Samsung Galaxy S9, SM-G960F Schematics

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New Product SVC Guide

[ SM-G960F ]

Instructor : Minkyu Kim (Logic), Dongjun Lee(RF)

This material is a property of Samsung Electronics Co., Ltd. Any unauthorized use of this material can be punished under
applicable International and/or domestic law.

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Notice

This guide is intended solely for the Samsung Electronics internal training and may contain

trade secret, industrial technology or privileged and confidential information otherwise

protected under applicable law including the Unfair Competition Prevention and Trade Secret
Protection Act. Any unauthorized dissemination, distribution, copying of use of the information
contained in this guide is strictly prohibited and subject to legal action.

All functionality, features, specifications and other product information provided in this

document including, but not limited to, the benefits, design, pricing, components, performance,

availability, and capabilities of the product are subject to change without notice or obligation.
Samsung reserves the right to make changes to this guide and the product described herein,
at anytime, without obligation on Samsung Electronics to provide notification of such change.

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Contents

1. Specification of SM-G960F (Galaxy S9)

2. H/W
2-1. New Concepts of H/W
2-2. Disassembly & Assembly
2-3. Parts Layout (Module & ICs)
2-4. Troubleshooting
2-5. RF Calibration

3. SVC Technical Information

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Specification

Item Spec.

Vendor & Name

AP Chipset

Samsung Exynos 9810

RAM Flash

Memory

4GB 64GB

Size Resolution Type

Display

5.8 inch 1440 X 2960, QHD+ Dual Edge Super AMOLED

Resolution (Main/Front) Auto Focus Video (Main)

CAMERA

12MP / 8MP Phase detection 3840p@30fps / 1080p@60fps

2G/3G LTE

Network

Support Cat18 DL (1.2Gbps) / Cat5 UL (75Mbps)

Sensors

Connectivity Bluetooth 5.0, WIFI a/b/g/n/ac, NFC, USB3.1, MST

Accelerometer, Magnetic, Gyro, Barometer, RGB Light, Proximity, Gesture, Fingerprint Scanner,

Heart Rate Sensor, Force touch Sensor, IRIS scanner

Cores & Architecture Speed (Big/Little)

Octa-core & 64 bit 2.7 Ghz / 1.7 Ghz

Battery & GPS 3,000mAh A-GPS & GLONASS & Galileo & BeiDou

Micro SD & OS Up to 400GB Android V8.0 (Oreo)

Remarks Water Resistance : IP68 Dual SIM : supported

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New Concepts of H/W

Stereo Speaker

Before

From the bottom speaker to mono when
playing music

Now

Previously, the upper speaker output
power was 50mW, but now it is 1W.

Upper speaker and lower speaker operate
separately in stereo when playing music

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New Concepts of H/W

Advanced Camera

The variable aperture lens which can automatically
switch between F1.5 and F2.4 in wide camera.

Low light condition (100lux ↓)

Wide Lens (F1.5/F2.4)

FOV 77˚, OIS

※ GS8 : F1.7 only

. More bright and vivid image.
. Less noise in the dark

Normal condition (100lux ↑)

. More clear image all around

. Less distortion in the corner

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New Concepts of H/W

Advanced Camera

GS8 MAIN CAM GS9 MAIN CAM

Sensor 12M 2PD 12M FRS

F-number F/1.7 F/1.5 – 2.4

Item STAR1 STAR2

Front CAMERAs

Module Size

Low light

Performance

Front

Combo

Module

8M CAM

11.3x11.3x4.9t
(max. 6.1)

11.5x11.8x5.2t
(max. 6.3)

Reference 1.6x (lens 1.28x)

IRIS CAM

Separate
Module

Front
8M CAM

IRIS CAM

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Disassembly & Reassembly

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Disassembly & Reassembly

inner tape BTM

Part

Code

Item

(Non-reusable)

Area Europe Korea Japan China, USA

Kit Code

(Composed with below items)

Backglass

Outside tape

Backglass

inner tape TOP

Backglass

Finger print

tape

S9 SVC Code

GH82-15971A GH82-15972A GH82-15973A GH82-15974A

GH81-15404A

GH81-15405A GH81-15408A GH81-15409A GH81-15406A

GH81-15407A GH81- 15415A

GH02-15815A

Cam sealing

tape

Mic sealing

tape

GH02-16007A

GH02-06116A(2ea)

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Disassembly & Reassembly

Important checking points

After detaching the back glass,

In case of detaching the back glass, be careful of finger sensor

FPCB. This FPCB Flex crack well.

cover the lens with a protective cap as soon as possible.

DO NOT touch the lens without gloves.

In case of detaching the Sub PBA, be careful of a side contact.

It can be broken easily if the Sub PBA is disassembled by force.

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OK NG

During disassembly & reassembly, check

the RF FPCB position.

If the RF FPCB are not fitted correctly

during reassembly, RF FPCB can be cracked.

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