
Datasheet
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RRL025P03
Pch -30V -2.5A Power MOSFET
Range of storage temperature
Power dissipation
Gate - Source voltage
l
Absolute maximum ratings(T
a
= 25°C)
l
Packaging specifications
Basic ordering unit (pcs)
2) Built-in G-S Protection Diode.
3) Small Surface Mount Package (TUMT6).
4) Pb-free lead plating ; RoHS compliant
(1)
(2)
(3)
(4)
(5)
(6)
*1 ESD PROTECTION DIODE
*2 BODY DIODE
(2) Drain
(3) Gate
(4) Source
(5) Drain
(6) Drain

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Data Sheet
*1 Limited only by maximum temperature allowed.
*2 Pw 10ms, Duty cycle 1%
*3 Mounted on a seramic board (30×30×0.8mm)
*4 Mounted on a FR4 (15×20×0.8mm)
*5 Pulsed
VGS= -10V, ID= -2.5A, Tj=125°C
Static drain - source
on - state resistance
Gate threshold voltage
temperature coefficient
ID= -1mA
referenced to 25°C
Gate - Source leakage current
Zero gate voltage drain current
Breakdown voltage
temperature coefficient
ID= -1mA
referenced to 25°C
Drain - Source breakdown
voltage
lElectrical characteristics(T
a
= 25°C)
Thermal resistance, junction - ambient

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Data Sheet
Inverse diode continuous,
forward current
lBody diode electrical characteristics (Source-Drain)(T
a
= 25°C)
V
DD
⋍ -15V, ID= -2.5A
VGS = -5V
V
DD
⋍ -15V, ID= -2.5A
VGS = -5V
V
DD
⋍ -15V, ID= -2.5A
VGS = -10V
lGate Charge characteristics(T
a
= 25°C)
Reverse transfer capacitance
lElectrical characteristics(T
a
= 25°C)

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Data Sheet
lElectrical characteristic curves
1
10
100
1000
0.0001 0.01 1 100
0.01
0.1
1
10
100
0.1 1 10 100
Single Pulse
Mounted on a ceramic board.
(30mm × 30mm × 0.8mm)
0
20
40
60
80
100
120
0 50 100 150 200
0.001
0.01
0.1
1
10
0.0001 0.01 1 100
Mounted on ceramic board
(30mm × 30mm × 0.8mm)
D=0.05
D=0.01
bottom Signle
Fig.1 Power Dissipation Derating Curve
Fig.2 Maximum Safe Operating Area
Power Dissipation : P
D
/P
D
max. [%]
Drain Current : -I
D
[A]
Fig.3 Normalized Transient Thermal
Resistance vs. Pulse Width
Fig.4 Single Pulse Maxmum Power
dissipation
Normalized Transient Thermal Resistance : r
(t)
Pulse Width : PW [s] Pulse Width : PW [s]
Peak Transient Power : P(W)
Junction Temperature : Tj [°C]
Drain - Source Voltage : -VDS [V]

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Data Sheet
lElectrical characteristic curves
0
0.5
1
1.5
2
2.5
3
0 0.2 0.4 0.6 0.8 1
VGS= -3.2V
VGS= -2.8V
VGS= -10V
VGS= -4.5V
VGS= -3.0V
VGS= -3.8V
VGS= -2.5V
Ta=25ºC
Pulsed
0
0.5
1
1.5
2
2.5
3
0 2 4 6 8 10
VGS= -3.2V
VGS= -10V
VGS= -4.5V
VGS= -3.6V
VGS= -3.0V
VGS= -2.8V
Ta=25ºC
Pulsed
0.001
0.01
0.1
1
10
0 1 2 3 4
Ta= 125ºC
Ta= 75ºC
Ta= 25ºC
Ta= -25ºC
VDS= -10V
Pulsed
0
20
40
60
-50 0 50 100 150
V
GS
= 0V
ID = -1mA
pulsed
Fig.5 Typical Output Characteristics(I)
Drain Current : -I
D
[A]
Drain - Source Voltage : -VDS [V]
Fig.6 Typical Output Characteristics(II)
Drain Current : -I
D
[A]
Drain - Source Voltage : -VDS [V]
Fig.7 Breakdown Voltage
vs. Junction Temperature
Drain - Source Breakdown Voltage : -V
(BR)DSS
[V]
Junction Temperature : Tj [°C]
Fig.8 Typical Transfer Characteristics
Gate - Source Voltage : -VGS [V]
Drain Current : -I
D
[A]

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Data Sheet
lElectrical characteristic curves
VDS= -10V
Pulsed
Ta= -25ºC
Ta=25ºC
Ta=75ºC
Ta=125ºC
0
100
200
300
0 2 4 6 8 10
ID= -3.0A
Ta=25ºC
Pulsed
ID= -1.5A
V
DS
= 10V
ID = -1mA
pulsed
0
0.2
0.4
0.6
0.8
1
1.2
-25 0 25 50 75 100 125 150
Fig.9 Gate Threshold Voltage
vs. Junction Temperature
Gate Threshold Voltage : -V
GS(th)
[V]
Junction Temperature : Tj [°C]
Fig.10 Transconductance vs. Drain Current
Transconductance : g
fs
[S]
Drain Current : -ID [A]
Fig.11 Drain CurrentDerating Curve
Drain Current Dissipation
: I
D
/I
D
max. (%)
Junction Temperature : Tj [ºC]
Fig.12 Static Drain - Source On - State
Resistance vs. Gate Source Voltage
Static Drain - Source On-State Resistance
: R
DS(on)
[mW]
Gate - Source Voltage : -VGS [V]

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Data Sheet
lElectrical characteristic curves
Ta=125ºC
Ta=75ºC
Ta=25ºC
Ta= -25ºC
VGS= -4.5V
Pulsed
Ta=125ºC
Ta=75ºC
Ta=25ºC
Ta= -25ºC
VGS= -10V
Pulsed
Ta=25ºC
Pulsed
VGS= -4.0V
VGS= -4.5V
VGS= -10V
0
20
40
60
80
100
120
-50 -25 0 25 50 75 100 125 150
V
GS
= -10V
ID = -2.5A
pulsed
Fig.13 Static Drain - Source On - State
Resistance vs. Drain Current(I)
Static Drain - Source On-State Resistance
: R
DS(on)
[mW]
Junction Temperature : Tj [ºC]
Fig.14 Static Drain - Source On - State
Resistance vs. Junction Temperature
Static Drain - Source On-State Resistance
: R
DS(on)
[mW]
Drain Current : -ID [A]
Fig.16 Static Drain-Source On-State
Resistance vs. Drain Current(III)
Static Drain - Source On-State Resistance
: R
DS(on)
[mW]
Drain Current : -ID [A]
Fig.15 Static Drain - Source On - State
Resistance vs. Drain Current(II)
Static Drain - Source On-State Resistance
: R
DS(on)
[mW]
Drain Current : -ID [A]

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Data Sheet
lElectrical characteristic curves
1
10
100
1000
0.01 0.1 1 10
tr
tf
t
d(on)
Ta=25ºC
VDD= -15V
VGS= -10V
RG=10W
Pulsed
t
d(off)
Fig.19 Switching Characteristics
Ta=125ºC
Ta=75ºC
Ta=25ºC
Ta= -25ºC
VGS= -4.0V
Pulsed
10
100
1000
0.01 0.1 1 10 100
C
oss
C
rss
C
iss
Ta=25ºC
f=1MHz
VGS=0V
0
2
4
6
8
10
0 2 4 6 8 10
Ta=25ºC
VDD= -15V
ID= -2.5A
RG=10W
Pulsed
Fig.17 Static Drain - Source On - State
Resistance vs. Drain Current(IV)
Static Drain - Source On-State Resistance
: R
DS(on)
[mW]
Drain Current : -ID [A]
Fig.18 Typical Capacitance
vs. Drain - Source Voltage
Capacitance : C [pF]
Drain - Source Voltage : -VDS [V]
Drain Current : -ID [A]
Fig.20 Dynamic Input Characteristics
Gate - Source Voltage : -V
GS
[V]
Total Gate Charge : Qg [nC]

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Data Sheet
lElectrical characteristic curves
0.01
0.1
1
10
0 0.2 0.4 0.6 0.8 1 1.2
VGS=0V
Pulsed
Ta=125ºC
Ta=75ºC
Ta=25ºC
Ta= -25ºC
Fig.21 Source Current
vs. Source Drain Voltage
Source Current : -I
S
[A]
Source-Drain Voltage : -VSD [V]

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Data Sheet
Fig.1-1 Switching Time Measurement Circuit
Fig.1-2 Switching Waveforms
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform

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Data Sheet
Patterm of terminal position areas
E
H
D
e
b
x S A
L
c
Lp
y
S
A1 A2
A
S
e1
b2
l1
e
A
E
MIN MAX MIN MAX
A - 0.85 - 0.033
A1 0.00 0.10 0 0.004
A2 0.72 0.82 0.028 0.032
b 0.25 0.40 0.01 0.016
c 0.12 0.22 0.005 0.009
D 1.90 2.10 0.075 0.083
E 1.60 1.80 0.063 0.071
e
L
Lp - 0.40 - 0.016
x - 0.10 - 0.004
y - 0.10 - 0.004
MIN MAX MIN MAX
e1
b2 - 0.50 - 0.02
l1 - 0.50 - 0.02

Notes
1)
The information contained herein is subject to change without notice.
2)
Before you use our Products, please contact our sales representative and verify the latest specifications :
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Although ROHM is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
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ROHM.
4)
Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
5)
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
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A