ROHS EmETXe-i9652 User Manual

EmETXe-i9652
COM Express CPU Module
User’s Manual
Version 1.2
2011.06
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Table of Contents
Chapter 1 - Introduction ............................................ 1
1.1 Copyright Notice .......................................................2
1.2 Declaration of Conformity ........................................2
1.3 About This User’s Manual ........................................3
1.4 Warning ......................................................................3
1.5 Replacing the Lithium Battery .................................3
1.6 Technical Support .....................................................4
1.7 Warranty .....................................................................4
1.8 Packing List ...............................................................5
1.9 Ordering Information ................................................5
1.10 Specifications ..........................................................6
1.11 Board Dimensions...................................................7
Chapter 2 - Installation ..............................................9
2.1 What is “ COM Express ”? .....................................10
2.2 Block Diagram ........................................................11
2.3 Jumpers and Connectors .......................................12
2.4 COM Express AB Connector ..................................13
2.5 COM Express CD Connector..................................15
2.6 The Installation Paths of CD Driver .......................17
Chapter 3 - BIOS ......................................................19
3.1 BIOS Main Setup .....................................................20
3.2 Advanced Settings ..................................................21
3.2.1 CPU Configuration ............................................22
3.2.2 IDE Configuration .............................................24
3.2.3 Floppy Configuration ........................................25
3.2.4 Super IO Configuration ....................................26
3.2.5 Hardware Health Configuration .......................28
3.2.6 ACPI Configuration ...........................................29
3.2.7 AHCI Configuration ...........................................30
3.2.8 APM Configuration ............................................31
3.2.9 MPS Configuration ............................................33
3.2.10 USB Configuration ..........................................34
3.2.11 Remote Access Configuration .......................36
3.3 Advanced PCI/PnP Settings ..................................37
3.4 Boot Settings ...........................................................39
3.4.1 Boot Settings Configuration ............................40
3.5 Security ....................................................................41
3.6 Advanced Chipset Settings ....................................43
3.6.1 North Bridge Chipset Configuration ...............43
3.6.2 South Bridge Chipset Configuration ...............46
3.7 Exit Options .............................................................48
3.8 Beep Sound codes list............................................53
3.8.1 Boot Block Beep Codes ...................................53
3.8.2 POST BIOS Beep Codes ...................................53
3.8.3 Troubleshooting POST BIOS Beep Codes .....54
Appendix .................................................................. 67
Appendix A: I/O Port Address Map ..............................68
Appendix B: BIOS Memory Map ..................................69
Appendix C: Interrupt Request Lines (IRQ) ................70
Appendix D: Digital I/O Setting ....................................71
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Introduction
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1Chapter 1
Introduction
Chapter 1 - Introduction
Introduction
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1.1 Copyright Notice
All Rights Reserved.
The information in this document is subject to change without prior notice in order to improve the reliability, design and function. It does not represent a commitment on the part of the manufacturer.
Under no circumstances will the manufacturer be liable for any direct, indirect, special, incidental, or consequential damages arising from the use or inability to use the product or documentation, even if advised of the possibility of such damages.
This document contains proprietary information protected by copyright. All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or other means in any form without prior written permission of the manufacturer.
1.2 Declaration of Conformity
CE
This product has passed the CE test for environmental specications when
shielded cables are used for external wiring. This kind of cable is available from ARBOR. Please contact your local supplier for ordering information. Test conditions for passing included the equipment being operated within an industrial enclosure. In order to protect the product from being damaged by ESD (Electrostatic Discharge) and EMI leakage, we strongly recommend the use of CE-compliant industrial enclosure products.
FCC Class A
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions : (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
RoHS
ARBOR Technology Corp. certies that all components in its products are in
compliance and conform to the European Union’s Restriction of Use of Haz­ardous Substances in Electrical and Electronic Equipment (RoHS) Directive 2002/95/EC.
The above mentioned directive was published on 2/13/2003. The main pur­pose of the directive is to prohibit the use of lead, mercury, cadmium, hexava­lent chromium, polybrominated biphenyls (PBB), and polybrominated diphenyl ethers (PBDE) in electrical and electronic products. Member states of the EU
Introduction
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are to enforce by 7/1/2006.
ARBOR Technology Corp. hereby states that the listed products do not con­tain unintentional additions of lead, mercury, hex chrome, PBB or PBDB that exceed a maximum concentration value of 0.1% by weight or for cadmium exceed 0.01% by weight, per homogenous material. Homogenous material
is dened as a substance or mixture of substances with uniform composition
(such as solders, resins, plating, etc.). Lead-free solder is used for all termina­tions (Sn(96-96.5%), Ag(3.0-3.5%) and Cu(0.5%)).
1.3 About This User’s Manual
This user’s manual provides general information and installation instructions about the product. This User’s Manual is intended for experienced users and integrators with hardware knowledge of personal computers. If you are not sure about any description in this booklet. please consult your vendor before further handling.
1.4 Warning
Single Board Computers and their components contain very delicate Integrated Circuits (IC). To protect the Single Board Computer and its components against damage from static electricity, you should always follow the following precautions when handling it :
1. Disconnect your Single Board Computer from the power source when you want to work on the inside.
2. Hold the board by the edges and try not to touch the IC chips, leads or cir­cuitry.
3. Use a grounded wrist strap when handling computer components.
4. Place components on a grounded antistatic pad or on the bag that comes with the Single Board Computer, whenever components are separated from the system.
1.5 Replacing the Lithium Battery
Incorrect replacement of the lithium battery may lead to a risk of explosion.
The lithium battery must be replaced with an identical battery or a battery type recommended by the manufacturer.
Do not throw lithium batteries into the trash-can. It must be disposed of in accordance with local regulations concerning special waste.
Introduction
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1.6 Technical Support
If you have any technical difculties, please do not hesitate to call or e-mail our
customer service.
http://www.arbor.com.tw
E-mail:info@arbor.com.tw
1.7 Warranty
This product is warranted to be in good working order for a period of two years from the date of purchase. Should this product fail to be in good working order at any time during this period, we will, at our option, replace or repair it at no additional charge except as set forth in the following terms. This warranty does
not apply to products damaged by misuse, modications, accident or disaster.
Vendor assumes no liability for any damages, lost prots, lost savings or any
other incidental or consequential damage resulting from the use, misuse of, or inability to use this product. Vendor will not be liable for any claim made by any other related party.
Vendors disclaim all other warranties, either expressed or implied, including
but not limited to implied warranties of merchantability and tness for a
particular purpose, with respect to the hardware, the accompanying product’s manual(s) and
written materials, and any accompanying hardware. This limited
warranty gives you specic legal rights.
Return authorization must be obtained from the vendor before returned merchandise will be accepted.
Authorization can be obtained by calling or
faxing
the vendor and
requesting a Return Merchandise Authorization (RMA)
number.
Returned
goods should always be accompanied by a clear problem
description.
Introduction
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1.8 Packing List
1 x EmETXe-i9652 COM Express CPU Module
1 x Driver CD
1 x Quick Installation Guide
1.9 Ordering Information
EmETXe-i9652
Socket P Intel® Core™ 2 Duo/Celeron® M COM Express CPU Module
HS-9455-C3
Heatsink w/ fan for socket type CPU module (125 x 96 x 39 mm)
PBE-1700 COM Express evaluation board in ATX form factor
CBK-04-1700-00
Cable kit
1 x SATA cable 1 x COM cable 1 x FDD cable 1 x IDE cable
If any of the above items is damaged or missing, contact your vendor immediately.
Introduction
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1.10 Specifications
Form Factor COM Express Type 2 CPU Module
CPU
Intel® Core™ 2 Duo processor, up to 800MHz FSB Intel® Celeron® M processor with 533/667MHz FSB
Chipset Intel® GME965 + Intel® ICH8M
System Memory
2 x 200-pin DDR2 SO-DIMM sockets supporting 533/667MHz SDRAM up to 4GB
VGA/LCD Controller
Integrated Intel® Graphics Media Accelerator X3100
Ethernet 1 x RTL8111 PCIe Gigabit Ethernet Controller
BIOS AMI PnP Flash BIOS
Serial ATA 3 x Serial ATA with 300MB/s HDD transfer rate
IDE Interface 1 x Ultra ATA, supports 2 IDE devices
Universal Serial Bus 8 x USB 2.0
Digital Input/Output 8-bit programmable Digital Input/Output
Expansion Interface
1 x PCI Express x16 5 x PCI Express x1 4 x PCI
Operation Temp. -20ºC ~ 70ºC (-4ºF ~ 158ºF)
Watchdog Timer 1 ~ 255 levels Reset
Dimension (L x W) 125 x 95 mm (4.9” x 3.7”)
Introduction
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1.11 Board Dimensions
43.28
DIMM2
DIMM1
CPU Socket
87.00
4.00
95.00
Ø2.70
4.00
Unit: mm
76.00
125.00
41.00
45.35
18.00
6.00
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Installation
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2Chapter 2
Installation
Chapter 2 - Installation
Installation
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2.1 What is “ COM Express ”?
With more and more demands on small and embedded industrial boards, a multi-functioned COM (Computer-on-Module) is the great one of the solutions. COM Express, board-to-board connectors consist of two rows of 220 pins each. Row AB, which is required, provides pins for PCI Express, SATA, LVDS, LCD channel, LPC bus, system and power management, VGA, LAN, and power and ground interfaces. Row CD, which is optional, provides SDVO and legacy PCI and IDE signals next to additional PCI Express, LAN and power and ground signals.
By the way, the target markets of COM will be focused on:
Retail & Advertising
Medical
Test & Measurement
Gaming & Entertainment
Industrial & Automation
Military & Government
Security
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2.2 Block Diagram
PCI Bus
Connector CD
Mobile Intel®
GME965
Socket P Intel®
Celeron® M/Core™
2 Duo CPU
FSB 533/667/800MHz
2 x 200 pins DDRII
SO-DIMM socket
Intel®
ICH8-M
AC’97 Link
Dual Channel DDRII
Analog
R.G.B.
18-24-bit LVDS
TV-Out
LPC I/F
PCIe LAN
controller
Serial ATA I/F
IDE ATA I/F
USB I/F
DMI I/F
Connector AB
PCIe*16
PCIe*1
Fintek F75111R
DIO
Installation
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2.3 Jumpers and Connectors
DIMM2
DIMM1
CPU Socket
D1
C1
B1
A1
D110
C110
B110
A110
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2.4 COM Express AB Connector
B1 GND GND A1 B2 GBE0_ACT# GBE0_MDI3- A2 B3 LPC_FRAME# GBE0_MDI3+ A3 B4 LPC_AD0 GBE0_LINK100# A4 B5 LPC_AD1 GBE0_LINK1000# A5 B6 LPC_AD2 GBE0_MDI2- A6 B7 LPC_AD3 GBE0_MDI2+ A7 B8 LPC_DRQ0# GBE0_LINK# A8 B9 LPC_DRQ1# GBE0_MDI1- A9
B10 LPC_CLK GBE0_MDI1+ A10
B11 GND GND A11 B12 PWRBTN# GBE0_MDI0- A12 B13 SMB_CK GBE0_MDI0+ A13 B14 SMB_DAT GBE0_CTREF A14 B15 SMB_ALERT# SUS_S3# A15 B16 N/C SATA0_TX+ A16 B17 N/C SATA0_TX- A17 B18 SUS_STAT# SUS_S4# A18 B19 N/C SATA0_RX+ A19 B20 N/C SATA0_RX- A20 B21 GND GND A21 B22 N/C SATA2_TX+ A22 B23 N/C SATA2_TX- A23 B24 PWR_OK SUS_S5# A24 B25 N/C SATA2_RX+ A25 B26 N/C SATA2_RX- A26 B27 WDT BATLOW# A27 B28 AC_SDIN2 ATA_ACT# A28 B29 AC_SDIN1 AC_SYNC A29 B30 AC_SDIN0 AC_RST# A30 B31 GND GND A31 B32 SPKR AC_BITCLK A32 B33 I2C_CK AC_SDOUT A33 B34 I2C_DAT BIOS_DISABLE# A34 B35 THRM# THRMTRIP# A35 B36 USB7- USB6- A36 B37 USB7+ USB6+ A37 B38 USB_4_5_OC# USB_6_7_OC# A38 B39 USB5- USB4- A39 B40 USB5+ USB4+ A40 B41 GND GND A41 B42 USB3- USB2- A42 B43 USB3+ USB2+ A43 B44 USB_0_1_OC# USB_2_3_OC# A44 B45 USB1- USB0- A45 B46 USB1+ USB0+ A46 B47 EXCD1_PERST# VCC_RTC A47 B48 EXCD1_CPPE# EXCD0_PERST# A48 B49 SYS_RESET# EXCD0_CPPE# A49 B50 CB_RESET# LPC_SERIRQ A50 B51 GND GND A51 B52 N/C N/C A52 B53 N/C N/C A53 B54 GPO1 GPI0 D54 A54 B55 N/C N/C A55
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B56 N/C N/C A56 B57 GPO2 GND A57 B58 N/C N/C A58 B59 N/C N/C A59 B60 GND GND A60 B61 PCIE_RX2+ PCIE_TX2+ A61 B62 PCIE_RX2- PCIE_TX2- A62 B63 GPO3 GPI1 A63 B64 PCIE_RX1+ PCIE_TX1+ A64 B65 PCIE_RX1- PCIE_TX1- A65 B66 WAKE0# GND A66 B67 WAKE1# GPI2 A67 B68 PCIE_RX0+ PCIE_TX0+ A68 B69 PCIE_RX0- PCIE_TX0- A69 B70 GND GND A70 B71 LVDS_B0+ LVDS_A0+ A71 B72 LVDS_B0- LVDS_A0- A72 B73 LVDS_B1+ LVDS_A1+ A73 B74 LVDS_B1- LVDS_A1- A74 B75 LVDS_B2+ LVDS_A2+ A75 B76 LVDS_B2- LVDS_A2- A76 B77 N/C LVDS_VDD_EN A77 B78 N/C N/C A78 B79 LVDS_BKLT_EN N/C A79 B80 GND GND A80 B81 LVDS_B_CK+ LVDS_A_CK+ A81 B82 LVDS_B_CK- LVDS_A_CK- A82 B83
CKLVDS_BKLT_CTRL
LVDS_I2C_CK A83
B84 VCC_5V_SBY LVDS_I2C_DAT A84 B85 VCC_5V_SBY GPI3 A85 B86 VCC_5V_SBY KBD_RST# A86 B87 VCC_5V_SBY KBD_A20GATE A87 B88 RSVD PCIE0_CK_REF+ A88 B89 VGA_RED PCIE0_CK_REF- A89 B90 GND GND A90 B91 VGA_GRN RSVD B91 A91 B92 VGA_BLU RSVD A92 B93 VGA_HSYNC GPO0 A93 B94 VGA_VSYNC RSVD A94 B95 VGA_I2C_CK RSVD A95 B96 VGA_I2C_DAT GND A96 B97 TV_DAC_A VCC_12V A97 B98 TV_DAC_B VCC_12V A98 B99 TV_DAC_C VCC_12V A99
B100 GND GND A100 B101 VCC_12V VCC_12V A101 B102 VCC_12V VCC_12V A102 B103 VCC_12V VCC_12V A103 B104 VCC_12V VCC_12V A104 B105 VCC_12V VCC_12V A105 B106 VCC_12V VCC_12V A106 B107 VCC_12V VCC_12V A107 B108 VCC_12V VCC_12V A108 B109 VCC_12V VCC_12V A109
B110 GND GND A110
Installation
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2.5 COM Express CD Connector
D1 GND GND C1 D2 IDE_D5 IDE_D7 C2 D3 IDE_D10 IDE_D6 C3 D4 IDE_D11 IDE_D3 C4 D5 IDE_D12 IDE_D15 C5 D6 IDE_D4 IDE_D8 C6 D7 IDE_D0 IDE_D9 C7 D8 IDE_REQ IDE_D2 C8
D9 IDE_IOW# IDE_D13 C9 D10 IDE_ACK# IDE_D1 C10 D11 GND GND C11 D12 IDE_IRQ IDE_D14 C12 D13 IDE_A0 IDE_IORDY C13 D14 IDE_A1 IDE_IOR# C14 D15 IDE_A2 PCI_PME# C15 D16 IDE_CS1# PCI_GNT2# C16 D17 IDE_CS3# PCI_REQ2# C17 D18 IDE_RESET# PCI_GNT1# C18 D19 PCI_GNT3# PCI_REQ1# C19 D20 PCI_REQ3# PCI_GNT0# C20 D21 GND GND C21 D22 PCI_AD1 PCI_REQ0# C22 D23 PCI_AD3 PCI_RESET# C23 D24 PCI_AD5 PCI_AD0 C24 D25 PCI_AD7 PCI_AD2 C25 D26 PCI_C/BE0# PCI_AD4 C26 D27 PCI_AD9 PCI_AD6 C27 D28 PCI_AD11 PCI_AD8 C28 D29 PCI_AD13 PCI_AD10 C29 D30 PCI_AD15 PCI_AD12 C30 D31 GND GND C31 D32 PCI_PAR PCI_AD14 C32 D33 PCI_SERR# PCI_C/BE1# C33 D34 PCI_STOP# PCI_PERR# C34 D35 PCI_TRDY# PCI_LOCK# C35 D36 PCI_FRAME# PCI_DEVSEL# C36 D37 PCI_AD16 PCI_IRDY# C37 D38 PCI_AD18 PCI_C/BE2# C38 D39 PCI_AD20 PCI_AD17 C39 D40 PCI_AD22 PCI_AD19 C40 D41 GND GND C41 D42 PCI_AD24 PCI_AD21 C42 D43 PCI_AD26 PCI_AD23 C43 D44 PCI_AD28 PCI_C/BE3# C44 D45 PCI_AD30 PCI_AD25 C45 D46 PCI_IRQC# PCI_AD27 C46 D47 PCI_IRQD# PCI_AD29 C47 D48 PCI_CLKRUN# PCI_AD31 C48 D49 PCI_M66EN PCI_IRQA# C49 D50 PCI_CLK PCI_IRQB# C50 D51 GND GND (FIXED) C51 D52 PEG_TX0+ PEG_RX0+ C52 D53 PEG_TX0- PEG_RX0- C53 D54 PEG_LANE_RV# TYPE0# C54 D55 PEG_TX1+ PEG_RX1+ C55
Installation
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D56 PEG_TX1- PEG_RX1- C56 D57 TYPE2# TYPE1# C57 D58 PEG_TX2+ PEG_RX2+ C58 D59 PEG_TX2- PEG_RX2- C59 D60 GND GND C60 D61 PEG_TX3+ PEG_RX3+ C61 D62 PEG_TX3- PEG_RX3- C62 D63 RSVD RSVD C63 D64 RSVD RSVD C64 D65 PEG_TX4+ PEG_RX4+ C65 D66 PEG_TX4- PEG_RX4- C66 D67 GND RSVD C67 D68 PEG_TX5+ PEG_RX5+ C68 D69 PEG_TX5- PEG_RX5- C69 D70 GND GND C70 D71 PEG_TX6+ PEG_RX6+ C71 D72 PEG_TX6- PEG_RX6- C72 D73 SDVO_CLK SDVO_DATA C73 D74 PEG_TX7+ PEG_RX7+ C74 D75 PEG_TX7- PEG_RX7- C75 D76 GND GND C76 D77 IDE_CBLID# RSVD C77 D78 PEG_TX8+ PEG_RX8+ C78 D79 PEG_TX8- PEG_RX8- C79 D80 GND GND C80 D81 PEG_TX9+ PEG_RX9+ C81 D82 PEG_TX9- PEG_RX9- C82 D83 RSVD RSVD C83 D84 GND GND C84 D85 PEG_TX10+ PEG_RX10+ C85 D86 PEG_TX10- PEG_RX10- C86 D87 GND GND C87 D88 PEG_TX11+ PEG_RX11+ C88 D89 PEG_TX11- PEG_RX11- C89 D90 GND GND C90 D91 PEG_TX12+ PEG_RX12+ C91 D92 PEG_TX12- PEG_RX12- C92 D93 GND GND C93 D94 PEG_TX13+ PEG_RX13+ C94 D95 PEG_TX13- PEG_RX13- C95 D96 GND GND C96 D97 PEG_ENABLE# RSVD C97 D98 PEG_TX14+ PEG_RX14+ C98 D99 PEG_TX14- PEG_RX14- C99
D100 GND GND C100 D101 PEG_TX15+ PEG_RX15+ C101 D102 PEG_TX15- PEG_RX15- C102 D103 GND GND C103 D104 VCC_12V VCC_12V C104 D105 VCC_12V VCC_12V C105 D106 VCC_12V VCC_12V C106 D107 VCC_12V VCC_12V C107 D108 VCC_12V VCC_12V C108 D109 VCC_12V VCC_12V C109 D110 GND GND C110
Installation
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2.6 The Installation Paths of CD Driver
Windows 2000 & XP
Driver Path
CHIPSET \CHIPSET\INF 9.11
LAN \ETHERNET\REALTEK\8111_WINXP_5764
VGA \GRAPHICS\INTEL_2K_XP_32\1432
Windows 7
Driver Path
CHIPSET \CHIPSET\INF 9.11
LAN Windows 7 built-in LAN driver
VGA \GRAPHICS\INTEL_WIN7_32\1930
\GRAPHICS\INTEL_WIN7_64\1930
Installation
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BIOS
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3Chapter 3
BIOS
Chapter 3 - BIOS
BIOS
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The AMI BIOS provides a setup utility program for specifying the system
congurations and settings. The BIOS ROM of the system stores the setup
utility. When you turn on the computer, the AMI BIOS is immediately activated.
The Main displays system overview status. Use the left/right arrow keys to
highlight a particular conguration screen from the top menu bar or use the down arrow key to access and congure the information below.
3.1 BIOS Main Setup
System Time
Set the system time. The time format is: Hour : 00 to 23 Minute : 00 to 59 Second : 00 to 59
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