts (V scan)are applied to the applicable electrode limes with Vscan, and 0 Vots (GND) to the rest. When Ramp waveforms are applied, however, a negative wall charge occurs on the Y electrodes, and a positive wall charge on the Address electrodes. Because the voltage level exceeds the initial discharge level in those cells affected by address waveforms (70~75V), an address discharge occurs. The PDP Address takes a long time because it applies injection and data waveforms line by line.

Circuit Operation Description

Samsung Electronics 6-15

6-2-3(C) Principles of Fets Operation and High Voltage Switching

1) With signal impressed on the gate(Positive voltage) , FET gets short-circuited (a conducting wire of zero (0) resistance); and

2) With no signal impressed on the gate (GND), FET gets open-circuited (a non-conducting wire of ∞ resistance).

1) With no signal impressed on G1, FET1 gets open-circuited, and with signal impressed on G2, FET2 gets short-circuited, thereby causing GND to be outputted to output terminals.

2) With signal impressed on G1, FET1 gets short-circuited, and with no signal impressed on G2, FET2 gets open-circuited, thereby causing 180V to be outputted to output terminals.

Circuit Operation Description

6-16 Samsung Electronics

6-2-3(D) Driver Circuit Composition Diagram

C_Xerc

VsVe

D_Xs

C_Xsink

Dscan

Xr

Xs

D_Xsink

Xrr

D_Ysink

Ramp

D_Xr

D_YVsC

LX

Cp

3

1

2

Xg

D_Xf

Xf

D_YGC

3 2

1

0 0

0

VscanVset

Vs

Ysc

Rset

Yrr

Ys

Ysp

C_Ysink

Ramp

Dset

D_YVsC

Yr

Yp

Cset

LY

D_Yr

+5V

Yfr

Yg

D_Yf

C_Yerc D_YGC

floating 5V

D_fVdd

Ramp

Yf

C_fVdd

0 0 00

Circuit Operation Description

Samsung Electronics 6-17

6-2-3(E) Driver Board Connector Layout

(1) X I

CN4004

- Power

CN4406

- Panel

CN4005

- Signal

CN4009

CN4008

CN4007

CN4006

CN4402

CN4401

CN4404

CN4403

CN44 05

CN4407

- Panel

CN4408

- Panel

Circuit Operation Description

6-18 Samsung Electronics

(2) X II

CN4004

- Power CN4009

CN4008

CN4505

CN45 01

CN45 03

CN4506

- Panel

CN4005

- Signal

CN4007

CN4006

CN45 02

CN45 04

CN4508

- Panel

CN4507

- Panel

Circuit Operation Description

Samsung Electronics 6-19

(3) Y I

CN5401

- Panel

CN5402

- Panel

CN5404

CN5406

CN5405

CN5407

CN5409

CN5008

- Power

CN5007

CN5001

CN5006

CN5005

CN5003

CN5403

- Panel

CN5408

CN5004

CN5002

- Signal

Circuit Operation Description

6-20 Samsung Electronics

(4) Y II

CN5503

- Panel

CN5502

- Panel

CN5508

CN5509

CN5507

CN5505

CN5506

CN5007

CN5001

CN5006

CN5005

CN5008

-

Power

CN5501

- Panel

CN5003

CN5504

CN5004

CN5002

- Signal

Circuit Operation Description

Samsung Electronics 6-21

Single scan mode PDP action : Rest section, X : 0 -> Ve, Y : 0

C_Xerc

VsVe

VscanVset

D_Xs

C_Xsink

Dscan

D_Xsink

D_Ysink

Ysc

Xr

Xs

Xrr

Ramp

C_Ysink

Ysp

D_Xr

D_YVsC

LX

Cp

1

D_Xf

Xf

D_YGC

0 0

0

Xg

155V

Vs :155V

2

3

3 2

1

floating 5V

Vs

Rset

Ys

Yrr

Ramp

Dset

Yr

Yp

Cset

LY

D_YVsC

D_Yr

+5V

Yfr

Yg

D_Yf

C_Yerc D_YGC

D_fVdd

Ramp

Yf

C_fVdd

0 0 00

V set + V s:355V

Y rise

155V

Va :78V

Vscan :65V 65V

Ve :184V

Yfall

RESET SCAN SUSTA IN

Vs :155V

184V

Y

X rise

X

Address

Circuit Operation Description

6-22 Samsung Electronics

Single scan mode PDP action : Rest section, X : 0 , Y : Vs -> Vs + Vset

C_Xerc

VsVe

VscanVset

C_Xsink

Dscan

D_Xs

D_Xsink

Ysc

Xr

Xs

Xrr

Ramp

D_Ysink

C_Ysink

Ysp

D_Xr

D_YVsC

LX

Cp

1

D_Xf

Xf

D_YGC

0 0

0

Xg

155V

Vs :155V

2

3

3 2

1

floating 5V

Vs

Rset

Ys

Yrr

Ramp

Dset

Yr

Yp

Cset

LY

D_YVsC

D_Yr

+5V

Yfr

Yg

D_Yf

C_Yerc D_YGC

D_fVdd

Ramp

Yf

C_fVdd

0 0 00

V set + V s:355V

Y rise

155V

Va :78V

Vscan :65V 65V

Ve :184V

Yfall

RESET SCAN SUSTA IN

Vs :155V

184V

Y

X rise

X

Address

Circuit Operation Description

Samsung Electronics 6-23

Single scan mode PDP action : Rest section, X : Vs, Y : Vs

C_Xerc

VsVe

VscanVset

D_Xs

C_Xsink

Dscan

D_Xsink

D_Ysink

Ysc

Xr

Xs

Xrr

Ramp

Ysp

C_Ysink

D_Xr

D_YVsC

LX

Cp

3

1

D_Xf

D_YGC

Xg

2

1

floating 5V

Xf

0 0

0

155V

Vs : 155V

3 2

Vs

Rset

Ys

Yrr

Ramp

Dset

Yr

Yp

Cset

LY

D_YVsC

D_Yr

+5V

Yfr

Yg

D_Yf

C_Yerc D_YGC

D_fVdd

Ramp

Yf

C_fVdd

0 0 00

Va :78V

Vscan : 65V 65V

Ve :184V

Y fall

155V

V set + V s:355V

Y rise

155V

Y

184V

Vs : 155V

X rise

X

Ad dress

RESET SCAN SUSTA IN

Circuit Operation Description

6-24 Samsung Electronics

Single scan mode PDP action : Rest section, X : Ve, Y : Vs

C_Xerc

VsVe

VscanVset

C_Xsink

Dscan

D_Xs

D_Xsink

Ysc

Xr

Xs

Xrr

Ramp

D_Ysink

C_Ysink

Ysp

D_Xr

D_YVsC

LX

Cp

1

D_Xf

Xf

D_YGC

0 0

0

Xg

155V

Vs :155V

2

3

3 2

1

floating 5V

Vs

Rset

Ys

Yrr

Ramp

Dset

Yr

Yp

Cset

LY

D_YVsC

D_Yr

+5V

Yfr

Yg

D_Yf

C_Yerc D_YGC

D_fVdd

Ramp

Yf

C_fVdd

0 0 00

V set + V s:355V

Y rise

155V

Va :78V

Vscan :65V 65V

Ve :184V

Yfall

RESET SCAN SUSTA IN

Vs :155V

184V

Y

X rise

X

Address

Circuit Operation Description

Samsung Electronics 6-25

Single scan mode PDP action : Rest section, X : Ve, Y : Vs -> 0

C_Xerc

VsVe

VscanVset

D_Xs

C_Xsink

Dscan

D_Xsink

D_Ysink

Ysc

Xr

Xs

Xrr

Ramp

C_Ysink

Ysp

D_Xr

D_YVsC

LX

Cp

1

D_Xf

Xf

D_YGC

0 0

0

Xg

155V

Vs :155V

2

3

3 2

1

floating 5V

Vs

Rset

Ys

Yrr

Ramp

Dset

Yr

Yp

Cset

LY

D_YVsC

D_Yr

+5V

Yfr

Yg

D_Yf

C_Yerc D_YGC

D_fVdd

Ramp

Yf

C_fVdd

0 0 00

V set + V s:355V

Y rise

155V

Va :78V

Vscan :65V 65V

Ve :184V

Yfall

RESET SCAN SUSTA IN

Vs :155V

184V

Y

X rise

X

Address

Circuit Operation Description

6-26 Samsung Electronics

Single scan mode PDP action : Rest section, X : Ve, Y : Vscan, idle scan-line

C_Xerc

VsVe

VscanVset

C_Xsink

Dscan

D_Xs

D_Xsink

Ysc

Xr

Xs

Xrr

Ramp

D_Ysink

C_Ysink

Ysp

D_Xr

D_YVsC

LX

Cp

1

D_Xf

Xf

D_YGC

0 0

0

Xg

155V

Vs :155V

2

3

3 2

1

floating 5V

Vs

Rset

Ys

Yrr

Ramp

Dset

Yr

Yp

Cset

LY

D_YVsC

D_Yr

+5V

Yfr

Ramp

Yg

D_Yf

C_Yerc D_YGC

D_fVdd

Yf

C_fVdd

0 0 00

V set + V s:355V

Y rise

155V

Va :78V

Vscan :65V 65V

Ve :184V

Yfall

RESET SCAN SUSTA IN

Vs :155V

184V

Y

X rise

X

Address

Circuit Operation Description

Samsung Electronics 6-27

Single scan mode PDP action : Rest section, X : Ve, Y : Vscan, address scan-line

C_Xerc

VsVe

VscanVset

C_Xsink

Dscan

D_Xs

D_Xsink

Ysc

Xr

Xs

Xrr

Ramp

D_Ysink

C_Ysink

Ysp

D_Xr

D_YVsC

LX

Cp

1

D_Xf

Xf

D_YGC

0 0

0

Xg

155V

Vs :155V

2

3

3 2

1

floating 5V

Vs

Rset

Ys

Yrr

Ramp

Dset

Yr

Yp

Cset

LY

D_YVsC

D_Yr

+5V

Yfr

Yg

D_Yf

C_Yerc D_YGC

D_fVdd

Ramp

Yf

C_fVdd

0 0 00

V set + V s:355V

Y rise

155V

Va :78V

Vscan :65V 65V

Ve :184V

Yfall

RESET SCAN SUSTA IN

Vs :155V

184V

Y

X rise

X

Address

Circuit Operation Description

6-28 Samsung Electronics

Single scan mode PDP action : Rest section, X : Ve, Y : Vscan, idle scan-line

C_Xerc

VsVe

VscanVset

C_Xsink

Dscan

D_Xs

D_Xsink

Ysc

Xr

Xs

Xrr

Ramp

D_Ysink

C_Ysink

Ysp

D_Xr

D_YVsC

LX

Cp

1

D_Xf

Xf

D_YGC

0 0

0

Xg

155V

Vs :155V

2

3

3 2

1

floating 5V

Vs

Rset

Ys

Yrr

Ramp

Dset

Yr

Yp

Cset

LY

D_YVsC

D_Yr

+5V

Yfr

Ramp

Yg

D_Yf

C_Yerc D_YGC

D_fVdd

Yf

C_fVdd

0 0 00

V set + V s:355V

Y rise

155V

Va :78V

Vscan :65V 65V

Ve :184V

Yfall

RESET SCAN SUSTA IN

Vs :155V

184V

Y

X rise

X

Address

Circuit Operation Description

Samsung Electronics 6-29

Single scan mode PDP action : Rest section, X : 0, Y : 0, GND mode

C_Xerc

D_XrXfD_Xf

Xr

VsVe

VscanVset

C_Xsink

Dscan

D_Xs

D_Xsink

Ysc

Rset

Xs

Xrr

Ramp

D_Ysink

C_Ysink

Yrr

Ramp

Dset

Ysp

D_YVsC

1

Yp

Cset

Cp

LX

3

2

+5V

Yfr

D_YGC

Xg

1

D_fVdd

3 2

floating 5V

C_fVdd

0 0

0

155V

Vs :155V

Va :78V

Vscan :65V 65V

Ve :184V

Yfall

Vs

Ys

Yr

LY

D_YVsC

D_Yr

Ramp

Yg

D_Yf

Yf

0 0 00

V set + V s:355V

Y rise

155V

RESET SCAN SUSTA IN

Vs :155V

184V

Y

X rise

X

Address

C_Yerc D_YGC

Circuit Operation Description

6-30 Samsung Electronics

Single scan mode PDP action : Rest section, X : 0, Y : 0 -> Vs, charging mode

C_Xerc

VsVe

VscanVset

C_Xsink

Dscan

D_Xs

D_Xsink

Ysc

Xr

Xs

Xrr

Ramp

D_Ysink

C_Ysink

Ysp

D_Xr

D_YVsC

LX

Cp

1

D_Xf

Xf

D_YGC

0 0

0

Xg

155V

Vs :155V

2

3

3 2

1

floating 5V

Vs

Rset

Ys

Yrr

Ramp

Dset

Yr

Yp

Cset

LY

D_YVsC

D_Yr

+5V

Yfr

Ramp

Yg

D_Yf

C_Yerc D_YGC

D_fVdd

Yf

C_fVdd

0 0 00

V set + V s:355V

Y rise

155V

Va :78V

Vscan :65V 65V

Ve :184V

Yfall

RESET SCAN SUSTA IN

Vs :155V

184V

Y

X rise

X

Address

Circuit Operation Description

Samsung Electronics 6-31

Single scan mode PDP action : Rest section, X : 0, Y : Vs, Gas discharging mode

C_Xerc

VsVe

VscanVset

D_Xs

C_Xsink

Dscan

D_Xsink

D_Ysink

Ysc

Xr

Xs

Xrr

Ramp

C_Ysink

Ysp

D_Xr

D_YVsC

LX

Cp

1

D_Xf

Xf

D_YGC

0 0

0

Xg

155V

Vs :155V

2

3

3 2

1

floating 5V

Vs

Rset

Ys

Yrr

Ramp

Dset

Yr

Yp

Cset

LY

D_YVsC

D_Yr

+5V

Yfr

Yg

D_Yf

C_Yerc D_YGC

D_fVdd

Ramp

Yf

C_fVdd

0 0 00

V set + V s:355V

Y rise

155V

Va :78V

Vscan :65V 65V

Ve :184V

Yfall

RESET SCAN SUSTA IN

Vs :155V

184V

Y

X rise

X

Address

Circuit Operation Description

6-32 Samsung Electronics

Single scan mode PDP action : Rest section, X : 0, Y : Vs -> 0, discharge mode

C_Xerc

VsVe

VscanVset

D_Xs

C_Xsink

Dscan

D_Xsink

D_Ysink

Ysc

Xr

Xs

Xrr

Ramp

C_Ysink

Ysp

D_Xr

D_YVsC

LX

Cp

1

D_Xf

Xf

D_YGC

0 0

0

Xg

155V

Vs :155V

2

3

3 2

1

floating 5V

Vs

Rset

Ys

Yrr

Ramp

Dset

Yr

Yp

Cset

LY

D_YVsC

D_Yr

+5V

Yfr

Yg

D_Yf

C_Yerc D_YGC

D_fVdd

Ramp

Yf

C_fVdd

0 0 00

V set + V s:355V

Y rise

155V

Va :78V

Vscan :65V 65V

Ve :184V

Yfall

RESET SCAN SUSTA IN

Vs :155V

184V

Y

X rise

X

Address

Circuit Operation Description

Samsung Electronics 6-33

6-3 Logic part

6-3-1 Description of Logic Board

The logic board consists of a logic main board and a buffer board. The logic main board is made up of a data signal processor that processes video signals, and a XY signal generator that runs the XY drivers. The buffer boar stores address driver output sigals and sends them to the address driver IC (COF module).

6-3-2 Name and Description of Major COmponents of the Logic Board

Logic Board Function Remarks

(Lo gic M a in)

(Bu ffe r Bo a rd )

E, F, G Buffer oard

H, I, J Buffer board

- Processes video signals. (W/L, Error diffusion, APC)

- Outputs address driver control signals and data signals to the buffer board.

- Outputs XY driver board control signals

Sends data signals and control signalss to the upper COF.

Sends data signals and control signals to the lower COP.

*

!

@

#

(

$

)

^&

%

Circuit Operation Description

6-34 Samsung Electronics

Description

NO

An input connector that receives LVDS encoded RGB, H, V, DATAEN, and

DCLK signals from the video board.

Indicates if the logic board properly receives Sync and

clock signal.

A connector to the Key Scan board that check and adjust

24C16 data.

An EEPROM for saving the gamma table, the APC table, the drive signal

timing and other options, etc.

A connector that outputs Y driver board control signals.

A connector that outputs X driver board control signals.

A connector that outputs address data and control signals to the

E,F and G buffer board.

A connector that outputs address data and control signals to the

H,I and J buffer board.

A fuse connected to the power source (5V) of the logic board.

A connector that supplies power (5V) to the logic board.

LVDS Connector

Operation LED

Key Scan Connector

256K

Y Connector

X Connector

Address Buffer

Connector (E,F,G)

Address Buffer

Connector (H,I,J)

Power Fuse

Power Connector

NAME

6-3-3 Waveform in Normal Operation

If the PDP unit and the logic board are operationg properly, the LED LD2010 in Figure 1 will blink at about a 1 second interval. If the unit is out of order, check the status of the Operation LED through eye-inspection first. If the behavior of the Operation LED is different from that of normal operation, you have to replace the board. To trouble-shoot the board, complete the logic board test procedures attached in the Appendix.

Circuit Operation Description

Samsung Electronics 6-35

6-3-3(A) Layout and Apperance of the Board

(1) Input

Fig. 1 Layout of the Logic Mainboard

LD2010 LD2002

LD2001

KEYSCAN

LG2000

F3

F2

256K

CN2001

256K

F1

TP1

U2002

GND

U2003

LG2003LG2002LG2001

U2005

U2006

U2007

U2008

CN2002

U2009

U2004

U2 010

LY2000

CN2003

LE2001 LE2002 LE2003

(2) Appearance of and Markings on the Connector

Basically, it is depicted exactly the same as the real one on the PCB.

6-3-3(B) DIP Switch setting that selects the internal or external clock (CN2001)

(1) External Mode Selection

Circuit Operation Description

6-36 Samsung Electronics

☞ When External Mode is selected;

! Enter PAGE 00. @ Set Register 2E’s address to 01. # Adjust the Dip Switch as shown above.

(UP : PIN_NUMBER 6,5,3,2,1 / DOWN : PIN_NUMBER 4)

(2) Internal Mode NTSC Pattern Selection

☞ When Internal Mode Pattern is selected;

! Enter PAGE 00. @ Set Register 2E’s address to 01. # Adjust the Dip Switch as shown above.

(UP : PIN_NUMBER 6,5,4,3,2 / DOWN : PIN_NUMBER 1)

MODE PAGE

NTSC 00 2E 01

REGISTER

ADDRESS

EXTERNAL

MODE VALUE

MODE PAGE

REGISTER

ADDRESS

INTERNAL

MODE VALUE

DIP SWITCH STATE

EXTERNAL MODE

6

5

4

3

DIP SWITCH STATE

INTERNAL MODE

2

1

NTSC 00 2E 00

6

5

4

3

2

1

Circuit Operation Description

Samsung Electronics 6-37

6-4 Scaler Board Block Diagram & Description

6-4-1 General Signal Process B/D

Ke y p a d

Exte r nal

IR

Module

Sub PCB for

Exte rna l Cont rol

MCLK DCLK

LVDS OUT

(63LVDM83A)

RGB,H/V

CLK, DE

2000. 05. 06

designed by K.H.I

PDP

Logic B’d

RGB,H/V

CLK, DE

Flash Mem.

(M29W800T)

(ICS501,502 )

C

2

Progr ammable P LL

OSD Mixe r,

(Imag e S c a ling ,

Image Processor

PW364

with CPU

Frame Rate Conversion)

M

CI

EEPRO

2

(24C16)

I

YUV,

2H/V,

AVO

RGB,

GCLK

Puls e Gen.

YPbP r RGB

(M4A3 32/32)

SCP

(CXA2101)

YPbPr

RGB,H/V

GFBK

DTV(480p,720p,1080i)DVD(480p)

RGB,H/V

Analog Switch

C

2

I

(BA7657)

with PLL

A/D conver ter

RGB

Analog Switch

RGB,H/V

C

2

I

(SDA9400)

Interlace to

Progre ss ive

YUV,H/ V

C

Decoder

2

(VPC3230)

Main Vid e o

I

D/A

(SDA9280)

C

2

I

Sand Castle

13.5MHz

27MHz

YPbPr

H/V (480P)

H/V

C

2

I

HD Interface

DVD

3D

COMB

YPbPr(480i)

C

2

I

(AD9884)

(BA7657)

SRAM

(KM616V1000)

RTC

(PCF8563)

CS

(LM1881)

Sync Sepe ra te

H/V

G(SOG)

DDC IC

V

DDC

(24LC21)

SDA/SCL

RXD/T X

D

(MAX232A)

Serial Interface

Aud io Am p.

( TA1101 )

Sub PCB for

Aud io

C

2

I

Aud io

Processor

( TDA7429 )

Video

(CVBS)

(Y/C)

S- Video

Input

(Y,Pb,Pr)

Comp onen t

DTV YPbPr

(480p,720p,1080i)

DVD YPbPr

(480i,480p)

PC RGB HV

(15 pin)

PC Input

VGA to S XGA

Vf: 56 to 75Hz

Hf: 3 1 to 80 kHz

RS232C

OUT

(L/R)

Audio In

RS232C IN

Circuit Operation Description

6-38 Samsung Electronics

6-4-2 Description in Signal Process Block

3D COMB FILTER : This 3D Comb Filter is used to improve noise and picture quality by three-dimensionally adjusting the

signal from the Input Video jack. The input signal is received from CVBS and the picture is digitally

improved via A/D Conversion and FIELD MEMORY. And then the signal is output as the ANALOG YC signal.

VPC3230 : This functions as a video decoder, which can receive all of the YC, YUV, CVBS inputs.

In addition, this converts Y/C into YUV after receiving 3D Comb Output Y/C, S-Vido Y/C, and DVD YUV.

VIDEO DOUBLER : Usually, the current video image adopts the INTERLACE Scanning system and it has poor video because of

Flicking on the screen. Using the SDA9400 , INTERLACE is converted into PROGRESSIVE in order to improve

the quality of video.

VIDEO PROCESSOR : Since the HD modes like 1920*1080I have higher video bandwidth than the existing video signals, the

ordinary decoder like VPC3230 can't handle those modes. PC has higher bandwidth of video signal than TV

and the RGB video format.

Therefore, if the HD signal can be converted into the RGB signals, the TV video signal can have the same

processing as the PC VIDEO signal. CXA2101 developed by SONY is used to convert YPbPr into RGB.

CXA2101 converts both DTV signals and all the SD signals processed in the sequence of SDA9400 then

SDA9280 into RGB.

This processor performs some user control functions, such as tint, color, and sharpness.

Also, it controls high light gains low light offsets when doing white balance adjustments.

ANALOG SWITCH : The video decoder like VPC3230 has a built-in video switch that assigns one signal out of various

received inputs, though most of ICs for PC are designed so that they support only one source because of

less necessity of simultaneously processing the multi inputs. To process the input source of MULTI

(PC&HD), therefore, a function of selecting an input should be externally added; as is performed by ROHM's

BA7657F. PW364 transmits a signal determining which input is selected.

ADC : A device that converts the input RGB signals into the 8bit DIGITAL RGB signals.

In case of white balance adjustments, this device sets the color temperature by controlling R/B gains and

R/B offsets.

PW364 : PW364 is a multi-functional scaler which one chip has video signal scaling, 8086 CPU, 4M BYTE VIDEO

MEMORY functions. The PC and Video input signals are received from GRAPHIC PORT and VIDEO PORT,

respectively.Its main functions include UP/DOWN SCALING, PIP, ZOOM, GAMMA CORRECTION,

Compensation of GEOMETRIC DISTORTION, powerful GRAPHIC OSD.

FIRMWARE : Mounted is a software that is used for system control by operating 8086 built in PW364. A 4MBIT FLASH

ROM is mainly used, but one up to 8MBIT can be used according to PROGRAM and capacity of OSD DATA.

The system is easy to maintain because programming can be re-done at any yime using the FLASH ROM.

Circuit Operation Description

Samsung Electronics 6-39

6-5 IC Line-Up

6-5-1 IC LINE UP

BA7657

CRYSTAL ANALOG

DIGITAL CLOCK

AD9884

CXA2101

TOLOGIC

LVDS OUT

90CF385

67.4MHZ

VIDEO CLK

16 .25 7

ICS501

130MHZ67. 4MHZ

PW364

27MHZ

20 .25

ICS502

SDA9400

27MHZ

FROMSMPS

29LV16

616V100

MAX232

13.5 MHZ

CONTROL

PWR

RMC/LED

BA7657

RGB1 RGB2

D_SUB

DTV

M4A3

DVD(480I)

K4E

151612D

Pr/RVH

B

SDA9280

20

20.2 5

UPD

64082

COM POSITE

Y/GPb/

VPC3230

Y/C

VIDEO

TO SOUND

Y/C

S_VIDE

O

Circuit Operation Description

6-40 Samsung Electronics

6-5-2 PIN Description

Pi n No. Pin Name Pin Na me Pin Name Pin Name Pin Na me Pin Name

1 DGND 2 GND SCL KEY1 3 TxOUT0 - / RxIN0 4+/ 5 REL_SW R 1 LED G 6 TEMP DET T2 7FANDETR2 8 GND

9AMPMUTE1 10 12V GND 11 12V 12 A6V 13 14 15 T xCLKOUT-/ RxCLKIN16

TxCLKOUT-/ RxCLKIN 17 18 19 20 21 NC 22 NC 23 NC 24 NC 25 NC 26 NC 27 NC 28 NC 29 NC 30 NC 31 NC

DGND

TxOUT0 RxIN0

DGND DGND

TxOUT1 - / RxIN1 TxOUT1 RxIN1

TxOUT3 - / RxIN3 TxOUT3 RxIN3

+/ DGND DGND

DGND DGND

+/

+

ST5V SDA ST5V

GND D5V T1 LED R

GND GND

GND

KEY1 KEY1 KEY4 GND

KEY4

GND GND

KEY4

RMC S IG

Circuit Operation Description

Samsung Electronics 6-41

6-6 Main I/O signal pules and voltages

6-6-1 Signal Pulses of Image Board(Input Signal Conditions : 7 Color bar)

* 9C55 VIDEO INPUT *3D COMB P88 VIDEO INPUT

* 3D COMB P84 Y OUTPUT *3D COMB P83 C OUTPUT

* 3U1(VPC3230) PIN75 Y_IN * 3U1(VPC3230) PIN72 C_IN

Circuit Operation Description

6-42 Samsung Electronics

* 3U1(VPC3230) PIN40 Yo_OUT * 3U1U(VPC3230) PIN56 HS_OUT

* 3U1(VPC3230) PIN57 VS_OUT * 3U1(VPC3230) PIN27 LLC2_OUT

* 3U1(VPC3230) PIN28 LLC1_OUT

Circuit Operation Description

Samsung Electronics 6-43

* 3U2(SDA9280) PIN47 V_Y_OUT * 3U2(SDA9280) PIN51 V_Pr_OUT

* 3U2(SDA9280) PIN54 V_Pb_OUT * 2U2(CXA2101) PIN39 B_OUT

* 2U2(CXA2101) PIN37 G_OUT * 2U2(CXA2101) PIN35 R_OUT

Circuit Operation Description

6-44 Samsung Electronics

* 1U1(AD9884) PIN:115 PCLK_OUT * U29(AD9884) PIN7 R_IN

* U29(AD9884) PIN95 ROUT_ODD * U29(AD9884) PIN105 ROUT_EVEN

Circuit Operation Description

Samsung Electronics 6-45

* 2U2(CXA2101AQ) PIN5 DTV.Y_IN * 2U2(CXA2101AQ) PIN4DTV.Pb_IN

* 2U2(CXA2101AQ) PIN3 DTV.Pr_IN * 2U2(CXA2101AQ) PIN35 DTV.R_OUT

* 2U2(CXA2101AQ) PIN37 DTV.G_OUT * 2U2(CXA2101AQ) PIN39 DTV.B_OUT a

6-46 Samsung Electronics

MEMO

Troubleshooting

Samsung Electronics 7-1

7. Troubleshooting

7-1 No Raster(Board Change in PDP Monitor)

ST - BY Mode(LED:RED)

norma l

Power On 8J1 Re place s caler B’d

(LED:GREEN) Output

norma l

SMPS AC

Abnormal

ST 5V

Abnormal

Abnormal Abnor mal

Output Voltage Input

norma l

Logic Connect Powe r Re place SMPS

LED Lig h t- o n

(Po w e r,Sink)

norma l

Abnormal

Re place Logic B’d

X- B’ d Connect Power

norma l

or Go to P age 7- 2

Cha n g e Fuse

X- B’ d Output

norma l

Abnormal

Repla ce X- B’d

Y- B’ d Connect Power

Y- B’ d

Abnormal

Repla ce X- B’d

Output

norma l

Repla ce Panel

7-2 Samsung Electronics

Alignment and Adjustments

7-2 No Raster in Scaler Board

Chec k Out p ut Da t a of 5J1

Abnormal

Nor mal

Chec k Log ic B’d

Check Input Signal of 5U1 LVDS IC

Pin 2 7(LHS),28(LVS),32(CLK)

Abnormal

Check Output Signal of 1U1 AD9884

Pin 115(CLK), 85 (G7), 1 05(R7),65(B7)

Abnormal

Check Input Signal of 1U1 AD9 884

R,G,B IN AND H,V IN

Abnormal

Check Output Signal of 3U3 SDA9280

Pin 47(Yout),

Nor mal

Chec k 5 U1

LVDS IC

CHECK PW364

CHECK 1U1

AD9884

CHECK 2U2

CXA2 1 0 1

Abnormal

Check Input Signal of 3U1 VPC323 0

Pin 75(Y IN)

Abnormal

Check Input Signal of U38 uP D6 4082

Pin 8 8 (CVBS in)

Nor mal

Chec k 3U1 , 3U2 OR3U3

CHECK

UPD64 0 8 2

CHECK INPUT SIGINAL

Troubleshooting

Samsung Electronics 7-3

7-3 Partly no screen

Troubleshooting

7-4 Samsung Electronics

7-4 63”HD s1.0 Logic Main Board T/S

If the PDP unit and the logic board operates properly, the operation LED of Figure 1 would blink at about

1 second interval.

If the unit is out of order, check the status of the operation LED through eye-inspection first. If the behavior of the operation LED is different from that of normal state, you have to replace the board. To check the trouble on the board, complete the following logic board test procedures described below.

Required testing equipment : - Oscilloscope (digital 400 MHz with more than 3 channels)

- Multi-meter

Other equipment : - DC power supply (5V: 1EA)

- Sub-PCB ASS'Y for JIG: 1 EA

Perform eye-inspection and short circuit inspection on the power stage of the logic board to be examined. If no problem is found, perform the following examinatios on the board in order. Change the clock setting of the logic board to internal. Connect the power (5V) to LD1, and check that the LED (LD2000) on the top left of the board blinks at about a 1 second interval. If the logic board is out of order, the LED will blink too fast or not be lit at all. If no problems were found in the above examination, connect the logic main board with CN2003(13P), LY2000(40P), LE2001(40P), LE2002(40P), LE2003(40P), LG2001(40P), LG2002(40P) and LG2003(40P) using the connection cable. Set the oscilloscope at 4ms/div and 5V/div. Check Drive Y s/w, Drive X s/w and the address signal in order. Set Probe 1 of the oscilloscope to the trigger signal and connect it to TP41 of the logic board. Measure the waveform at each test point on the board, and compare it with the appended waveforms. Make sure that you examine the waveforms of all the test points. Turn off the power supply switch after the test, and disconnect the connector.

Troubleshooting

Samsung Electronics 7-5

POL(LE2001, LE2002, LE2003, LG2001, LG2002, LG2003 : 25)

DATA(LE2001, LE2002, LE2003, LG2001, LG2002, LG2003 6~11, 15~20, 28~33

LG2003, LE2003 : 35~40)

Troubleshooting

7-6 Samsung Electronics

CLK(LE201, LE2002, LE2003, LG2001, LG2002, LG2003 : 13,22

STB(LE2001, LE2002, LE2003, LG2001, LG2002, LG2003 : 24)

Troubleshooting

Samsung Electronics 7-7

Y7

Y5

Troubleshooting

7-8 Samsung Electronics

Y11

Y9

Troubleshooting

Samsung Electronics 7-9

Y15

Y13

Troubleshooting

7-10 Samsung Electronics

Y19

Y17

Troubleshooting

Samsung Electronics 7-11

Y23

Y21

Troubleshooting

7-12 Samsung Electronics

Y28

Y25

Troubleshooting

Samsung Electronics 7-13

Y32

Y30

Troubleshooting

7-14 Samsung Electronics

X2

Y34

Troubleshooting

Samsung Electronics 7-15

X6

X4

Troubleshooting

7-16 Samsung Electronics

X10

X8

Troubleshooting

Samsung Electronics 7-17

7-5 Inspection of the Driver Board

7-5-1 Y buffer

- To check if there is a problem with the Y main, first examine whether the Y buffer operates normally.

- Disconnect the connector between the Y main and the Y buffer.

- Diode-check the area between OUTL and OUTH to make sure that the flow of the voltage remains at 0.4V~0.5V.

- The impedance between the two ends must be more than a few k Ω.

OUT L OUTH

OU TL

OU TH

OU TL

OU TH

OU TL

OU TH

OU TL

OU TH

OU TL

OU TH

OU TL

OU TH

TP

OU TL

OU TH

OU TL

OU TH

TP

Troubleshooting

7-18 Samsung Electronics

7-5-2 Y Main

- Connect the Y main to the Y buffer, and check that the output of the TP in the Y buffer appears as noted in Appendix 1 when power is applied.

CN5401

-

Panel

CN5402

-

Panel

CN5404

CN5406

CN5405

CN5407

CN5409

CN5007

CN5001

CN5006

CN5005

CN5008

-

Power

CN5003

CN5403

-

Panel

CN5408

CN5004

TP

CN5002

Signal

-

Troubleshooting

Samsung Electronics 7-19

7-5-3 X

-Check that the output of either Out 1 or Out 2 on the X board appears as noted in Appendix 2 when power is applied.

CN4004

-

Power

CN4009

X- OUT1

CN4005

-

Signal

CN4008

CN4007

X- OUT1

CN4006

Troubleshooting

7-20 Samsung Electronics

Appendix 1

■ Y Output Waveform

- The status of the waveform when it is not connected to the panel.

❈ Make sure there is only one scan waveform in the output!!

Y Output Waveform (200us/div, 100V/div)

❈ Be sure to check that the energy recovery software is operating!!

Troubleshooting

Samsung Electronics 7-21

Appendix 2

■ X Output Waveform

- The status of the waveform when it is not connected to the panel.

X Output Waveform (200us/div, 100V/div)

❈ Be sure to check that the energy recovery software is operating!!

Troubleshooting

7-22 Samsung Electronics

7-6 No audio is sounded and video is displayed properly

Exploded View and Parts List

Samsung Electronics 4-1

4. Exploded View and Parts List

4-1 HPL63H1X/XAA MODULE

You can search for the updated part code through ITSELF web site. URL : http://itself.sec.samsung.co.kr

[17]

[14]

[27]

[3]

[24]

[20]

[13]

[5]

[12]

[26]

[23]

[4]

[6]

[9]

[7]

[2]

[25]

[10]

[11]

[4]

[8]

[3][21]

Exploded View and Parts List

4-2 Samsung Electronics

J

6

1

0

5

200

HC,

TY

2

1

2

1

2

1

2

1

DP63HW01A 63, HW,ASYM,DUAL, 300x340x380, 0~0, 1443x833

LJ93-00050A 63HD

LJ61-00714A 63HD, SECC, T2. 0

NO PART DESCRI PTI ON CODE NO SPE CI FI C ATI ON Q’

LJ61-00552A 5 0HD, AL DI ECASTI NG,

PAN EL- PD P

ASSY- CHA SSIS, BASE

BRACK ET- WALL

GUI DE- STAND

1

2

3

4

LJ61-00855A 63HD, SECC, T1. 0, -, -, -, -

BRACK ET- PO W ER

5

LJ92-00540B 63HD, LJ41-00940B, - , SDI, E-BUFFER, 438X45XT1. 6MM,-,-,

LJ92-00541B 63HD, LJ41-00941B, - , SDI, F-BUFFER, 433X45XT1. 6MM,-,-,

LJ92-00542B 63HD, LJ41-00942B, - , SDI, G-BUFFER, 438X45XT1. 6MM,-,-,

LJ92-00543B 63HD, LJ41-00943B, - , SDI, H BUFFER, 438X45XT1. 6MM,-,-,

LJ92-00544B 63HD, LJ41-00944B, - , SDI, I BUFFER, 433X45XT1. 6MM,-,-,

LJ92-00545B 63HD, LJ41-00945B, - , SDI, J BUFFER, 438X45XT1. 6MM,-,-,

LJ92-00674A 63HD, LJ41-01057A, - , SDI , LOGIC MAIN, 320X190XT1. 6MM,-

LJ44-00039A PDP-PS-63A, 110 ~ 130V, 47HZ-63HZ

LJ92-00603A 63HD, LJ41-01230A, 63HD- YM-1.0,SDI,YMAIN, 315X190XT1

LJ92-00552B 63HD, LJ41-01112A, 63HD- XM-1.0,SDI,X-MAI N, - , CLAS S B,

LJ92-00547A 63HD, LJ41-00947A, - , SDI , Y-BUFFER LO, 375X60XT1.6MM,-

LJ92-00546A 63HD, LJ41-00946A, - , SDI , Y-BUFFER UP, 375X60XT1. 6MM,-

LJ92-00549A 63HD, LJ41-00949A, - , SDI , X-BUFFER LO, 375X60XT1.6MM,-

LJ92-00548A 63HD, LJ41-00948A, - , SDI , X-BUFFER UP, 375X60XT1. 6MM,-

LJ92-00655A 63HD, -, -, SDI, AC LI NE , 193. 5X146XT1. 6MM,-,-,-

LJ92-00551A 63HD, LJ41-00951A, - , SDI , Y-SUB, 410X30X1. 6MM,-,-,-

LJ92-00550A 63HD, LJ41-00950A, - , SDI , X-SUB, 410X25X1. 6MM,-,-,-

ASSY- PCB, B UFFE R( E )

ASSY- PCB, B UFFE R( F)

ASSY- PCB, B UFFE R( G)

ASSY- PCB, B UFFE R( H)

ASSY- PCB, B UFFE R( I )

ASSY- PCB, B UFFE R( J)

ASS Y- P CB, LOGI C( M AI N)

SMPS

ASSY-PCB, Y(MAI N)

ASSY-PCB, X(MAI N)

ASSY- PCB, B UFFE R( L )

ASSY- PCB, B UFFE R( U)

ASSY- PCB, B UFFE R( L )

ASSY- PCB, B UFFE R( U)

ASSY- PCB, LI N E (FI LT E R)

ASSY- PCB, SUB

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

Samsung Electronics 4-3

Exploded View and Parts List

4-2 HPL63H1X/XAA MONITOR

[5]

[8]

[22]

[30]

[32]

[4]

[32]

[3]

[15]

[5]

[12]

[13]

[1]

[2]

[33

Exploded View and Parts List

4-4 Samsung Electronics

S

C

E

W

M

A

H

I

E

6

0

-

0

67W

,

+,8

,

Z

Y

ELM

2

0

TY

2

1

2

1

6

2

1

3

1

63, HW,ASYM, DUAL, 300x340x380, 0~0, 1443x833

LJ91-00472A 6 3HD, ABS, L/ GRAY, S EC, - , - , -

ASSY- CABINET , FR ON T

GLASS- FI LTER LJ64-00052A 63HW, 1363A- 202S1-A, T3. 8, W1442, L832, -, - , 0. 1OHM3HO LD ER- FI TER, TOP LJ61- 00316B 63HD, AL, T1. 5, -, L1422, -, -4HOLDER- F I LTE R, BOT LJ61-00317B 63HD, AL, T1. 5, -, L1422, -, -5HO LD ER- FI TER, SI DE LJ61-00318B 63HD, AL, T1. 5, -, L742, - , -6ASSY PCB CON T ROL LJ92-00538A 63HD, -, 63HD-KP- 1. 0, SDI , KEY PAD, 217X15XT1. 6MM,-,-,-

1

NO PART DESCRI PTI ON CODE NO SPE CI FI C ATI ON Q’

2

BUTTON- CONTROL LJ64-00030A 42"S1. 0 ABS( V0)

7

LJ92-00592A 63HD, -, -, SDI, SCALER BOARD, - , D52A, HPL5025M,-,-

PM63HW003A

MODULE

ASSY-PCB, VIDEO

8

LJ92-00586B 63HD, - , 63HD- ST- 1. 0, SDI , SDI , SPK TERM,-,CLASS B,-,-

LJ92-00593A 6 3HD, - , - , S DI , AUDI O SOUND, - , HPL50 2 5 M X/ XAA, D5 2 A, - , -

ASSY- PCB, TE RMI NAL

ASS Y- P CB, AUI DO

HO LD ER- CABI NET, TL LJ61- 00733A 63HD, SPC , T1. 6, -, -, - , -13HOLDER- CABI NE T LJ61-00715A 63HD, SPC, T1.6, - , - , - , NI14HO LD ER- CABI NET, TM LJ61-00789A 50HD, SPC, T1. 6, - , - , - , -15HOLDER- CABI NE T, SI DE LJ61-00734A 63HD, SPC, T1. 6, - , - , - , -16HOLDER- CABI NE T, SI DE( M ) LJ61-00735A 63HD, SPC, T1. 6, - , - , - , -17BRACK ET- RMC LJ61- 00324A SPD-42P1S,SECC,T1.0,-,-,-,-18ASSY PCB CON T ROL LJ92-00539A 63HD, -,63HD-RM-1.0,SDI,R/MODULE,90X27X1. 6MM,-,-,-19COV ER- BACK , TERM IAL LJ63-01065A 63HD, AL, T1. 5, -, -, -, -, BLK, -20COV ER- BACK LJ63-01064B 63HD, AL, T1. 5, -, -, -, -, BLK, -

9

10

11

12

6006-001035 WSP, PH, +, M3, L8, ZPC ( Y EL) , SM10C

SCREW-ASS’ Y, M ACH

21

SCREW- TAPPI NG 6002-001142 TH,+,2,M3. 5, L10, ZPC( YEL) , SWRCH1 8 A

22

Samsung Electronics 4-5

Exploded View and Parts List

4-3 For assy replacement, code number and description by assy

In order to replace a broken part, please see the figure below and makea request using the assy code number of a spec assy neccessary for replacement.

5

6

7

10

8

14

18

13

10

17

3

4

9

12

2

15

8

16

1

9

11

Exploded View and Parts List

4-6 Samsung Electronics

1

Q’TY

1

2

1

2

1

LJ92-00540B 63HD, LJ41- 00940B, - , SDI, E-BUFFER, 438X45XT1. 6MM,-,-,

LJ92-00541B 63HD, LJ41- 00941B, - , SDI, F-BUFFER, 433X45XT1. 6MM,-,-,

LJ92-00542B 63HD, LJ41- 00942B, - , SDI, G-BUFFER, 438X45XT1. 6MM,-,-,

LJ92-00543B 63HD, LJ41- 00943B, - , SDI, H BUFFER, 438X45XT1. 6MM,-,-,

LJ92-00544B 63HD, LJ41- 00944B, - , SDI, I BUFFER, 433X45XT1. 6MM,-,-,

LJ92-00545B 63HD, LJ41- 00945B, - , SDI, J BUFFER, 438X45XT1. 6MM,-,-,

LJ92-00674A 63HD, LJ41-01057A, - , SDI, LOGI C MAI N, 3 2 0 X1 90 XT1. 6 M M,-

LJ44-00039A PDP-PS- 63A, 110 ~ 130V, 47HZ- 63HZ

LJ92-00603A 63HD, LJ41-01230A, 63HD- YM-1.0,SDI,YMAI N, 3 1 5 X1 9 0 XT1

LJ92-00552B 63HD, LJ41- 01112A, 63HD-XM-1.0,SDI,X-MAI N, - , CLAS S B,

LJ92-00547A 63HD, LJ41-00947A, - , SDI, Y- BUFFER LO, 375X60XT1. 6MM,-

LJ92-00546A 63HD, LJ41-00946A, - , SDI, Y- BUFFER UP, 375X60XT1. 6MM,-

LJ92-00549A 63HD, LJ41-00949A, - , SDI, X- BUFFER LO, 375X60XT1. 6MM,-

LJ92-00548A 63HD, LJ41-00948A, - , SDI, X- BUFFER UP, 375X60XT1. 6MM,-

LJ92-00655A 63HD, -, - , SDI , AC LINE , 193. 5X146XT1. 6MM,-,-,-

LJ92-00551A 63HD, LJ41-00951A, - , SDI, Y- SUB, 410X30X1. 6MM,-,-,-

LJ92-00550A 63HD, LJ41-00950A, - , SDI, X- SUB, 410X25X1. 6MM,-,-,-

LJ92-00592A 63HD, -, - , SDI , SCALER BOARD, - , D52A, HPL5025M

ASSY- PC B, BUFFE R( E)

ASSY- PC B, BUFFE R( F)

ASSY- PC B, BUFFE R( G)

ASSY- PC B, BUFFE R( H)

ASSY- PC B, BUFFE R( I )

ASSY- PC B, BUFFE R( J)

ASS Y- PCB, LOGI C( M AI N)

SMPS

ASSY-PCB,Y(MAI N)

ASSY-PCB,X(MAI N)

ASSY- PC B, BUFFE R( L)

ASSY- PC B, BUFFE R( U)

ASSY- PC B, BUFFE R( L)

ASSY- PC B, BUFFE R( U)

ASSY- PC B, L I N E (FI LT E R)

ASSY- PC B, SUB

ASSY PCB VIDEO

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

NO PART DESCRI PTI ON CODE NO SPE CI FI CATI ON

18

DDC/ADC/analog Connector

[ AD9884 INTERFACE PAR

T ]

ABO[7:0]

ARO6

ARO5

ARO3

ARO4

ARO[7:0]

ABO0

ARO7

ABO1

ABO7

ABO5

ABO4

ABO3

ABO6

ABO2

ARO1

ARO0

ARO2

ARE[7:0]

AGE[7:0]

ABE[7:0]

ABE3

AGE0

ARE7

AGE2

ARE3

ARE5

AGE3

ARE4

AGE5

AGE7

ABE1

ARE1

AGE6

ABE4

ABE0

AGE1

ABE6 ABE7

ARE2

ABE2

ARE0

ABE5

ARE6

AGE4

SR3

SQ1

SR6

SQ6

SQ18

SQ20

SR5

SR0

SR7

SR23

SR20

SQ10

SQ11

SR14

SR11

SQ5

SQ23

SQ7

SQ16

SQ22

SQ14

SR1

SR21

SQ9 SQ8

SR4

SQ4

SR15

SR9

SQ12

SR8

SR13

SR22

SQ3

SR12

SR16

SQ15

SR17

SR2

SQ0

SQ19

SQ21

SQ2

SR19 SR18

SQ17

SQ13

SR10

ARE1

ARE0

ARE2

ARE3

ARE4

ARE5

ARE6

ARE7

ABO2

ABO5

ABO7

ABO6

ABO4

ABO1

ABO0

ABO3

SOGREF

SQ22 SQ21

SQ7

SQ3 SQ2

SQ15

SR21

SR16

SQ18

SQ5

SR18

SR10

SR0

SQ23

SQ0

SR14

SR6

SQ11

SQ6

SR7

SR4

SQ14 SQ13

SQ4

SR5

SR3 SR2 SR1

SR22

SR8

SQ19

SQ9 SQ8

SR23

SR19

SR11

SQ20

SQ17 SQ16

SQ10

SR9

SQ12

SQ1

SR13

SR17

SR12

SR20

SR15

SR13

SR20

SR8

SR22

SR3

SR5

SR1

SR9

SR7

SR0

SR4

SR18

SR19

SQ13

SQ0

SR14

SQ18

SR10

SQ23

SR6

SQ10

SQ5

SQ6

SR23

SQ15

SQ2

SQ7

SQ11

SQ4

SQ12

SR2

SR16

SR21

SQ19

SQ17

SQ3

SQ21

SR11

SQ14

SQ22

SQ9

SQ16

SQ8

SQ20

SQ1

SR12

SR15

SR17

AGE0 AGE1 AGE2 AGE3 AGE4

AGE5

AGE6

AGE7

ABE1

ABE2 ABE3 ABE4 ABE5 ABE6 ABE7

ARO6

ARO7

ARO5

ARO2 ARO3

ARO0

ARO4

ARO1

ABE0

AGO7

AGO0

AGO4 AGO5

AGO2

AGO3

AGO6

AGO7

AGO4

AGO1

AGO[7:0]

AGO3

AGO6

AGO1

AGO5

AGO0

SOGREF

ABO7

ABO2

ABO1

ABO5

ABO0

ABO3 ABO4

ABO6

AGO2

AGO5 AGO6

AGO4

AGO1

AGO0

AGO3

AGO7

ARO6

ARO3 ARO4 ARO5

ARO0

ARO2

ARO1

ARO7

ABE2

ABE5 ABE6

ABE4

ABE1

ABE0

ABE3

ABE7

AGE6

AGE3 AGE4 AGE5

AGE0

AGE2

AGE1

AGE7

ARE3

ARE6

ARE5

ARE7

ARE1 ARE2

ARE0

ARE4

ADVCC

VPLL

3.3V_A

3.3V

3.3V_A

ADVCC

3.3V_A

+5V

VPLL

ADVCC

TP212

1U2

2

1

4

5

6

3

nr

gnd

out

in

err

*sd

TP252

TP4

TP253

1C34

10uF/16V

TP514

TP224

1C31

104Z(OPEN)

TP254

1C5

10uF/16V

TP3

TP255 TP256

1C2

102J

1U1

AD9884

1 2 3 4 5 6 7 8

9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38

39404142434445464748495051525354555657585960616263

64

102 101 100

128

127

126

125

124

123

122

121

120

119

118

117

116

115

114

113

112

111

110

109

108

107

106

105

104

103

99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65

nc1 nc2

nc3 vdd1 gnd1 gnd2 RAIN vdd2 gnd3 vdd3 vdd4 gnd4 gnd5 SOGIN GAIN vdd5 gnd7 vdd6 vdd7 gnd8 gnd9 BAIN vdd8 gnd10 vdd9 gnd11 CKINV CLAMP SDA SCL A0 A1 PVCC1 PVCC2 gnd12 nc4 nc5 nc6

gnd13

HSYNC

COAST

gnd14

PVCC3

CKEXT

FILT

nc7

gnd15

PVCC4

gnd16

PVCC5

gnd17

gnd18

gnd19

VCC1

DBB7

DBB6

DBB5

DBB4

DBB3

DBB2

DBB1

DBB0

gnd20

VCC2

DRB0 DRB1 DRB2

vdd11

REFIN

REFOUT

PWRDN/

vdd10

gnd29

gnd28

gnd27

VCC8

gnd26

SOGOUT

HSOUT

DATACK/

DATACK

VCC7

gnd25

DRA0

DRA1

DRA2

DRA3

DRA4

DRA5

DRA6

DRA7

VCC6

gnd24

DRB3 DRB4 DRB5 DRB6 DRB7

VCC5

gnd23 DGA0 DGA1 DGA2 DGA3 DGA4 DGA5 DGA6 DGA7

VCC4

gnd22 DGB0 DGB1 DGB2 DGB3 DGB4 DGB5 DGB6 DGB7

VCC3

gnd21 DBA0 DBA1 DBA2 DBA3 DBA4 DBA5 DBA6 DBA7

1R9 304J

1NF1 SGM32F 1E104-2A

1

2

3

TP257

TP30

TP223

1C20 563K

TP258

1C1

104Z

1R7

472J

TP24

TP259

TP201

TP260

1C3

100J

1AR1 22 ohm 1 2 3 4 5

6

7

8

TP27

TP235

1C30

100J

1R4

102J

TP261

1C19

100J

TP14

TP222

TP262

TP29

TP202

1C28

104Z

TP263

1C18

102J

1C13

100J

TP264

TP31 TP234

1AR2 22 ohm 1 2 3 4 5

6

7

8

1C29

102J

TP265

1C9 563K

1C17

104Z

TP203

1AR3 22 ohm 1 2 3 4 5

6

7

8

TP221

Graphics Port

4U1A

PW364

U26 V24 V23 V25

V26 W25 W24 W23

H23

G26

H25

P23

P24

P25

P26

R23

B25

A26

D24

E23

C25

B26

C26

E24

R24

R25

R26

T23 T24 T25 T26

U25

F23 D25 D26

F24 E25 E26

F25

F26

D21 B22 C22 A23 B23 D22 C23 A24

L24 K26

L25

J26 K25

L26

L23

M25 H26 J25 J23 J24 M24 M26

GRE0 GRE1 GRE2 GRE3 GRE4 GRE5 GRE6 GRE7

GGE0 GGE1 GGE2 GGE3 GGE4 GGE5 GGE6 GGE7

GBE0 GBE1 GBE2 GBE3 GBE4 GBE5 GBE6 GBE7

GRO0 GRO1 GRO2 GRO3 GRO4 GRO5 GRO6 GRO7

GGO0 GGO1 GGO2 GGO3 GGO4 GGO5 GGO6 GGO7

GBO0 GBO1 GBO2 GBO3 GBO4 GBO5 GBO6 GBO7

GCLK GPEN GVS GHS GSOG GFIELD PLLCLK

GCLKOUT

GFBK GREF

GBLKSPL

GCOAST

GHSFOUT

GADCCLK

1C11

104Z

TP266

TP33

1AR4 22 ohm 1 2 3 4 5

6

7

8

TP267

1R8

332J

1AR5 22 ohm 1 2 3 4 5

6

7

8

TP20

1C12

102J

TP268

TP35

TP204

TP233

1AR6 22 ohm 1 2 3 4 5

6

7

8

TP11

TP269

1C23

102J

TP205

TP34

TP220

1C6

100J

TP270

TP7

TP206

1C26

102J

TP271

1C22

104Z

TP207

1R1 470

TP272

TP232

1C25

104Z

TP273

1C24

100J

TP13

TP219

1R2

103J

TP274

1Q1

KSC1623_G

1

2 3

TP275

TP9

TP208

TP16

TP276

TP15

TP231

1C27

100J

1R10 334J

TP277

TP218

TP278

TP209

TP6

1C35

10uF/16V

TP279

TP17

TP280

TP230

TP281

TP217

TP282

TP19

1C4

10uF/16V

TP283

1C37

104Z

1C10 150J

TP229

TP12

1R5 472J

1C14 563K

TP21

1C38

104Z

TP216

1C16 150J

1AR7 22 ohm 1 2 3 4 5

6

7

8

TP236

1C15 563K

1AR12 22 ohm 1 2 3 4 5

6

7

8

TP237

1C39

104Z

1NF3

SGM32F1 E104-2A

1

2

3

1C21 150J

1AR9 22 ohm 1 2 3 4 5

6

7

8

TP238

1C32

393Z

TP23

TP228

1AR10 22 ohm 1 2 3 4 5

6

7

8

TP239

1C40

104J

1C36

104Z

TP615

TP18

TP215

1AR11 22 ohm 1 2 3 4 5

6

7

8

TP240

1NF21M2012-121

1 2

TP199

1AR8 22 ohm 1 2 3 4 5

6

7

8

TP241

TP25

TP28

TP616

TP32

TP242

TP200

TP26

TP227

1R3

201J(OPEN)

TP617

TP243

TP1

TP214

TP244

1C33

392J

1C8

104Z

TP245

TP210

TP22

TP246

TP10

TP226

1R11

104J

TP247

TP8

TP213

TP248

1C7

10uF/16V

1Q2 KSC1623_G

1

2 3

TP249

TP211

TP2

TP250

TP225

1R6 472J

TP251

TP5

SR[23:0]

SQ[23:0]

CLAMP SDA SCL

PCLK

CKINV

ADSEL

MHS

SOG

ARE[7:0]

AD_R_OUT

AD_G_OUT

AD_B_OUT

PCLK

SQ[23:0]

SR[23:0]

CDE

CLAMP

MHS

CVSYNC

MHSYNC

MCOAST

SOG

CHSYNC

CKINV

MHSYNC CLAMP MCOAST

MHS

SQ[23:0]

SR[23:0]

ARO[7:0]

AGE[7:0]

AGO[7:0]

ABE[7:0]

ABO[7:0]

MHSYNC

MCOAST

ABO[7:0]

AGO[7:0]

ARO[7:0]

ABE[7:0]

AGE[7:0]

ARE[7:0]

10. Schematic Diagrams

Samsung Electronics

Schematic Diagrams

10-1

10-1 VIDEO

10-1-1 MAIN ADC (AD9884)

Schematic Diagrams

10-2 Samsung Electronics

10-1-2 VIDEO D/A CONVERTER

V_Y/G

V_Pr/R

V_Pb/B

3C87

10uF/16V

TP297

3R61

3R71

3C88

10uF/16V

5V_A

3NF12

SGM32F 1E104-2A

1

3NF13 SGM32F 1E104-2A

1

3NF15

SGM32F 1E104-2A

1

3R52

101J

000J

101J

CLK2 IVCLK

IVVS IVHS

TP284

3R63 R470J

TP285

3R68 R820J

TP286

3R70 R820J

5VCCI

3

2

3C85

5VCCA

3C89

104M

TP292

3NF14

1 2

M2012-121

104M

3

5VCC

TP293

3

3C90

104M

3R53 101J(OPEN) 3R56 101J

3R57 101J 3R58 101J

3R78 472J

TP291

3C86

104M

TP515

3R75

TP618

TP298

3R76

151J

SCL

SDA

3C76

152M

133J

3C91

104M

TP287 TP288 TP289

3C68

100M

3R62 3R64

3R69

622J

3R77

103J

3R59

3C69

3C70

100M

TP517 101J 101J

3C73

3C74

100M

TP290

424140393837363534333231302928

43

HS

VDD7

VSS9

TEST1

44

LF

45

Vcci

46

GNDY

47

YQ

48

Vcci1

49

VccA

50

GNDV

51

VQ

52

VccI2

53

GNDU

54

UQ

55

GNDA

56

Vref

57

Rref

58

Vcc

59

GND

60 10

VSS10 VDD3

VDD1

VDD2

VSS1V0V1V2V3

61626364656667

000J

VS

CLL

SDA

TEST

VSS8

3U3

SDA9280

V4

VSS2V5V6V7UV0

123456789

68

TP516

TP518

VSS7

TP294

VDD6

SCL

RES

SCA

UV1

INS

UV2

IVPEN

TP295

27

BLN

VSS6

VSS3

VSS4

VDD5 YUV7 YUV6

YUV5 YUV4 YUV3 YUV2 YUV1

YUV0 VSS5

UV7 UV6 UV5

UV4 UV3

VDD4

3R65 101J

3C77

104M

26 25 24

23 22 21 20 19

18 17 16 15 14

13 12 11

AY7 AY6 AY5

AY4 AY3 AY2 AY1 AY0

3C78

104M

AV7 AV6

AV5 AV4

AV3

AV1 AV0

RESETQ

TP296

3C79

104M

5AD

3C81

3C80

104M

3AR22 120 ohm 1 2

3 4 5

3AR23 120 ohm 1

2 3 4 5

3AR24

120 ohm

1 2 3 4 5

3AR25 120 ohm 1 2 3 4 5

3C82

104M

3NF11

SGM32F 1E104-2A 3

3C84

3C83

10uF/16V

104M

YIN7

8

YIN6

7

YIN5

6

YIN4

YIN3

8

YIN2

7

YIN1

6

YIN0

UVIN7

8

UVIN6

7 6

UVIN5 UVIN4

UVIN3

8 7

UVIN2AV2

6

UVIN1 UVIN0

5V_A

1

2

YIN[7:0]

UVIN[7:0]

AY0 AY1

AY2 AY3 AY4 AY5 AY6

AY7

AV0 AV1

AV2 AV3 AV4 AV5 AV6

AV7

TP299 TP300

TP301 TP302 TP303 TP304

TP305 TP306

TP307 TP308

TP309 TP310 TP311 TP312

TP313 TP314

Samsung Electronics

Schematic Diagrams

10-3

10-1-3 S-VIDEO &COMPONENT1 SIGNAL PROCESS

3R2 223J TP619

3R6 101J

3R10 223J

3R11 101J

3R17

3R22 101J

3NF9 NFM40R0 1C101T1

1

2

TP322

3R44 101J

NFM40R0 1C101T1 3NF10

1

3C9 474Z

Pb/B

3C28 10uF/16V

Y/G

3C48 474Z

Pr/R

3.3V

3R43 101J

3J2

TSC7549

1 2 3 4

5 6 7 8 9 10

11

TP529

TP530

TP531

TP621

TP620

5VA

KSC1623_G 3Q1

1

TP622

3R7

2 3

3R8 470J

3R9

223J

471J

5VA

3Q2

1

KSC1623_G

3R13

223J

1

3R23

223J

3

2

3

TP532

2 3

5VA

2 3

3R40

750J

TP533

3R15

471J

3Q3 KSC1623_G

3R25

471J

3C92

S1_DET

3C93

3R47

750J

TP623

3R14 470J

TP624

3R24 470J

1

+

22uF/16V

+

22uF/16V

2

3D2

DAN217

3

3R39 101J

TP629

1

2

3

TP630

TP315

3C10 224K

3C14

152K(OPEN)

TP316

3C27 224K

3C29 224K

3C33

152K(OPEN)

TP317

3C51 224K

3C56

152K(OPEN)

3D3

DAN217

3R46

3C15

+

47UF/16V

3C23

3C24

224Z

152K

3C35

3C36

224Z

152K

TP326

3C54

3C53

104M

3NF8

SGM32F1 E104-2A

1

3C62

10uF

TP319

TP321

TP323

3C16

473J

3C25

391J

3C37

391J

47UF/16V

3.3VD

3C55

104M

3

2

C_OUTC_IN

D_PB

5VA

TP324

3C22 +

D_Y1 D_Y1

D_Y

3.3V_D

3NF6 SGM32F 1E104-2A

1

2

D_PR

UV0 UV1 UV2 UV3 UV4 UV5 UV6 UV7

Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7

TP318

223J

3R38

TP534

1

3R41

223J

TP320

3R45 223J

TP535

101J

1

3R48

223J

47UF/16V

TP325

5VA

3C34 +

47UF/16V

3

3C52

+

47UF/16V

TP339 TP340 TP341 TP342 TP343 TP344 TP345 TP346

TP347 TP348 TP349 TP350 TP351 TP352 TP353 TP354

5VA

3C61

100J

3Q5 KSC1623_G

Y_IN Y_OUT

2 3

3R42

471J

3Q6 KSC1623_G

2 3

3R49

471J

TP631

5VA

TP632

3C64 334Z 3C65 334Z

3C67 102K

3C1 270J

20.25MHz

3C3 270J

C1_OUT

Y1_OUT

3C30

+

D_PB

D_Y

D_PR

VSIN0 VSIN1 VSIN2 VSIN3 VSIN4 VSIN5 VSIN6 VSIN7

5V_A

3C31

224Z

TP328

TP327

3Y1

TP355 TP356 TP357 TP358 TP359 TP360 TP361 TP362

UV0 UV1 UV2 UV3

UV4 UV5 UV6 UV7

Y0 Y1 Y2 Y3

Y4 Y5 Y6 Y7

1 2

C_OUT C1_OUT Y_OUT

Y1_OUT

3R16 102J

UV[7:0]

3AR15 120 ohm 1 2 3 4 5

3AR18 120 ohm 1 2 3 4 5

3AR20 120 ohm 1 2 3 4 5

3AR21 120 ohm 1 2 3 4 5

Y[7:0]

5VA

3R1 330J

3C2 104M

3R4 101J

3R3 101J

TP625

TP626

VS

VSTBY

FPDAT

R2/CR2IN

ASGFNCVSUPCAP

TP524

3C43 224Z

TP525

TP519

3C44 224Z

3C45 152K

TP521

UVIN2 UVIN3 VDDD1 VSSS1 UVIN4 UVIN5 UVIN6 UVIN7 VDD3 VSS4 YIN0 YIN1 YIN2 YIN3 YIN4 YIN5

TP627

FSY/HC

MSY/HS

VPC3230

VSUPD

3C46 391J

3C58 104M

32

49

CLK2

AVO

GNDD

UNIN1

YIN6

TP628

6463626160595857565554535251504948474645444342

3U1

NC1

CLK5

XTAL2

XTAL1

ASGF1

65

GNDF

66

VRT

67

I2CSEL

68

ISGND

69

VSUPF

70

VOUT

71

CIN

72

VIN1

73

VIN2

74

VIN3

75

VIN4

76

VSUPA1

77

GNDA1

78

VREF

79

FB1IN

80

AISGND

B1/CB1IN

G1/Y1IN

R1/CR1IN

B2/CB2IN

G2/Y2IN

1234567891011121314151617181920212223

3C41 224Z

3C42 224Z

YSIN0

TP363

YSIN1

TP364

YSIN2

TP365

YSIN3

TP366

YSIN4

TP367

YSIN5

TP368

YSIN6

TP369

YSIN7

TP370

8

VSIN0

7

VSIN1

6

VSIN2

3.3VDD2

33

YSIN4 YSIN5

YSIN6 YSIN7

34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

TP523

VSIN3

8

VSIN4 VSIN5

7 6

VSIN6 VSIN7

YSIN0

8 7

YSIN1

6

YSIN2 YSIN3

8 7 6

3R5 101J

INTLC

VSUPSY1

GNDCAP

SCL

3R18 101J

SCL

RESETQ

3R27 101J

UNIN0

RESET

VDDD5

YIN7

UV0

GNDSY1

SDA

3R19 101J

3R20 101J

SDA

RESETQ

CLK2

SYNCEN

3R28

3R29 000J

000J

SYNCEN

VSSS3

TP528

UV2

UV1

C0C1C2

RESQ

TEST

3R21 102J

3C47

104M

IVCLK

TP526

IVCLK

TP527

X2

X1/CLK2

3U2

SDA9400

CLK1

VDDD4

3R50 000J

UV3

C3

VGAV

YCOEQ

TP520

VDD2

CLKOUT

VDD4

VSS5

GNDC

VSUPC

FFIE

FFWE

HIN

3R30 101J

HIN

VSS3

VSSS2

VDDD3

UV4

UV5

C4C5C6

FFRSTW

FFRE

SDA

SCL

VIN

3R31 101J

3R32 101J

VIN

SDA

HOUT/HEXT

VDDD2

IVHS

UV7

UV6

41

C7

VSUPY

GNDY

GNDLLC

VSUPLLC

VSUPPA

GNDPA

FFOE

CLK20

24

3R33 101J

SCL

TEST

INTERACED

YOUT7

HREF

VOUT/VEXT

IVVS

IVPEN

Y0 Y1 Y2 Y3

Y4 Y5 Y6 Y7

LLC1 LLC2

171819202122232425262728293031

UVOUT0

YOUT6

646362616059585756555453525150

40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25

3.3VD

UVOUT1 UVOUT2 UVOUT3 UVOUT4 UVOUT5 UVOUT6 UVOUT7

VDD1

VSS2 YOUT0 YOUT1 YOUT2 YOUT3 YOUT4

VSS1 YOUT5

UV[7:0]

TP332

TP522

VIN

TP329

HIN

3.3VD

3C13 683M

3C32 473K 3C38 152K

YIN0 YIN1 YIN2 YIN3 YIN4 YIN5 YIN6 YIN7 IVHS IVVS

TP37 TP39 TP41 TP43 TP45 TP47 TP49 TP51 TP53 TP55 TP56

Y[7:0]

TP330 TP331

TP336

IVFIELD

3C12 473K

3C11 102K

Y0 Y1 Y2 Y3

Y4 Y5 Y6 Y7

TP633

3NF3 10uH12 3NF4 10uH12

TP634

TP335

TP36 TP38 TP40 TP42 TP44 TP46 TP48 TP50 TP52 TP54

UVIN0 UVIN1 UVIN2 UVIN3 UVIN4 UVIN5 UVIN6 UVIN7

IVCLK IVFIELD IVPEN

3.3VDD1

UVIN0

UVIN1

16 15

UVIN2

14

UVIN3

13

UVIN4

12

UVIN5 UVIN6

11 10

UVIN7 9 8 7

YIN0

YIN1

6 5

YIN2 4

YIN3 3

YIN4 2

YIN5

1

YIN6

YIN7

TP334

UVIN[7:0]

YIN[7:0]

UVIN[7:0]

YIN[7:0]

3C39 220J

TP333

IVHS IVVS

3.3V_D

SYNCEN CLK2

3C40 220J

3NF1 SGM32F 1E104-2A

1

3NF2 SGM32F 1E104-2A

1

CLK2

TP391

IVCLK

IVPEN IVVS IVFIELD IVFIELDOUT IVHS

YIN0 YIN1 YIN2 YIN3

YIN4 YIN5 YIN6 YIN7

UVIN0 UVIN1 UVIN2 UVIN3

UVIN4 UVIN5 UVIN6 UVIN7

2

IVPENOUT IVVSOUT IVFIELDOUT IVHSOUT

YOUT0 YOUT1 YOUT2 YOUT3 YOUT4 YOUT5 YOUT6 YOUT7

1 3NF5

M2012-260

1 2

3C49

10pF

3AR13 120 ohm 1 2 3 4 5

3AR14 120 ohm 1 2 3 4 5

3AR16 120 ohm 1 2 3 4 5

3AR17 120 ohm 1 2 3 4 5

3AR19 120 ohm 1 2 3 4 5

3

3C4 +

47UF/16V

3

3C17 +

47UF/16V

TP371 TP372 TP373 TP374

TP375 TP376 TP377 TP378 TP379 TP380 TP381 TP382

TP392

3C50

10pF

8

IVPENOUT

7

IVVSOUT

6

IVHSOUT

8 7 6

8

UVOUT4 UVOUT5

7 6

UVOUT6 UVOUT7

3C5

104M

3C18

104M

TP337

TP338

3C6

104M

3C19

104M

UVOUT0 UVOUT1 UVOUT2 UVOUT3 UVOUT4 UVOUT5 UVOUT6 UVOUT7

YOUT0 YOUT1 YOUT2 YOUT3 YOUT4 YOUT5 YOUT6 YOUT7

UVOUT0 UVOUT1 UVOUT2 UVOUT3

3.3VDD1

3C7

104M

3.3VDD2

3C20

104M

TP383 TP384 TP385 TP386 TP387 TP388 TP389 TP390

3C8

104M

3C21

104M

B16

VCLK

B17

VCLKEN

B18

VPEN

A21

VLAV

B21

VVS

A22

VHS

C21

VFIELD

A9

VR0

B10

VR1

A10

VR2

D11

VR3

C11

VR4

B11

VR5

A11 D12

C12 B12 A12 B13 A13 D14 C14 B14

A14 D15 C15 B15 A15 D16 C16 A16

VR6 VR7

VG0 VG1 VG2 VG3 VG4 VG5 VG6 VG7

VB0 VB1 VB2 VB3 VB4 VB5 VB6 VB7

4U1B

PW364

Video Po

rt

Schematic Diagrams

10-4 Samsung Electronics

10-1-4 CONPONENT2 SIGNAL PROCESS

3.3V

2C95

10uF/16V

3.3V

5V_A

2NF9 NFM40R0 1C101T1

2J4

BNC

2NF13 S G M 3 2 F 1E104-2A

1

2

2NF1 SGM32F 1E104-2A 1

2NF2 SGM32F1 E104-2A 1

2

5V_A

2J1

BNC

1

3

2C1

104

2NF14 SGM32F1 E104-2A 1

2

TP537

3

2

2R85 750J

2C99

10uF/16V

3

2C2

104

3

2C96

104J

TP404

2C106

22uF/16V

8

4

2C97

104J

VCC

GND

+

TP397

ENVDD

TDI

PROTECT

TCK

TP154 TP155

1

NC

OUT

TP156

TP158

2C100

104

1

3

H1 H2

2C98

104J

EIO2 EIO3

Y1

27MHz

5

H1

1

3

TP536

2

2D8 DAN217

2R79 101J

2R97

OSC

2R98

R000J

TP426

2R100

R102J

TP657

2

2D14

DAN217

2R94 101J 2R73 101J

TP398

4847464544434241403938

2U7

R472J

TP393

TP394

TP395

TP396

H2

2R99

R000J

2D11

RLS4148

9VA3

TP542

TP538

2R82

223J

1 2 3 4 5 6 7 8

9 10 11 12

TP402

H2_OUT

21

H_IN V_IN

9VA3 9VA3 9VA3

2R76 223J

2Q6

1

KSC1623_G

2 3

2R88

471J

TP427

TP658

I/O 5 I/O 6 I/O 7 TDI CLK0/I0 NC GND TCK I/O 8 I/O 9 I/O 10 I/O 11

2R101

R000J

Y/G

2J2

BNC

13 11

14

2D12

RLS4148

PCHSYNC2

TP406

I/O 4

I/O 3

I/O 2

I/O 1

I/O 0

GNDNCVCC

M4A3-32/ 32-12VC48

I/O 12

I/O 13

I/O 14

I/O 15

VCCNCGND

1314151617181920212223

2U8

1

A0

3

A1

5

A2 A3 A4

9

A5

VCC

74HC04

TP428

V1

21

TP659

2NF6 N F M 40R0 1C101T1

1

2NF10 N F M 40R0 1C101T1

1

2J5

BNC

TP401

GND

2R102

R102J

O0 O1 O2 O3 O4 O5

2

I/O 31

I/O 30

I/O 16

I/O 17

I/O 18

2 4 6 12 10 8

7

2D13

RLS4148

3

2R86 750J

37

I/O 29

I/O 19

24

I/O 28

I/O 20

TP405

21

I/O 27 I/O 26 I/O 25 I/O 24

TDO

GND

CLK1/I1

I/O 23 I/O 22 I/O 21

TP539

22uF/16V

NC

TMS

2R103

R472J

HS_OUT

36 35 34 33 32 31 30 29 28 27 26 25

V1

TP403

H2_OUT

SCP

2R95 101J

2R74 101J

1

2C107

+

2C105

104J

VS_OUT

TP400

TP556

TP157

TP159

1

2

2D9 DAN217

3

2R80 101J

EIO0 EIO1

2R110 R102J

2C109

100

3

H_IN V_IN

TP152

Pr/R

TP153

Pb/B Y/G

TDO

TP399

TMS

3.3V

2R111

R472J

2R112 R100J

2R113

R471J

5V_A 5VDD

2NF3 S G M 3 2 F 1E104-2A 1

TP559

3.3V

2C101

10uF/16V

2

2D15

DAN217

9VA3

TP540

TP541

2R83

223J

1

2R77 223J

1

2NF15 S G M 3 2 F 1E104-2A

RESETQ

2R104

OSC

2C59

2

10uF/16V

2

PCVSYNC2

2Q7 KSC1623_G

2 3

2R89

471J

R151J

2R105

3

Pb/B

R151J

2R106

3

2C102

104J

V_Y/G

V_Pb/B

V_Pr/R

IVHS IVVS

R151J

2R107

2R108

2R109

TP558

2C60

104

2C103

2C104

104J

TP548

2NF11 N F M 40R0 1C101T1

1

TP407

2J3

BNC

2

TCK

TMS

TDI

TDO

2R66

2C82 330J

3

TP554

10uF/16V

5VDD

TP423

822J

TP547

TP543

22uF/16V

2R87 750J

2C55

H_IN_V V_IN_V Pr/R_V Pb/B_V Y/G_V H_IN_D V_IN_D Pr/R_D Pb/B_D Y/G_D

HS_OUT

2C108

2C12 474

2C17 474

2C21 474

2C30 474

2C33 474

2C36 474

2C43 474

2C46 474

2C52 474

2C56 474

1 2 3 4 5 6 7 8 9

10

1 2 3 4 5 6 7 8

1

+

2C15 474

2C20 474

2C22 474

2C32 474

2C34 474

TP555

2J6

2U6

A1 B1 RST1 Q1 Q2 Cext2 Rx/Cx2 GND

2

3

TP635 TP636 TP637 TP638 TP639 TP640 TP641 TP642 TP643 TP644

H_IN_V V_IN_V Pr/R_V Pb/B_V Y/G_V

H_IN_D V_IN_D Pr/R_D Pb/B_D Y/G_D

2C41 474

2C45 474

2C50 474

2C53 474

2C58 474

2C63

103

TP560 TP561 TP562

53014-1010

74HCT221

Rx/Cx1

2D10 DAN217

2R81 101J

9VA1

VS_CXA HS_CXA SCP_CXA

VCC

Cext1

Q1 Q2

RST2

B2 A2

TP544

2C80

104

1 2 3 4 5 6 7 8

9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

16 15 14 13 12 11 10 9

TP545

IN2-H IN2-V IN2-1 IN2-2 IN2-3 VCC-MAT IN3-H IN3-V IN3-1 IN3-2 IN3-3 GND-MAT IN4-H IN4-V IN4-1 IN4-2 IN4-3 V-PH IN5-H IN5-V IN5-1 IN5-2 IN5-3 H-PH

5VDD

2C81 471J

TP655

2R78 223J

1

2R84

223J

8025

SELV-OUTYG-OUT

2R41 271J

2R40 824J

TP546

5VDD

2R75

2Q8 KSC1623_G

2 3

2R90

471J

SELH-OUT

SELCR-OUT

IREF-SYNC

YG-IN

2R42 473J

2C68 104M

TP425

Pr/R

2C3 474

SELY-IN

SELY-OUT

SELCB-OUT

CXA2101AQ

VCC-OUT

HS-OUT

VS-OUT

HS_CXA

VS_CXA VS_OUT

2R44 101J

2R43 101J

HS_OUT

2R64

R202J

TP654

TP424

391J

TP408

9VA2

2C5 474

2C4 474

SELCR-IN

SELCB-IN

2U2

VTIM-IN

SCP-IN

SCP_CXA

2R46 101J

2R45 101J

SCP

HS_OUT1

TP552

10uF/16V

2R3 223

IREF-YC

VCC-SIG1

GND-OUT

HP-IN

2R47 101J

2C86

2C6 474

GND-SIG

R-OUT

2C69 104M

2R48 101J

TP648

9VA

2C87

104M

Y1-IN

R-SH

2C7 474

CB1-1N

G-OUT

2R49 101J

2R5 101

2R4 101

2C8 474

656667686970717273747576777879

V1-IN

H1-IN

CR1-IN

YCBCR-SW

VM/SHP/COL-OFF

VM-OUT

DPIC-MUTE

ADDRESS

YS/YM-2

YS/YM-1

PABL-FIL

B-SH

B-OUT

G-SH

403938373635343332313029282726

2C70 104M

2C71 104M

2R50 101J

1

TP409

2NF7 SGM32F1 E104-2A

1

EY-IN ECB-IN ECR-IN

CLP-C

SDA

SCL

DPIC-C

LB2-IN LG2-IN LR2-IN

LB1-IN LG1-IN LR1-IN

ABL-IN

ABL-FIL

IK-IN

2

TP421

TP651 TP652 TP653

2Q3 KSC1623_G

2 3

2R67

561J

TP415

64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41

2C66

104

2R68

101J

R_OUT

3

1

VS_OUT

2R7 391J

2C13 474

2C16 474

2C18 474

2R11 101

2R14 101

2C23 474

2R17 101

2C35 10uF/16

2C37 474

2C44 474

2C47 474

2C51 474

2C57 10uF/16 2R34 335J

TP553

9VA2

2C67

10uF/16V

TP649

1

TP410

2NF8 SGM32F1 E104-2A

3

2NF12

S G M 3 2 F 1E104-2A

2

1

TP412 TP413 TP414

TP416 TP417 TP418 TP419

2R13 101(OPEN)

2C42 474

2R26 101

2C49 474

2R29 101

2C62 474

2C65 474

TP422

2Q4 KSC1623_G

2 3

2R69

2R70

561J

101J G_OUT

TP551

3

2

10uF/16V

R_OUT G_OUT B_OUT VS_OUT1 HS_OUT1 Y/G Pb/B Pr/R

9VA2

TP645

2C38 471

TP647

2R30 103J

2R51 103J

2Q1 KSA1182

3 2

2R58 103J

TP650

1

TP411

9VA1

2C89

2C88

104

TP646

2R21 101 2R22 101

2C39

471

1

9VA2

2 3

TP549

TP550

10uF/16V

2Q5 KSC1623_G

2R71

561J

2C90

TP420

9VA2

2C61

104M

TP656

2R72

101J

B_OUT

2C91

10uF/16V

104

2R53

9VA2

103J

9VA3

R_OUT G_OUT B_OUT VS_OUT1 HS_OUT1 Y/G Pb/B Pr/R

2R27

103J

2R35

103J

2C92

2C93

104

SDA SCL

PCG2_IN

PCB2_IN PCR2_IN

Samsung HPL63H1X Schematic

Specifications and Main Features

Frequently Asked Questions

User Manual