Datasheet RYM002N05 Datasheet (ROHM)

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0.9V Drive Nch MOSFET
RYM002N05
Structure Dimensions (Unit : mm)
Silicon N-channel MOSFET
Features
2) Small package(VMT3).
3) Ultra low voltage drive(0.9V drive).
Application
Switching
Packaging specifications Inner circuit
Package Taping
Type
Code T2L Basic ordering unit (pieces) 8000
RYM002N05
VMT3
Abbreviated symbol : QJ
(3)
Absolute maximum ratings (Ta = 25C)
Parameter
Drain-source voltage V
Gate-source voltage V
Drain current
Source current (Body Diode)
Continuous I
Pulsed I Continuous I
Pulsed I
Power dissipation P
Symbol Limits Unit
DSS
GSS
D
DP
S
SP
D
50 V
8V
200 mA
*1
800 mA
125 mA
*1
800 mA
*2
150 mW
Channel temperature Tch 150 C Range of storage temperature Tstg 55 to +150 C
*1 Pw10s, Duty cycle1%
*2 Each terminal mounted on a recommended land.
Thermal resistance
Parameter
Channel to Ambient Rth (ch-a) 833 C / W
* Each terminal mounted on a recommended land.
Symbol Limits Unit
*
(1) Gate (2) Source (3) Drain
(1) (2)
1 ESD PROTECTION DIODE2 BODY DIODE
1/5
2010.07 - Rev.A
Data Sheet
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RYM002N05
Electrical characteristics (Ta = 25C)
Parameter
Symbol Min. Typ. Max. Unit Gate-source leakage I Drain-source breakdown voltage V Zero gate voltage drain current I Gate threshold voltage V
GSS
(BR)DSS
DSS
GS (th)
--10 AVGS=8V, VDS=0V
50 - - V ID=1mA, VGS=0V
--1AVDS=50V, VGS=0V
0.3 - 0.8 V VDS=10V, ID=1mA
Conditions
- 1.6 2.2 ID=200mA, VGS=4.5V
- 1.7 2.4 ID=200mA, VGS=2.5V
Static drain-source on-state resistance
R
DS (on)
- 2.0 2.8 ID=200mA, VGS=1.5V
- 2.2 3.3 ID=100mA, VGS=1.2V
- 3.0 9.0 ID=10mA, VGS=0.9V
iss
oss
rss
d(on)
d(off)
*
- 26 - pF VDS=10V
-6-pFV
GS
=0V
- 3 - pF f=1MHz
-5-nsI
*
*
-8-nsV
*
*
r
- 17 - ns RL=250
*
*
- 43 - ns RG=10
*
*
f
=100mA, VDD 25V
D
=4.5V
GS
Forward transfer admittance l Yfs l 0.2 - - S ID=200mA, VDS=10V Input capacitance C Output capacitance C Reverse transfer capacitance C Turn-on delay time t Rise time t Turn-off delay time t Fall time t
*Pulsed
Body diode characteristics (Source-Drain) (Ta = 25C)
Parameter
Forward Voltage V
*Pulsed
Symbol Min. Typ. Max. Unit
*
SD
- - 1.2 V Is=200mA, VGS=0V
Conditions
2/5
2010.07 - Rev.A
Data Sheet
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RYM002N05
Electrical characteristics curves (Ta = 25C)
0.2
[A]
D
0.1
VGS= 0.9V
DRAIN CURRENT : I
0
0 0.2 0.4 0.6 0.8 1
DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.1 Typical Output Characteristics( ) Fig.2 Typical Output Characteristics( )
10000
Ta= 25°C
Pulsed
)[mΩ]
on
(
DS
1000
RESISTANCE : R
STATIC DRAIN-SOURCE ON-STATE
100
0.001 0.01 0.1 1
DRAIN-CURRENT : ID[A]
Fig.4 Static Drain-Source On-State Resistance vs. Drain Current( )
VGS= 0.8V
VGS= 4.5V
VGS= 2.5V
VGS= 1.5V
VGS= 1.2V
VGS= 0.7V
VGS= 0.9V
VGS= 1.2V
VGS= 1.5V
VGS= 2.5V
VGS= 4.5V
Ta=25°C
Pulsed
0.2
[A]
D
VGS= 0.9V
0.1
VGS= 0.8V
DRAIN CURRENT : I
0
0246810
DRAIN-SOURCE VOLTAGE : VDS[V]
10000
VGS= 4.5V
Pulsed
)[mΩ]
on
(
DS
1000
RESISTANCE : R
STATIC DRAIN-SOURCE ON-STATE
100
0.001 0.01 0.1 1
DRAIN-CURRENT : ID[A]
Fig.5 Static Drain-Source On-State Resistance vs. Drain Current( )
VGS= 4.5V V
= 2.5V
GS
V
= 1.5V
GS
V
= 1.2V
GS
Ta=25°C
Pulsed
VGS= 0.7V
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= 25°C
1
VDS= 10V
0.1
Pulsed
Ta= 125°C
Ta= 75°C
[A]
D
Ta= 25°C
Ta= 25°C
0.01
DRAIN CURRENT : I
0.001
0 0.2 0.4 0.6 0.8 1
GATE-SOURCE VOLTAGE : VGS[V]
Fig.3 Typical Transfer Characteristics
10000
VGS= 2.5V
Pulsed
)[mΩ]
on
(
DS
1000
RESISTANCE : R
STATIC DRAIN-SOURCE ON-STATE
100
0.001 0.01 0.1 1 10
DRAIN-CURRENT : ID[A]
Fig.6 Static Drain-Source On-State Resistance vs. Drain Current( )
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= 25°C
10000
VGS= 1.5V
Pulsed
)[mΩ]
on
(
DS
1000
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= 25°C
RESISTANCE : R
STATIC DRAIN-SOURCE ON-STATE
100
0.001 0.01 0.1 1 10
DRAIN-CURRENT : ID[A]
Fig.7 Static Drain-Source On-State Resistance vs. Drain Current( )
10000
VGS= 1.2V
Pulsed
)[mΩ]
on
(
DS
1000
RESISTANCE : R
STATIC DRAIN-SOURCE ON-STATE
100
0.001 0.01 0.1 1 10
DRAIN-CURRENT : ID[A]
Fig.8 Static Drain-Source On-State Resistance vs. Drain Current( )
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= 25°C
3/5
10000
VGS= 0.9V
Pulsed
)[mΩ]
on
(
DS
1000
RESISTANCE : R
STATIC DRAIN-SOURCE ON-STATE
100
0.001 0.01 0.1 1 10
DRAIN-CURRENT : ID[A]
Fig.9 Static Drain-Source On-State Resistance vs. Drain Current( )
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= 25°C
2010.07 - Rev.A
Data Sheet
www.rohm.com ©2010 ROHM Co., Ltd. All rights reserved.
RYM002N05
10
VDS= 10V
Pulsed
1
Ta=25°C
Ta=25°C
Ta=75°C
Ta=125°C
0.1
0.01 0.1 1
FORWARD TRANSFER ADMITTANCE : |Yfs| [S]
DRAIN-CURRENT : ID[A]
Fig.10 Forward Transfer Admittance vs. Drain Current
1000
100
t
d(off)
Ta=25°C
V
t
f
VGS=4.5V
RG=10
Pulsed
10
SWITCHING TIME : t [ns]
t
t
d(on)
r
1
0.01 0.1 1
1
VGS=0V
[A]
s
Pulsed
0.1
Ta= 125°C
5000
4000
)[mΩ]
ON
(
DS
3000
Ta=25°C
Pulsed
ID= 0.01A
ID= 0.20A
2000
Ta= 75°C
SOURCE CURRENT : I
Ta= 25°C
Ta= 25°C
0.01
0 0.5 1 1.5
SOURCE-DRAIN VOLTAGE : VSD [V]
Fig.11 Reverse Drain Current vs. Sourse-Drain Voltage
[V]
4
=25V
DD
GS
3
2
Ta=25°C
VDD=25V
1
ID= 0.2A
RG=10
GATE-SOURCE VOLTAGE : V
0
Pulsed
0 0.5 1 1.5
1000
RESISTANCE : R
STATIC DRAIN-SOURCE ON-STATE
0
02468
GATE-SOURCE VOLTAGE : VGS[V]
Fig.12 Static Drain-Source On-State Resistance vs. Gate Source Voltage
1000
Ta=25°C
f=1MHz V
=0V
GS
100
10
CAPACITANCE : C [pF]
C
rss
C
oss
1
0.01 0.1 1 10 100
C
iss
DRAIN-CURRENT : ID[A]
Fig.13 Switching Characteristics
TOTAL GATE CHARGE : Qg [nC]
Fig.14 Typical Capacitance vs. Drain-Source Voltage
DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.15 Typical Capacitance vs. Drain-Source Voltage
4/5
2010.07 - Rev.A
Data Sheet
www.rohm.com ©2010 ROHM Co., Ltd. All rights reserved.
RYM002N05
F
it
S
%
V V
Measurement circuits
V
GS
D.U.T.
R
G
ig.1-1 Switching time measurement circu
D
I
V
D
R
L
V
DD
GS DS
t
Pulse width
50%
10%
10% 10%
d(on)
t
on
90%
50%
90% 90
t
d(off)
t
r
t
off
Fig.1-2 Switching waveforms
t
f
Notice
This product might cause chip aging and breakdown under the large electrified environment. Please consider to design ESD protection circuit.
5/5
2010.07 - Rev.A
Notes
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