Samsung B5722 Service Manual

GSM TELEPHONE

GT-B5722

GSM TELEPHONE

CONTENTS

Safety Precautions

1.

Specification

2.

Product Function

3.

Array course control

4.

Exploded View and Parts list

5.

MAIN Electrical Parts List

6.

Block Diagrams

7.

PCB Diagrams

8.

Chart of Troubleshooting

9.

Reference data

10.

Disassembly and Assembly

11.
Instructions

Safety Precautions

1.

Repair Precaution

1-1.

Repair in Shield Box, during detailed tuning.

●

Take specially care of tuning or test,

because specipicty of cellular phone is sensitive for surrounding interference(RF noise).

Be careful to useakind of magnetic object or tool,

●

because performance of parts is damaged by the influence of manetic force.

Surely useastandard screwdriver when you disassemble this product,

●

otherwise screw will be worn away.

Useathicken twisted wire when you measure level.

●

thicken twisted wire has low resistance, therefore error of measurement is few.

A

Repair after separate Test Pack and Set because for short danger(for example an

●

overcurrent and furious flames of parts etc) when you repair board in condition of

connecting Test Pack and tuning on.

Take specially care of soldering, because Land of PCB is small and weak in heat.

●

Surely tune on/off while using AC power plug, becausearepair of battery charger is

●

dangerous when tuning ON/OFF PBA and Connector after disassembing charger.

Don't use as you pleases after change other material than replacement registered on SEC

●

System.

Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

1-1

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Safety Precautions

ESD(Electrostatically Sensitive Devices) Precaution

1-2.

Several semiconductor may be damaged easilly by static electricity. Such parts are called by

ESD(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.

You can prevent from ESD damage by static electricity.

Remove static electricity remained your body before you touch semiconductor or parts with

●

semiconductor. There are ways that you touch an earthed place or wear static electricity

prevention string on wrist.

Use earthed soldering steel when you connect or disconnect ESD.

●

Use soldering removing tool to break static electricity.,otherwise ESD will be damaged by

●

static electricity.

Don't unpack until you set up ESD on product. Because most of ESD are packed by box

●

and aluminum plate to have conductive power,they are prevented from static electricity.

You must maintain electric contact between ESD and place due to be set up until ESD is

●

connected completely to the proper place oracircuit board.

1-2

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Specification

2.

MASTER

-

GSM General Specification

2-1.

GSM850 EGSM900 DCS1800 PCS1900

Freq. Band[MHz]

Uplink/Downlink

ARFCN range 128-251

Tx/Rx spacing 45MHz 45MHz 95MHz 80 MHz

Mod. Bit rate

/BitPeriod

Time Slot Period

/ Frame Period

Modulation 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK

824-849
869-894

270.833kbps

3.692us

576.9us

4.615ms

880~915
925~960

0~124 &

975~1023

270.833kbps

3.692us

576.9us

4.615ms

1710~1785
1805~1880

512~885 512~810

270.833kbps

3.692us

576.9us

4.615ms

1850~1910
1930~1990

270.833kbps

3.692 us

576.9 us

4.615 ms

MS Power 33dBm~5dBm 33dBm~5dBm 30dBm~0dBm 30dBm~0dBm

Po w er C la s s 5~19(

Sensitivity -102dBm -102dBm -100dBm -100dBm

TDMAMux8888

Cell Radius 35Km 35Km 2Km 2 Km

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class

4) 5~19(

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2-1

class

4) 0~15(

class1)

0~15(

class1)

Specification

GSM TX power class

2-2.

TX Power

control level

533±2

631±2

729±2

827±2

925±2

10 23±2

11 21±2

GSM850 GSM900

dBm

dBm

dBm

dBm

dBm

dBm

dBm

33±2

31±2

29±2

27±2

25±2

23±2

21±2

dBm

dBm

dBm

dBm

dBm

dBm

dBm

TX Power

control level

030±3

128±3

226±3

324±3

422±3

520±3

618±3

DCS1800 PCS1900

dBm

dBm

dBm

dBm

dBm

dBm

dBm

30±3

28±3

26±3

24±3

22±3

20±3

18±3

dBm

dBm

dBm

dBm

dBm

dBm

dBm

12 19±2

13 17±2

14 15±2

15 13±2

16 11±3

17 9±3

18 7±3

19 5±3

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

19±2

17±2

15±2

13±2

11±3

9±3

7±3

5±3

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

716±3

814±3

912±4

10 10±4

11 8±4

12 6±4

13 4±4

14 2±5

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

16±3

14±3

12±4

10±4

8±4

6±4

4±4

2±5

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

15 0±5

2-2

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dBm

0±5

dBm

SLAVE

-

Specification

2-3.

GSM General Specification

Freq. Band[MHz]

Uplink/Downlink

ARFCN range 0~124 & 975~1023 512~885

Tx/Rx spacing 45MHz 95MHz

Mod. Bit rate/

Bit Period

Time Slot Period/Frame

Period

EGSM 900 DCS1800

880~915
925~960

270.833kbps

3.692us

576.9us

4.615ms

1710~1785
1805~1880

270.833kbps

3.692us

576.9us

4.615ms

Modulation 0.3GMSK 0.3GMSK

MS Power 33dBm~5dBm 30dBm~0dBm

Power Class

Sensitivity -102dBm -100dBm

TDMA Mux 8 8

Cell Radius 35Km 2Km

max

(

2-3

4

+33

dBm)

max

(

1

+30

dBm)

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Specification

2-4.

GSM TX power class

TX Power

control level

533±2

631±2

729±2

827±2

925±2

10 23±2

11 21±2

GSM900

dBm

dBm

dBm

dBm

dBm

dBm

dBm

TX Power

control level

0 30±3

1 28±3

2 26±3

3 24±3

4 22±3

5 20±3

6 18±3

DCS1800

dBm

dBm

dBm

dBm

dBm

dBm

dBm

12 19±2

13 17±2

14 15±2

15 13±2

16 11±3

17 9±3

18 7±3

19 5±3

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

7 16±3

8 14±3

9 12±4

10 10±4

11 8±4

12 6±4

13 4±4

14 2±5

15 0±5

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

2-4

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Operation Instruction and Installation

3.

Main Function

-

EDGE & GPRS Dual Standby

MASTER:Quad Band(GSM850+EGSM900+DCS1800+PCS1900)

-

SLAVE:Dual Band(GSM900+DCS1800)

-

Stereo FM Radio

-

Bluetooth v2.0

-

-2.8"

-3

QVGA

MP FF with Power LED

3-1

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Array course control

4.

Software Adjustments

4-1.

Test Jig(GH99

RF Test Cable(GH

-36900

39-00985

A)

A)

Test Cable(GH

Adapter(GH

39-01160

99-38251

A)

A)

4-1

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Array course control

Software Downloading

4-2.

4-2-1.

•

•

•

•

4-2-2.

■

■

1

Pre-requsite for Downloading

Downloader Program(

OneNAND Downloader Version

0.2

)

GT-B5722 Mobile Phone

Data Cable

K3 File(Master/Slave Binary, Master/Slave TFS), CSC File

S/W Downloader Program

To make USB connection between your PC and the Mobile phone.

Press and hold

Both of PC and Mobile phone must be in Power off state)

(

key then connect the Data cable to Mobile phone.

'*'

Load the binary download program by executing the

PNX6517-PNX4902 OneNAND Downloader v0.2 for GT-B5722(Rushmore).exe"

"

Select the

.

COM port

that the mobile phone is connected to

.

.

4-2

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Array course control

Check if both

.

2

Master

and

Slave

are selected.

3

Click

.

BIN..

and Select Master K3 binary file.

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Array course control

4

Click

.

BIN..

and Select Slave K3 binary file.

Check if

.

5

BIN+TFS

are selected

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Array course control

6

Click

.

TFS..

and Select Master/Slave K3 TFS file.

Check if

7.

With common CSC

are selected

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Array course control

8.

Click

CSC..

and Select CSC file.

9.

Click

START.

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Array course control

10

.

When the

message

below is displayed, turn on the

test jig

9.

Click

DOWNLOAD.

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Array course control

Wait until the message

.

7

Confirm the downloaded version name and etc.

.

8

'Download Complete'

*#1234#

Full Reset

:

*2767*3855#

displayed

:

4-8

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Exploded View and Parts List

5.

5-1.

Cellular phone Exploded View

QME03

QFR01

QLC01

QLB01

QAR01

QVK01

QSH01

QKP01

QVK03

QCR96

QVK02

QMP01

QMI01

QSP01

QCA01

QRE01

QVO01

QIF01

QCW01

QSH02

QCK02

QAN02

QCK01

QCR101

QBA01

QBC00

5-1

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Exploded View and Parts List

5-2.

Cellular phone Parts list

Design LOC Description SEC CODE

QAR01 AUDIO-RECEIVER

QCR101 SCREW-MACHINE

QCR96 SCREW-MACHINE

3009-001405

6001-002005

6001-002259

QMI01 MICROPHONE-ASSY-GT-B5722 GH30-00615A

QBA01 INNER BATTERY PACK-1200MAH,BLK,LTN,M GH43-03172A

QVK01 KEY FPCB-VOLUME KEY FPCB,GT-B5722 GH59-08223A

QVK02 KEY FPCB-CAM+HOLD KEY FPCB,GT-B5722 GH59-08227A

QME03 TOUCH/PANEL-GT_B5722,DUOS(BLK) GH59-08240B

QSP01 MODULE-SPK+MOT+INT MODULE ASSY(B5722) GH59-08320A

QVK03 KEY FPCB-SIM S/W(GT-B5722) GH59-08443A

QSH01 ICT SHIELD-CAN_TOP GH70-05740A

QMP01 A/S ASSY-PBA MAIN,SER,RUSS,GT-B5722(SVC GH82-04333A

QLC01 ELA MODULE-LCD MODULE ASSY(GT_B5722) GH96-04100A

QCA01 ASSY CAMERA-MODULE,GT_B5722(3M) GH96-04112A

QFR01 ASSY CASE-FRONT GH98-14706A

QKP01 ASSY KEYPAD-(EU/BLACK) GH98-14708A

QSH02 ASSY COVER-SHIELD CAN BOT GH98-14709A

QBC00 ASSY COVER-BATT GH98-15354A

QLB01 ASSY BRACKET-LCD GH98-15721A

QRE01 ASSY CASE-REAR GH98-14705A

QAN02 INTENNA-MAIN(GT-B5722) GH42-02200A

QIF01 PMO COVER-IF GH72-56304A

QCK02 PMO KEY-SIM GH72-56419A

QCW01 PCT DECO-CAMERA WINDOW GH72-56989A

QCK01 ASSY KEY-CAMERA HOLD GH98-14707A

QVO01 ASSY KEY-VOLUME GH98-15606A

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MAIN Electrical Parts List

6.

SEC CODE Design LOC Description

0403-001547

0406-001286

0406-001288

0406-001288

0406-001288

0406-001288

0406-001293

0505-001325

0505-002207

0801-003024

1001-001394

1001-001546

1001-001581

1003-002047

1003-002102

1108-000294

1201-002947

1203-005728

1203-006002

1203-006025

1204-003022

1205-003517

1205-003662

1205-003682

1205-003853

1404-001221

2007-000137

2007-000138

2007-000138

2007-000140

2007-000141

2007-000141

2007-000143

2007-000148

2007-000148

2007-000148

D300 DIODE-ZENER

ZD407,ZD502,ZD503 DIODE-TVS

D500,D501,ZD400 DIODE-TVS

ZD401,ZD403,ZD404 DIODE-TVS

ZD405,ZD406,ZD409 DIODE-TVS

ZD500,ZD501,ZD504 DIODE-TVS

D100 DIODE-TVS

Q600 FET-SILICON

U601 FET-SILICON

U101 IC

U602 IC

U401,U402,U500 IC

U100,U200,U201,U403 IC

U400 IC

U102,U600 IC

UME300 IC

PAM100,PAM600 IC

PMU300 IC

U502 IC

U404 IC

U105 IC

U104 IC

UCP600 IC

U103 IC

UCP200 IC

TH200 THERMISTOR

R407 R-CHIP

R100,R102,R200,R209 R-CHIP

R413,R414,R417,R505 R-CHIP

C635,R222 R-CHIP

R218,R219,R305,R401 R-CHIP

R402,R410,R411 R-CHIP

R425 R-CHIP

R203,R207,R208,R212 R-CHIP

R301,R308,R406,R428 R-CHIP

R601 R-CHIP

6-1

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Main Electrical Parts List

SEC CODE Design LOC Description

2007-000149

2007-000152

2007-000159

2007-000162

2007-000164

2007-000165

2007-000170

2007-000172

2007-000172

2007-000758

2007-000932

2007-001292

2007-001308

2007-001319

2007-001333

2007-001333

2007-002796

2007-003015

2007-007193

2007-007573

2007-007589

2007-007875

2007-007981

2007-008354

2203-000254

2203-000278

2203-000311

2203-000386

2203-000386

2203-000425

2203-000438

2203-000725

2203-000812

2203-000812

2203-000812

2203-000812

R220 R-CHIP

R309 R-CHIP

R423,R424,R426,R427 R-CHIP

R104,R105,R106 R-CHIP

R412 R-CHIP

R422 R-CHIP

R504,R514 R-CHIP

R101,R511,R512,R605 R-CHIP

R617 R-CHIP

R419 R-CHIP

R604,R606 R-CHIP

R303,R304,R612,R613 R-CHIP

R107 R-CHIP

R216,R217 R-CHIP

R108,R211,R213,R415 R-CHIP

R500,R501,R609,R610 R-CHIP

R433 R-CHIP

R103 R-CHIP

R603 R-CHIP

R300 R-CHIP

R221 R-CHIP

R307 R-CHIP

R306 R-CHIP

R223,R302 R-CHIP

C135,C212 C-CERAMIC,CHIP

C314,C607 C-CERAMIC,CHIP

C341 C-CERAMIC,CHIP

C118,C333,C336,C407 C-CERAMIC,CHIP

C409,C622 C-CERAMIC,CHIP

C500,C503 C-CERAMIC,CHIP

C132,C137,C203 C-CERAMIC,CHIP

C417 C-CERAMIC,CHIP

C113,C123,C143,C144 C-CERAMIC,CHIP

C214,C216,C432,C434 C-CERAMIC,CHIP

C435,C436,C504,C505 C-CERAMIC,CHIP

C623,C628,C639,C640 C-CERAMIC,CHIP

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Main Electrical Parts List

SEC CODE Design LOC Description

2203-000854

2203-000995

2203-001153

2203-001239

2203-003054

2203-005050

2203-005052

2203-005234

2203-005281

2203-005281

2203-005281

2203-005288

2203-005395

2203-005446

2203-005483

2203-005552

2203-006048

2203-006048

2203-006048

2203-006048

2203-006048

2203-006048

2203-006048

2203-006123

2203-006137

2203-006208

2203-006257

2203-006260

2203-006260

2203-006324

2203-006348

2203-006399

2203-006399

2203-006399

2203-006399

2203-006399

C211,C313 C-CERAMIC,CHIP

C105,C502,C608 C-CERAMIC,CHIP

C408,C410 C-CERAMIC,CHIP

C405,C406 C-CERAMIC,CHIP

C517,C518,C526 C-CERAMIC,CHIP

C111,C112 C-CERAMIC,CHIP

C626 C-CERAMIC,CHIP

C121,C124,C125,C127 C-CERAMIC,CHIP

C115,C116,C122,C145 C-CERAMIC,CHIP

C151,C152,C627,C629 C-CERAMIC,CHIP

C630,C631 C-CERAMIC,CHIP

C133 C-CERAMIC,CHIP

C129 C-CERAMIC,CHIP

C130,L102 C-CERAMIC,CHIP

C221 C-CERAMIC,CHIP

C114,C117 C-CERAMIC,CHIP

C200,C201,C204,C206 C-CERAMIC,CHIP

C208,C213,C312,C319 C-CERAMIC,CHIP

C328,C334,C345,C346 C-CERAMIC,CHIP

C403,C404,C411,C412 C-CERAMIC,CHIP

C418,C419,C501,C522 C-CERAMIC,CHIP

C606,C609,C610,C611 C-CERAMIC,CHIP

C612,C618 C-CERAMIC,CHIP

C205,C207 C-CERAMIC,CHIP

C119,C131 C-CERAMIC,CHIP

C600,C602 C-CERAMIC,CHIP

C146 C-CERAMIC,CHIP

C104,C138,C139,C323 C-CERAMIC,CHIP

C324,C325,C326,C332 C-CERAMIC,CHIP

C301 C-CERAMIC,CHIP

C342,C508 C-CERAMIC,CHIP

C134,C136,C140,C147 C-CERAMIC,CHIP

C148,C149,C150,C209 C-CERAMIC,CHIP

C210,C300,C302,C303 C-CERAMIC,CHIP

C305,C307,C308,C309 C-CERAMIC,CHIP

C318,C321,C330,C429 C-CERAMIC,CHIP

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Main Electrical Parts List

SEC CODE Design LOC Description

2203-006399

2203-006399

2203-006399

2203-006562

2203-006562

2203-006562

2203-006562

2203-006707

2203-006824

2203-006872

2203-006890

2203-007271

2203-007279

2203-007279

2203-007317

2404-001377

2409-001172

2703-001178

2703-001180

2703-001708

2703-001734

2703-001748

2703-001751

2703-001868

2703-002170

2703-002176

2703-002200

2703-002201

2703-002204

2703-002208

2703-002267

2703-002269

2703-002281

2703-002309

2703-002365

2703-002367

C510,C511,C512,C519 C-CERAMIC,CHIP

C520,C521,C523,C524 C-CERAMIC,CHIP

C601,C603,C604,C605 C-CERAMIC,CHIP

C202,C215,C219,C304 C-CERAMIC,CHIP

C317,C320,C327,C329 C-CERAMIC,CHIP

C335,C416,C433,C513 C-CERAMIC,CHIP

C514,C516,C525 C-CERAMIC,CHIP

C142 C-CERAMIC,CHIP

C339,C340,C615,C616 C-CERAMIC,CHIP

C120,C126 C-CERAMIC,CHIP

C331,C343 C-CERAMIC,CHIP

C515 C-CERAMIC,CHIP

C101,C337,C338,C344 C-CERAMIC,CHIP

C420,C421,C617,C636 C-CERAMIC,CHIP

C315,C316,C322,C632 C-CERAMIC,CHIP

TA400,TA401 C-TA,CHIP

BAT300 BATTERY

C613 INDUCTOR-SMD

L106 INDUCTOR-SMD

L108 INDUCTOR-SMD

L107 INDUCTOR-SMD

L112 INDUCTOR-SMD

L110 INDUCTOR-SMD

L409,L411 INDUCTOR-SMD

L604,L605 INDUCTOR-SMD

L105 INDUCTOR-SMD

L103 INDUCTOR-SMD

L410,L412 INDUCTOR-SMD

L606 INDUCTOR-SMD

C102 INDUCTOR-SMD

C128,L104 INDUCTOR-SMD

L100,L421,L422,L600 INDUCTOR-SMD

L111 INDUCTOR-SMD

L406,L407 INDUCTOR-SMD

L117 INDUCTOR-SMD

C108,C619,L116,L415 INDUCTOR-SMD

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Main Electrical Parts List

SEC CODE Design LOC Description

2703-002367

2703-002367

2703-002543

2703-003121

2703-003258

2703-003260

2703-003412

2801-004339

2801-004805

2801-004893

2901-001540

2901-001540

2904-001879

2904-001889

2904-001910

2904-001914

2909-001320

2911-000132

2911-000144

3301-001158

3301-001885

3301-001885

3301-001885

3301-001885

3705-001503

3708-002015

3709-001456

3709-001465

3710-002683

3711-005966

3711-006084

3711-006865

4202-001463

L416,L417,L418,L419 INDUCTOR-SMD

L420 INDUCTOR-SMD

L109 INDUCTOR-SMD

C141 INDUCTOR-SMD

L607 INDUCTOR-SMD

L300 INDUCTOR-SMD

L408 INDUCTOR-SMD

OSC300 CRYSTAL-UNIT

OSC600 CRYSTAL-UNIT

OSC100 CRYSTAL-UNIT

F500,F501,F502,F503 FILTER-EMI

F504 FILTER-EMI

F602 FILTER-SAW

F101 FILTER-SAW

F601 FILTER-SAW

F102 FILTER-SAW

F103 FILTER-LC

F600 ASM

F100 DUPLEXER-FEM

L601,L603 CORE-FERRITE BEAD

L119,L120,L400,L401 CORE-FERRITE BEAD

L402,L403,L505,L506 CORE-FERRITE BEAD

L507,L508,L509,L510 CORE-FERRITE BEAD

L602,R431,R432 CORE-FERRITE BEAD

RFC600,RFS100 CONNECTOR-COAXIAL

HDC400 CONNECTOR-FPC

SIM200 CONNECTOR-CARD EDGE

CD400 CONNECTOR-CARD EDGE

IFC500 JACK-PHONE

HEA502 CONNECTOR-HEADER

BTC300 CONNECTOR-HEADER

HEA500 CONNECTOR-HEADER

ANT102 ANTENNA-CHIP

GH70-03349A SC500,SC501,SC502 ON-BOARD-CLIP

GH70-03349A SC503,SC504,SC505 ON-BOARD-CLIP

GH80-03320A R616 PB-SHORT

Please consult the GSPN website(Samsung Portal) for the most recent version of the product's
part list.

6-5

SAMSUNG Proprietary-Contents may change without notice

This Document can not be used without Samsung's authorization

Block Diagrams

TSQ

(26

MHz)

7.

7-1

SAMSUNG Proprietary-Contents may change without notice

This Document can not be used without Samsung's authorization