Datasheet RW1E015RP Datasheet (ROHM)

C
RW1E015RP
zStructure zDimensions (Unit : mm)
Silicon P-channel MOSFET
zFeatures
1) Low on-resistance.
2) Space saving, high power package.
3) Low voltage drive. (4V)
zApplications
Switching zInner circuit
zPackaging specifications
Type
RW1E015RP
Package Code Basic ordering unit (pieces)
Taping
T2R
8000
zAbsolute maximum ratings (Ta=25°C)
Parameter Drain-source voltage Gate-source voltage
Drain current
Source current (Body diode)
Total power dissipation Channel temperature Range of Storage temperature
1 Pw10µs, Duty cycle1%2 When mounted on a ceramic board
Continuous Pulsed Continuous Pulsed
Symbol
DSS GSS
D
DP
S
SP
D
Limits Unit
30 ±20
±1.5
1
±6
0.5
1
6
2
0.7
150
55 to +150
zThermal resistance
Parameter
hannel to ambient
When mounted on a ceramic board.
Symbol Limits Unit
Rth(ch-a)
179
WEMT6
Abbreviated symbol : UJ
(6)
(1)
1 ESD PROTECTION DIODE2 BODY DIODE
VV VV AI AI AI AI
WP
°CTch °CTstg
°C / W
(6) (5) (4)
(1) (2) (3)
(5)
2
(2)
(4)
1
(1) Drain (2) Drain (3) Gate
(3)
(4) Source (5) Drain (6) Drain
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2009 ROHM Co., Ltd. All rights reserved.
2009.06 - Rev.A
zElectrical characteristics (Ta=25°C)
Parameter Symbol Gate-source leakage Drain-source breakdown voltage
V
(BR) DSS
Zero gate voltage drain current Gate threshold voltage
Static drain-source on-state resistance
V
R
Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge
Pulsed
zBody diode characteristics (Source-drain) (Ta=25°C)
Parameter Symbol
Pulsed
Min.−Typ. Max.
I
GSS
−±10 µAVGS=±20V, VDS=0V
30 −−VID= −1mA, VGS=0V
I
DSS
GS (th)
DS (on)
−−−1 µAV
1.0 −−2.5 V V
115 160 I
170 240 m
190 270 I
1.2 −−SV
Y
fs
C
C C
t
d (on)
t
d (off)
Q
Q
Q
230 pF V
iss
4033− pF V
oss
rss
t
r
t
f
g
gs
gd
12
8
40
13
3.2
1.2
0.7
−−nC
Min. Typ. Max.
V
SD
−−−1.2 V IS= −1.5A, VGS=0VForward voltage
pF f=1MHz
ns
ns
ns
ns
nC
nC
Unit
DS DS
= 1.5A, VGS= 10V
m
D
= 0.7A, VGS= 4.5V
I
D
= 0.7A, VGS= 4V
m
D
DS DS GS
VDD −15V
ID= 0.7A
GS
V
L
R R
G
=10
V
DD
I
= 1.5A
D
V
GS
Unit
Conditions
= 30V, VGS=0V = 10V, ID= 1mA
= 10V, ID= 1.5A = 10V =0V
= 10V
21.4
15V
R R
L
10
G
=10
= 5V
Conditions
Data Sheet RW1E015RP
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2009 ROHM Co., Ltd. All rights reserved.
2009.06 - Rev.A
V
V
V
V
zElectrical characteristics curves
3
2.5
[A]
D
2
1.5
1
DRAIN CURRENT : -I
0.5
0
00.20.40.60.81
DR AIN-SOU RCE VOLT AGE : -VDS[V]
Fi g.1 T ypic al Output Charac teri stic s(Ⅰ) Fi g.2 Typic al Output Char acteri stics (Ⅱ)
VGS= -10 VGS= -8.0 VGS= -4.5 VGS= -4.0
VGS= -3.0V
Ta=25°C Pulsed
3
2.5
[A]
D
2
1.5
1
DRAIN CURRENT : -I
0.5
0
024 6810
DRAIN-SOURCE VOLTAGE : -V
VGS= -10V
VGS= -3.0V
VGS= -4.5V V
= -4.0V
GS
VGS= -2.8V
Ta= 25°C Pulsed
DS
Data Sheet RW1E015RP
10
VDS= -10V Pulsed
[A]
D
1
Ta= 125°C
Ta= 75°C
0.1 Ta= 25°C
Ta= - 25°C
DRAIN CURRENT : -I
0.01
0.001 01234
[V]
GATE- SOURC E VOLTAGE : - VGS[V]
Fi g.3 Typic al Tr ansfer Charac teris tics
1000
Ta= 25°C Pulsed
]
(on)[m
DS
100
RESIST ANCE : R
STATIC DRAIN- SOURC E ON-STAT E
10
0.1110
DRAIN-CURRENT : -I
Fi g.4 St atic D rain -Sourc e On-St ate
Resistance vs. Drain Cur rent(Ⅰ)
1000
VGS= -4.0V Pulsed
]
(on)[m
DS
100
RESIST ANCE : R
STATIC DRAIN- SOURC E ON-STAT E
10
0.1 1 10
DRAIN-CURRENT : -ID[A]
Fi g.7 St atic D rain -Sourc e On-St ate
Resistance vs. Drain Cur rent(Ⅳ)
VGS= -4.0V V
= -4.5V
GS
V
= -10V
GS
[A]
D
Ta=125°C Ta=75°C Ta=25°C Ta= -25°C
1000
VGS= -10V
]
Pulsed
(on)[m
DS
100
RESISTANCE : R
STATIC DRAIN-SOURCE ON-STATE
10
0.1 1 10
DRAIN-CURRENT : -ID[A]
Fi g.5 Stati c Drai n-Sourc e On-State
Resistance vs. Drain Cur rent(Ⅱ)
10
VDS= -10V Pulsed
1
0.1
0.01 0.1 1 10
FOR WARD TRAN SFER ADM ITTAN CE : |Yfs| [S]
DRAIN-CURRENT : -ID[A]
Fig.8 Forward Transfer Admittance vs. Drain Curr ent
Ta=125°C Ta=75°C Ta=25°C Ta= -25°C
Ta= -25°C Ta= 25°C Ta= 75°C Ta= 125°C
1000
VGS= -4.5V
]
Pulsed
(on)[m
DS
100
RESIST ANCE : R
STATIC DRAIN-SOURCE ON-STATE
10
0.1 1 10
DRAIN-CURRENT : -ID[A]
Fi g.6 Stati c Drai n-Sourc e On-State
Resistance vs. Drain Cur rent(Ⅲ)
10
VGS=0V Pulsed
1
0.1
REVERSE DRAIN CURRENT : -Is [A]
0.01
00.511.5
SOURCE-DRAIN VOLTAGE : -VSD [V]
Fi g.9 Revers e Drai n Curr ent vs. Sourse-D rain Voltage
Ta=125°C Ta=75°C Ta=25°C Ta= -25°C
Ta=125°C Ta=75°C Ta=25°C Ta= -25°C
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2009 ROHM Co., Ltd. All rights reserved.
2009.06 - Rev.A
Fig.1-1 Switching Time Measurement Circuit
%
V
V
F
it
V
Data Sheet RW1E015RP
500
]
400
(ON)[m
DS
300
200
RESISTAN CE : R
100
STATIC DRAIN- SOURC E ON-STAT E
0
0 5 10 15
Fi g.10 Stati c Dr ain-Sour ce On-Stat e Resistance vs. Gate Source Voltage
ID= -1.5A
ID= -0.7A
GATE- SOURCE VOLTAGE : -VGS[V]
1000
100
CAPACITANCE : C [pF]
Ta=25°C f=1M Hz V
=0V
GS
10
0.01 0.1 1 10 100
DRAIN-SOURCE VOLTAGE : -V
Fi g.13 T ypi cal C apacitanc e vs. Drain-Source Voltag e
zMeasurement circuit
V
GS
I
D
D.U.T.
R
G
Crss
Coss
Ta=25°C Puls ed
Ciss
[V]
DS
R
L
V
DD
1000
td(off)
100
td(on)
10
SWITC HING TIME : t [ns]
1
0.01 0. 1 1 10
Fig.11 Switching Characteristics
t
f
DRAIN-CURRENT : -ID[A]
Ta= 25°C
= -15V
V
DD
V
= -10V
GS
=10
R
G
Pulsed
t
r
10
[V]
GS
8
6
4
2
GATE-SO URCE VOLTAGE : - V
0
01234567
TOTAL GATE CH ARGE : Qg [nC]
Fi g.12 D ynamic Input Charac teris tics
Ta= 25°C V
DD
= -1.5A
I
D
R
G
Pulsed
= -15V
=10
Pulse Width
GS
V
DS
10%
50%
90%
50%
10% 10
DS
t
90% 90%
d(on)
tr
t
on
t
d(off)
tf
t
off
D
I
D.U.T.
I
G(Const)
V
GS
R
G
ig.2-1 Gate Charge Measurement Circu
zNotice
This product might cause chip aging and breakdown under the large electrified environment. Please consider to design ESD protection circuit.
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2009 ROHM Co., Ltd. All rights reserved.
Fig.1-2 Switching Waveforms
V
G
V
DS
R
L
V
DD
GS
QgsQ
Q
g
gd
Charge
Fig.2-2 Gate Charge Waveform
2009.06 - Rev.A
Notes
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