Samsung DVD-P355B-FOU User Manual
DVD PLAYER
Chassis : Spino
DVD-P355B/XEU, XET, XEE, SED, XEO,
XEC, XEL, FOU, XEG, XEH,
XEV
SERVICE
ŒŒ
41mm With LED Module
´´
Playback MPEG4 DVD-Audio
ˇˇ
ZORAN Vaddis7 1-Chip Solution
Manual
DVD PLAYER
Merit & Character regarding Product
SERVICE MANUAL
DVD-P355B
ELECTRONICS
© Samsung Electronics Co., Ltd. JUN . 2005
Printed in Korea
AK82-0000929A
This Service Manual is a property of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
international and/or domestic law.
CONTENTS
1. Precautions 1-1 ~ 1-6
1-1 Safety Precautions (1-1)
1-2 Servicing Precautions (1-3)
1-3 ESD Precautions (1-4)
1-4 Handling the optical pick-up (1-5)
1-5 Pick-up disassembly and reassembly (1-6)
2. Product Specification 2-1 ~ 2-4
2-1 Product Specification (2-1)
2-2 Chassis Product Specification (2-2)
2-3 Option Product Specification (2-3)
3. Alignment and Adjustments 3-1 ~ 3-4
3-1 Location of Test Point (3-1)
3-2 Skew Adjustment (3-2)
4. Disassembly and Reassembly 4-1 ~ 4-10
4-1 Cabinet and PCB (4-1)
4-2 Deck (4-6)
5. Troubleshooting 5-1 ~ 5-14
6. Exploded View and Parts List 6-1 ~ 6-6
6-1 Cabinet Assembly (6-2)
6-2 DVD Mechanical Parts (6-4)
7. Electrical Parts List 7-1 ~ 7-6
CONTENTS
8. Block Diagram 8-1 ~ 8-2
9. Wiring Diagram 9-1 ~ 9-2
10. PCB Diagrams 10-1 ~ 10-4
10-1 Main PCB (10-2)
11. Schematic Diagrams 11-1 ~ 11-8
11-1 Power Drive (11-2)
11-2 Servo (11-3)
11-3 AV-Decoder (11-4)
11-4 Fromt Micom (11-5)
11-5 Audio (11-6)
11-6 Video (11-7)
12. Operating Instructions and Installation 12-1 ~ 12-50
13. Circuit Operating Descriptions 13-1 ~ 13-16
13-1 Power (13-1)
13-2 RF (13-7)
13-3 System Control (13-9)
13-4 Servo (13-10)
13-5 DVD Data Processor (13-13)
13-6 Video (13-14)
13-7 Audio (13-15)
CONTENTS
14. Reference Information 14-1 ~ 14-16
14-1 Introduction to DVD (14-1)
14-2 DVD-Video Fromat (14-3)
14-1 DVD-Audio (14-9)
14-2 DivX (14-12)
Samsung Electronics 1-1
1. Precautions
1-1 Safety Precautions
1) Before returning an instrument to the customer,
always make a safety check of the entire instrument,
including, but not limited to, the following items:
(1) Be sure that no built-in protective devices are
defective or have been defeated during servicing.
(1)Protective shields are provided to protect both
the technician and the customer. Correctly replace
all missing protective shields, including any
removed for servicing convenience.
(2)When reinstalling the chassis and/or other assembly in the cabinet, be sure to put back in place
all protective devices, including, but not limited to,
nonmetallic control knobs, insulating fish papers,
adjustment and compartment covers/shields, and
isolation resistor/capacitor networks. Do not operate this instrument or permit it to be operated without all protective devices correctly installed and
functioning.
(2) Be sure that there are no cabinet openings through
which adults or children might be able to insert
their fingers and contact a hazardous voltage. Such
openings include, but are not limited to, excessively wide cabinet ventilation slots, and an improperly fitted and/or incorrectly secured cabinet back
cover.
(3) Leakage Current Hot Check-With the instrument
completely reassembled, plug the AC line cord
directly into a 120V AC outlet. (Do not use an isolation transformer during this test.) Use a leakage
current tester or a metering system that complies
with American National Standards institute (ANSI)
C101.1 Leakage Current for Appliances and
Underwriters Laboratories (UL) 1270 (40.7). With
the instrument’s AC switch first in the ON position
and then in the OFF position, measure from a
known earth ground (metal water pipe, conduit,
etc.) to all exposed metal parts of the instrument
(antennas, handle brackets, metal cabinets, screwheads, metallic overlays, control shafts, etc.), especially any exposed metal parts that offer an electrical return path to the chassis.
Any current measured must not exceed 0.5mA.
Reverse the instrument power cord plug in the outlet and repeat the test. See Fig. 1-1.
Any measurements not within the limits specified
herein indicate a potential shock hazard that must
be eliminated before returning the instrument to
the customer.
Fig. 1-1 AC Leakage Test
(4) Insulation Resistance Test Cold Check-(1) Unplug
the power supply cord and connect a jumper wire
between the two prongs of the plug. (2) Turn on the
power switch of the instrument. (3) Measure the
resistance with an ohmmeter between the
jumpered AC plug and all exposed metallic cabinet
parts on the instrument, such as screwheads,
antenna, control shafts, handle brackets, etc. When
an exposed metallic part has a return path to the
chassis, the reading should be between 1 and 5.2
megohm. When there is no return path to the chassis, the reading must be infinite. If the reading is
not within the limits specified, there is the possibility of a shock hazard, and the instrument must be
repaired and rechecked before it is returned to the
customer. See Fig. 1-2.
Fig. 1-2 Insulation Resistance Test
DEVICE
UNDER
TEST
(READING SHOULD
NOT BE ABOVE
0.5mA)
LEAKAGE
CURRENT
TESTER
EARTH
GROUND
TEST ALL
EXPOSED METER
SURFACES
ALSO TEST WITH
PLUG REVERSED
(USING AC ADAPTER
PLUG AS REQUIRED)
2-WIRE CORD
Antenna
Terminal
Exposed
Metal Part
ohm
ohmmeter
Precautions
1-2 Samsung Electronics
2) Read and comply with all caution and safety related notes on or inside the cabinet, or on the chassis.
3) Design Alteration Warning-Do not alter or add to
the mechanical or electrical design of this instrument. Design alterations and additions, including
but not limited to, circuit modifications and the
addition of items such as auxiliary audio output
connections, might alter the safety characteristics of
this instrument and create a hazard to the user. Any
design alterations or additions will make you, the
servicer, responsible for personal injury or property
damage resulting therefrom.
4) Observe original lead dress. Take extra care to
assure correct lead dress in the following areas:
(1) near sharp edges, (2) near thermally hot parts (be
sure that leads and components do not touch thermally hot parts), (3) the AC supply, (4) high voltage,
and (5) antenna wiring. Always inspect in all areas
for pinched, out-of-place, or frayed wiring, Do not
change spacing between a component and the
printed-circuit board. Check the AC power cord for
damage.
5) Components, parts, and/or wiring that appear to
have overheated or that are otherwise damaged
should be replaced with components, parts and/ or
wiring that meet original specifications.
Additionally, determine the cause of overheating
and/or damage and, if necessary, take corrective
action to remove any potential safety hazard.
6) Product Safety Notice-Some electrical and mechanical parts have special safety-related characteristics
which are often not evident from visual inspection,
nor can the protection they give necessarily be
obtained by replacing them with components rated
for higher voltage, wattage, etc. Parts that have special safety characteristics are identified by shading,
an ( )or a ( )on schematics and parts lists. Use
of a substitute replacement that does not have the
same safety characteristics as the recommended
replacement part might create shock, fire and/or
other hazards. Product safety is under review continuously and new instructions are issued whenever appropriate.
Precautions
Samsung Electronics 1-3
1-2 Servicing Precautions
CAUTION : Before servicing units covered by this
service manual and its supplements, read and follow
the Safety Precautions section of this manual.
Note : If unforseen circumstances create conflict
between the following servicing precautions and any
of the safety precautions, always follow the safety precautions. Remember: Safety First.
1-2-1 General Servicing Precautions
(1) a. Always unplug the instrument’s AC power cord
from the AC power source before (1) re-moving
or reinstalling any component, circuit board,
module or any other instrument assembly, (2)
disconnecting any instrument electrical plug or
other electrical connection, (3) connecting a test
substitute in parallel with an electrolytic capacitor in the instrument.
b. Do not defeat any plug/socket B+ voltage inter-
locks with which instruments covered by this
service manual might be equipped.
c. Do not apply AC power to this instrument and
/or any of its electrical assemblies unless all
solid-state device heat sinks are correctly installed.
d. Always connect a test instrument’s ground lead
to the instrument chassis ground before connecting the test instrument positive lead. Always
remove the test instrument ground lead last.
Note : Refer to the Safety Precautions section ground
lead last.
(2) The service precautions are indicated or printed on
the cabinet, chassis or components. When servicing, follow the printed or indicated service precautions and service materials.
(3) The components used in the unit have a specified
flame resistance and dielectric strength.
When replacing components, use components
which have the same ratings. Components identified by shading, by( ) or by ( ) in the circuit diagram are important for safety or for the characteristics of the unit. Always replace them with the exact
replacement components.
(4) An insulation tube or tape is sometimes used and
some components are raised above the printed
wiring board for safety. The internal wiring is
sometimes clamped to prevent contact with heating components. Install such elements as they
were.
(5) After servicing, always check that the removed
screws, components, and wiring have been installed correctly and that the portion around the
serviced part has not been damaged and so on.
Further, check the insulation between the blades of
the attachment plug and accessible conductive
parts.
1-2-2 Insulation Checking Procedure
Disconnect the attachment plug from the AC outlet
and turn the power ON. Connect the insulation resistance meter (500V) to the blades of the attachment
plug. The insulation resistance between each blade of
the attachment plug and accessible conductive
parts(see note) should be more than 1 Megohm.
Note : Accessible conductive parts include metal panels, input terminals, earphone jacks, etc.
Precautions
1-4 Samsung Electronics
1-3 ESD Precautions
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be damaged easily by static electricity.
Such components commonly are called Electrostatically Sensitive Devices(ESD). Examples of typical ESD
devices are integrated circuits and some field-effect
transistors and semiconductor chip components. The
following techniques should be used to help reduce
the incidence of component damage caused by static
electricity.
(1) Immediately before handling any semiconductor
component or semiconductor-equipped assembly,
drain off any electrostatic charge on your body by
touching a known earth ground. Alternatively,
obtain and wear a commercially available discharging wrist strap device, which should be
removed for potential shock reasons prior to applying power to the unit under test.
(2) After removing an electrical assembly equipped
with ESD devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
(3) Use only a grounded-tip soldering iron to solder or
unsolder ESD devices.
(4) Use only an anti-static solder removal devices.
Some solder removal devices not classified as
“anti-static” can generate electrical charges sufficient to damage ESD devices.
(5) Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage
ESD devices.
(6) Do not remove a replacement ESD device from its
protective package until immediately before your
are ready to install it.(Most replacement ESD
devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive materials).
(7) Immediately before removing the protective ma-
terials from the leads of a replacement ESD device,
touch the protective material to the chassis or circuit assembly into which the device will be
installed.
CAUTION : Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
(8) Minimize bodily motions when handling unpack-
aged replacement ESD devices. (Otherwise harmless motion such as the brushing together of your
clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient
to damage an ESD device).
Precautions
Samsung Electronics 1-5
1-4 Handling the optical pick-up
The laser diode in the optical pick up may suffer electrostatic breakdown because of potential static electricity from clothing and your body.
The following method is recommended.
(1) Place a conductive sheet on the work bench (The
black sheet used for wrapping repair parts.)
(2) Place the set on the conductive sheet so that the
chassis is grounded to the sheet.
(3) Place your hands on the conductive sheet(This
gives them the same ground as the sheet.)
(4) Remove the optical pick up block
(5) Perform work on top of the conductive sheet. Be
careful not to let your clothes or any other static
sources to touch the unit.
◆ Be sure to put on a wrist strap grounded to the
sheet.
◆ Be sure to lay a conductive sheet made of copper
etc. Which is grounded to the table.
Fig.1-3
(6) Short the short terminal on the PCB, which is in-
side the Pick-Up ASS’Y, before replacing the PickUp. (The short terminal is shorted when the PickUp Ass’y is being lifted or moved.)
(7) After replacing the Pick-up, open the short termi-
nal on the PCB.
THE UNIT
WRIST-STRAP
FOR GROUNDING
1M
1M
CONDUCTIVE SHEET
Precautions
1-6 Samsung Electronics
1-5 Pick-up disassembly and reassembly
1-5-1 Disassembly
1) Remove the power cord.
2) Disassemble the Deck-Assy.
3) Make solder land 2 points short on Pick-up.
(See Fig. 1-4)
4) Disassemble the Pick-up.
1-5-2 Assembly
1) Replace the Pick-up.
2) Remove the soldering 2 points on Pick-up.
3) Reassemble the Deck-Assy.
PICK-UP ASS'Y
SOLDER LAND 2 POINTS SHORT
Note : If the assembly and disassembly are not done in correct sequence, the Pick-up may be damaged.
Fig. 1-4
Samsung Electronics
2-1
2. Product Specification
2-1 Product Specification
Power Requirements AC230V, 50Hz
Power Consumption 10W
General
Weight 1.7Kg
Dimensions 430mm (W) x 207mm (D) x 42mm (H)
Operating Temperature Range +5°C to 35°C
Operating Humidity Range 10% to 75%
DVD
Reading Speed : 3.49 ~ 4.06m/sec.
(Digital Versatile Disc)
Approx. Play Time
(Single Sided, Single Layer Disc) : 135min.
CD : 12Cm Reading Speed : 4.8 ~ 5.6m/sec.
Disc (Compact Disc) Maximum Play Time : 74min.
CD : 8cm Reading Speed : 4.8 ~ 5.6m/sec.
(Compact Disc) Maximum Play Time : 20min.
VCD : 12Cm
Reading Speed : 4.8 ~ 5.6m/sec.
Maximum Play Time : 74min. (Video+Audio)
Composite Video 1 channel ; 1.0Vp-p (75ohm load)
R (Red) : 0.7 Vp-p (75ohm load)
G (Green) : 0.7 Vp-p (75ohm load)
SCART Jack B (Blue) : 0.7 Vp-p (75ohm load)
Composite Video : 1.0 Vp-p (75ohm load)
Video Output
Luminance Signal : 1.0 Vp-p (75ohm load)
Color Signal : 0.3 Vp-p (75ohm load)
Y: 1.0 Vp-p (75ohm load)
Component Video Pr: 0.70 Vp-p (75ohm load)
Pb: 0.70 Vp-p (75ohm load)
S-Video
Luminance Signal : 1.0Vp-p (75ohm load)
Chrominance Signal : 0.3Vp-p (75ohm loa)
HDMI High Definition Multimedia Interface (576p, 720p, 768p, 1080i)
SCART Jack 2 Channel : L(1/L), R(2/R)
2 Channel L(1/L), R(2/R)
Audio Output
*Ferquency Response
48KHz Sampling : 4Hz to 22KHz
96KHz Sampling : 4Hz to 44KHz
*S/N Ratio 110dB
*Dynamic Range 100dB
*Total Harmonic Distortion 0.004%
* : Nominal specification
Product Specification
2-2
Samsung Electronics
2-2 Chassis Product Specification
MODEL DVD-P250K/XSS DVD-P350K/XSS
FLASH 2M 2M
RF X Ti-D
DRIVE FAN8026 FAN8026
A/V DECODER ZR36862 ZR36778
6dB_AMP LA73054 LA73054
AUDIO DAC PCM1753 PCM1753
AUDIO ADC M65855P M65855P
FRONTMICOM eFHP5842 eFHP5842
MIC INPUT 1MIC 1MIC
NTSC O O
Default PAL PAL
SCARTOUT X X
PSO MULTI MULTI
DTS 2CH/DIGI 2CH/DIGI
D-AUDIO X X
MPEG4 X O
MP3 O O
P-CD O O
WMA O O
VCD O O
SVCD O O
MEMORY CARD X X
DVD-P355K/XAX
2M
Ti-D
FAN8026
ZR36778
LA73054
PCM1753
M65855P
eFHP5842
2MIC
O
NT
X
MULTI
2CH/DIGI
O
O
O
O
O
O
O
X
DVD-P255K/XSS
2M
X
FAN8026
ZR36862
LA73054
PCM1753
M65855P
eFHP5842
2MIC
O
PAL
X
MULTI
2CH/DIGI
X
X
O
O
O
O
O
X
Product Specification
2-3
Samsung Electronics
2-3 Option Product Specification
Remote
Control
AK59-00011K
Batteries for
Remote Control
(AAA Size)
AC43-12002H
User ’s Manual
Video/Audio
Cable
AC39-42001R
Description Fig
Description
Parts No Remark
S.N.A
AK68-00632G
Model Stamdard
of DVD-P355B/XEL
Model Stamdard
of DVD-P355B/XEL
Model Stamdard
of DVD-P355B/XEL
Model Stamdard
of DVD-P355B/XEL
Samsung Electronics 3-1
3. Alignment and Adjustment
3-1 Location of Test Point
Fig. 3-1 Location of Test Point
Pin29 of RIC1
RIC1
SP37239
RIC1
SP37239
Alignment and Adjustment
3-2 Samsung Electronics
3-2-1 Adjustment Spec. and Test Point
3-2 Skew Adjustment
Test Disc Adjustment Spec. Test Point Adjustment Location
TDV-533 “Pin 29 of RIC1” Screw A / B
Chapter 14 Flat Waveform (Main PCB - Component Side) Ass’y Deck - Top Side
(See Fig. 3-1) (See Fig. 3-2)
Fig. 3-2 Ass’y Deck (Top Side)
◆ Test Disc ; Service not Available
<Table 3-1>
Alignment and Adjustment
Samsung Electronics 3-3
3-2-2 SKEW Adjustment Method
Needed to minimize the variations in Skew of the Pickup unit and to provide optimum match with the recorded
signal on the Disc.
1) Connect an Oscilloscope to the “Pin 29 of RIC1” Test Point (See Fig. 3-1)
2) Connect Power, Open the Tray and Play the Ch.14 whish is in the TDV-533 Disc.
◆ Set the Oscilloscope Range as follows :
(Voltage ; 20mV/Div., Frequency ; 10m Sec.)
3) Adjust the Screws “A” and “B” (See Fig. 3-2) using a Hex screwdriver until you obtain a Flat Waveform and
the picture is stable.
Then, go to Chapter 1 and make sure the Waveform is Flat here as well.
If not, you have to go back to Chapter 14 and adjust again.
If you cannot obtain a Flat waveform, then the unit is defective.
Note : The Deck must be in a horizontal position. Use both “A” and “B” screws to adjust.
Typical Waveform before Adjustment Waveform after Correct Adjustment
Fig.3-3 Envelope Waveform
Samsung Electronics
4-1
4. Disassembly and Reassembly
4-1 Cabinet and PCB
4-1-1 Top Cabinet Removal
1) Remove 3 Screws Πthe back Top Cabinet.
2) Lift up the Top Cabinet in direction of arrow.
Π3 SCREWS
Fig. 4-1 Top Cabinet Removal
Note : Reassembly in reverse order.
4-2
Samsung Electronics
Disassembly and Reaasembly
4-1-2 Door-Tray Removal
1) Supply power and open Tray Œ.
2) Disassemble the Door-Tray ´ in direction of arrow “A”.
3) Close Tray Πand power off.
Note : If Tray Œ doesn’t open, insert a Screw driver ¨ into the Emergency hole ˇ (as shown in detailed draw-
ing) and then push it in the direction of arrow “B”. Open Tray manually.
ΠTRAY
´ DOOR-TRAY
"A"
¨ SCREW DRIVER
"B"
ˇ EMERGENCY HOLE
Fig. 4-2 Door-Tray Removal
Disassembly and Reaasembly
Samsung Electronics
4-3
Π2 HOOKS
ˇ 1 HOOK
´ 1 HOOK
ˆ A'ssy Front-Cabinet
¨ 2 HOOKS
Fig.4-3 Ass’y Front-Cabinet Removal
4-1-3 Ass’y Front-Cabinet Removal
1) Release 6 Hooks Œ, ´, ˇ, ¨ and Remove the Ass’y Front-Cabinet ˆ.
4-4
Samsung Electronics
Disassembly and Reaasembly
DCN1
DCN2
ASS'Y-DECK
Π3 SCREWS
FLAT-CABLE
4-1-4 Ass’y Deck Removal
1) Disconnect Flat-Cable from DCN1, DCN2 on Main PCB.
2) Remove 3 Screws Œ from the Ass’y Deck and lift it up.
Fig. 4-4 Ass’y Deck Removal
Disassembly and Reaasembly
Samsung Electronics
4-5
Π4 SCREWS
´ MAIN PCB
Fig. 4-5 Main PCB Removal
4-1-5 Main PCB Removal
1) Remove 4 Screws Œ.
2) Lift up the Main PCB ´.
4-6
Samsung Electronics
Disassembly and Reaasembly
4-2 Deck
4-2-1 Holder Chuck Removal
1) Push 4 Hooks Œ in the direction of arrow “A” and lift up the Holder Chuck ´.
Fig. 4-6 Holder Chuck Removal
´ HOLDER CHUCK
Π2 HOOKS
Π2 HOOKS
"A"
"A"
Disassembly and Reaasembly
Samsung Electronics
4-7
4-2-2 Tray Disc Removal
1) Insert a Screw Driver Œ into Emergency Hole ´ and push the Slider Housing ˇ in the direction arrow “A”.
2) When the Tray Disc ¨ comes out a little, pull it in the direction arrow “B” by hand.
Fig.4-7 Tray Disc Removal
"B"
ˇ SLIDER HOUSING
¨ TRAY DISC
"A"
ΠSCREW DRIVER
´ EMERGENCY HOLE
4-8
Samsung Electronics
Disassembly and Reaasembly
4-2-3 Assy P/U Deck Removal
1) Remove the 4 Soldering Π(SL+, SL-, SP+, SP-).
2) Remove the 1 Screw ´ and lift up the Ass’y P/U Deck ˇ
Fig. 4-8 Assy P/U Deck Removal
SP+
SL+
TM-
TM+
SP-
SL-
´ 1 SCREW
ˇ ASS'Y P/U DECK
¨ CHASSIS SUB
Π4 SOLDERING
<Assembly Point>
Disassembly and Reaasembly
Samsung Electronics
4-9
4-2-4 Ass’y Housing Removal
1) Remove the 2 Soldering Œ. (TM+, TM-)
2) Push the 2 Hooks ´ in the direction of arrow “A” and remove Ass’y PCB Deck ˇ.
3) Push the Slider Housing ¨ in the direction arrow “B”.
4) Push the 1 Hook ˆ in the direction of arrow “C” and lift up the Slider Housing ¨.
5) Remove the Belt Pulley Ø and 2 Screws ∏, Ass’y Motor Load ”.
6) Push the 1 Hook ’ in the direction of arrow “D” and lift up the Gear Pulley ˝, Gear Tray Ô.
Fig. 4-9 Ass’y Housing Removal
"B"
"D"
"A"
"A"
"C"
¨ SLIDER HOUSING
ˇ ASS'Y PCB DECK
Π2 SOLDERING
∏ 2 SCREWS
Ø BELT PULLEY
Ô GEAR TRAY
˝ GEAR PULLEY
’ 1 HOOK
ˆ 1 HOOK
” ASS'Y MOTOR LOAD
´ 2 HOOKS
4-10
Samsung Electronics
Disassembly and Reaasembly
4-2-5 Ass’y Bracket Deck Removal
1) Push the Hook Œ in the direction of arrow “A” and lift up the Gear Feed B ´.
2) Push the Hook ˇ in the direction of arrow “B” and lift up the Gear Feed B ¨.
3) Remove the 2 Screws ˆ and lift up Motor Feed Ass’y Ø.
4) Remove the 2 Screws ∏ and lift down Motor Spindl Ass’y ”.
5) Remove the 3 Screws ’ and remove 3 Holder Cam Skew ˝, Shaft Pick Up Ô, Ass’y Pick Up .
6) Remove the 1 Screws Ú and remove Gear Back Lash Æ.
Fig. 4-10 Ass’y Bracket Deck Removal
´ GEAR FEED B
¨ GEAR FEED A
ˆ 2 SCREWS
Ø MOTOR FEED
ASS'Y
Ú 2 SCREWS
∏ 2 SCREWS
” MOTOR SPINDLE
CHASSIS SUB
˝ 3 HOLDER CAM SKEW
’ 3 SCREWS
Ô SHAFT PICK UP
ASS'Y PICK UP
Æ GEAR BACK LASH
"A"
"B"
ΠHOOK
ˇ HOOK
Samsung Electronics 5-1
5. Troubleshooting
No focus incoming
FE in ZIC1-181
is within specified range?
FIC1-27, 28 output
are normal?
Check open state from
FIC1 to pick-up.
Check RIC1 and A, B, C, D input.
Check FIC1.
Yes
Yes
No
No
A
(FE Waveform)
Troubleshooting
5-2 Samsung Electronics
No pick-up home positing
ZIC1-191(SLED-PWM)
output is normal?
(1.7V ~ 1.8V)
Check the Sled Motor and connection.
Check ZIC1.
Yes
No
SLED+, SLED-
FIC1-13, 14 output are
normal?
Check FIC1.
Yes
No
Troubleshooting
Samsung Electronics 5-3
NO LD CD ON
RIC1-22 is 5V?
Current exceeds 0.1A?
LD out pick-up replace.
Open check in related circuit.
Check RIC1
Yes
Yes
Yes
No
No
Divide RQ2 emitter terminal
voltage and 5V real voltage
difference into 10ohm.
Troubleshooting
5-4 Samsung Electronics
No Search Operation
MIRR, RIC1-27
output is normal?
Actual velocity occurs
at ZIC1-191 terminal?
Actual velocity occurs
at FIC1-13, 14 terminal?
Check RIC1 peripheral circuit.
MEVO, RIC1-32
output level is normal?
Check ZIC1 peripheral circuit.
Check FIC1 peripheral circuit.
No
No
No
No
Yes
TE occurs in search range?
Focus On?
Yes
Yes
Yes
A
See "Fine Seek Check"
No
Yes
Check pick-up.
No
(MIRR Waveform)
(TE Waveform)
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