ROHM TT8U1 Technical data

<MOSFET>
<
<
1.5V Drive Pch +SBD MOSFET
TT8U1
zStructure zDimensions (Unit : mm) Silicon P-channel MOSFET / schottky barrier diode
zFeatures
1) Low On-resistance.
2) High Power Package.
3) Low voltage drive. (1.5V)
zApplications Switching
zInner circuit
zPackaging specifications
Type
TT8U1
Package Code Basic ordering unit (pieces)
Taping
TR
3000
zAbsolute maximum ratings (Ta=25°C)
TSST8
(8) (7)
(1) (2)
1 BODY DIODE
(8) (7) (5)(6)
(1) (2) (4)(3)
Abbreviated symbol : U01
Each lead has same dimensions
(6) (5)
1
(3) (4)
Parameter Drain-source voltage Gate-source voltage
Drain current
Source current (Body diode)
Continuous Pulsed Continuous
Pulsed Channel temperature Power dissipation
1 Pw10µs, Duty cycle1%2 Mounted on a ceramic board
Di>
Parameter Repetitive peak reverse voltage Reverse voltage Forward current
Forward current surge peak Junction temperature Power dissipation
1 60HZ / 1Cycle2 Mounted on a ceramic board
MOSFET and Di>
Parameter Symbol Unit Total power dissipation Range of Storage temperature
Mounted on a ceramic board
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2009 ROHM Co., Ltd. All rights reserved.
Symbol
DSS GSS
D
1
DP
S
1
SP
2
P
D
Symbol
RM
V
R
I
F
1
I
FSM
Tj 150
2
P
D
P
D
Limits
20
±10 ±2.4 ±9.6
0.8
9.6
150
Limits
30 20
1.0
3.0
Limits
1.25
55 to +150
W / ELEMENT1.0
W / ELEMENT1.0
W / TOTAL
1/5
Unit
VV VV AI AI AI AI
°CTch
Unit
VV V A A
°C
°CTstg
2009.06 - Rev.A
<MOSFET>
<MOSFET> Body diode (source-drain)
TT8U1
zElectrical characteristics (Ta=25°C)
Data Sheet
Parameter Symbol Gate-source leakage Drain-source breakdown voltage Zero gate voltage drain current Gate threshold voltage
Static drain-source on-state resistance
Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge
Pulsed
Parameter Symbol
Pulsed
<Di>
Parameter Forward voltage drop Reverse leakage
I
V
(BR) DSS
I
V
GS (th)
R
DS (on)
C
C C
t
d (on)
t
d (off)
Q
Q
V
Min. Typ. Max.
GSS
−−±100 nA VGS=±10V, VDS=0V
Unit
20 −−VID= 1mA, VGS=0V
DSS
−−−1 µAV
0.3 −−1.0 V V
80 105 I
105 140 m
m
I
m 150 225 ID= −1.2A, VGS= −1.8V
180 360 I
2.4 −−SV
Y
fs
850 pF V
iss
6050− pF V
oss
rss
t
r
t
f
Q
g
gs
gd
9
25
55
45
6.7
1.7
0.6
−−nC
Min. Typ. Max.
SD
−−−1.2 V IS= 2.4A, VGS=0VForward voltage
m
pF f=1MHz
ns
ns
ns
ns
nC
nC
VDD −10V
VGS= −4.5V ID= −1.2A
R R
V V I RL 4.2 / RG=10Ω
Unit
DS
DS D D
D
DS
DS
GS
L
G
DD
GS D
Conditions
= −20V, VGS=0V
= −10V, ID= −1mA = −2.4A, VGS= −4.5V = −1.2A, VGS= −2.5V
= −0.5A, VGS= −1.5V
= −10V, ID= −2.4A
= −10V
=0V
8.3Ω =10
−10V = −4.5V
= −2.4A
Conditions
Symbol Min. Typ. Max. Unit Conditions
V
F
R
−−
I
0.410.37 500
µA
V
= 1.0A
I
F
VR=20V
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2009 ROHM Co., Ltd. All rights reserved.
2/5
2009.06 - Rev.A
TT8U1
zElectrical characteristics curves
5
Ta= 25°C Pulsed
4
[A]
D
3
2
DRAIN CURRENT : -I
1
0
0 0.2 0.4 0.6 0.8 1
DRAIN-SOURCE VOLTAGE : -VDS[V] DR AIN-SO URCE VO LTAGE : -VDS[V]
Fi g.1 T ypic al output c haract eris tics (Ⅰ) F ig .2 Typical output char acteri stic s(Ⅱ)
VGS= -10V
= -4.5V
V
GS
VGS= -2.5V
= -1.8V
V
GS
VGS= -1.5V
VGS= -1.4V
5
VGS= - 10V
4
[A]
D
3
2
DRAIN CURRENT : -I
1
0
0246810
VGS= -4.5V
VGS= -1.5V
= -1.4V
V
GS
VGS= -2.5V
= -1.8V
V
GS
Ta=25°C Pulsed
10
VDS= - 10V Pulsed
[A]
D
1
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= - 25°C
0.1
DRAIN CURRENT : -I
0.01
0.001
00.511.52
GATE- SOURC E VOLTAGE : - VGS[V]
Fi g.3 T ypic al Tr ansfer Charac teri stic s
Data Sheet
1000
Ta=25°C Pulsed
]
(ON)[m
DS
100
VGS= -1.5V
= -1.8V
V
GS
= -2.5V
V
RESIST ANCE : R
STATIC DRAIN-SOURCE ON-STATE
10
0.1110
DRAIN-CURRENT : -I
Fi g.4 St atic D rai n-Sourc e On-Sta te
R esis tance vs. Dr ain C urr ent(Ⅰ)
1000
VGS= -1.8V Pulsed
]
(ON)[m
DS
100
RESIST ANCE : R
STATIC DRAIN-SOURCE ON-STATE
10
0.1 1 10
DRAIN-CURRENT : -ID[A]
Fi g.7 St atic D rai n-Sourc e On-Sta te
Resist ance vs. Drai n Cur rent(Ⅳ)
V
GS
GS
= -4.5V
[A]
D
Ta=125°C
Ta=75°C Ta=25°C
Ta= -25°C
1000
VGS= -4.5V Pulsed
]
(ON)[m
DS
100
RESISTAN CE : R
STATIC DRAIN-SOURCE ON-STATE
10
0.1 1 10
DRAIN-CURRENT : -ID[A]
Fi g.5 St atic D rai n-Sourc e On-Stat e
Resistance vs. Drain Curr ent(Ⅱ)
1000
VGS= -1.5V Pulsed
]
(ON)[m
DS
100
Ta= 125°C
Ta=75°C
RESIST ANCE : R
STATIC DRAIN-SOURCE ON-STATE
10
0.1 1 10
DRAIN-CURRENT : -I
Fi g.8 Stat ic Dr ain- Source O n-State
Resi stance vs. D rai n Curr ent(Ⅴ)
Ta=25°C
Ta= -25°C
Ta= 125°C Ta=75°C Ta=25°C Ta= -25°C
[A]
D
1000
VGS= -2.5V Pulsed
]
(ON)[m
DS
100
Ta=125°C
RESIST ANCE : R
STATIC DRAIN-SOURCE ON-STATE
10
0.1 1 10
DRAIN-CURRENT : -ID[A]
Fi g.6 St atic D rai n-Sourc e On-Sta te
Resistance vs. Drain Curr ent(Ⅲ)
10
VDS= -10V Pulsed
1
0.1
0.1110
FORWARD TRANSFER ADMITTANCE : |Yfs| [S]
DRAIN-CURRENT : -ID[A]
Fi g.9 F orward T ransfer Admittanc e vs. Drai n Curr ent
Ta=75°C Ta=25°C Ta= -25°C
Ta= 125°C
Ta= 75°C Ta= 25°C
Ta= -25°C
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2009 ROHM Co., Ltd. All rights reserved.
3/5
2009.06 - Rev.A
TT8U1
Data Sheet
10
VGS=0V Pulsed
1
Ta= 125°C
Ta= 75°C
0.1
REVER SE DRAIN C URREN T : -Is [A]
0.01
00.511.5
SOUR CE-DR AIN VOLTAGE : - VSD [V]
Fi g.10 R evers e Drai n Curr ent vs. Sourse- Drain Voltag e
5
[V]
GS
4
3
2
1
GATE- SOURC E VOLTAGE : -V
0
02468
TOTAL GATE CHARGE : Qg [nC]
Fi g.13 D ynamic Input Char acteri stic s
Ta= 25°C
Ta= -25°C
Ta=25°C V
DD
= -2.4A
I
D
R
G
Pulsed
= - 10V
=10
250
]
200
(ON)[m
150
DS
100
ID= -1.2A
50
RESIST ANCE : R
STATIC DRAIN -SOUR CE ON-ST ATE
0
0246810
GATE- SOURCE VOLT AGE : -VGS[V]
Fi g.11 Stat ic Dr ain- Source On- State Resistance vs. Gate Source Voltage
10000
1000
100
CAPAC ITANCE : C [pF]
10
0.01 0.1 1 10 100
DR AIN-SOU RCE VOLTAGE : -V
Fi g.14 T ypic al Capac itance vs. Dr ain-Source Voltag e
ID= -2.4A
Coss
Crss
Ta=25°C Pulsed
Ta= 25°C f=1MH z
=0VCiss
V
GS
[V]
DS
10000
1000
100
10
SWIT CHING TI ME : t [ns]
t
r
1
0.01 0.1 1 10
100
puls ed
10
[mA]
R
1
0.1
0.01
REVER SE CUR RENT : I
0.001
0.0001 010203040
Fi g.15 R evers e Curr ent vs. Revers e Voltag e
td(off)
t
f
td(on)
DRAIN-CURRENT : -ID[A]
Fi g.12 Swit ching Charac teris tics
REVER SE VOLTAGE : V
Ta=25°C
= -10V
V
DD
= -4.5V
V
GS
=10
R
G
Pulsed
Ta = 125
Ta = 75
Ta = 25
Ta= - 25
[V]
R
Ω
10000
puls ed
[mA]
F
1000
100
Ta = 125
10
FORWARD CURRENT : I
1
0.1 0 0.1 0.2 0.3 0.4 0.5 0.6
FOR WARD VOLTAGE : V
Fi g.16 F orward C urr ent vs. F orward Vol tage
Ta = 75
Ta= 25
Ta= - 25
[V]
F
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2009 ROHM Co., Ltd. All rights reserved.
4/5
2009.06 - Rev.A
F
it
%
V
V
F
it
S
Fig.2-2 Gate Charge Waveform
V
TT8U1
zMeasurement circuits
Pulse width
D
V
R
G
I
GS
D.U.T.
V
DS
R
L
V
DD
GS
10%
50%
10% 10
DS
90% 90%
t
d(on)
t
r
t
on
90%
t
d(off)
t
off
50%
t
f
Data Sheet
ig.1-1 Switching Time Measurement Circu
Fig.1-2 Switching Waveforms
VG
I
D
D.U.T.
R
L
V
DD
I
G(Const.)
V
GS
R
G
ig.2-1 Gate Charge Measurement Circu
V
D
GS
Q
gs
g
Q
Q
gd
Charge
zNotice
1. SBD has a large reverse leak current compared to other type of diode. Therefore ; it would raise a junction temperature, and increase a reverse power loss. Further rise of inside temperature would cause a thermal runaway. This built-in SBD has low VF characteristics and therefore, higher leak current. Please consider enough the surrounding temperature, generating heat of MOSFET and the reverse current.
2. This product might cause chip aging and breakdown under the large electrified environment. Please consider to design ESD protection circuit.
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2009 ROHM Co., Ltd. All rights reserved.
5/5
2009.06 - Rev.A
Notes
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The content specied herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specications, which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specied in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage.
The technical information specied herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other par ties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information.
Notice
The Products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, commu­nication devices, electronic appliances and amusement devices).
The Products specied in this document are not designed to be radiation tolerant.
While ROHM always makes ef forts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, re or any other damage caused in the event of the failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machiner y, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing.
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