Datasheet RRL025P03 Datasheet (ROHM)

Datasheet
www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved.
RRL025P03
Pch -30V -2.5A Power MOSFET
T
j
150
°C
Range of storage temperature
T
stg
-55 to +150
°C
Power dissipation Gate - Source voltage
V
GSS
20
V
P
D
*3
1.0
W
P
D
*4
0.32
W
Continuous drain current
I
D
*1
2.5
A
Pulsed drain current
I
D,pulse
*2
10
A
Drain - Source voltage
V
DSS
-30
V
Taping code
TR
Marking
UA
l
Absolute maximum ratings(T
a
= 25°C)
Parameter
Symbol
Value
Unit
l
Packaging specifications
Type
Packaging
Taping
l
Application
Reel size (mm)
180
DC/DC converters
Tape width (mm)
8
Basic ordering unit (pcs)
3,000
l
Features
l
Inner circuit
1) Low on - resistance.
2) Built-in G-S Protection Diode.
3) Small Surface Mount Package (TUMT6).
4) Pb-free lead plating ; RoHS compliant
l
Outline
V
DSS
-30V
TUMT6
R
DS(on)
(Max.)
75mW
I
D
-2.5A
P
D
1.0W
(1)
(2)
(3)
(4)
(5)
(6)
*1 ESD PROTECTION DIODE *2 BODY DIODE
(1) Drain
(2) Drain (3) Gate (4) Source (5) Drain (6) Drain
1/11
2013.02 - Rev.B
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Data Sheet
RRL025P03
*1 Limited only by maximum temperature allowed.
*2 Pw 10ms, Duty cycle 1%
*3 Mounted on a seramic board (30×30×0.8mm)
*4 Mounted on a FR4 (15×20×0.8mm)
*5 Pulsed
W
Transconductance
gfs
*5
VDS= -10V, ID= -2.5A
2.0
4.4-S
Gate input resistannce
R
G
f = 1MHz, open drain
-24-
mW
VGS= -4.5V, ID= -1.2A
-85115
VGS= -4.0V, ID= -1.2A
-95125
VGS= -10V, ID= -2.5A, Tj=125°C
Static drain - source on - state resistance
R
DS(on)
*5
VGS= -10V, ID= -2.5A
-5575-95
135
V
Gate threshold voltage temperature coefficient
ΔV
(GS)th
ΔT
j
ID= -1mA referenced to 25°C
-
3.9
-
mV/°C
Gate threshold voltage
V
GS (th)
V
DS
= -10V, ID = -1mA
-1--2.5
mA
Gate - Source leakage current
I
GSS
V
GS
= 20V, V
DS
= 0V
-
-
10
mA
Zero gate voltage drain current
I
DSS
V
DS
= -30V, V
GS
= 0V
-
-
-1
V
Breakdown voltage temperature coefficient
ΔV
(BR)DSS
ΔT
j
ID= -1mA referenced to 25°C
-
-25
-
mV/°C
Drain - Source breakdown voltage
V
(BR)DSS
V
GS
= 0V, ID = -1mA
-30
-
-
lElectrical characteristics(T
a
= 25°C)
Parameter
Symbol
Conditions
Values
Unit
Min.
Typ.
Max.
lThermal resistance
Parameter
Symbol
Values
Unit Min.
Typ.
Max.
R
thJA
*4
--391
°C/W
R
thJA
*3
--125
°C/W
Thermal resistance, junction - ambient
2/11
2013.02 - Rev.B
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Data Sheet
RRL025P03
-
-1.2
V
A
Inverse diode continuous, forward current
IS
*1
Ta = 25°C
-
-
-0.8
Forward voltage
V
SD
*5
V
GS
= 0V, Is = -2.5A
-
Min.
Typ.
Max.-1.6
-
Gate - Drain charge
Q
gd
*5
-
1.6
-
lBody diode electrical characteristics (Source-Drain)(T
a
= 25°C)
Parameter
Symbol
Conditions
Values
Unit
nC
Gate - Source charge
Q
gs
*5
V
DD
-15V, ID= -2.5A
VGS = -5V
Total gate charge
Q
g
*5
V
DD
-15V, ID= -2.5A
VGS = -5V
V
DD
-15V, ID= -2.5A
VGS = -10V
-
5.2--12-
-
lGate Charge characteristics(T
a
= 25°C)
Parameter
Symbol
Conditions
Values
Unit Min.
Typ.
Max.
Turn - on delay time
t
d(on)
*5
V
DD
-15V, V
GS
= -10V
-7-
ns
Rise time
t
r
*5
ID = -1.2A
-16-
Turn - off delay time
t
d(off)
*5
RL = 12.5W
-50-
Fall time
t
f
*5
RG = 10W
-
33
pF
Output capacitance
C
oss
V
DS
= -10V
-70-
Reverse transfer capacitance
C
rss
f = 1MHz
Input capacitance
C
iss
V
GS
= 0V
-
480--70-
lElectrical characteristics(T
a
= 25°C)
Parameter
Symbol
Conditions
Values
Unit Min.
Typ.
Max.
3/11
2013.02 - Rev.B
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Data Sheet
RRL025P03
lElectrical characteristic curves
1
10
100
1000
0.0001 0.01 1 100
Ta=25ºC Single Pulse
0.01
0.1
1
10
100
0.1 1 10 100
Operation in this area
is limited by RDS(on)
( VGS = 10V )
PW = 100ms
PW = 1ms
PW = 10ms
DC Operation
T
a
=25ºC
Single Pulse Mounted on a ceramic board. (30mm × 30mm × 0.8mm)
0
20
40
60
80
100
120
0 50 100 150 200
0.001
0.01
0.1
1
10
0.0001 0.01 1 100
Rth(ch
-a)=125ºC/W
Rth(ch
-a)(t)=r(t)×Rth(ch-a)
Mounted on ceramic board (30mm × 30mm × 0.8mm)
top D=1
D=0.5 D=0.1
D=0.05 D=0.01 bottom Signle
Ta=25ºC Single Pulse
Fig.1 Power Dissipation Derating Curve
Fig.2 Maximum Safe Operating Area
Power Dissipation : P
D
/P
D
max. [%]
Drain Current : -I
D
[A]
Fig.3 Normalized Transient Thermal Resistance vs. Pulse Width
Fig.4 Single Pulse Maxmum Power
dissipation
Normalized Transient Thermal Resistance : r
(t)
Pulse Width : PW [s] Pulse Width : PW [s]
Peak Transient Power : P(W)
Junction Temperature : Tj [°C]
Drain - Source Voltage : -VDS [V]
4/11
2013.02 - Rev.B
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Data Sheet
RRL025P03
lElectrical characteristic curves
0
0.5
1
1.5
2
2.5
3
0 0.2 0.4 0.6 0.8 1
VGS= -3.2V
VGS= -2.8V
VGS= -10V VGS= -4.5V
VGS= -3.0V
VGS= -3.8V
VGS= -2.5V
Ta=25ºC Pulsed
0
0.5
1
1.5
2
2.5
3
0 2 4 6 8 10
VGS= -3.2V
VGS= -10V VGS= -4.5V VGS= -3.6V
VGS= -3.0V
VGS= -2.8V
Ta=25ºC Pulsed
0.001
0.01
0.1
1
10
0 1 2 3 4
Ta= 125ºC Ta= 75ºC Ta= 25ºC Ta= -25ºC
VDS= -10V Pulsed
0
20
40
60
-50 0 50 100 150
V
GS
= 0V ID = -1mA pulsed
Fig.5 Typical Output Characteristics(I)
Drain Current : -I
D
[A]
Drain - Source Voltage : -VDS [V]
Fig.6 Typical Output Characteristics(II)
Drain Current : -I
D
[A]
Drain - Source Voltage : -VDS [V]
Fig.7 Breakdown Voltage vs. Junction Temperature
Drain - Source Breakdown Voltage : -V
(BR)DSS
[V]
Junction Temperature : Tj [°C]
Fig.8 Typical Transfer Characteristics
Gate - Source Voltage : -VGS [V]
Drain Current : -I
D
[A]
5/11
2013.02 - Rev.B
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Data Sheet
RRL025P03
lElectrical characteristic curves
0.1
1
10
0.1 1 10
VDS= -10V Pulsed
Ta= -25ºC Ta=25ºC Ta=75ºC Ta=125ºC
0
100
200
300
0 2 4 6 8 10
ID= -3.0A
Ta=25ºC Pulsed
ID= -1.5A
0
1
2
3
-50 0 50 100 150
V
DS
= 10V ID = -1mA pulsed
0
0.2
0.4
0.6
0.8
1
1.2
-25 0 25 50 75 100 125 150
Fig.9 Gate Threshold Voltage vs. Junction Temperature
Gate Threshold Voltage : -V
GS(th)
[V]
Junction Temperature : Tj [°C]
Fig.10 Transconductance vs. Drain Current
Transconductance : g
fs
[S]
Drain Current : -ID [A]
Fig.11 Drain CurrentDerating Curve
Drain Current Dissipation
: I
D
/I
D
max. (%)
Junction Temperature : Tj [ºC]
Fig.12 Static Drain - Source On - State Resistance vs. Gate Source Voltage
Static Drain - Source On-State Resistance
: R
DS(on)
[mW]
Gate - Source Voltage : -VGS [V]
6/11
2013.02 - Rev.B
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Data Sheet
RRL025P03
lElectrical characteristic curves
10
100
1000
0.1 1 10
Ta=125ºC Ta=75ºC Ta=25ºC Ta= -25ºC
VGS= -4.5V Pulsed
10
100
1000
0.1 1 10
Ta=125ºC Ta=75ºC Ta=25ºC Ta= -25ºC
VGS= -10V Pulsed
10
100
1000
0.1 1 10
Ta=25ºC Pulsed
VGS= -4.0V VGS= -4.5V VGS= -10V
0
20
40
60
80
100
120
-50 -25 0 25 50 75 100 125 150
V
GS
= -10V ID = -2.5A pulsed
Fig.13 Static Drain - Source On - State Resistance vs. Drain Current(I)
Static Drain - Source On-State Resistance
: R
DS(on)
[mW]
Junction Temperature : Tj [ºC]
Fig.14 Static Drain - Source On - State Resistance vs. Junction Temperature
Static Drain - Source On-State Resistance
: R
DS(on)
[mW]
Drain Current : -ID [A]
Fig.16 Static Drain-Source On-State
Resistance vs. Drain Current(III)
Static Drain - Source On-State Resistance
: R
DS(on)
[mW]
Drain Current : -ID [A]
Fig.15 Static Drain - Source On - State
Resistance vs. Drain Current(II)
Static Drain - Source On-State Resistance
: R
DS(on)
[mW]
Drain Current : -ID [A]
7/11
2013.02 - Rev.B
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Data Sheet
RRL025P03
lElectrical characteristic curves
Switching Time : t [ns]
1
10
100
1000
0.01 0.1 1 10
tr
tf
t
d(on)
Ta=25ºC VDD= -15V VGS= -10V RG=10W Pulsed
t
d(off)
Fig.19 Switching Characteristics
10
100
1000
0.1 1 10
Ta=125ºC Ta=75ºC Ta=25ºC Ta= -25ºC
VGS= -4.0V Pulsed
10
100
1000
0.01 0.1 1 10 100
C
oss
C
rss
C
iss
Ta=25ºC f=1MHz VGS=0V
0
2
4
6
8
10
0 2 4 6 8 10
Ta=25ºC VDD= -15V ID= -2.5A RG=10W Pulsed
Fig.17 Static Drain - Source On - State Resistance vs. Drain Current(IV)
Static Drain - Source On-State Resistance
: R
DS(on)
[mW]
Drain Current : -ID [A]
Fig.18 Typical Capacitance vs. Drain - Source Voltage
Capacitance : C [pF]
Drain - Source Voltage : -VDS [V]
Drain Current : -ID [A]
Fig.20 Dynamic Input Characteristics
Gate - Source Voltage : -V
GS
[V]
Total Gate Charge : Qg [nC]
8/11
2013.02 - Rev.B
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Data Sheet
RRL025P03
lElectrical characteristic curves
0.01
0.1
1
10
0 0.2 0.4 0.6 0.8 1 1.2
VGS=0V Pulsed
Ta=125ºC
Ta=75ºC Ta=25ºC
Ta= -25ºC
Fig.21 Source Current
vs. Source Drain Voltage
Source Current : -I
S
[A]
Source-Drain Voltage : -VSD [V]
9/11
2013.02 - Rev.B
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Data Sheet
RRL025P03
lMeasurement circuits
Fig.1-1 Switching Time Measurement Circuit
Fig.1-2 Switching Waveforms
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
10/11
2013.02 - Rev.B
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Data Sheet
RRL025P03
lDimensions (Unit : mm)
Dimension in mm/inches
TUMT6
Patterm of terminal position areas
E
H
D
e
b
x S A
L
c
Lp
y
S
A1 A2
A
S
e1
b2
l1
e
A
E
MIN MAX MIN MAX
A - 0.85 - 0.033 A1 0.00 0.10 0 0.004 A2 0.72 0.82 0.028 0.032
b 0.25 0.40 0.01 0.016
c 0.12 0.22 0.005 0.009
D 1.90 2.10 0.075 0.083
E 1.60 1.80 0.063 0.071
e
HE 2.00 2.20 0.079 0.087
L
Lp - 0.40 - 0.016
x - 0.10 - 0.004 y - 0.10 - 0.004
MIN MAX MIN MAX
e1
b2 - 0.50 - 0.02
l1 - 0.50 - 0.02
INCHES
0.65
0.03
DIM
MILIMETERS
0.20
0.01
DIM
MILIMETERS
INCHES
1.70
0.067
11/11
2013.02 - Rev.B
Notes
1)
The information contained herein is subject to change without notice.
2)
Before you use our Products, please contact our sales representative and verify the latest specifica­tions :
3)
Although ROHM is continuously working to improve product reliability and quality, semicon­ductors can break down and malfunction due to various factors. Therefore, in order to prevent personal injury or fire arising from failure, please take safety measures such as complying with the derating characteristics, implementing redundant and fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no responsibility for any damages arising out of the use of our Poducts beyond the rating specified by ROHM.
4)
Examples of application circuits, circuit constants and any other information contained herein are provided only to illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production.
5)
The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM or any other parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of such technical information.
6)
The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communi­cation, consumer systems, gaming/entertainment sets) as well as the applications indicated in this document.
7)
The Products specified in this document are not designed to be radiation tolerant.
8)
For use of our Products in applications requiring a high degree of reliability (as exemplified below), please contact and consult with a ROHM representative : transportation equipment (i.e. cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and power transmission systems.
9)
Do not use our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power control systems, and submarine repeaters.
10)
ROHM shall have no responsibility for any damages or injury arising from non-compliance with the recommended usage conditions and specifications contained herein.
11)
ROHM has used reasonable care to ensur the accuracy of the information contained in this document. However, ROHM does not warrants that such information is error-free, and ROHM shall have no responsibility for any damages arising from any inaccuracy or misprint of such information.
12)
Please use the Products in accordance with any applicable environmental laws and regulations, such as the RoHS Directive. For more details, including RoHS compatibility, please contact a ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations.
13)
When providing our Products and technologies contained in this document to other countries, you must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act.
14)
This document, in part or in whole, may not be reprinted or reproduced without prior consent of ROHM.
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