Datasheet RZF030P01 Datasheet (ROHM)

1.5V Drive Pch MOSFET
RZF030P01
zStructure
Silicon P-channel
MOSFET
zFeatures
1) Low on-resistance.
2) High power package.
3) Low voltage drive. (1.5V)
zApplications
Switching
zPackaging specifications
Type
RZF030P01
Package Code Basic ordering unit (pieces)
Taping
TL
3000
zAbsolute maximum ratings (Ta=25°C)
Parameter Drain-source voltage Gate-source voltage
Drain current Source current
(Body diode) Total power dissipation
Channel temperature Range of Storage temperature
1 Pw10µs, Duty cycle1%2 Mounted on a ceramic board
Continuous Pulsed Continuous Pulsed
zThermal resistance
Parameter
Channel to ambient
Mounted on a ceramic board.
Symbol
DSS GSS
D
DP
S
SP
D
Symbol Limits Unit
Rth(ch-a)
Limits Unit
12 ±10
55 to +150
±3
±12
0.65
12
0.8
150
156
11
2
zDimensions (Unit : mm)
TUMT3
(1) Gate (2) Source (3) Drain
zEquivalent circuit
(1)
1 ESD PROTECTION DIODE2 BODY DIODE
VV VV AI AI AI AI
WP
°CTch °CTstg
°C / W
Abbreviated symbol : YD
(3)
1
(2)
0.2Max.
2
(1) Gate (2) Source (3) Drain
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2009 ROHM Co., Ltd. All rights reserved.
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2009.01 - Rev.
RZF030P01 Data Sheet
zElectrical characteristics (Ta=25°C)
Parameter Symbol Gate-source leakage
Drain-source breakdown voltage
V
Zero gate voltage drain current
Gate threshold voltage
Static drain-source on-state resistance
V
R
Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge
Gate-source charge Gate-drain charge
Pulsed
zBody diode characteristics (Source -drain) (Ta=25°C)
Parameter Symbol
Pulsed
Min.−Typ. Max.
I
GSS
(BR) DSS
I
DSS
0.3 −−1.0 V V
GS (th)
−±10 µAVGS=±10V, VDS=0V
12 −−VID= −1mA, VGS=0V
−−−1 µAV
28 39 I
DS (on)
Y
C
C C
t
d (on)
t
d (off)
Q
Q
Q
51 76 I
5 −−SV
fs
1860 pF V
iss
210
oss
200
rss
t
r
t
f
g
gs
gd
9
40
210
120
18
3.0
2.5
−−nC
39 54 m
Min. Typ. Max.
V
SD
−−−1.2 V IS= 3A, VGS=0VForward voltage
Unit
= 12V, VGS=0V
DS
= 6V, ID= 1mA
DS
= 3A, VGS= 4.5V
m
D
= 1.5A, VGS= 2.5V
I
D
= 1.5A, VGS= 1.8V
m
D
m 72 144 ID= 0.6A, VGS= 1.5V
= 6V, ID= 3A
DS
= 6V
DS
pF V
=0V
GS
pF f=1MHz
ns
ns
ns
ns
nC
nC
ID= 1.5A
V
DD
6V
GS
= 4.5V
V R
L
4
R
G
=10
V
−6V
DD
I
= −3A
D
V
= −4.5V
GS
Unit
Conditions
L
R R
G
=10
Conditions
2
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2/5
2009.01 - Rev.
RZF030P01 Data Sheet
zElectrical characteristic curves
10
[A]
D
5
DRAIN CURRENT : -I
0
0.0 2.0 4.0 6.0 8.0 10.0
DRAIN-SOURCE VOLTAGE : -V
Fig.1 Typical Output Characteristics (Ι)
VGS= - 10V
VGS= - 4.5V
VGS= - 1.8V
Ta= 25 pulsed
VGS= - 1.6V
VGS= - 1.4V
VGS= - 1.2V
VGS= - 1.0V
[V]
DS
10
VGS= - 10V
VGS= - 4.5V
[A]
D
5
DRAIN CURRENT : -I
0
0.0 0.2 0.4 0.6 0.8 1.0
DRAIN-SOURCE VOLTAGE : -V
Fig.2 Typical Output Characteristics (Ⅱ)
VGS= - 2.4V
Ta= 25
pulsed
VGS= - 1.8V
VGS= - 1.6V
VGS= - 1.4V
VGS= - 1.2V
VGS= -1.0V
[V]
DS
10
VDS= - 6V
pulsed
[A]
D
1
Ta=1 25
Ta=7 5
Ta=2 5
Ta=- 25
0.0 0.5 1.0 1.5
GATE-SOURCE VOLTAGE: - V
Fig.3 Typical Transfer Characteristics
DRAIN CURRENT: - I
0.1
0.01
0.001
[V]
GS
1000
VGS= - 1.5V
= - 1.8V
V
(on) [mΩ]
DS
100
STATE
RESISTANCE : R
STATIC DRAIN-SOURCE ON-
10
1000
(on) [mΩ]
DS
100
STATE
GS
= - 2.5V
V
GS
= - 4.5V
V
GS
0.01 0.1 1 10 DRAIN CURRENT : - I
Fig.4 Static Drain-Source On-State
Resistance vs.Drain Current
VGS= - 2.5V
pulsed
Ta= 25 pulsed
Ta=125 Ta= 75 Ta= 25 Ta= -25
[A]
D
℃ ℃ ℃
250
200
(on) [mΩ]
150
DS
100
STATE
50
RESISTANCE : R
STATIC DRAIN-SOURCE ON-
0
GATE-SOURCE CURRENT : -V
Fig.5 Static Drain-Source On-State Resistance vs.Gate-Source Voltage
1000
(on) [mΩ]
DS
100
STATE
ID= - 1.5A
ID= - 3.0A
0246810
VGS= - 1.8V
pulsed
Ta=2 5 pulsed
Ta=1 25 Ta=7 5 Ta=2 5 Ta=- 25
[V]
GS
℃ ℃ ℃
1000
VGS= - 4.5V
pulsed
Ta=1 25
(on) [mΩ]
DS
100
STATE
RESISTANCE: R
STATIC DRAIN-SOURCE ON-
10
0.01 0.1 1 10 DRAIN CURRENT : - I
Fig.6 Static Drain-Source On-State
Resistance vs.Drain Current
1000
VGS= - 1.5V
pulsed
(on) [mΩ]
DS
100
STATE
Ta=7 5 Ta=2 5 Ta=- 25
D
Ta= 125 Ta= 75 Ta= 25 Ta= -25
℃ ℃ ℃
[A]
℃ ℃ ℃
RESISTANCE : R
RESISTANCE : R
STATIC DRAIN-SOURCE ON-
10
0.01 0.1 1 10
DRAIN CURRENT : - I
Fig.7 Static Drain-Source On-State
Resistance vs. Drain Current
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2009 ROHM Co., Ltd. All rights reserved.
[A]
D
RESISTANCE : R
STATIC DRAIN-SOURCE ON-
10
0.01 0.1 1 10
DRAIN CURRENT : - I
Fig.8 Static Drain-Source On-State Resistance vs. Drain Current
[A]
D
3/5
STATIC DRAIN-SOURCE ON-
10
0.01 0.1 1 10
DRAIN CURRENT : - I
Fig.9 Static Drain-Source On-State Resistance vs. Drain Current
[A]
D
2009.01 - Rev.
)
RZF030P01 Data Sheet
10
VGS=0V
pulsed
100
VDS= - 6V
pulsed
10000
Ciss
1
0.1
SOURCE CURRENT : - Is [A]
0.01
0.0 0.5 1.0 1.5
SOURCE DRAIN VOLTAGE : - V
Fig.10 Source Current vs.
Source-Drain Voltage
10000
1000
SWITCHING TIME : t [ns]
tf
td(off
100
10
tr
1
0.01 0.1 1 10
DRAIN CURRENT : -I
Fig.13 Switching Characteristics
Ta= 125 Ta= 75 Ta= 25 Ta= -25
Ta= 25
=-6V
V
DD
= - 4.5V
V
GS
R
=10
G
Pulsed
D
℃ ℃ ℃
td(on)
[A]
10
Yfs [S]
1
ADMITTANCE :
FORWARD TRANSFER
0.1
[V]
SD
0.01 0.1 1 10
DRAIN CURRENT : - I
Fig.11 Forward Transfer Admittance vs. Drain Current
Ta= 25
[V]
4
GS
3
2
1
GATE-SOURCE VOLTAGE : -V
0
V
= - 6V
DD
= - 3A
I
D
=10
R
G
Pulsed
0 5 10 15 20
TOTAL GATE CHARGE : Qg [nC]
Fig.14 Dynamic Input Characteristic s
Ta= 125 Ta= 75 Ta= 25 Ta= -25
℃ ℃ ℃
[A]
D
1000
100
Ta=25
CAPASITANCE : C [pF]
10
f=1MHz
=0V
V
GS
0.01 0.1 1 10 100
DRAIN-SOURCE VOLTAGE : -V
Fig.12 Typical Capacitance vs. Drain-Source Voltage
Coss
Crss
[V]
DS
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RZF030P01 Data Sheet
zMeasurement circuits
V
GS
D
I
D.U.T.
R
G
V
DS
R
L
V
DD
V
GS
V
DS
t
d(on)
Pulse Width
10%
50%
90% 90%
t
on
90%
10% 10%
d(off)
t
t
r
t
off
50%
tf
Fig.1-1 Switching Time Measurement Circuit
Fig.1-2 Switching Waveforms
V
G
D
I
GS
D.U.T.
I
G(Const.)
V
R
G
Fig.2-1 Gate Charge Measurement Circuit
V
DS
R
L
V
DD
V
GS
Q
gs
Fig.2-2 Gate Charge Waveforms
g
Q
Q
gd
Charge
zNotice
This product might cause chip aging and breakdown under the large electrified environment. Please consider to design ESD protection circuit.
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2009.01 - Rev.
Appendix
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wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM
upon request.
Examples of application circuits, circuit constants and any other information contained herein illustrate the
standard usage and operations of the Products. The peripheral conditions must be taken into account
when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document. However, should
you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no re-
sponsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and examples
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sponsibility whatsoever for any dispute arising from the use of such technical information.
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Please be sure to implement in your equipment using the Products safety measures to guard against the
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The Products are not designed or manufactured to be used with any equipment, device or system
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Notes
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Appendix-Rev4.0
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