Samsung B7510 Service Manual

GSM TELEPHONE

GT-B7510

GSM TELEPHONE

CONTENTS

Safety Precautions

1.

Specification

2.

Product Function

3.

Exploded View and Parts list

4.

MAIN Electrical Parts List

5.

Level1Repair

6.

Level2Repair

7.

Level3Repair

8.

Reference data

9.

Notice All functionality, features, specifications and other product information provided in this document inclu ding, but not limited to, the benefits, design, pricing, components, performance, availability, and capabiliti

es of the product are subject to change without

-

notice or obligation. Samsung reserves the right to make changes to this document and the product described herein, at anytime, without obligation on Samsung to provide notification of such change.

:

Safety Precautions

1.

Repair Precaution

1-1.

Repair in Shield Box, during detailed tuning. Take specially care of tuning or test, because

―

specipicty of cellular phone is sensitive for surrounding interference(RF noise).

Be careful to useakind of magnetic object or tool, because performance of parts is damaged by

―

the influence of magnetic force.

Surely useastandard screwdriver when you disassemble this product, otherwise screw will be

―

worn away.

Useathicken twisted wire when you measure level.

―

thicken twisted wire has low resistance, therefore error of measurement is few.

A

Repair after separate Test Pack and Set because for short danger(for example an overcurrent

―

and furious flames of parts etc) when you repair board in condition of connecting Test Pack and

tuning on.

Take specially care of soldering, because Land of PCB is small and weak in heat.

―

Surely tune on/off while using AC power plug, becausearepair of battery charger is dangerous

―

when tuning ON/OFF PBA and Connector after disassembling charger.

Don't use as you pleases after change other material than replacement registered on SEC System.

―

Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

1-1

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Safety Precautions

ESD(Electrostatically Sensitive Devices) Precaution

1-2.

Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD

Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.

(

You can prevent from ESD damage by static electricity.

Remove static electricity remained your body before you touch semiconductor or parts with

―

semiconductor. There are ways that you touch an earthed place or wear static electricity prevention

string on wrist.

Use earthed soldering steel when you connect or disconnect ESD.

―

Use soldering removing tool to break static electricity.,otherwise ESD will be damaged by static

―

electricity.

Don't unpack until you set up ESD on product. Because most of ESD are packed by box and

―

aluminum plate to have conductive power,they are prevented from static electricity.

You must maintain electric contact between ESD and place due to be set up until ESD is

―

connected completely to the proper place oracircuit board.

1-2

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Specification

2.

GSM General Specification

2-1.

GSM850

Phase 1

Freq.

Band[MHz]

Uplink/Downlin

k

ARFCN range 128~251

Tx/Rx spacing 45MHz 45MHz 95MHz 80MHz 190MHz 45MHz

Mod. Bit rate/

Bit Period

Time Slot

Period/Frame

Period

824~849 869~894

270.833kbp s

3.692us

576.9us

4.615ms

EGSM 900

Phase 2

880~915 925~960

0~124 &

975~1023

270.833kbp s

3.692us

576.9us

4.615ms

DCS1800

Phase 1

1710~1785 1805~1880

512~885 512~810

270.833kbp s

3.692us

576.9us

4.615ms

PCS1900

1850~1910 1930~1990

270.833kbp s

3.692us

576.9us

4.615ms

WCDMA

2100

1922~1977 2112~2167

UL:9612~98 88DL:10562

~10838

3.84Mcps 3.84Mcps

FrameLengt

h:

10ms

Slotlength:

0.667ms

WCDMA900

880~915 925~960

UL:2712~28

63,DL:2937

~3088

FrameLengt

h:

10ms

Slotlength:

0.667ms

Modulation 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK

MS Power

Power Class

Se

nsitivity

TDMA Mux 8 8 8 8

Cell Radius 35Km 35Km 2Km 2Km 2Km 2Km

33dBm~5dBm33dBm~5dBm30dBm~0dBm30dBm~0dBm24dBm~-

5pcl ~

19pcl

-102dBm -102dBm -100dBm -100dBm -106.7dBm -106.7dBm

pcl

5

~19

pcl0pcl

2-1

~15

pcl0pcl

~15

QPSKHQPSKQPSKHQPS

24dBm~-

pcl

50dBm

max+24dB

3(

m)

8

50dBm

max+24dB

3(

K

m)

8

Specification

GSM Tx Power Class

2-2.

TX Power

control

GSM850

level

533±2

631±2

729±2

827±2

925±2

10 23±2

11 21±2

12 19±2

dBm

TX Power

control

EGSM900

level

533±2

631±2

729±2

827±2

925±2

10 23±2

11 21±2

12 19±2

dBm

TX Power

control

DCS1800

level

030±3

128±3

226±3

324±3

422±3

520±3

618±3

716±3

dBm

TX Power

control

PCS1900

level

030±3

128±3

226±3

324±3

422±3

520±3

618±3

716±3

dBm

13 17±2

14 15±2

15 13±2

16 11±3

17 9±3

18 7±3

19 5±3

dBm

13 17±2

14 15±2

15 13±2

16 11±3

17 9±3

18 7±3

19 5±3

dBm

2-2

814±3

912±4

10 10±4

11 8±4

12 6±4

13 4±4

14 2±5

15 0±5

dBm

814±3

912±4

10 10±4

11 8±4

12 6±4

13 4±4

14 2±5

15 0±5

dBm

Operation Instruction and Installation

3.

Main Function

GoogleAndroid OS

-

Size:

-

Band:GSM QUAD BAND GSM850/900/1800/1900(Release:R99)

-

BAND:HSDPA

-

3

-

LCD:

-

1350

-

3.5

-

Micro USB/ Power, Data

-

Wi-Fi

-

Bluetooth v3.0

-

USB v2.0 High Speed,

-

A-GPS

-

FM w/RDS

-

input:QWERTY Key, C-Type single TSP

-

Audio:mp3, ogg, aac, mid, xmf, rtttl, imy, rtx, ota, amr, wav, mxmf

-

Image:bmp, gif, jpg, png, wbmp, agif

-

Video:MPEG4, H.263, H.264,3gp, mp4

-

B/B: MSM7227 turbo

-

PMIC: MAX8899

-

Tranceiver: RTR6285

-

PAM: SKY77554(2G)

-

RF7201(3G Dual)

-

Intenna:Carrier type

-

LCD:

-

MEMORY:4G+3G

-

108.6

Mega pixel AF Camera,

2.8"

mA standard Battery

pi Earjack/ Earphone

802.11

2.8"

x66.7x10.65

7.2M

LQVGA TFT

b/g/n

LQVGA TFT

2.2

Froyo

B1/B8

800M

1/5"

CMOS

3-1

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Exploded View and Parts List

4.

Cellular phone Exploded View

4-1.

QME03

QFR01

QLC01

QKP01

QME01

QLB01

QCA01

QSP01

QRE01

QAR01

QVO01

QRF06

QMP01

QMI01

QCK01 QAN02

QCR67

QBA01

QBC00

4-1

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Exploded View and Parts List

Cellular phone Parts list

4-2.

Design LOC Description SEC CODE

QCR67 SCREW-MACHINE

6001-002083

QMI01 MICROPHONE-ASSY-GT-B7510 GH30-00722A

QBA01 INNER BATTERY PACK-EB494358VU,GT-S5830,L GH43-03504A

QSP01 MODULE-SPK+SIM S/C GH59-10724A

QME03 TOUCH/PANEL-GT-B7510 GH59-10728A

QMP01 A/S ASSY-PBAMAIN(COMM)GT-B7510 GH82-05631A

QLC01 ELA MODULE-LCD MODULE(GT-B7510) GH96-05085A

QCA01 ASSY CAMERA-3M AF MODULE(GT-B7510 GH96-05091A

QFR01 ASSY CASE-FRONT GH98-18418A

QBC00 ASSY COVER-BATT GH98-18420A

QKP01 ASSY KEYPAD-QWERTY GH98-18421A

QLB01 ASSY BRACKET-LCD GH98-18430A

QME01 KEY FPCB-QWERTY KEY(GT-B7510) GH59-10713A

QAR01 ASSY ETC-RCV&EAR JACK ASSY GH59-10737A

QRE01 ASSY CASE-REAR GH98-18419A

QAN02 INTENNA-GTB7510 MAIN GH42-02892A

QRF06 PMO COVER-DC USB GH72-61733A

QCK01 PMO KEY-POWER HOLD GH72-61734A

QVO01 PMO KEY-VOLUME GH72-61735A

4-2

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MAIN Electrical Parts List

5.

Design LOC SEC CODE Description

D401

D501

ZD400,ZD600,ZD601

ZD508

D502

ZD401,ZD402,ZD403

ZD500,ZD501,ZD502

ZD506,ZD511,ZD513

ZD514,ZD606

D400,D500

Q500

TR400

U301

U300

U601

U501

U103

PAM100

U500

U401

U403

U503

U402

U400

U603

U100

U200

U201

UCP300

U600

U602

TH300

ZD602,ZD603,ZD604

R337

R101,R323,R510,R532

R610

0403-001870

0404-001172

0406-001286

0406-001329

0406-001431

0406-001459

0407-001002

0504-001138

0505-002341

0801-003200

0801-003265

1001-001385

1001-001645

1201-003057

1201-003210

1202-001068

1203-004776

1203-005298

1203-006331

1203-006346

1203-006732

1204-003112

1205-003297

1205-004076

1205-004113

1205-004180

1209-002023

1209-002030

1404-001221

1405-001298

2007-000137

2007-000138

DIODE-ZENER

DIODE-SCHOTTKY

DIODE-TVS

DIODE-ARRAY

TR-DIGITAL

FET-SILICON

IC

THERMISTOR

VARISTOR

R-CHIP

-7

7

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Main Electrical Parts List

Design LOC SEC CODE Description

R117,R304

R108,R306,R307,R308

R309,R313,R314,R315

R316,R500,R531

R310,R411,R509

R418

R514

R412,R413,R414,R416

R417

R300,R305,R318,R319

R320,R322,R332,R410

R524

R511

R512

R517

R336,R523,R527,R528

R612

R521,R522

R335

R415

R301,R609

R407

R201

R311,R312

R611

R405

R409

R408

R406

R400

R530

R105

R110

R112,R113,R600,R601

R603,R604,R605,R606

R607,R608,R615,R616

2007-000140

2007-000141

2007-000148

2007-000149

2007-000155

2007-000157

2007-000162

2007-000165

2007-000168

2007-000170

2007-000172

2007-000242

2007-001292

2007-001298

2007-001339

2007-003001

2007-007107

2007-007132

2007-007139

2007-007193

2007-007334

2007-007468

2007-007480

2007-007573

2007-007698

2007-007798

2007-008043

2007-008044

2007-008045

R-CHIP

5-2

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Design LOC SEC CODE Description

R617,R618,R619,R620

R106

R107

R515,R529

R302

R520

R109

R111

R325

R507,R508

R403

R404

R116,R123

R200

C126,C189,C226,C230

C231,C436

C102,C108,C217

C179,C215,C219,C238

C326

C321

C434,C435,C513,C614

C107,C110,C112,C233

C501

C130,C133,C329

C430

C117

C109,C113,C119,C127

C128,C129,C145,C146

C148,C454,C457,C458

C459

C213

C122,C330,C431

C114

C180

C406,C407

C242

2007-008045

2007-008046

2007-008049

2007-008055

2007-008298

2007-008516

2007-008588

2007-008647

2007-008766

2007-008774

2007-008806

2007-008812

2007-009766

2007-009794

2203-000233

2203-000254

2203-000278

2203-000311

2203-000386

2203-000425

2203-000438

2203-000489

2203-000585

2203-000679

2203-000812

2203-000940

2203-000995

2203-001017

2203-001383

2203-001405

2203-002668

Main Electrical Parts List

R-CHIP

C-CERAMIC,CHIP

5-3

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Main Electrical Parts List

Design LOC SEC CODE Description

C111,C201,C203,C205

C210,C220,C221,C223

C224,C300,C303,C304

C305,C310,C312,C316

C324,C325,C327,C328

C437,C443,C447,C448

C606,C607,C608,C610

C144

C241

C147,C232

C240

C208,C209

C234

C139,C142

C162,C163,C164,C322

C172,C173

C138,C140,C151,C161

C239

C158,C165,C186

C150

C170

C229

C323

C204,C207,C212,C235

C314,C315,C462,C506

C507,C611

C118,C120

C168,C176

C612

C404

C313,C410,C414,C415

C416,C417,C419,C423

C425,C428,C429,C432

C445,C449,C450,C451

C452,C461,C605

C157,C160,C166,C169

2203-002709

2203-005050

2203-005052

2203-005281

2203-005288

2203-005393

2203-005450

2203-005552

2203-005682

2203-005725

2203-005732

2203-005734

2203-005736

2203-005792

2203-005806

2203-005968

2203-006047

2203-006048

2203-006187

2203-006194

2203-006201

2203-006260

2203-006399

2203-006423

C-CERAMIC,CHIP

5-4

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Design LOC SEC CODE Description

C175,C178,C182,C184

C187

C216,C218,C227,C228

C236,C301,C302,C306

C318,C319,C408,C409

C442,C446,C503,C508

C600,C602,C603,C604

C131,C135

C134,C400,C401,C402

C403,C438,C439,C440

C441,C520

C200,C202,C211

C308,C309

C433

C517

C500

C206,C222,C237,C411

C412,C413,C418,C422

C424,C426,C427,C453

C515,C516

C116,C455,C609

C185

C307,C311,C505

C519

C456

BAT400

L126,L133

L124

L120

L127

L105,L122

R333

L113

L132

C225,L131,L212

L117,L130

2203-006423

2203-006562

2203-006707

2203-006824

2203-006838

2203-006839

2203-006841

2203-006978

2203-007240

2203-007271

2203-007279

2203-007317

2203-007474

2203-007634

2203-007775

2409-001172

2703-001178

2703-001729

2703-001737

2703-001750

2703-001786

2703-001990

2703-002170

2703-002176

2703-002208

2703-002281

Main Electrical Parts List

C-CERAMIC,CHIP

CAPACITOR

INDUCTOR-SMD

5-5

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Main Electrical Parts List

Design LOC SEC CODE Description

L509

L110,L207

L128,L129

L107

L115

L211

L503

L400,L401,L402,L403

L118,L121

OSC400

OSC200

OSC100

F600,F601,F602,F603

F604,F605,F606,F607

F608,F609

F103

F104

F102

F101

DUF101

DUF100

L206

L202,L203

L104

L504,L505,L506,L507

L204

SW600,SW601,SW602

RFS100

CN603

HEA601

BTC400

HEA500

L108,L109,L200,L205

MOT500,MOT501

IFC500

F200

2703-002308

2703-002314

2703-002365

2703-002367

2703-002958

2703-003004

2703-003485

2703-003686

2703-003915

2801-004909

2801-005045

2809-001366

2901-001424

2904-001658

2904-001702

2904-001908

2904-001920

2910-000099

2910-000117

3301-001438

3301-001659

3301-001756

3301-001885

3301-001895

3404-001410

3705-001731

3708-002222

3711-005937

3711-007533

3711-007592

3712-001348

3722-003065

2911-000162

INDUCTOR-SMD

CRYSTAL-UNIT

OSCILLATOR-VCTCXO

FILTER-EMI SMD

FILTER-SAW

FILTER

CORE-FERRITE BEAD

SWITCH-TACT

CONNECTOR-COAXIAL

CONNECTOR-FPC/FFC/PIC

CONNECTOR-HEADER

CONNECTOR

JACK-PHONE

FILTER

5-6

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Main Electrical Parts List

Design LOC SEC CODE Description

UME300

L123

L112,L114,L116

HEA401

HEA600

HEA400

F201

F100

Please consult the GSPN website (Samsung Portal) for the most recent version of the product's part list.

1108-000411

2703-003917

2703-004030

3711-007762

3711-005456

3709-001681

1201-003216

2904-001889

MEMORY

INDUCTOR-SMD

CONNECTOR-HEADER

CONNECTOR-CARD EDGE

IC

FILTER-SAW

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Level

6.

S/W Download

6-1.

Repair

1

6-1-1.

Pre-requsite for S/W Downloading

GT-B7510 Mobile Phone

•

Battery

•

USB cable

•

JIG BOX(GH99-36900A)

•

RF Test Cable(GH39-00985A)

•

JIG Cable(GH39-01339A)

•

Adapter(GH99-38251A)

•

Downloader Program(

•

Binary files

•

PC(Windows XP,

•

The settings for download.

★

7)

Odin Multi Downloader v4.38)

6-1

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Level1Repair

6-1-2.

S/W Downloader Program

Execute the binary download program,which is"Odin Multi Downloader v4.38".

1.

Load the files of OPS, BOOT, PHONE, PDS, CSC from the folder that you saved

2.

binary files.(CLICK the each Naming Button and select the file)

OPS:OPS file

-

BOOT:APBOOT_...

-

phone:MODEM_...

-

PDA:CODE_...

-

CSC:CSC_...

-

Turn On the Mobile with push'Q' Button to enter the Download mode and check

3.

the Download Logo on LCD

QWERTY Key Pad

<

Click the Start button whenaport is ready

4.

><

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Download Logo>

6-2

Level1Repair

After downloading finished successfully, there is

5.

Check the binary version using key streaming,

6.

PASS" message.

a "

"*#1234#".

6-3

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Level

7.

Disassembly and Assembly Instructions

7-1.

Repair

2

7-1-1.

1)

Disassembly

1 2

Be careful not to make scratch and molding damage!

Release Screw7Point at REAR

Disjoint Hook on the bottom of the REAR

Be careful not to make scratch and molding damage!

1)

3

Disjoint hook on the both side of the REAR

Push out REAR to both side.

1)

Disassemble REAR

4

Detach Power Key FPCB and Cammera Key FPCB.

1)

Be careful not to damage to FPCB(Use tweezer!)

2)

7-1

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Level2Repair

7.

5

Disassemble FPCB.

6

Disassemble Main PBA from the FRONT Ass'y

Detach Earjack/LCD/Qwerty key FPCB.(3point)

1)

7

Disassemble Module from PBA.

Hold up Main PBA from left.

1)

8

Complete disassembly.

Disassemble Cammera Module from PBA.

1)

Disassemble SPK Module from PBA.

2)

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7-2

Level2Repair

7.

7-1-1.

1

Assembly

SetaPBA and FRONT Ass'y.

2

Assemble SPK module.

3

Assemble Camera module

Assemble left hook first.

1)

Assemble right hook.

2)

4

Assemble PBA on FRONT Ass'y.

Assemble fiting to silk line

1)

7-3

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Level2Repair

7.

5

Assemble PBA on FRONT Ass'y.

6

Assemble FRONT Ass'y on REAR.

Assemble Earjack/LCD/Qwerty key FPCB.(3point).

1)

Be careful not to damage to FPCB.

2)

7

Assemble FRONT Ass'y on REAR.

Assemble matching location from earjack of rear

1)

upper

8

Drive Screws at6points

Be careful not to make scratch and molding damage!

1)

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Drive Screws at6points with torque

1)

1.1 +/- 0.1

Kgf/

㎠

7-4

Level

8.

Block Diagram

8-1.

Repair

3

8-1

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Samsung B7510 Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual