ROHM RSR020N06 Technical data

Datasheet

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© 2012 ROHM Co., Ltd. All rights reserved.

RSR020N06

Nch 60V 2A Power MOSFET

Range of storage temperature

T

stg

-55 to +150

°C

P

D

*4

0.54

W

Power dissipation
Junction temperature

T

j

150

°C

Gate - Source voltage

V

GSS

20VP

D

*3

1.0

W

Continuous drain current

I

D

*1

2

A

Pulsed drain current

I

D,pulse

*2

8

A

Drain - Source voltage

V

DSS

60

V

Taping code

TL

Marking

PZ

lAbsolute maximum ratings(Ta = 25°C)

Parameter

Symbol

Value

Unit

lPackaging specifications

Type

Packaging

Taping

lApplication

Reel size (mm)

180

DC/DC converters

Tape width (mm)

8

Basic ordering unit (pcs)

3,000

lFeatures

lInner circuit

1) Low on - resistance.

2) Built-in G-S Protection Diode.

3) Small Surface Mount Package (TSMT3).

4) Pb-free lead plating ; RoHS compliant

lOutline

V

DSS

60V

R

DS(on)

(Max.)

170mW

I

D

2A

P

D

1.0W

TSMT3

(1)

(2)

(3)

(1) Gate

(2) Source

(3) Drain

*1 ESD PROTECTION DIODE
*2 BODY DIODE

1/11

2012.06 - Rev.B

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© 2012 ROHM Co., Ltd. All rights reserved.

Data Sheet

RSR020N06

*1 Limited only by maximum temperature allowed.

*2 Pw  10ms, Duty cycle  1%

*3 Mounted on a ceramic board (30×30×0.8mm)
*4 Mounted on a FR4 (12×20×0.8mm)

lThermal resistance

Parameter

Symbol

Values

Unit
Min.

Typ.

Max.

Thermal resistance, junction - ambient

R

thJA

*4

--231

°C/W

Thermal resistance, junction - ambient

R

thJA

*3

--125

°C/W

lElectrical characteristics(Ta = 25°C)

Parameter

Symbol

Conditions

Values

Unit
Min.

Typ.

Max.

V

Breakdown voltage
temperature coefficient

ΔV

(BR)DSS

ΔT

j

ID = 1mA
referenced to 25°C

-67-

mV/°C

Drain - Source breakdown
voltage

V

(BR)DSS

V

GS

= 0V, ID = 1mA

60--

mA

Gate - Source leakage current

I

GSS

V

GS

= 20V, V

DS

= 0V

-

-

10

mA

Zero gate voltage drain current

I

DSS

V

DS

= 60V, V

GS

= 0V

--1

V

Gate threshold voltage
temperature coefficient

ΔV

(GS)th

ΔT

j

ID = 1mA
referenced to 25°C

-

-4.4

-

mV/°C

Gate threshold voltage

V

GS (th)

V

DS

= 10V, ID = 1mA

1.0-2.5

Static drain - source
on - state resistance

R

DS(on)

*5

VGS=10V, ID=2A

-

120

170-220

310

mW

VGS=4.5V, ID=2A

-

140

195

VGS=4.0V, ID=2A

-

150

210

VGS=10V, ID=2A, Tj=125°C

W

Transconductance

gfs

*5

V

DS

= 10V, ID = 2A

1.3

3.0-S

Gate input resistannce

R

G

f = 1MHz, open drain

-

3.0

-

2/11

2012.06 - Rev.B

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Data Sheet

RSR020N06

*5 Pulsed

lElectrical characteristics(Ta = 25°C)

Parameter

Symbol

Conditions

Values

Unit
Min.

Typ.

Max.

pF

Output capacitance

C

oss

V

DS

= 10V

-50-

Reverse transfer capacitance

C

rss

f = 1MHz

Input capacitance

C

iss

V

GS

= 0V

-

180--22-

Turn - on delay time

t

d(on)

*5

V

DD

⋍ 30V, V

GS

= 10V

-6-

ns

Rise time

t

r

*5

ID = 1.0A

-10-

Turn - off delay time

t

d(off)

*5

RL = 30W

-20-

Fall time

t

f

*5

RG = 10W

-6-

lGate Charge characteristics(Ta = 25°C)

Parameter

Symbol

Conditions

Values

Unit
Min.

Typ.

Max.

nC

V

DD

⋍ 30V, ID = 2A

VGS = 10V

-

4.9

-

Gate - Source charge

Q

gs

*5

V

DD

⋍ 30V, ID = 2A

VGS = 5V

V

DD

⋍ 30V, ID = 2A

VGS = 5V

-

2.7

-

Typ.

Max.

-

1.0

-

Gate - Drain charge

Q

gd

*5

-

0.6

-

Total gate charge

Q

g

*5

A

Forward voltage

V

SD

*5

V

GS

= 0V, Is = 2A

--1.2

V

Inverse diode continuous,
forward current

IS

*1

Ta = 25°C

--0.8

lBody diode electrical characteristics (Source-Drain)(Ta = 25°C)

Parameter

Symbol

Conditions

Values

Unit
Min.

3/11

2012.06 - Rev.B

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© 2012 ROHM Co., Ltd. All rights reserved.

Data Sheet

RSR020N06

lElectrical characteristic curves

0.1

1

10

100

1000

0.0001 0.01 1 100

T

a

= 25ºC

Single Pulse

0.01

0.1

1

10

0.1 1 10 100

DC Operation

T

a

= 25ºC

Single Pulse
Mounted on ceramic board.
(30mm ×

30mm ×

0.8mm)

Operation in this area

is limited by RDS(on)

(VGS = 10V)

PW = 100μs

PW = 1ms

PW = 10ms

0

20

40

60

80

100

120

0 50 100 150 200

Fig.1 Power Dissipation Derating Curve

Power Dissipation : P

D

/P

D

max. [%]

Junction Temperature : Tj [°C]

Fig.2 Maximum Safe Operating Area

Drain Current : I

D

[A]

Drain - Source Voltage : VDS [V]

Fig.3 Normalized Transient Thermal
Resistance vs. Pulse Width

Normalized Transient Thermal Resistance : r

(t)

Pulse Width : PW [s]

Fig.4 Single Pulse Maxmum Power dissipation

Peak Transient Power : P(W)

Pulse Width : PW [s]

0.001

0.01

0.1

1

10

0.0001 0.01 1 100

T

a

=25ºC

Single Pulse

Rth(ch

-a)=125ºC/W

Rth(ch

-a)(t)=r(t)×Rth(ch-a)

Mounted on ceramic board.
(30mm ×

30mm × 0.8mm)

top D=1

D=0.5
D=0.1
D=0.05
D=0.01

bottom Signle

4/11

2012.06 - Rev.B