Samsung GT-E1150 Service Manual
GSM ТЕЛЕФОН
МОДЕЛЬ GT-E1150
РУКОВОДСТВО ПО
ТЕХНИЧЕСКОМУ ОБСЛУЖИВАНИЮ
GSM ТЕЛЕФОН СОДЕРЖАНИЕ
1. Спецификации
2. Поиск и устранение
неисправностей
3. Представление в разобранном
виде и перечень частей
4. Перечень электрических
компонентов
5. Блок-схемы
6. Диаграммы печатных плат
Данное руководство по техническому обслуживанию является
собственностью компании Samsung Electronics Co.,Ltd. Любое
несанкционированное использование данного руководства
может преследоваться согласно действующему международному
и национальному законодательству.
ⓒ Samsung Electronics Co.,Ltd.
1. Ɇɟɪɵ ɩɪɟɞɨɫɬɨɪɨɠɧɨɫɬɢ ɢ ɛɟɡɨɩɚɫɧɨɫɬɢ
1-1. Ɇɟɪɵ ɩɪɟɞɨɫɬɨɪɨɠɧɨɫɬɢ ɩɪɢ ɪɟɦɨɧɬɟ
• Ɍɨɧɤɢɟ ɧɚɫɬɪɨɣɤɢ ɜ ɩɪɨɰɟɫɫɟ ɪɟɦɨɧɬɚ ɩɪɨɜɨɞɢɬɟ ɜ ɷɤɪɚɧɢɪɨɜɚɧɧɨɦ ɛɨɤɫɟ.
Ɉɫɨɛɟɧɧɨ ɛɭɞɶɬɟ ɜɧɢɦɚɬɟɥɶɧɵ ɩɪɢ ɜɵɩɨɥɧɟɧɢɢ ɧɚɫɬɪɨɟɤ ɢɥɢ ɬɟɫɬɨɜ, ɩɨɫɤɨɥɶɤɭ
ɫɨɬɨɜɵɟ ɬɟɥɟɮɨɧɵ ɨɫɨɛɟɧɧɨ ɱɭɜɫɬɜɢɬɟɥɶɧɵ ɤ ɨɤɪɭɠɚɸɳɢɦ ɩɨɦɟɯɚɦ (ɪɚɞɢɨɲɭɦɚɦ).
• Ȼɭɞɶɬɟ ɨɫɬɨɪɨɠɧɵ ɩɪɢ ɢɫɩɨɥɶɡɨɜɚɧɢɢ ɥɸɛɨɝɨ ɪɨɞɚ ɦɚɝɧɢɬɧɵɯ ɦɚɬɟɪɢɚɥɨɜ ɢɥɢ
ɢɧɫɬɪɭɦɟɧɬɨɜ, ɩɨɫɤɨɥɶɤɭ ɧɟɤɨɬɨɪɵɟ ɭɡɥɵ ɦɨɝɭɬ ɛɵɬɶ ɩɨɜɪɟɠɞɟɧɵ ɩɨɞ ɞɟɣɫɬɜɢɟɦ
ɦɚɝɧɢɬɧɨɝɨ ɩɨɥɹ.
• ȼɨ ɢɡɛɟɠɚɧɢɟ ɩɪɟɠɞɟɜɪɟɦɟɧɧɨɝɨ ɢɡɧɨɫɚ ɜɢɧɬɨɜ ɩɪɢ ɪɚɡɛɨɪɤɟ ɢɡɞɟɥɢɹ ɢɫɩɨɥɶɡɭɣɬɟ
ɬɨɥɶɤɨ ɫɬɚɧɞɚɪɬɧɵɟ ɨɬɜɟɪɬɤɢ.
• Ⱦɥɹ ɩɪɨɜɟɞɟɧɢɹ ɷɥɟɤɬɪɢɱɟɫɤɢɯ ɢɡɦɟɪɟɧɢɣ ɢɫɩɨɥɶɡɭɣɬɟ ɬɨɥɫɬɵɣ ɫɤɪɭɱɟɧɧɵɣ ɩɪɨɜɨɞ.
Ɍɚɤɨɣ ɩɪɨɜɨɞ ɢɦɟɟɬ ɦɚɥɨɟ ɫɨɩɪɨɬɢɜɥɟɧɢɟ, ɱɬɨ ɨɛɟɫɩɟɱɢɜɚɟɬ ɦɚɥɭɸ ɩɨɝɪɟɲɧɨɫɬɶ ɜ
ɢɡɦɟɪɟɧɢɹɯ.
• ɉɪɢ ɪɟɦɨɧɬɟ ɩɥɚɬɵ ɜ ɭɫɥɨɜɢɹɯ ɟɟ ɫɨɟɞɢɧɟɧɢɹ ɫ ɭɫɬɪɨɣɫɬɜɨɦ ɬɟɫɬɢɪɨɜɚɧɢɹ ɢ
ɜɤɥɸɱɟɧɢɢ, ɜɨ ɢɡɛɟɠɚɧɢɟ ɤɨɪɨɬɤɨɝɨ ɡɚɦɵɤɚɧɢɹ (ɧɚɩɪɢɦɟɪ, ɩɟɪɟɝɪɭɡɤɚ ɩɨ ɬɨɤɭ,
ɜɨɡɝɨɪɚɧɢɟ ɞɟɬɚɥɟɣ ɢ ɩɪ.) ɩɪɨɜɨɞɢɬɟ ɪɟɦɨɧɬɧɵɟ ɪɚɛɨɬɵ ɬɨɥɶɤɨ ɨɬɫɨɟɞɢɧɢɜ
ɭɫɬɪɨɣɫɬɜɨ ɬɟɫɬɢɪɨɜɚɧɢɹ ɨɬ ɚɩɩɚɪɚɬɚ.
• Ɉɫɨɛɟɧɧɨ ɛɭɞɶɬɟ ɨɫɬɨɪɨɠɧɵ ɩɪɢ ɩɚɣɤɟ, ɩɨɬɨɦɭ ɱɬɨ ɩɥɨɳɚɞɤɚ ɩɟɱɚɬɧɨɣ ɩɥɚɬɵ
ɞɨɜɨɥɶɧɨ ɦɚɥɚ ɢ ɱɭɜɫɬɜɢɬɟɥɶɧɚ ɤ ɩɟɪɟɝɪɟɜɭ.
• Ȼɭɞɶɬɟ ɜɧɢɦɚɬɟɥɶɧɵ ɩɪɢ ɜɤɥɸɱɟɧɢɢ/ɜɵɤɥɸɱɟɧɢɢ ɫ ɩɨɦɨɳɶɸ ɪɨɡɟɬɤɢ ɢɫɬɨɱɧɢɤɚ
ɩɢɬɚɧɢɹ ɩɨɫɬɨɹɧɧɨɝɨ ɬɨɤɚ, ɩɨɫɤɨɥɶɤɭ ɜɨɡɦɨɠɧɨ ɩɨɜɪɟɠɞɟɧɢɟ ɡɚɪɹɞɧɨɝɨ
ɭɫɬɪɨɣɫɬɜɚ ɜ ɩɪɨɰɟɫɫɟ ɟɝɨ ɪɟɦɨɧɬɚ ɩɪɢ ɜɤɥɸɱɟɧɢɢ/ɜɵɤɥɸɱɟɧɢɢ ɚɞɚɩɬɟɪɚ
ɩɢɬɚɧɢɹ ɢ ɪɚɡɴɟɦɚ ɩɨɫɥɟ ɪɚɡɛɨɪɤɢ ɡɚɪɹɞɧɨɝɨ ɭɫɬɪɨɣɫɬɜɚ.
• ɇɟ ɢɫɩɨɥɶɡɭɣɬɟ ɞɥɹ ɡɚɦɟɧɵ ɦɚɬɟɪɢɚɥɵ, ɤɨɬɨɪɵɟ ɧɟ ɡɚɪɟɝɢɫɬɪɢɪɨɜɚɧɵ ɜ ɤɚɱɟɫɬɜɟ
ɡɚɦɟɧɢɬɟɥɟɣ ɜ ɫɢɫɬɟɦɟ SEC, ɤɚɤ ɛɵ ȼɚɦ ɷɬɨɝɨ ɧɟ ɯɨɬɟɥɨɫɶ. ɂɧɠɟɧɟɪ ɩɨ ɨɛɫɥɭɠɢɜɚɧɢɸ
ɧɟ ɦɨɠɟɬ ɨɬɜɟɱɚɬɶ ɡɚ ɬɨ, ɱɬɨ ȼɵ ɧɟ ɫɨɛɥɸɞɚɟɬɟ ɷɬɢ ɩɪɚɜɢɥɚ.
1-1
ɋɨɛɫɬɜɟɧɧɨɫɬɶ ɤɨɦɩɚɧɢɢ SAMSUNG – ɫɨɞɟɪɠɚɧɢɟ ɦɨɠɟɬ ɛɵɬɶ ɢɡɦɟɧɟɧɨ ɛɟɡ ɭɜɟɞɨɦɥɟɧɢɹ
ɇɚɫɬɨɹɳɢɣ ɞɨɤɭɦɟɧɬ ɦɨɠɟɬ ɛɵɬɶ ɢɫɩɨɥɶɡɨɜɚɧ ɬɨɥɶɤɨ ɫ ɪɚɡɪɟɲɟɧɢɹ ɤɨɦɩɚɧɢɢ Samsung
Ɇɟɪɵ ɩɪɟɞɨɫɬɨɪɨɠɧɨɫɬɢ ɢ ɛɟɡɨɩɚɫɧɨɫɬɢ
1-2. Ɇɟɪɵ ɩɪɟɞɨɫɬɨɪɨɠɧɨɫɬɢ ɩɪɢ ɪɚɛɨɬɟ ɫ ɭɫɬɪɨɣɫɬɜɚɦɢ,
ɱɭɜɫɬɜɢɬɟɥɶɧɵɦɢ ɤ ɷɥɟɤɬɪɨɫɬɚɬɢɱɟɫɤɢɦ ɡɚɪɹɞɚɦ (ESD)
ɇɟɤɨɬɨɪɵɟ ɩɨɥɭɩɪɨɜɨɞɧɢɤɢ ɦɨɝɭɬ ɛɵɬɶ ɥɟɝɤɨ ɩɨɜɪɟɠɞɟɧɵ ɫɬɚɬɢɱɟɫɤɢɦ ɷɥɟɤɬɪɢɱɟɫɬɜɨɦ.
Ɍɚɤɢɟ ɷɥɟɦɟɧɬɵ (ɞɟɬɚɥɢ) ɨɬɧɨɫɹɬɫɹ ɤ ɤɥɚɫɫɭ ɱɭɜɫɬɜɢɬɟɥɶɧɵɯ ɤ ɫɬɚɬɢɱɟɫɤɨɦɭ ɷɥɟɤɬɪɢɱɟɫɬɜɭ
(ESD), ɧɚɩɪɢɦɟɪ ɷɬɨ ɢɧɬɟɝɪɚɥɶɧɵɟ ɫɯɟɦɵ, ɦɢɤɪɨɫɯɟɦɵ ɜ ɤɨɪɩɭɫɟ BGA ɢɩɪ. ɉɪɨɱɬɢɬɟ
ɫɥɟɞɭɸɳɢɟ ɦɟɪɵ ɩɪɟɞɨɫɬɨɪɨɠɧɨɫɬɢ. ɗɬɨ ɩɨɡɜɨɥɢɬ ȼɚɦ ɭɛɟɪɟɱɶ ɞɟɬɚɥɢ ɨɬ ɩɨɪɚɠɟɧɢɹ
ɫɬɚɬɢɱɟɫɤɢɦ ɷɥɟɤɬɪɢɱɟɫɬɜɨɦ.
• ɋɧɢɦɢɬɟ ɷɥɟɤɬɪɨɫɬɚɬɢɱɟɫɤɢɣ ɡɚɪɹɞ ɫ ɜɚɲɟɝɨ ɬɟɥɚ ɩɪɟɠɞɟ, ɱɟɦ ɩɪɢɤɨɫɧɭɬɶɫɹ ɤ
ɩɨɥɭɩɪɨɜɨɞɧɢɤɭ ɢɥɢ ɞɟɬɚɥɢ ɫ ɩɨɥɭɩɪɨɜɨɞɧɢɤɨɦ. ɋɭɳɟɫɬɜɭɟɬ ɜɚɪɢɚɧɬɵ ȼɚɲɟɝɨ
ɫɨɩɪɢɤɨɫɧɨɜɟɧɢɹ ɫ ɡɚɡɟɦɥɟɧɧɵɦ ɦɟɫɬɨɦ ɢɥɢ ɰɟɩɨɱɤɨɣ ɷɥɟɤɬɪɨɫɬɚɬɢɱɟɫɤɨɣ ɡɚɳɢɬɵ ɧɚ
ɡɚɩɹɫɬɶɟ.
• ɂɫɩɨɥɶɡɭɣɬɟ ɡɚɡɟɦɥɟɧɧɵɟ ɩɪɢɩɨɢ ɩɪɢ ɫɨɟɞɢɧɟɧɢɢ/ɪɚɡɴɟɞɢɧɟɧɢɢ ESD ɭɫɬɪɨɣɫɬɜ.
• ɂɫɩɨɥɶɡɭɣɬɟ ɢɧɫɬɪɭɦɟɧɬ ɭɫɬɪɚɧɟɧɢɹ ɩɪɢɩɨɹ ɞɥɹ ɫɧɹɬɢɹ ɫɬɚɬɢɱɟɫɤɨɝɨ ɷɥɟɤɬɪɢɱɟɫɬɜɚ,
ɢɧɚɱɟ ESD ɭɫɬɪɨɣɫɬɜɨ ɦɨɠɟɬ ɛɵɬɶ ɩɨɜɪɟɠɞɟɧɨ ɷɥɟɤɬɪɨɫɬɚɬɢɱɟɫɤɢɦ ɪɚɡɪɹɞɨɦ.
• Ɋɚɫɩɚɤɨɜɵɜɚɣɬɟ ESD ɭɫɬɪɨɣɫɬɜɨ ɬɨɥɶɤɨ ɧɟɩɨɫɪɟɞɫɬɜɟɧɧɨ ɩɪɢ ɭɫɬɚɧɨɜɤɟ ɟɝɨ ɧɚ
ɢɡɞɟɥɢɟ. Ⱦɥɹ ɩɪɟɞɨɬɜɪɚɳɟɧɢɹ ɩɨɪɚɠɟɧɢɹ ɫɬɚɬɢɱɟɫɤɢɦ ɷɥɟɤɬɪɢɱɟɫɬɜɨɦ, ɛɨɥɶɲɢɧɫɬɜɨ
ESD ɭɫɬɪɨɣɫɬɜ ɩɚɤɭɸɬɫɹ ɜ ɤɨɪɨɛɤɢ ɫ ɚɥɸɦɢɧɢɟɜɵɦɢ ɩɨɞɥɨɠɤɚɦɢ ɞɥɹ ɨɛɟɫɩɟɱɟɧɢɹ
ɜɵɫɨɤɨɣ ɷɥɟɤɬɪɨɩɪɨɜɨɞɧɨɫɬɢ.
• ɇɟɨɛɯɨɞɢɦɨ ɞɨ ɬɟɯ ɩɨɪ ɩɨɞɞɟɪɠɢɜɚɬɶ ɩɨɫɬɨɹɧɧɨɟ ɷɥɟɤɬɪɢɱɟɫɤɨɟ ɫɨɟɞɢɧɟɧɢɟ ɦɟɠɞɭ
ESD ɭɫɬɪɨɣɫɬɜɨɦ ɢ ɦɟɫɬɨɦ, ɤɭɞɚ ɨɧɨ ɞɨɥɠɧɨ ɛɵɬɶ ɭɫɬɚɧɨɜɥɟɧɨ, ɩɨɤɚ ɭɫɬɪɨɣɫɬɜɨ ɧɟ
ɛɭɞɟɬ ɩɨɥɧɨɫɬɶɸ ɩɨɞɫɨɟɞɢɧɟɧɨ ɤ ɧɚɞɥɟɠɚɳɟɦɭ ɦɟɫɬɭ ɢɥɢ ɦɨɧɬɚɠɧɨɣ ɩɥɚɬɟ.
1-2
ɋɨɛɫɬɜɟɧɧɨɫɬɶ ɤɨɦɩɚɧɢɢ SAMSUNG – ɫɨɞɟɪɠɚɧɢɟ ɦɨɠɟɬ ɛɵɬɶ ɢɡɦɟɧɟɧɨ ɛɟɡ ɭɜɟɞɨɦɥɟɧɢɹ
ɇɚɫɬɨɹɳɢɣ ɞɨɤɭɦɟɧɬ ɦɨɠɟɬ ɛɵɬɶ ɢɫɩɨɥɶɡɨɜɚɧ ɬɨɥɶɤɨ ɫ ɪɚɡɪɟɲɟɧɢɹ ɤɨɦɩɚɧɢɢ Samsung
SAMSUNG Proprietary-Contents may change without notice
2.
Specification
This Document can not be used without Samsung's authorization
2-1
2-1.
GSM General Specification
GSM900
Phase 1
DCS1800
Phase 1
Freq.
Band[MHz]
Uplink/Downlink
880.2~914.8
925.2~959.8
1710~1785
1805~1880
ARFCN range
975~1023
0~124
512~885
Tx/Rx spacing
45MHz
95MHz
Mod. Bit rate/
Bit Period
270.833kbps
3.692us
270.833kbps
3.692us
Time Slot Period/Frame
Period
576.9us
4.615ms
576.9us
4.615ms
Modulation
0.3GMSK
0.3GMSK
MS Power
33dBm~5dBm
30dBm~0dBm
Power Class
5pcl ~ 19pcl
0
pcl
~15
pcl
Sensitivity
-102dBm
-100dBm
TDMA Mux
8
8
Cell Radius
35Km
2Km
SAMSUNG Proprietary-Contents may change without notice
Specification
This Document can not be used without Samsung's authorization
2-2
2-2.
GSM TX
P
ower class
TX Power
control level
GSM
850
5 33±3
dBm
6 31±3
dBm
7 29±3
dBm
8 27±3
dBm
9 25±3
dBm
10 23±3
dBm
11 21±3
dBm
12 19±3
dBm
13 17±3
dBm
14 15±3
dBm
15 13±3
dBm
16 11±5
dBm
17 9±5
dBm
18 7±5
dBm
19 5±5
dBm
TX Power
control level
DCS1800
030±3
dBm
128±3
dBm
226±3
dBm
324±3
dBm
422±3
dBm
520±3
dBm
618±3
dBm
716±3
dBm
814±3
dBm
912±4
dBm
10 10±4
dBm
11 8±4
dBm
12 6±4
dBm
13 4±4
dBm
14 2±5
dBm
15 0±5
dBm
SAMSUNG Proprietary-Contents may change without notice
3.
Product Function
3-1
This Document can not be used without Samsung's authorization
Main Function
•
GSM
900/1800
•1.43"
CSTN
•
SMS, MMS
•64
Poly Melody
•
Noise Cancellatio•JAVA
SAMSUNG Proprietary-Contents may change without notice
4.
Array course control
4-1
This Document can not be used without Samsung's authorization
Test Jig
(
GH
99-36900
A)
4-1.
Software Adjustments
Test Cable
(
GH39-01160A) RF Test Cable
(
GH39-00985A)
RF Test Cable
(
GH99-38251A)
SAMSUNG Proprietary-Contents may change without notice
Array course control
4-2
This Document can not be used without Samsung's authorization
4-2.
Software Downloading
4-2-1.
Pre-requsite for Downloading
•
Downloader Program(
PNX4900 Downloader
v1.0
For Lite)
•
GT-E1150 Mobile Phone•Data Cable
•
JIG BOX•Test Cable•Serial Cable•Binary files
4-2-2.
S/W Downloader Program
■
Load the binary download program
by executing the
"
PNX4900 Downloader
v1.0
Lite
"
1
.
Select the connected serial port and
the rate of speed
.
SAMSUNG Proprietary-Contents may change without notice
Array course control
4-3
This Document can not be used without Samsung's authorization
2
.
Select the Port, Baud Rate and Mode
.
SAMSUNG Proprietary-Contents may change without notice
Array course control
4-4
This Document can not be used without Samsung's authorization
3
.
Select the START Button, When Complete DL.Bootloader.
SAMSUNG Proprietary-Contents may change without notice
Array course control
4-5
This Document can not be used without Samsung's authorization
4
.4.P
ress the
"
Start" button and connect the Handset,
then press
"
확인
".
SAMSUNG Proprietary-Contents may change without notice
Array course control
4-6
This Document can not be used without Samsung's authorization
5
.
Check the All Download
&
Calset
,
Click the Download Botton,
SAMSUNG Proprietary-Contents may change without notice
Array course control
4-7
This Document can not be used without Samsung's authorization
6
.
When downloading is complete, automatically the small window was showed up.
7
.
Confirm the downloaded version name and etc.
:
*#1234#
Full Reset
:
*2767*3855#
- This Document can not be used without Samsung's authorization -
5-2. Cellular phone Parts list : GT-E1150TSATGY
Design LOC
Description
SEC CODE
QAN02
INTENNA-GT-E1150 (MEA)
GH42-02240A
QBC00
ASSY COVER-BATT
GH98-14976B
QCR03
SCREW-MACHINE
6001-001811
QCR67
SCREW-MACHINE
6001-002083
QCR92
SCREW-MACHINE
6001-002261
QFL01
ASSY CASE-LOWER
GH98-14978B
QFR01
ASSY CASE-FRONT
GH98-14979B
QFU01
ASSY CASE-UPPER (TGY/TS)
GH98-15956B
QHI01
ASSY HINGE
GH98-03590A
QIF01
PMO COVER-IF
GH72-57494B
QKP01
RMO KEY-MAIN KEYPAD (TGY/TS)
GH73-13746B
QLC01
ASSY COMM HALB-LCD HOT BAR,SVC,GTE1150
GH96-04302A
QME01
DOME SHEET-GT-E1150
GH59-08433A
QME16
ASSY ETC-LCD CON TO CON
GH59-08429A
QMI01
MICROPHONE-ASSY-GTE1150(MAIN)
GH30-00633A
QMO01
MOTOR DC-SGHZ130
GH31-00154C
QMP01
A/S ASSY-PBA MAIN,GTE1150,TGY,HONG,SVC
GH82-04504A
QRE01
ASSY CASE-REAR
GH98-14980B
QSC01
TAPE-SCREW SHEET L
GH74-46762B
QSC02
TAPE-SCREW SHEET R
GH74-46763B
QSP01
SPEAKER
3001-002561
SAMSUNG Proprietary-Contents may change without notice
6.
MAIN Electrical Parts List
6-1
This Document can not be used without Samsung's authorization
SEC CODE Design LOC Description
0403-001547
ZD200 DIODE-ZENER
0406-001286
ZD301 DIODE-TVS
0406-001286
ZD302 DIODE-TVS
0406-001293
D303 DIODE-TVS
0406-001293
D304 DIODE-TVS
0406-001293
ZD101 DIODE-TVS
0407-001002
D200 DIODE-ARRAY
0601-002070
LED301 LED
0601-002070
LED302 LED
0601-002070
LED303 LED
0601-002070
LED304 LED
0601-002070
LED305 LED
0601-002070
LED306 LED
1009-001037
U301 IC
1108-000217
UME200 MEMORY
1201-002931
PAM100 IC
1203-005485
U104 IC
1203-005498
U200 IC
1203-005512
U302 IC
1203-005686
U103 IC
1205-003679
UCP200 IC
1404-001221
TH200 THERMISTOR
2007-000138
R317 R-CHIP
2007-000138
R318 R-CHIP
2007-000139
R301 R-CHIP
2007-000141
R300 R-CHIP
2007-000141
R306 R-CHIP
2007-000141
R312 R-CHIP
2007-000141
R313 R-CHIP
2007-000144
R208 R-CHIP
2007-000148
R200 R-CHIP
2007-000148
R201 R-CHIP
2007-000151
R109 R-CHIP
2007-000157
R314 R-CHIP
2007-000162
R110 R-CHIP
2007-000162
R209 R-CHIP
SAMSUNG Proprietary-Contents may change without notice
Main Electrical Parts List
6-2
This Document can not be used without Samsung's authorization
SEC CODE Design LOC Description
2007-000172
R207 R-CHIP
2007-000172
R303 R-CHIP
2007-000172
R304 R-CHIP
2007-000172
R305 R-CHIP
2007-000172
R307 R-CHIP
2007-000172
R308 R-CHIP
2007-000172
R311 R-CHIP
2007-000173
R309 R-CHIP
2007-000173
R310 R-CHIP
2007-001288
R107 R-CHIP
2007-001301
R206 R-CHIP
2007-001333
R210 R-CHIP
2007-010071
R219 R-CHIP
2203-000386
C323 C-CER,CHIP
2203-000386
C327 C-CER,CHIP
2203-000386
C348 C-CER,CHIP
2203-000425
C225 C-CER,CHIP
2203-000425
C228 C-CER,CHIP
2203-000585
C303 C-CER,CHIP
2203-000585
C306 C-CER,CHIP
2203-000585
C307 C-CER,CHIP
2203-000585
C309 C-CER,CHIP
2203-000585
C310 C-CER,CHIP
2203-000585
C311 C-CER,CHIP
2203-000812
C117 C-CER,CHIP
2203-000812
C120 C-CER,CHIP
2203-000812
C121 C-CER,CHIP
2203-000812
C218 C-CER,CHIP
2203-000812
C229 C-CER,CHIP
2203-000812
C331 C-CER,CHIP
2203-000812
C332 C-CER,CHIP
2203-000812
C333 C-CER,CHIP
2203-000812
C334 C-CER,CHIP
2203-000812
C338 C-CER,CHIP
2203-000812
C342 C-CER,CHIP
2203-000812
C343 C-CER,CHIP
SAMSUNG Proprietary-Contents may change without notice
Main Electrical Parts List
6-3
This Document can not be used without Samsung's authorization
SEC CODE Design LOC Description
2203-000812
C344 C-CER,CHIP
2203-000812
C345 C-CER,CHIP
2203-000812
C347 C-CER,CHIP
2203-001072
C110 C-CER,CHIP
2203-001153
C351 C-CER,CHIP
2203-001239
C324 C-CER,CHIP
2203-003054
C113 C-CER,CHIP
2203-005057
C112 C-CER,CHIP
2203-005234
C107 C-CER,CHIP
2203-005234
C114 C-CER,CHIP
2203-005234
C116 C-CER,CHIP
2203-005281
C118 C-CER,CHIP
2203-005281
C119 C-CER,CHIP
2203-005288
L111 C-CER,CHIP
2203-006048
C209 C-CER,CHIP
2203-006048
C210 C-CER,CHIP
2203-006048
C211 C-CER,CHIP
2203-006048
C212 C-CER,CHIP
2203-006048
C215 C-CER,CHIP
2203-006048
C230 C-CER,CHIP
2203-006048
C231 C-CER,CHIP
2203-006048
C301 C-CER,CHIP
2203-006048
C302 C-CER,CHIP
2203-006048
C321 C-CER,CHIP
2203-006048
C325 C-CER,CHIP
2203-006048
C328 C-CER,CHIP
2203-006137
C235 C-CER,CHIP
2203-006208
C201 C-CER,CHIP
2203-006208
C202 C-CER,CHIP
2203-006348
C223 C-CER,CHIP
2203-006399
C200 C-CER,CHIP
2203-006399
C203 C-CER,CHIP
2203-006399
C204 C-CER,CHIP
2203-006399
C205 C-CER,CHIP
2203-006399
C206 C-CER,CHIP
2203-006399
C214 C-CER,CHIP
SAMSUNG Proprietary-Contents may change without notice
Main Electrical Parts List
6-4
This Document can not be used without Samsung's authorization
SEC CODE Design LOC INDUCTORDescription
2203-006399
C329 C-CER,CHIP
2203-006399
C340 C-CER,CHIP
2203-006562
C111 C-CER,CHIP
2203-006562
C125 C-CER,CHIP
2203-006562
C127 C-CER,CHIP
2203-006562
C312 C-CER,CHIP
2203-006562
C313 C-CER,CHIP
2203-006824
C207 C-CER,CHIP
2203-006824
C208 C-CER,CHIP
2203-006824
C227 C-CER,CHIP
2203-006841
C222 C-CER,CHIP
2203-007279
C109 C-CER,CHIP
2203-007279
C308 C-CER,CHIP
2404-001424
C322 C-TA,CHIP
2703-001178
C123 INDUCTOR-SMD
2703-002198
L104 INDUCTOR-SMD
2703-002201
L309 INDUCTOR-SMD
2703-002201
L310 INDUCTOR-SMD
2703-002203
L103 INDUCTOR-SMD
2703-002204
L110 INDUCTOR-SMD
2703-002208
C115 INDUCTOR-SMD
2703-002281
L109 INDUCTOR-SMD
2703-003184
L201 INDUCTOR-SMD
2801-004353
OSC200 CRYSTAL-SMD
2801-004805
OSC201 CRYSTAL-SMD
2904-001879
F100 FILTER-SAW
3301-001158
L200 BEAD-SMD
3301-001812
L311 BEAD-SMD
3301-001885
L302 BEAD-SMD
3301-001885
L303 BEAD-SMD
3301-001885
L304 BEAD-SMD
3301-001885
L306 BEAD-SMD
3301-001885
L312 BEAD-SMD
3705-001503
RFS100 CONNECTOR-COAXIAL
3709-001447
SIM200 CONNECTOR-CARD EDGE
3710-002683
IFC300 SOCKET-INTERFACE
SAMSUNG Proprietary-Contents may change without notice
Main Electrical Parts List
6-5
This Document can not be used without Samsung's authorization
SEC CODE Design LOC Description
3711-005981
HDC300 HEADER-BOARD TO BOARD
3711-006228
BTC200 HEADER-BATTERY
GH80-03320A L100 SOLDER-CREAM/SMT KOREA(FREE)
GH80-03321A R216 SOLDER-CREAM/DHDMR(FREE)
Please consult the GSPN website
(
Samsung Portal) for the most recent version of the product's part list.
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