BT@ SKU W/Bluetooth module 要打
MLED@ SKU Media LED supper 要打
SUB@ SKU W/SUBWOOFER要打
A
Brookdale chipset(845MP/MZ+ICH3-M)
PCB Layer
Structure:
TOP
GND1
IN1
IN2
VCC
IN3
GND2
BOT
B
C
D
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF
R&D DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
E
F
G
H
Compal Electronics, Inc.
Title
SCHEMATIC, M/B LA-1381
SizeDocu ment NumberRe v
401212
Custom
星期一 十二
Date:Sheet
?30, 2002
I
of
146,
J
2B
A
B
C
D
E
F
G
H
I
J
Compal confidential
Model Name :APL11
File Name : LA-1381
11
Mobil e Nort hwood
uFCBGA/ uFC PGA CPU
22
33
Fan Cont rol
CRT Connector
page 6
page 15
VGA
Board
& CPUVID
LM75 thermal
sensor
AGP Conn
page 15
page 6
AGP4X(1.5V)
System Bus
400MHz
Brookdale-M
MCH-M
625 BGA
USB2.0 conn X 2
page 32
HUB Link
CPU B ypass
44
Mini PCI
Conn.
page 36
VIA_ VT 6202
USB2.0
page 26
PCI BUS
IDSEL:AD20
(PIRQA/B#,GNT#2,REQ#2)
55
TI TSB43AB22
1394
page 25
DC/DC Interface
Suspend
66
page 37
CardBus Controller
PCI 1410
Slot 0
page 24
14M_5V
Power Circuit
DC/DC
page
38,39,40,41,42,43,44,45
77
Touch Pad
EC Ext. I/O
3.3V 33MHz
page 23
EC 87591
page 30
page 29
page 31
1.8V 266MHz
LPC BUS
3.3V 33MHz
Int.KBD
ICH3-M
421 BGA
SD/MS CARD
page 27
page 33
page 4,5
HD#(0..63)HA#( 3..31)
page 8,9
page 16,17
LPT
Port.
page 29
Memory
BUS(DDR)
2.5V 200MHz
LAN interface
USB interface
3.3V 48MHz
3.3V 24.57 6MHz
3.3V ATA100
SMsC
LPC47N227
page 28
Therm al Sensor
MAX6654W320-04
page 5
SO-DIMM X2
BANK 0, 1, 2, 3
LAN
Kinnereth
Blu etooth
USB conn X1
IDE Connector
(HDD/CR-ROM)
page 19
Clock Generator
page 11,12
page 20
page 32
page 32
page 14
RJ45
page 20
AC-LINK
AC97
Codec
ALC202
page 21
AMP& Phone
Jack
page 22
SUB WOOFER
page 37
MDC
page 32
BIOS
page 31page 29
88
A
B
C
D
PS/2 conn
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF
R&D DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
E
FIR
page 29
F
FDD
page 19
G
Compal Electronics, Inc.
Title
SCHEM AT IC , M/ B LA- 1381
SizeDocu ment NumberRe v
401212
Custom
星期一 十二
H
Date:Sheet
?30, 2002
I
246,
2B
of
J
10
9
8
7
6
5
4
3
2
1
Power Managment table
HH
State
Signal
+3VALW
+5VALW
+1.8VALW
+3V
+5V
+2.5V
+12VALW
GG
S0
S1
ON
ONONON
ONON
+3VS
+5VS
+1.8VS
+1.5VS
+1.2VP
+CPU_CORE
+1.25V
NB Chip RevSB Chip Rev
S3
S5 S4/AC
FF
EE
DD
CC
S5 S4/AC don't exist
ONON
ONOFF
OFFOFFOFF
OFF
OFF
BB
AA
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF
R&D DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF
R&D DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
2. Place decoupling cap 220PF near CPU.(Within
500mils )
R57
49.9_1%
Trace width>=7mila
R58
100_1%
M22
M25
C443
1UF
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF
R&D DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
Place close to CPU, Use 2~3 vias per PAD.
Place .22uF caps underneath balls on solder side.
Place 10uF caps on the peripheral near balls.
11
Use 2~3 vias per PAD.
B
C
D
E
Layout note :
Place close to CPU power and
ground pin as possible
(<1inch)
F
+CPU_CORE
G
12
C462
+
DT@470UF_D4_2.5V_10m
12
C449
+
DT@470UF_D4_2.5V_10m
H
12
C441
+
DT@470UF_D4_2.5V_10m
I
12
C492
+
DT@470UF_D4_2.5V_10m
12
C419
+
DT@470UF_D4_2.5V_10m
J
Please place these cap in the socket cavity area
+CPU_CORE
12
22
33
44
55
C95
10UF_6.3V_1206_X5R
+CPU_CORE
12
C107
10UF_6.3V_1206_X5R
Please place these cap on the socket north side
+CPU_CORE
12
C80
10UF_6.3V_1206_X5R
+CPU_CORE
12
C128
10UF_6.3V_1206_X5R
+CPU_CORE
12
C429
10UF_6.3V_1206_X5R
12
C122
10UF_6.3V_1206_X5R
12
C106
10UF_6.3V_1206_X5R
12
C92
10UF_6.3V_1206_X5R
12
C61
10UF_6.3V_1206_X5R
12
C430
10UF_6.3V_1206_X5R
12
C89
10UF_6.3V_1206_X5R
12
C465
10UF_6.3V_1206_X5R
12
C104
10UF_6.3V_1206_X5R
12
C59
10UF_6.3V_1206_X5R
12
C423
10UF_6.3V_1206_X5R
12
C113
10UF_6.3V_1206_X5R
12
C461
10UF_6.3V_1206_X5R
12
C428
10UF_6.3V_1206_X5R
12
C57
10UF_6.3V_1206_X5R
12
C53
10UF_6.3V_1206_X5R
12
C98
10UF_6.3V_1206_X5R
12
C445
10UF_6.3V_1206_X5R
12
C118
10UF_6.3V_1206_X5R
12
C56
10UF_6.3V_1206_X5R
Please place these cap on the socket south side
+CPU_CORE
12
C123
10UF_6.3V_1206_X5R
66
77
+CPU_CORE
12
C447
10UF_6.3V_1206_X5R
+CPU_CORE
12
C176
10UF_6.3V_1206_X5R
12
C115
10UF_6.3V_1206_X5R
12
C83
10UF_6.3V_1206_X5R
12
C426
10UF_6.3V_1206_X5R
12
C159
10UF_6.3V_1206_X5R
12
C495
10UF_6.3V_1206_X5R
12
C427
10UF_6.3V_1206_X5R
12
C116
10UF_6.3V_1206_X5R
12
C174
10UF_6.3V_1206_X5R
12
C55
10UF_6.3V_1206_X5R
12
C448
10UF_6.3V_1206_X5R
12
C175
10UF_6.3V_1206_X5R
EN_FAN2<30>
EMI Clip PAD for CPU
PAD1
PAD-2.5X3
1
A
B
C
D
88
For Desktop's CPU:
ESR total=0.75m ohm
C total=6350uF
For Mo b i l e 's CPU:
ESR total=1.875m ohm
C total=2590uF
.1UF_0402
12
R295
13K_1%
+12VS
84
U27A
+
-
R293
7.32K_1%
+12VS
5
6
1
LM358
12
F
C190
EN_FAN1<30>
3
2
12
R296
13K_1%
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF
R&D DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF
R&D DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
AGP_ST0
0=System memory is DDR
1=System memory is SDR
D
HD#[0..63] <4>
AGP_AD[0..31]<15>
AGP_C/BE#[0..3]<15>
AGP_ST[0..2]<15>
+CPU_CORE
12
R66
R_E
49.9_1%
12
R65
R_F
100_1%
GTL Reference Vol tage
Layout note :
1. Place R_E and R_F near MCH
2. Place decoupling cap 220PF near MCH pin.(Within
500mils )
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF
R&D DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
Layout note
Place R_J closely Ball
H3<40mil,Ball H3 to G3
trace must
routing 1"
DDR_SMA[0..12] <11>
12
C142.1UF_0402_X5R
C143@47PF_0402
+1.25VS
Layout note
Place R113
closely ball
J28
88
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF
R&D DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
A
B
C
D
E
F
G
H
Compal Electronics, Inc.
Title
SCHEM AT IC , M/ B LA- 1381
SizeDocu ment NumberRe v
401212
Custom
星期一 十二
Date:Sheet
?30, 2002
I
of
946,
J
2B
10
9
8
7
6
5
4
3
2
1
Layout note :
Distribute as close as possible
HH
GG
FF
to MCH Processor Quadrant.(between VTTFSB and VSS pin)
+CPU_CORE
12
C63
.1UF_0402_X5R
+CPU_CORE
12
C109
.1UF_0402_X5R
+CPU_CORE
12
C52
10UF_6.3V_1206_X5R
Layout note :
EE
Distribute as close as possible
to MCH Processor Quadrant.(between VCCAGP/VCCCORE
and VSS pin)
+1.5VS
12
C114
.1UF_0402_X5R
Processor system bus
12
C62
.1UF_0402_X5R
12
C82
.1UF_0402_X5R
12
10UF_6.3V_1206_X5R
12
C66
.1UF_0402_X5R
12
C70
.1UF_0402_X5R
C54
AGP/CORE
12
C96
.1UF_0402_X5R
12
C105
.1UF_0402_X5R
12
C78
.1UF_0402_X5R
12
C69
.1UF_0402_X5R
12
C425
10UF_6.3V_1206_X5R
12
C85
.1UF_0402_X5R
12
C125
.1UF_0402_X5R
12
C81
.1UF_0402_X5R
12
C97
.1UF_0402_X5R
12
C119
.1UF_0402_X5R
Layout note :
Distribute as close as possible
to MCH P rocessor Quadrant.(bet ween VCCSM and VSS pin)
+2.5V
12
C136
.1UF_0402_X5R
+2.5V
12
C146
.1UF_0402_X5R
+2.5V
12
C163
.1UF_0402_X5R
+2.5V
12
C167
+
220UF_D2_4V
DDR Memory interface
12
C137
.1UF_0402_X5R
12
C160
.1UF_0402_X5R
12
C157
.1UF_0402_X5R
12
C139
.1UF_0402_X5R
12
C164
.1UF_0402_X5R
12
C158
.1UF_0402_X5R
12
C140
.1UF_0402_X5R
12
C165
.1UF_0402_X5R
12
C152
.1UF_0402_X5R
12
C135
.1UF_0402_X5R
12
C162
.1UF_0402_X5R
12
C144
.1UF_0402_X5R
12
C150
22UF_10V_1206
12
C166
22UF_10V_1206
DD
+1.5VS
12
C126
10UF_6.3V_1206_X5R
12
C86
10UF_6.3V_1206_X5R
12
C75
+
100UF_D_16V
CC
Layout note :
Distribute as close as possible
to MCH Processor Quadr ant.(between VCCHL and VSS pin)
+1.8VS
12
BB
C130
10UF_6.3V_1206_X5R
AA
Hub-Link
12
C127
.1UF_0402_X5R
10
12
C132
.1UF_0402_X5R
9
12
C133
.1UF_0402_X5R
Compal Electronics, Inc.
Title
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF
R&D DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
8
7
6
5
4
3
SCHEMATIC, M/B LA-1381
SizeDocu ment NumberRe v
401212
Custom
星期一 十二
Date:Sheet
?30, 2002
2
of
1046,
1
2B
A
Layout note
Place these resistor
closely DIMM0,
all trace length<750mil
11
22
33
44
55
DDR_SDQ[0..63]<9>
66
DDR_CB[0..7]<9>
DDR_SD QS [0 ..8 ]<9>
77
88
A
B
DDR_SDQ0
DDR_SDQ4
DDR_SDQ1
DDR_SDQ5
DDR_SDQ6
DDR_SDQS0
DDR_SDQ2
DDR_SDQ3
DDR_SDQ8
DDR_SDQ7
DDR_SDQ9
DDR_SDQ12
DDR_SDQS1
DDR_SDQ13
DDR_SDQ10
DDR_SDQ14
DDR_SDQ15
DDR_SDQ11
DDR_SDQ16
DDR_SDQ20
DDR_SDQ21
DDR_SDQ17
DDR_SDQ18
DDR_SDQS2
DDR_SDQ19
DDR_SDQ22
DDR_SDQ24
DDR_SDQ23
DDR_SDQ25
DDR_SDQ28
DDR_SDQS3
DDR_SDQ29
DDR_SDQ56
DDR_SDQ51
DDR_SDQ60
DDR_SDQ57
DDR_SDQS7
DDR_SDQ61
DDR_SDQ62
DDR_SDQ58
DDR_SDQ63DDR_DQ63
DDR_SDQ59DDR_DQ59
RP109 4P2R_22
14
23
RP130 4P2R_22
14
23
RP131 4P2R_22
14
23
RP110 4P2R_22
14
23
RP132 4P2R_22
14
23
RP92 4P2R_22
14
23
RP111 4P2R_22
14
23
RP93 4P2R_22
14
23
RP112 4P2R_22
14
23
RP94 4P2R_22
14
23
RP113 4P2R_22
14
23
RP95 4P2R_22
14
23
RP120 4P2R_22
14
23
RP96 4P2R_22
14
23
RP114 4P2R_22
14
23
RP97 4P2R_22
14
23
DDR_SDQ[0..63]
DDR_CB[0..7]
DDR _ S DQS[0..8]
RP127 4P2R_22
14
23
RP106 4P2R_22
14
23
RP128 4P2R_22
14
23
RP108 4P2R_22
14
23
RP129 4P2R_22
14
23
DDR_DQ0
DDR_DQ4
DDR_DQ1
DDR_DQ5
DDR_DQ6
DDR_DQS0
DDR_DQ2
DDR_DQ3
DDR_DQ8
DDR_DQ7
DDR_DQ9
DDR_DQ12
DDR_DQS1
DDR_DQ13
DDR_DQ10
DDR_DQ14
DDR_DQ15
DDR_DQ11
DDR_DQ16
DDR_DQ20
DDR_DQ21
DDR_DQ17
DDR_DQ18
DDR_DQS2
DDR_DQ19
DDR_DQ22
DDR_DQ24
DDR_DQ23
DDR_DQ25
DDR_DQ28
DDR_DQS3
DDR_DQ29
DDR_DQ56
DDR_DQ51
DDR_DQ60
DDR_DQ57
DDR_DQS7
DDR_DQ61
DDR_DQ62
DDR_DQ58
B
C
DDR_SDQ30
DDR_SDQ26
DDR_SDQ31
DDR_SDQ27
DDR_CB5
DDR_CB4
DDR_CB1
DDR_CB0
DDR_CB2
DDR_SDQS8
DDR_CB3
DDR_CB6
DDR_CB7
DDR_SDQ36
DDR_SDQ32
DDR_SDQ33
DDR_SDQ37
DDR_SDQ38
DDR_SDQS4
DDR_SDQ39
DDR_SDQ34
DDR_SDQ44
DDR_SDQ35
DDR_SDQ45
DDR_SDQ40
DDR_SDQS5
DDR_SDQ41
DDR_SDQ43
DDR_SDQ42
DDR_SDQ47
DDR_SDQ46
DDR_SDQ49
DDR_SDQ48
DDR_SDQ53
DDR_SDQ52
DDR_SDQ54
DDR_SDQS6
DDR_SDQ55
DDR_SDQ50
C
D
RP115 4P2R_22
14
23
RP98 4P2R_22
14
23
RP116 4P2R_22
14
23
RP99 4P2R_22
14
23
RP121 4P2R_22
14
23
RP100 4P2R_22
14
23
RP117 4P2R_22
14
23
RP122 4P2R_22
14
23
RP102 4P2R_22
14
23
RP123 4P2R_22
14
23
RP103 4P2R_22
14
23
RP118 4P2R_22
14
23
RP119 4P2R_22
14
23
RP101 4P2R_22
14
23
RP104 4P2R_22
14
23
RP124 4P2R_22
14
23
RP125 4P2R_22
14
23
RP105 4P2R_22
14
23
RP126 4P2R_22
14
23
RP107 4P2R_22
14
23
D
DDR_DQ30
DDR_DQ26
DDR_DQ31
DDR_DQ27
DDR_F_CB5
DDR_F_CB4
DDR_F_CB1
DDR_F_CB0
DDR_F_CB2
DDR_DQS8
DDR_F_CB3
DDR_F_CB6
DDR_F_CB7
DDR_DQ36
DDR_DQ32
DDR_DQ33
DDR_DQ37
DDR_DQ38
DDR_DQS4
DDR_DQ39
DDR_DQ34
DDR_DQ44
DDR_DQ35
DDR_DQ45
DDR_DQ40
DDR_DQS5
DDR_DQ41
DDR_DQ43
DDR_DQ42
DDR_DQ47
DDR_DQ46
DDR_DQ49
DDR_DQ48
DDR_DQ53
DDR_DQ52
DDR_DQ54
DDR_DQS6
DDR_DQ55
DDR_DQ50
E
DDR_DQ4
DDR_DQ5
DDR_DQS0
DDR_DQ3
DDR_DQ7
DDR_DQ12
DDR_DQ13
DDR_DQS1
DDR_DQ14
DDR_DQ11
DDR_CLK1<9>
DDR_CLK1#<9>
DDR_DQ20
DDR_DQ17
DDR_DQS2
DDR_DQ22
DDR_DQ23
DDR_DQ28
DDR_DQ29
DDR_DQS3
DDR_DQ26
DDR_DQ27
DDR_F_CB4
DDR_F_CB0DDR_F_CB1
DDR_DQS8
DDR_F_CB6
DDR_F_CB7
DDR_CLK0<9>
DDR_CLK0#<9>
DDR_CKE1<9>
DDR_SCS#0<9>
DIMM_SMDATA<12,14>
DIMM_SMCLK<12,14>
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF
R&D DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF
R&D DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
E
F
G
H
Compal Electronics, Inc.
Title
SCHEM AT IC , M/ B LA- 1381
SizeDocu ment NumberRe v
401212
Custom
星期一 十二
Date:Sheet
?30, 2002
I
of
1246,
J
2B
A
B
C
D
E
F
G
H
I
J
Layout note :
Distribute as close as possible
to DDR-SODIMM.
11
+2.5V
12
C559
.1UF_0402_X5R
12
C577
.1UF_0402_X5R
12
C560
.1UF_0402_X5R
12
C562
.1UF_0402_X5R
12
C571
.1UF_0402_X5R
12
C558
.1UF_0402_X5R
12
C576
.1UF_0402_X5R
12
C555
.1UF_0402_X5R
12
C575
.1UF_0402_X5R
12
C557
.1UF_0402_X5R
22
33
44
55
66
+2.5V+2.5V
12
C574
.1UF_0402_X5R
12
C556
.1UF_0402_X5R
12
C570
.1UF_0402_X5R
12
C561
.1UF_0402_X5R
12
C573
.1UF_0402_X5R
12
C572
.1UF_0402_X5R
+
Layout note :
Place one cap close to every 2 pull up resistors termination to
+1.25V
+1.25VS
12
C259
.1UF_0402_X5R
+1.25VS
12
C323
.1UF_0402_X5R
+1.25VS
12
C336
.1UF_0402_X5R
+1.25VS
12
C344
.1UF_0402_X5R
12
C324
.1UF_0402_X5R
12
C325
.1UF_0402_X5R
12
C316
.1UF_0402_X5R
12
C328
.1UF_0402_X5R
12
C271
.1UF_0402_X5R
12
C319
.1UF_0402_X5R
12
C317
.1UF_0402_X5R
12
C330
.1UF_0402_X5R
12
C260
.1UF_0402_X5R
12
C309
.1UF_0402_X5R
12
C305
.1UF_0402_X5R
12
C318
.1UF_0402_X5R
12
C347
.1UF_0402_X5R
12
C312
.1UF_0402_X5R
12
C306
.1UF_0402_X5R
12
C331
.1UF_0402_X5R
12
C326
.1UF_0402_X5R
12
C313
.1UF_0402_X5R
12
C346
.1UF_0402_X5R
12
C322
.1UF_0402_X5R
12
C310
.1UF_0402_X5R
12
C314
.1UF_0402_X5R
12
C333
.1UF_0402_X5R
12
C270
.1UF_0402_X5R
12
C255
220UF_D2_6.3V
12
+
12
C311
.1UF_0402_X5R
12
C332
.1UF_0402_X5R
12
C334
.1UF_0402_X5R
12
C329
.1UF_0402_X5R
C273
220UF_D2_6.3V
12
12
12
12
C307
.1UF_0402_X5R
C315
.1UF_0402_X5R
C320
.1UF_0402_X5R
C345
.1UF_0402_X5R
12
C308
.1UF_0402_X5R
12
C335
.1UF_0402_X5R
12
C327
.1UF_0402_X5R
12
C343
.1UF_0402_X5R
+1.25VS
12
C268
77
.1UF_0402_X5R
+1.25VS
12
C258
.1UF_0402_X5R
12
C269
.1UF_0402_X5R
12
C257
.1UF_0402_X5R
12
C266
.1UF_0402_X5R
12
C337
.1UF_0402_X5R
12
C267
.1UF_0402_X5R
12
C321
.1UF_0402_X5R
12
C272
.1UF_0402_X5R
12
C342
.1UF_0402_X5R
88
A
B
C
12
C338
.1UF_0402_X5R
D
12
C339
.1UF_0402_X5R
12
C340
.1UF_0402_X5R
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF
R&D DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF
R&D DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERRED FROM THE CUSTODY OF THE COMPETENT DIVISION OF
R&D DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.