Datasheet TT8M2 Datasheet (ROHM)

2.5V Drive Nch MOSFET
1.5V Drive Pch MOSFET
TT8M2
zStructure zDimensions (Unit : mm) Silicon N-channel MOSFET/
Silicon P-channel MOSFET
zFeatures
1) Low on-state resistance.
2) Low voltage drive.
3) High power package.
zApplication zInner circuit
Switching
zPackaging specifications
Type
TT8M2
Package Code Basic ordering unit (pieces)
Taping
TR
3000
zAbsolute maximum ratings (Ta=25°C) <Tr1 : Nch>
Parameter Drainsource voltage Gatesource voltage
Drain current
Source current (Body diode)
1 Pw10µs, Duty cycle1%
Continuous Pulsed Continuous Pulsed
Symbol
V
DSS
V
GSS
I
D
I
DP
I
S
I
SP
Limits Unit
30
±12
±2.5
1
1
±10
0.8 10
TSST8
(8) (7) (5)(6)
(1) (2) (4)(3)
Abbreviated symbol : M02
(8)
2
1
(1)
1 ESD protection diode2 Body diode
V V A A A A
2
(5)(6)(7)
(1) Tr1 Source
(4)(3)(2)
(2) Tr1 Gate (3) Tr2 Source (4) Tr2 Gate (5) Tr2 Drain (6) Tr2 Drain (7) Tr1 Drain (8) Tr1 Drain
1
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2009.06 - Rev.A
T C
R
<Tr2 : Pch>
Parameter Drainsource voltage Gatesource voltage
Drain current
Source current (Body diode)
1 Pw10µs, Duty cycle1%
Continuous Pulsed Continuous Pulsed
<Tr1 AND Tr2>
Parameter
otal power dissipation
hannel temperature ange of Storage temperature
2 Mounted on a ceramic board
zElectrical characteristics (Ta=25°C) < Characteristics for the Tr1( Nch ).>
Parameter Gate-source leakage Drain-source breakdown voltage Zero gate voltage drain current Gate threshold voltage
Static drain-source on-state resistance
Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge
Pulsed
Symbol
I
V
(BR) DSS
I
V
R
DS (on)
C
C C
t
t
Q
zBody diode characteristics (Source-drain) (Ta=25°C)
Parameter Symbol
V
Pulsed
GSS
Symbol
V
DSS
V
GSS
I
D
I
DP
I
S
I
SP
Symbol
P
D
Tch
Tstg
Min.
Typ. Max.
−−±10
Limits Unit
20 ±10
±2.5
1
±10
0.8
1
10
Limits Unit
1.25
2
1.0
150
55 to +150
30 −−VID=1mA, VGS=0V
DSS
GS (th)
−−1
0.5 1.5
65 90 I
70 95 mΩmΩID=2.5A, VGS=4V
95 130 mID=2.5A, VGS=2.5V
2.2 −−SV
Y
fs
180
iss oss rss
d (on)
t
r
d (off)
t
Q
Q
gs
gd
60
f
g
−−
35
30 20 20
3.2
0.9
0.4
7
Min. Typ. Max.
−−1.2 VForward voltage IS= 2.5A, VGS=0V
SD
Unit
µA
V
GS
µA
VDS=30V, VGS=0V
V
VDS=10V, ID=1mA
=2.5A, VGS=4.5V
D
DS
pF
VDS=10V
pF
VGS=0V
pF
f=1MHz
ns
VDD 15V
ID=1.2A
ns
GS
V
ns
L
R
ns
R
G
nC
V
DD
nC
VGS=4.5V R
L
nC
Unit
Data Sheet TT8M2
V V A A A A
W / TOTAL
W / ELEMENT
°C °C
Conditions
12V, VDS=0V
=10V, ID=2.5A
=4.5V
12.5Ω =10
15V, ID=2.5A
6, RG=10
Conditions
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2009.06 - Rev.A
zElectrical characteristics (Ta=25°C) < Characteristics for the Tr2( Pch ).>
Parameter
Symbol Gate-source leakage Drain-source breakdown voltage
V
(BR) DSS
Zero gate voltage drain current Gate threshold voltage
Static drain-source on-state resistance
V
R
Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge
Pulsed
zBody diode characteristics (Source-drain) (Ta=25°C)
Parameter Symbol
Pulsed
I
GSS
I
DSS
GS (th)
DS (on)
Y
fs
C
iss
C
oss
C
rss
t
d (on)
r
t
t
d (off)
t
f
Q
Q
gs
Q
gd
V
SD
g
Min.
Typ. Max.
−−±10
20 −−VID= −1mA, VGS=0V
−−−1
0.3 −−1.0
49 68 I
68 95 mΩmΩID= −1.2A, VGS= −2.5V
100
150 mΩ ID= −1.2A, VGS= −1.8V
140 280
2.5 −−SV
1270
100
−−
90
9
30
120
85 12
2.5
2.0
Min. Typ. Max.
−−−1.2 VForward voltage IS= −2.5A, VGS=0V
Unit
µA
V
10V, VDS=0V
GS
µA
VDS= −20V, VGS=0V
V
VDS= −10V, ID= −1mA
= −2.5A, VGS= −4.5V
D
= −0.5A, VGS= −1.5V
I
D
m
= −10V, ID= −2.5A
DS
pF
VDS= −10V
pF
VGS=0V
pF
f=1MHz
ns
V
DD
ID= −1.2A
ns
GS
= −4.5V
V
ns
R
L
8.3
ns
G
=10
R
nC
V
10V, ID= −2.5A
DD
nC
VGS= −4.5V R
L
4, RG=10
nC
Unit
Data Sheet TT8M2
Conditions
10V
Conditions
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2009.06 - Rev.A
zElectrical characteristics curves <Nch>
2.5
2
[A]
D
1.5
1
DRAIN CURRENT : I
0.5
0
0 0.2 0.4 0.6 0.8 1
Fi g.1 Typi cal Output C haract eris tics(Ⅰ) Fi g.2 T ypic al Output C haract eris tics(Ⅱ)
VGS= 10V
= 4.5V
V
GS
=4.0V
V
GS
V
= 2.5V
GS
= 2.0V
V
GS
DR AIN-SOU RCE VOLTAGE : VDS[V] DR AIN-SOU RCE VOLTAGE : VDS[V]
VGS= 1.5V
VGS= 1.2V
Ta=25°C Pulsed
2.5
2
[A]
D
1.5
1
DRAIN CURRENT : I
0.5
0
VGS= 4.5V V
= 4.0V
GS
= 2.5V
V
GS
0246810
VGS= 1. 5V
VGS= 1. 2V
Ta= 25°C Pulsed
10
VDS= 10V Pulsed
[A]
D
Ta= 125°C
1
Ta= 75°C
Ta= 25°C Ta= - 25°C
0.1
DRAIN CURRENT : I
0.01
0.001
00.511.52
GATE- SOURC E VOLTAGE : VGS[V]
Fi g.3 Typi cal Tr ansfer Charact eris tics
Data Sheet TT8M2
1000
Ta= 25°C Pulsed
]
(on)[m
DS
100
RESIST ANCE : R
STATIC DRAIN -SOUR CE ON- STATE
10
0.1110
DRAIN-CURRENT : I
Fi g.4 Stat ic Dr ain- Source On- State
Resi stance vs. D rain C urre nt(Ⅰ)
1000
VGS= 2. 5V Pulsed
]
(on)[m
DS
100
RESIST ANCE : R
STATIC DRAIN -SOUR CE ON- STATE
10
0.1 1 10
DRAIN-CURRENT : ID[A]
Fi g.7 Stat ic Dr ain- Source On- State
Resi stance vs. D rain C urre nt(Ⅳ)
VGS= 2.5V
= 4.0V
V
GS
V
= 4.5V
GS
[A]
D
Ta= 125°C Ta= 75°C Ta= 25°C Ta= -25°C
1000
VGS= 4. 5V Pulsed
]
(on)[m
DS
100
RESIST ANCE : R
STATI C DRAIN -SOUR CE ON-ST ATE
10
0.1 1 10
DRAIN-CURRENT : ID[A]
Fi g.5 Stat ic D rain- Source On-State
Resi stance vs. D rain C urrent (Ⅱ)
10
VDS= 10V Pulsed
1
FOR WARD TRANSF ER
ADMITT ANCE : |Yfs| [S]
0.1
0.01 0.1 1 10
DRAIN-CURRENT : ID[A]
Fi g.8 F orward Tr ansfer Admittance vs. Dr ain Cur rent
Ta= 125°C Ta=75°C Ta=25°C Ta= -25°C
Ta= -25°C Ta= 25°C Ta= 75°C Ta= 125°C
1000
VGS= 4. 0V Pulsed
]
(on)[m
DS
100
RESIST ANCE : R
STATIC DRAIN -SOUR CE ON- STATE
10
0.1 1 10
DRAIN-CURRENT : ID[A]
Fi g.6 Stat ic Dr ain- Source On- State
Resi stance vs. D rain C urr ent(Ⅲ)
300
]
250
200
(ON)[m
DS
150
100
RESIST ANCE : R
50
STATI C DRAIN -SOUR CE ON-ST ATE
0
0246810
Fi g.9 Stat ic Dr ain- Source On- State Resistance vs. Gate Source Voltage
ID= 1. 2A
ID= 2. 5A
GATE-SOURCE VOLTAGE : VGS[V]
Ta= 125°C Ta=75°C Ta=25°C Ta= -25°C
Ta= 25°C Puls ed
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10
VGS=0V Pulsed
1
0.1
REVERSE DRAIN CURRENT : Is [A]
0.01
00.511.5
SOURC E-DR AIN VOLTAGE : VSD [V]
Fi g.10 R ever se Dr ain Cur rent vs. Sourse-Dr ain Voltage
1000
t
f
100
10
SWITC HING TIM E : t [ns]
td(on)
1
0.01 0.1 1 10
DRAIN-CURRENT : ID[A]
Fig.13 Switching Characteristics
Ta=25°C RG=10
= 15V Pul sed
V
DD
=4.5V
V
GS
td(off)
Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
t
Data Sheet TT8M2
5
Ta= 25°C
= 15V
V
DD
[V]
= 2. 5A
I
GS
D
4
=10
R
G
Pulsed
3
2
1
GATE-SOUR CE VOLTAGE : V
0
01234
TOTAL GATE C HARGE : Qg [nC ]
Fi g.11 D ynamic Input Char acteri sti cs
r
1000
Ciss
100
CAPACITANCE : C [pF]
10
Coss
Crss
0.01 0.1 1 10 100
DRAIN-SOURCE VOLTAGE : V
Fi g.12 T ypic al Capac itance vs. Drain- Source Voltag e
Ta= 25°C f=1MHz
=0V
V
GS
[V]
DS
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2009.06 - Rev.A
<Pch>
[A]
D
DRAIN CURRENT : -I
]
(ON)[m
DS
RESIST ANCE : R
STATIC DRAIN-SOURCE ON-STATE
4
VGS= -1.3V
VGS= -4.5V
= -2.5V
V
GS
= -1.8V
V
GS
= -1.5V
V
GS
VGS= -1.1V
VGS= -1.5V
= -1.8V
V
GS
= -2.5V
V
GS
= -4.5V
V
GS
[A]
D
Ta=25°C Pulsed
3
2
1
0
0 0.2 0.4 0.6 0.8 1
DRAIN-SOURCE VOLTAGE : -VDS[V] DRAIN-SOURCE VOLTAGE : -VDS[V]
Fi g.1 Typic al Output Char acteri stic s(Ⅰ) Fi g.2 Typic al Output Char acteri stic s(Ⅱ)
1000
Ta=25°C Pulsed
100
10
0.1 1 10
DRAIN-CURRENT : -I
Fi g.4 Stati c Dr ain-Sour ce On-State
Resi stance vs. Dr ain Current(Ⅰ)
4
VGS= -10V
= -1.8V
V
[A]
D
DRAIN CURRENT : -I
1000
]
(ON)[m
DS
RESISTANCE : R
STATIC DRAIN-SOURCE ON-STATE
GS
3
VGS= -1.5V
2
1
0
0246810
VGS= -4.5V Pulsed
100
10
0.1 1 10
DRAIN-CURRENT : -ID[A]
Fi g.5 Stati c Dr ain-Sour ce On-State
Resi stance vs. Dr ain Current(Ⅱ)
Ta= 25°C Pulsed
VGS= -1.3V
VGS= -1.2V
VGS= -1.1V
Ta= 125°C Ta= 75°C Ta= 25°C Ta= -25°C
10
VDS= -10V Pulsed
[A]
D
1
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= - 25°C
0.1
DRAIN CURRENT : -I
0.01
0.001
00.511.5
GATE-SOUR CE VOLTAGE : -VGS[V]
Fi g.3 T ypic al Tr ansfer C haract eris tics
1000
VGS= -2.5V Pulsed
]
(ON)[m
DS
100
RESIST ANCE : R
STATIC DRAIN-SOURCE ON-STATE
10
0.1110
DRAIN-CURRENT : -ID[A]
Fi g.6 Stati c Dr ain-Sour ce On-State
Resi stance vs. Dr ain Current(Ⅲ)
Ta= -25°C Ta=25°C Ta=75°C Ta=125°C
Data Sheet TT8M2
1000
VGS= -1.8V Pulsed
]
(ON)[m
DS
100
RESIST ANCE : R
STATIC DRAIN-SOURCE ON-STATE
10
0.1110
DRAIN-CURRENT : -ID[A]
Fi g.7 Stati c Dr ain-Sour ce On-State
Resi stance vs. Dr ain Current(Ⅳ)
Ta=125°C Ta=75°C Ta=25°C Ta= -25°C
1000
VGS= -1.5V Pulsed
]
(ON)[m
DS
100
RESIST ANCE : R
STATIC DRAIN-SOURCE ON-STATE
10
0.1 1 10
DRAIN-CURRENT : -I
Fi g.8 Stati c Dr ain-Sour ce On-State
Resi stance vs. Dr ain Current(Ⅳ)
Ta=125°C Ta=75°C Ta=25°C Ta= -25°C
[A]
D
100
VDS= -10V Pulsed
10
Ta= -25°C
1
0
0.1 1 10
FORWARD TRANSFER ADMITTANCE : |Yfs| [S]
DRAIN-CURRENT : -ID[A]
Fi g.9 For ward Trans fer Admitt ance vs. Drai n Cur rent
Ta=25°C Ta=75°C Ta=125°C
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Data Sheet TT8M2
300
]
250
200
(ON)[m
DS
150
100
RESISTANCE : R
50
STATIC DRAIN-SOURCE ON-STATE
ID= -1.2A
0
0246 810
GATE- SOURC E VOLTAGE : -VGS[V]
Fi g.10 St atic D rain- Sourc e On-Stat e Resistance vs. Gate Source Voltage
10000
1000
100
CAPACITANCE : C [pF]
Ta=25°C f=1MH z
=0V
V
GS
10
0.01 0.1 1 10 100
ID= -2.5A
Coss
Crss
DRAIN-SOURCE VOLTAGE : -V
Fi g.13 Typical Capacit ance vs. Dr ain-Source Voltage
Ta=25°C Pulsed
Ciss
10
VGS=0V Pulsed
Ta=125°C
1
Ta=75°C Ta=25°C Ta=-25°C
0.1
REVERSE DRAIN CURRENT : -Is [A]
0.01 0 0.2 0.4 0.6 0.8 1 1.2
SOURCE-DRAIN VOLTAGE : -VSD [V]
Fi g.11 R ever se Dr ain Cur rent vs. Sourse-D rain Voltage
10000
1000
100
10
SWITC HING TIME : t [ns]
1
0.01 0. 1 1 10
[V]
DS
td(off)
t
r
DRAIN-CURRENT : -ID[A]
Fig.14 Switching Characteristics
t
td(on)
Ta=25°C
= -10V
V
DD
=- 4.5V
V
GS
=10
R
G
Pulsed
f
5
[V]
4
GS
3
2
1
GATE- SOURC E VOLTAGE : -V
0
02468101214
TOTAL GATE C HARGE : Qg [nC]
Fi g.12 Dynamic Input C haracter isti cs
Ta=25°C V I
D
R Pulsed
= -10V
DD
= -2.5A
=10
G
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F
it
%
V V
F
S
Fig.2-2 Gate Charge Waveform
V
F
it
S
%
V
V
F
S
V
zMeasurement circuits
< Nch >
RG
VGS
D
I
D.U.T.
RL
VDD
VDS
Data Sheet TT8M2
Pulse Width
90%
t
d(off)
t
50%
off
t
f
50%
10%
GS DS
10% 10
90% 90%
t
d(on)
t
r
t
on
ig.1-1 Switching Time Measurement Circu
V
I
G(Const.)
GS
R
G
D.U.T.
I
D
R
L
V
DD
ig.2-1 Gate charge measurement circuit
< Pch >
D
V
R
G
I
GS
R
L
D.U.T.
V
DD
V
D
V
D
Fig.1-2 Switching Waveforms
V
G
Q
g
GS
Q
gs
Q
gd
Charge
Pulse width
GS
10%
50%
DS
90% 90%
t
d(on)
t
on
90%
10% 10
t
t
d(off)
r
t
50%
off
t
f
ig.3-1 Switching time measurement circu
Fig.3-2 Switching waveforms
VG
D
I
G(Const.)
V
GS
D.U.T.
R
G
I
V
D
R
L
V
DD
GS
Q
gs
g
Q
Q
gd
Charge
ig.4-1 Gate charge measurement circuit
Fig.4-2 Gate charge waveform
zNotice
This product might cause chip aging and breakdown under the large electrified environment. Please consider to design ESD protection circuit.
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Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd.
The content specied herein is subject to change for improvement without notice.
The content specied herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specications, which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specied in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage.
The technical information specied herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other par ties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information.
Notice
The Products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, commu­nication devices, electronic appliances and amusement devices).
The Products specied in this document are not designed to be radiation tolerant.
While ROHM always makes effor ts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, re or any other damage caused in the event of the failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing.
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