GSM TELEPHONE
GT-C3510T
GSM TELEPHONE |
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CONTENTS |
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1. |
Safety Precautions |
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2. |
Specification |
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3. |
Product Function |
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4. |
Array course control |
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5. |
Exploded View and Parts List |
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6. |
Main Electrical Parts List |
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7. |
Block Diagrams |
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8. |
PCB Diagrams |
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9. |
Flow Chart of Troubleshooting |
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10. Reference data |
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11. Disassembly and Assembly |
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instructions |
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12. Schematic Diagram |
1. Safety Precautions
1-1. Repair Precaution
― Repair in Shield Box, during detailed tuning.
Take specially care of tuning or test, because the specification of cellular phone is sensitive for surrounding interference(RF noise).
―Be careful to use a kind of magnetic object or tool, because performance of parts is damaged by the influence of magnetic force.
―Surely use a standard screwdriver when you disassemble this product, otherwise screw will be worn away.
―Use a thicken twisted wire when you measure level.
A thicken twisted wire has low resistance, therefore error of measurement is few.
―Repair after separate Test Pack and Set because for short danger (for example an overcurrent and furious flames of parts etc) when you repair board in condition of connecting Test Pack and tuning on.
―Take specially care of soldering, because Land of PCB is small and weak in heat.
―Surely tune on/off while using AC power plug, because a repair of battery charger is dangerous when tuning ON/OFF PBA and Connector after disassembling charger.
―Don't use as you pleases after change other material than replacement registered on SEC System. Otherwise engineer in charge isn't charged with problem that you don't keep this rules.
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Safety Precautions
1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD (Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
―Remove static electricity remained your body before you touch semiconductor or parts with semiconductor. There are ways that you touch an earthed place or wear static electricity prevention string on wrist.
―Use earthed soldering steel when you connect or disconnect ESD.
―Use soldering removing tool to break static electricity. Otherwise ESD will be damaged by static electricity.
―Don't unpack until you set up ESD on product. Because most of ESD are packed by box and aluminum plate to have conductive power,they are prevented from static electricity.
―You must maintain electric contact between ESD and place due to be set up until ESD is connected completely to the proper place or a circuit board.
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2. Specification
2-1. General CH and Freq. Table
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GSM 850 |
EGSM 900 |
DCS1800 |
PCS1900 |
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Freq. |
824~849 |
880~915 |
1710~1785 |
1850~1910 |
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Band[MHz] |
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869~894 |
925~960 |
1805~1880 |
1930~1990 |
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Uplink/Downlink |
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ARFCN range |
128~251 |
0~124 & |
512~885 |
512~810 |
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975~1023 |
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Tx/Rx spacing |
45MHz |
45MHz |
95MHz |
80MHz |
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Mod. Bit rate/ |
270.833kbps |
270.833kbps |
270.833kbps |
270.833kbps |
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Bit Period |
3.692us |
3.692us |
3.692us |
3.692us |
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Time Slot |
576.9us |
576.9us |
576.9us |
576.9us |
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Period/Frame |
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4.615ms |
4.615ms |
4.615ms |
4.615ms |
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Period |
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Modulation |
0.3GMSK |
0.3GMSK |
0.3GMSK |
0.3GMSK |
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MS Power |
33dBm~5dBm |
33dBm~5dBm |
30dBm~0dBm |
30dBm~0dBm |
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Power Class |
4 |
4 |
1 |
1 |
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(max +33dBm) |
(max +33dBm) |
(max +30dBm) |
(max +30dBm) |
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Sensitivity |
-102dBm |
-102dBm |
-100dBm |
-100dBm |
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TDMA Mux |
8 |
8 |
8 |
8 |
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Cell Radius |
35Km |
35Km |
2Km |
2Km |
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Specification
2-2. GSM General Specification
TX Power |
GSM850 |
control level |
GSM900 |
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5 |
33±2 dBm |
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6 |
31±2 dBm |
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7 |
29±2 dBm |
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8 |
27±2 dBm |
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9 |
25±2 dBm |
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10 |
23±2 dBm |
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11 |
21±2 dBm |
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12 |
19±2 dBm |
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13 |
17±2 dBm |
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14 |
15±2 dBm |
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15 |
13±2 dBm |
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16 |
11±3 dBm |
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17 |
9±3 dBm |
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18 |
7±3 dBm |
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19 |
5±3 dBm |
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TX Power |
DCS1800 |
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control level |
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0 |
30±3 dBm |
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1 |
28±3 dBm |
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2 |
26±3 dBm |
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3 |
24±3 dBm |
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4 |
22±3 dBm |
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5 |
20±3 dBm |
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6 |
18±3 dBm |
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7 |
16±3 dBm |
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8 |
14±3 dBm |
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9 |
12±4 dBm |
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10 |
10±4 dBm |
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11 |
8±4 dBm |
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12 |
6±4 dBm |
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13 |
4±4 dBm |
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14 |
2±5 dBm |
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15 |
0±5 dBm |
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2-2 |
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TX Power |
PCS1900 |
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control level |
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0 |
30±3 dBm |
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1 |
28±3 dBm |
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2 |
26±3 dBm |
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3 |
24±3 dBm |
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4 |
22±3 dBm |
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5 |
20±3 dBm |
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6 |
18±3 dBm |
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7 |
16±3 dBm |
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8 |
14±3 dBm |
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9 |
12±4 dBm |
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10 |
10±4 dBm |
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11 |
8±4 dBm |
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12 |
6±4 dBm |
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13 |
4±4 dBm |
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14 |
2±5 dBm |
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15 |
0±5 dBm |
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3. Product Function
Main Function
-EDGE
-1.3 Mega Pixel Camera
-GSM 850/900/1800/1900
-Analog TV
-Music player
-Bluetooth
-FM Radio
-MicroSD Card Support
-Automatic EQ & DNSe 2.0
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4. Array course control
4-1. Software Adjustments
Test Jig (GH99-36900A) |
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INA-XPLUG ADAPTER(GH99-38251A) |
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Test Cable (GH39-01313A) |
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RF Test Cable (GH39-00985A) |
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Array course control
4-2. Software Downloading
4-2-1. Pre-requisite for Downloading
•Downloader Program(Downloader V5.56)
•GT-C3510T Mobile Phone
•Data Cable
•Binary file
4-2-2. S/W Downloader Program
■ 1. Load the binary download program by executing the “Downloader V5.56”
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Array course control
2. Select the "BRCM2133" as Control.
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Array course control
3. Select the Full Download.
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Array course control
4. Load the file of Boot, Apps, Rsrc 1, Rsrc2, Factory FS from the folder that you saved the binary files.
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Array course control
5. Click the Port Search button when the download cable is connected to PC.
cf. You have to set the phone as a download mode by pressing Volume Volume + Camera + End key simultaneously before connecting to PC
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Array course control
6. Then the down loader can search the port.
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Array course control
7. Click the Download button when the Port searched. It will start to download.
7. When downloading is finished successfully, there is a "All files complete" message.
4-3. Memory Full reset
:You should take following procedures in order. Memory Full reset
- *2767*3855#
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5. Exploded View and Parts List
5-1. Cellular phone Exploded View
5-1
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Exploded View and Parts List
5-2. Cellular phone Parts list
Design LOC |
Discription |
SEC CODE |
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QAR01 |
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AUDIO-RECEIVER |
3009-001483 |
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QCR67 |
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SCREW-MACHINE |
6001-002083 |
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QMI01 |
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MICROPHONE-ASSY-GT_I6230 |
GH30-00647A |
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QMO01 |
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MOTOR LINEAR VIBRATION-GT_S7330 |
GH31-00449A |
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QAN02 |
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INTENNA-MAIN(GT-C3510T) |
GH42-02429A |
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QCA01 |
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CAMERA MODULE-GT-I6230 |
GH59-08983A |
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QME01 |
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DOME SHEET-GTI6230 |
GH59-09015A |
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QSP01 |
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MODULE-GTI6230_SPK+CARRIER |
GH59-09024A |
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QME03 |
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TOUCH/PANEL-GT-C3510T(BLK) |
GH59-09160A |
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QLB01 |
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NDC BRACKET-SHIELD |
GH71-09331A |
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QMP01 |
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A/S ASSY-GTC3510T_PBA MAIN (SVC) |
GH82-04811A |
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QLC01 |
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ASSY LCD-2.8",TFT(GT-C3510T) |
GH96-04422A |
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QFR01 |
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ASSY CASE-FRONT(XEM/BLK) |
GH98-16118A |
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QBC00 |
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ASSY COVER-BATT |
GH98-16124A |
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QKP01 |
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ASSY KEYPAD-FRONT |
GH98-16151A |
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QCK02 |
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ASSY KEY-HOLD |
GH98-16671A |
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QRE01 |
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ASSY CASE-REAR |
GH98-16958A |
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QCR72 |
SCREW-MACHINE |
6001-002051 |
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QCW01 |
PCT WINDOW-CAMERA |
GH72-58060A |
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QCK01 |
ASSY KEY-CAM |
GH98-16667A |
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QVO01 |
ASSY KEY-VOLUME |
GH98-16668A |
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QSD01 |
ASSY COVER-SD |
GH98-16669A |
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QIF01 |
ASSY COVER-IF |
GH98-16670A |
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6. Main Electrical Parts List
SEC CODE |
Design LOC |
Discription |
0403-001688 |
D300 |
DIODE-ZENER |
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0404-001504 |
ZD100,ZD101,ZD102 |
DIODE-SCHOTTKY |
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0404-001504 |
ZD103 |
DIODE-SCHOTTKY |
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0406-001231 |
ZD300,ZD301,ZD302 |
DIODE-TVS |
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0406-001231 |
ZD303,ZD304,ZD402 |
DIODE-TVS |
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0406-001231 |
ZD403,ZD404 |
DIODE-TVS |
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0406-001286 |
ZD305,ZD400 |
DIODE-TVS |
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0406-001293 |
D403 |
DIODE-TVS |
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0406-001329 |
D400,D405,D406,ZD104 |
DIODE-TVS |
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0406-001329 |
ZD105 |
DIODE-TVS |
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0505-002207 |
U101 |
FET-SILICON |
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0801-003026 |
U301 |
IC |
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0801-003130 |
U200 |
IC |
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1001-001546 |
U102,U300 |
IC |
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1108-000296 |
UME200 |
MEMORY |
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1201-002675 |
U302 |
IC |
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1201-002933 |
PAM100 |
IC |
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1203-006070 |
U400 |
IC |
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1203-006176 |
PM300 |
IC |
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1204-003103 |
U103 |
IC |
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1205-003656 |
UCP200 |
IC |
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1205-003839 |
U100 |
IC |
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1404-001221 |
VR200 |
THERMISTOR |
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2007-000138 |
R109,R207,R301 |
R-CHIP |
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2007-000141 |
R409,R410,R414,R415 |
R-CHIP |
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2007-000143 |
R204 |
R-CHIP |
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2007-000144 |
R208,R209,R210,R211 |
R-CHIP |
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2007-000144 |
R315 |
R-CHIP |
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2007-000146 |
R407 |
R-CHIP |
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2007-000148 |
R408 |
R-CHIP |
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2007-000149 |
R126 |
R-CHIP |
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2007-000151 |
R102 |
R-CHIP |
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2007-000152 |
R214 |
R-CHIP |
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2007-000156 |
R318 |
R-CHIP |
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2007-000159 |
R319,R320 |
R-CHIP |
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2007-000160 |
R406 |
R-CHIP |
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2007-000162 |
R100,R101,R218,R400 |
R-CHIP |
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6-1
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Main Electrical Parts List
SEC CODE |
Design LOC |
Discription |
2007-000162 |
R401,R412,R413 |
R-CHIP |
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2007-000165 |
R312 |
R-CHIP |
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2007-000172 |
R404,R405 |
R-CHIP |
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2007-001291 |
R303,R304,R305,R306 |
R-CHIP |
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2007-001313 |
R115,R116,R117,R118 |
R-CHIP |
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2007-001313 |
R119,R120,R121,R122 |
R-CHIP |
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2007-001313 |
R123,R124,R125 |
R-CHIP |
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2007-001319 |
R202,R203,R215,R216 |
R-CHIP |
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2007-001333 |
R321 |
R-CHIP |
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2007-001339 |
R200,R201 |
R-CHIP |
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2007-001341 |
R420 |
R-CHIP |
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2007-003010 |
R106 |
R-CHIP |
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2007-003013 |
R107,R108,R112,R113 |
R-CHIP |
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2007-003018 |
R104,R105 |
R-CHIP |
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2007-007001 |
R217 |
R-CHIP |
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2007-007156 |
R424 |
R-CHIP |
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2007-008401 |
R205 |
R-CHIP |
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2007-008517 |
R206 |
R-CHIP |
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2007-008776 |
R411 |
R-CHIP |
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2007-008780 |
R127,R128,R417,R419 |
R-CHIP |
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2007-008780 |
R421 |
R-CHIP |
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2203-000233 |
C110,C237,C358,C400 |
C-CERAMIC,CHIP |
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2203-000233 |
C442 |
C-CERAMIC,CHIP |
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2203-000254 |
C104,C141,C151,C155 |
C-CERAMIC,CHIP |
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2203-000254 |
C159,C165,C166,C235 |
C-CERAMIC,CHIP |
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2203-000254 |
C325,C326,C356,C429 |
C-CERAMIC,CHIP |
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2203-000278 |
C100,C103 |
C-CERAMIC,CHIP |
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2203-000311 |
C154,C162 |
C-CERAMIC,CHIP |
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2203-000386 |
C152,C153,C315,C316 |
C-CERAMIC,CHIP |
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2203-000386 |
C409,C423,C428,C431 |
C-CERAMIC,CHIP |
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2203-000425 |
C219 |
C-CERAMIC,CHIP |
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2203-000438 |
C113,C145,C148,C150 |
C-CERAMIC,CHIP |
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2203-000438 |
C160,C161,C402,C404 |
C-CERAMIC,CHIP |
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2203-000438 |
C410,C420,C430 |
C-CERAMIC,CHIP |
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2203-000466 |
C108 |
C-CERAMIC,CHIP |
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2203-000489 |
C350,C351 |
C-CERAMIC,CHIP |
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2203-000550 |
C307,C312 |
C-CERAMIC,CHIP |
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6-2
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Main Electrical Parts List
SEC CODE |
Design LOC |
Discription |
2203-000627 |
C163,C164 |
C-CERAMIC,CHIP |
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2203-000812 |
C129,C140,C168,C354 |
C-CERAMIC,CHIP |
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2203-000812 |
C363,C406,C412 |
C-CERAMIC,CHIP |
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2203-000854 |
C228,C232 |
C-CERAMIC,CHIP |
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2203-000995 |
C205,C216,C231 |
C-CERAMIC,CHIP |
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2203-001072 |
C125,C126 |
C-CERAMIC,CHIP |
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2203-001101 |
C138,C139,C223 |
C-CERAMIC,CHIP |
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2203-002709 |
C131,C132,C156,C157 |
C-CERAMIC,CHIP |
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2203-002709 |
C158,C305 |
C-CERAMIC,CHIP |
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2203-005234 |
C115,C236 |
C-CERAMIC,CHIP |
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2203-005383 |
C169 |
C-CERAMIC,CHIP |
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2203-005446 |
C230 |
C-CERAMIC,CHIP |
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2203-005450 |
C114 |
C-CERAMIC,CHIP |
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2203-006048 |
C105,C106,C200,C208 |
C-CERAMIC,CHIP |
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2203-006048 |
C210,C211,C212,C213 |
C-CERAMIC,CHIP |
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2203-006048 |
C217,C218,C306,C308 |
C-CERAMIC,CHIP |
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2203-006048 |
C309,C311,C344,C345 |
C-CERAMIC,CHIP |
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2203-006048 |
C346,C355,C408,C411 |
C-CERAMIC,CHIP |
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|
2203-006048 |
C413,C417,C427,C432 |
C-CERAMIC,CHIP |
|
|
|
2203-006257 |
C313,C314 |
C-CERAMIC,CHIP |
|
|
|
2203-006348 |
C303,C323,C401,C403 |
C-CERAMIC,CHIP |
|
|
|
2203-006377 |
C424,C425 |
C-CERAMIC,CHIP |
|
|
|
2203-006399 |
C101,C102,C120,C130 |
C-CERAMIC,CHIP |
|
|
|
2203-006399 |
C133,C134,C135,C142 |
C-CERAMIC,CHIP |
|
|
|
2203-006399 |
C144,C147,C149,C201 |
C-CERAMIC,CHIP |
|
|
|
2203-006399 |
C207,C209,C227,C229 |
C-CERAMIC,CHIP |
|
|
|
2203-006399 |
C310,C327,C328,C330 |
C-CERAMIC,CHIP |
|
|
|
2203-006399 |
C333,C334,C335,C336 |
C-CERAMIC,CHIP |
|
|
|
2203-006399 |
C337,C338,C339,C348 |
C-CERAMIC,CHIP |
|
|
|
2203-006399 |
C349,C352,C357,C359 |
C-CERAMIC,CHIP |
|
|
|
2203-006399 |
C362,C434,C446,C447 |
C-CERAMIC,CHIP |
|
|
|
2203-006399 |
C448 |
C-CERAMIC,CHIP |
|
|
|
2203-006585 |
C136,C137 |
C-CERAMIC,CHIP |
|
|
|
2203-006681 |
C214,C215,C225,C226 |
C-CERAMIC,CHIP |
|
|
|
2203-006681 |
C443,C449 |
C-CERAMIC,CHIP |
|
|
|
2203-006842 |
C440,C441 |
C-CERAMIC,CHIP |
|
|
|
2203-006872 |
C107,C117,C203,C204 |
C-CERAMIC,CHIP |
|
|
|
6-3
SAMSUNGProprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Main Electrical Parts List
SEC CODE |
Design LOC |
Discription |
2203-006872 |
C206,C220,C221,C224 |
C-CERAMIC,CHIP |
|
|
|
2203-006872 |
C331,C332,C340,C341 |
C-CERAMIC,CHIP |
|
|
|
2203-006872 |
C342,C343 |
C-CERAMIC,CHIP |
|
|
|
2203-006890 |
C143,C146,C321,C322 |
C-CERAMIC,CHIP |
|
|
|
2203-006890 |
C347 |
C-CERAMIC,CHIP |
|
|
|
2203-007240 |
C439 |
C-CERAMIC,CHIP |
|
|
|
2203-007270 |
C302,C304 |
C-CERAMIC,CHIP |
|
|
|
2203-007279 |
C123,C353,C407,C422 |
C-CERAMIC,CHIP |
|
|
|
2203-007317 |
C421 |
C-CERAMIC,CHIP |
|
|
|
2203-007393 |
C418 |
C-CERAMIC,CHIP |
|
|
|
2409-001172 |
BAT300 |
CAPACITOR |
|
|
|
2703-001178 |
L102,L119,L124,L129 |
INDUCTOR-SMD |
|
|
|
2703-001726 |
L112,L114,L137,L141 |
INDUCTOR-SMD |
|
|
|
2703-001726 |
L201 |
INDUCTOR-SMD |
|
|
|
2703-002170 |
L108,L109 |
INDUCTOR-SMD |
|
|
|
2703-002176 |
L118,L121 |
INDUCTOR-SMD |
|
|
|
2703-002200 |
L134 |
INDUCTOR-SMD |
|
|
|
2703-002203 |
L125,L127 |
INDUCTOR-SMD |
|
|
|
2703-002206 |
L138,L142 |
INDUCTOR-SMD |
|
|
|
2703-002208 |
L104,L107 |
INDUCTOR-SMD |
|
|
|
2703-002269 |
L103 |
INDUCTOR-SMD |
|
|
|
2703-002281 |
L110,L111,L116,L117 |
INDUCTOR-SMD |
|
|
|
2703-002281 |
L122 |
INDUCTOR-SMD |
|
|
|
2703-002365 |
C127,C128 |
INDUCTOR-SMD |
|
|
|
2703-002367 |
L204 |
INDUCTOR-SMD |
|
|
|
2703-002369 |
L105 |
INDUCTOR-SMD |
|
|
|
2703-002495 |
L130 |
INDUCTOR-SMD |
|
|
|
2703-002544 |
L139,L140 |
INDUCTOR-SMD |
|
|
|
2703-002589 |
L128,L131 |
INDUCTOR-SMD |
|
|
|
2703-002596 |
L133,L135,L136 |
INDUCTOR-SMD |
|
|
|
2703-003260 |
L300,L301 |
INDUCTOR-SMD |
|
|
|
2703-003476 |
L400,L417 |
INDUCTOR-SMD |
|
|
|
2703-003748 |
L403,L404 |
INDUCTOR-SMD |
|
|
|
2801-004340 |
OSC100 |
CRYSTAL-UNIT |
|
|
|
2801-004893 |
OSC200 |
CRYSTAL-UNIT |
|
|
|
2801-004909 |
OSC300 |
CRYSTAL-UNIT |
|
|
|
2901-001435 |
F400,F401,F402 |
FILTER-EMI SMD |
|
|
|
6-4
SAMSUNGProprietary-Contents may change without notice This Document can not be used without Samsung's authorization