ROHM RTF015N03 Technical data

C
RTF015N03
zStructure zDimensions (Unit : mm) Silicon N-channel MOSFET
zFeatures
1) Low On-resistance.
2) Space saving, small surface mount package (TUMT3).
3) Low voltage drive (2.5V drive).
zApplications
Switching
zPackaging specifications zInner circuit
TUMT3
(1) Gate (2) Source (3) Drain
2.0
0.3
(3)
1.7 0.20.2
(1)
(2)
0.65 0.65
1.3
Abbreviated symbol : PP
0.85Max.
2.1
0.77
0.2Max.
0~0.1
0.17
Type
Package Code Basic ordering unit (pieces)
Taping
TL
3000
RTF015N03
zAbsolute maximum ratings (Ta=25°C)
Parameter Drain-source voltage Gate-source voltage
Drain current
Source current (Body diode)
Total power dissipation Channel temperature Range of storage temperature
1 Pw10µs, Duty cycle1%2 Mounted on a ceramic board
Continuous Pulsed Continuous Pulsed
Symbol
zThermal resistance
Parameter
hannel to ambient
Mounted on a ceramic board
Symbol Limits Unit
(3)
(1)
1
1 ESD PROTECTION DIODE2 BODY DIODE
2
(2)
(1) Gate (2) Source (3) Drain
Limits Unit
DSS GSS
D
DP
S
SP
D
1
12
30 12
±1.5 ±6.0
0.6
6.0
0.8
150
55 to +150
VV VV AI AI AI AI
WP
°CTch °CTstg
156
°C/WRth(ch-a)
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2009 ROHM Co., Ltd. All rights reserved.
1/3
2009.03 - Rev.A
RTF015N03
zElectrical characteristics (Ta=25°C)
Parameter Symbol Gate-source leakage Drain-source breakdown voltage
V
(BR) DSS
Zero gate voltage drain current Gate threshold voltage
Static drain-source on-state resistance
V
R
Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge
Pulsed
zBody diode characteristics (Source-drain) (Ta=25°C)
Parameter Symbol
I
GSS
I
DSS
GS (th)
DS (on)
Y
fs
C
iss
C
oss
C
rss
t
d (on)
t
r
t
d (off)
t
f
Q
Q
gs
Q
gd
V
SD
g
Min.−Typ. Max.
Unit
Conditions
10 µAVGS=12V, VDS=0V
30 −−VID= 1mA, VGS=0V
−−1 µAV
0.5 1.5 V V
170 240 I
m
180 250 mΩ
240 340 I
m
1.5 −−SV
80 pF V
1412− pF V
−−nC
Min. Typ. Max.
pF f=1MHz
7
ns
9
ns
15
ns
6
ns
1.6
2.2 nC
0.5
nC
0.3
Unit
= 30V, VGS=0V
DS
= 10V, ID= 1mA
DS
= 1.5A, VGS= 4.5V
D
I
= 1.5A, VGS= 4V
D
= 1.5A, VGS= 2.5V
D
= 10V, ID= 1.5A
DS
= 10V
DS
=0V
GS
VDD 15V
ID= 0.75A
GS
= 4.5V
V
L
=20
R
G
=10
R
15V
V
GS
V
DD
I
= 1.5A
D
L
=10 RG=10
R
Conditions
−−1.2 V IS= 0.6A, VGS=0VForward voltage
= 4.5V
Data Sheet
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2009 ROHM Co., Ltd. All rights reserved.
2/3
2009.03 - Rev.A
RTF015N03
zElectrical characteristics curves
1000
100
td(off)
Ta=25°C
DD
=15V
V V
GS
=4.5V
R
G
=10
tf
Pulsed
(V)
GS
6
5
4
3
Ta=25°C
DD
=15V
V I
D
=1.5A
R
G
=10
Pulsed
(A)
D
Data Sheet
10
1
0.1
Ta=125°C
75°C 25°C
25°C
VDS=10V Pulsed
10
td(on)
SWITCHING TIME : t (ns)
1
0.01
tr
0.1 1 10
DRAIN CURRENT : ID (A)
Fig.1 Switching Characteristics
1.0
0.9
(m)
0.8
DS
0.7
0.6
0.5
0.4
0.3
0.2
0.1
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
0.0 0
12 103456789
GATE-SOURCE VOLTAGE : VGS (V)
Fig.4 Static Drain-Source
On-State Resistance vs.
Gate source Voltage
10
()
DS (on)
Ta=25°C Pulsed
VGS=4.0V Pulsed
2
1
GATE-SOURCE VOLTAGE : V
0
0 0.5
1 1.5 2
TOTAL GATE CHARGE : Qg (nC)
Fig.2 Dynamic Input Characteristics
10
(A)
S
0.1
Ta=125°C
1
75°C 25°C
25°C
SOURCE CURRENT : I
0.01
0.0
0.5 1.0 1.5
SOURCE-DRAIN VOLTAGE : VSD (V)
Fig.5 Source Current vs.
Source-Drain Voltage
10
()
DS (on)
VGS=0V Pulsed
VGS=2.5V Pulsed
0.01
DRAIN CURRENT : I
0.001
0.0
0.5 1.0 2.01.5 2.5
GATE-SOURCE VOLTAGE : VGS (V)
Fig.3 Typical Transfer Characteristics
10
()
DS (on)
Ta=125°C
1
75°C 25°C
25°C
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
0.1
0.01
0.1 1 10
DRAIN CURRENT : ID (A)
Fig.6 Static Drain-Source
On-State Resistance
vs. Drain Current ( Ι )
10
()
DS (on)
Ta=25°C Pulsed
VGS=4.5V Pulsed
Ta=125°C
1
75°C 25°C
25°C
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
0.1
0.01
0.1 1 10
DRAIN CURRENT : ID (A)
Fig.7 Static Drain-Source
On-State Resistance
vs. Drain Current ( ΙΙ )
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2009 ROHM Co., Ltd. All rights reserved.
Ta=125°C
1
75°C 25°C
25°C
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
0.1
0.01
0.1 1 10
DRAIN CURRENT : ID (A)
Fig.8 Static Drain-Source
On-State Resistance
vs. Drain Current ( ΙΙΙ )
3/3
1
VGS=2.5V
VGS=4V
VGS=4.5V
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
0.1
0.01
0.1 1 10
DRAIN CURRENT : ID (A)
Fig.9 Static Drain-Source
On-State Resistance
vs. Drain Current ( Ι )
2009.03 - Rev.A
Appendix
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wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM
upon request.
Examples of application circuits, circuit constants and any other information contained herein illustrate the
standard usage and operations of the Products. The peripheral conditions must be taken into account
when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document. However, should
you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no re-
sponsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and examples
of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to
use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no re-
sponsibility whatsoever for any dispute arising from the use of such technical information.
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Please be sure to implement in your equipment using the Products safety measures to guard against the
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Notes
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Appendix-Rev4.1
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