
Datasheet
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RRH040P03
Pch -30V -4A Power MOSFET
2) Built-in G-S Protection Diode.
3) Small Surface Mount Package (SOP8).
4) Pb-free lead plating ; RoHS compliant
lPackaging specifications
Basic ordering unit (pcs)
lAbsolute maximum ratings(Ta = 25°C)
Power dissipation
Gate - Source voltage
Avalanche energy, single pulse
Range of storage temperature
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(6) Drain
(7) Drain
(8) Drain
*1 ESD PROTECTION DIODE
*2 BODY DIODE
(2) Source
(3) Source
(4) Gate

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Data Sheet
*1 Limited only by maximum temperature allowed.
*2 Pw 10ms, Duty cycle 1%
*3 L ⋍ 10mH, V
DD
= -15V, Rg = 25W, starting Tj = 25C
*4 Mounted on a ceramic board (30×30×0.8mm)
*5 Mounted on a FR4 (20×20×0.8mm)
Thermal resistance, junction - ambient
Thermal resistance, junction - ambient
lElectrical characteristics(Ta = 25°C)
Breakdown voltage
temperature coefficient
ID = -1mA
referenced to 25°C
Drain - Source breakdown
voltage
Gate - Source leakage current
Zero gate voltage drain current
Gate threshold voltage
temperature coefficient
ID = -1mA
referenced to 25°C
Static drain - source
on - state resistance
VGS= -10V, ID= -4A, Tj=125°C

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Data Sheet
lElectrical characteristics(Ta = 25°C)
Reverse transfer capacitance
lGate Charge characteristics(Ta = 25°C)
V
DD
⋍ -15V, ID = -4A
VGS = -10V
V
DD
⋍ -15V, ID = -4A
VGS = -5V
V
DD
⋍ -15V, ID = -4A
VGS = -5V
lBody diode electrical characteristics (Source-Drain)(Ta = 25°C)
IS = -4A
di/dt = 100A / ms
Inverse diode continuous,
forward current

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Data Sheet
lElectrical characteristic curves
1
10
100
1000
0.0001 0.01 1 100
0.001
0.01
0.1
1
10
0.0001 0.01 1 100
Mounted on ceramic board
(30mm × 30mm × 0.8mm)
D=0.05
D=0.01
bottom Signle
Fig.1 Power Dissipation Derating Curve
Power Dissipation : P
D
/P
D
max. [%]
Junction Temperature : Tj [°C]
Fig.2 Maximum Safe Operating Area
Drain Current : -I
D
[A]
Drain - Source Voltage : -VDS [V]
Fig.3 Normalized Transient Thermal
Resistance vs. Pulse Width
Normalized Transient Thermal Resistance : r
(t)
Pulse Width : PW [s]
Fig.4 Avalanche Current vs. Power dissipation
Peak Transient Power : P(W)
Pulse Width : PW [s]
0
20
40
60
80
100
120
0 50 100 150 200
0.01
0.1
1
10
100
0.1 1 10 100
Single Pulse
Mounted on a ceramic board.
(30mm × 30mm × 0.8mm)

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Data Sheet
lElectrical characteristic curves
0
2
4
6
8
10
0 0.2 0.4 0.6 0.8 1
VGS= -2.5V
Ta= 25ºC
VGS= -3.0V
VGS= -10V
VGS= -4.5V
VGS= -4.0V
VGS= -3.5V
0
2
4
6
8
10
12
14
16
18
20
0 2 4 6 8 10
VGS= -3.0V
VGS= -10V
VGS= -4.0V
VGS= -3.5V
Ta= 25ºC
Fig.5 Avalanche Current vs Inductive Load
Avalanche Current : -I
AR
[A]
Coil Inductance : L [mH]
Fig.6 Avalanche Energy Derating Curve
vs Junction Temperature
Avalanche Energy : E
AS
/ E
AS
max. [%]
Junction Temperature : Tj [ºC]
Fig.7 Typical Output Characteristics(I)
Drain Current : -I
D
[A]
Drain - Source Voltage : -VDS [V]
Fig.8 Typical Output Characteristics(II)
Drain Current : -I
D
[A]
Drain - Source Voltage : -VDS [V]
0.01
0.1
1
10
100
0.01 0.1 1 10 100
0%
20%
40%
60%
80%
100%
120%
0 25 50 75 100 125 150 175

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Data Sheet
lElectrical characteristic curves
0.01
0.1
1
10
1 1.5 2 2.5 3
V
DS
= -10V
Ta = 125ºC
Ta = 75ºC
Ta = 25ºC
Ta = -25ºC
V
DS
= 10V
Ta = -25ºC
Ta = 25ºC
Ta = 75ºC
Ta = 125ºC
Fig.9 Breakdown Voltage
vs. Junction Temperature
Drain - Source Breakdown Voltage : V
(BR)DSS
[V]
Junction Temperature : Tj [°C]
Fig.10 Typical Transfer Characteristics
Drain Current : -I
D
[A]
Gate - Source Voltage : -VGS [V]
Fig.11 Gate Threshold Voltage
vs. Junction Temperature
Gate Threshold Voltage : -V
GS(th)
[V]
Junction Temperature : Tj [°C]
Fig.12 Transconductance vs. Drain Current
Transconductance : g
fs
[S]
Drain Current : -ID [A]
0
20
40
60
-50 0 50 100 150

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Data Sheet
lElectrical characteristic curves
Ta= 25ºC
VGS= -4.0V
VGS= -4.5V
VGS= -10V
Fig.13 Drain Current Derating Curve
Drain Current Dissipation
: I
D
/ I
D
max. (%)
Junction Temperature : Tj [ºC]
Fig.15 Static Drain - Source On - State
Resistance vs. Drain Current(I)
Static Drain - Source On-State Resistance
: R
DS(on)
[mW]
Junction Temperature : Tj [ºC]
Fig.16 Static Drain - Source On - State
Resistance vs. Junction Temperature
Static Drain - Source On-State Resistance
: R
DS(on)
[mW]
Drain Current : -ID [A]
Fig.14 Static Drain - Source On - State
Resistance vs. Gate Source Voltage
Static Drain - Source On-State Resistance
: R
DS(on)
[mW]
Gate - Source Voltage : -VGS [V]
0
50
100
150
200
250
300
0 5 10 15
Ta= 25ºC
ID= -4.0A
ID= -2.0A
0
0.2
0.4
0.6
0.8
1
1.2
-25 0 25 50 75 100 125 150
0
20
40
60
80
100
-50 -25 0 25 50 75 100 125 150

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Data Sheet
lElectrical characteristic curves
VGS= -4.5V
Ta = 125ºC
Ta = 75ºC
Ta = 25ºC
Ta = -25ºC
V
GS
= -10V
Ta = 125ºC
Ta = 75ºC
Ta = 25ºC
Ta = -25ºC
VGS= -4.0V
Ta = 125ºC
Ta = 75ºC
Ta = 25ºC
Ta = -25ºC
Fig.18 Static Drain - Source On - State
Resistance vs. Drain Current(III)
Static Drain - Source On-State Resistance
: R
DS(on)
[mW]
Drain Current : -ID [A]
Fig.17 Static Drain - Source On - State
Resistance vs. Drain Current(II)
Static Drain - Source On-State Resistance
: R
DS(on)
[mW]
Drain Current : -ID [A]
Fig.19 Static Drain - Source On - State
Resistance vs. Drain Current(IV)
Static Drain - Source On-State Resistance
: R
DS(on)
[mW]
Drain Current : -ID [A]

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Data Sheet
lElectrical characteristic curves
0.01
0.1
1
10
0 0.5 1 1.5
Ta = 125ºC
Ta = 75ºC
Ta = 25ºC
Ta = -25ºC
V
GS
= 0V
Fig.20 Typical Capacitance
vs. Drain - Source Voltage
Capacitance : C [pF]
Drain - Source Voltage : -VDS [V]
Fig.22 Dynamic Input Characteristics
Gate - Source Voltage : -V
GS
[V]
Total Gate Charge : Qg [nC]
Fig.21 Switching Characteristics
Switching Time : t [ns]
Drain Current : -ID [A]
Fig.23 Source Current
vs. Source Drain Voltage
Source Current : -I
S
[A]
Source-Drain Voltage : -VDS [V]
0
1
2
3
4
5
6
7
8
9
10
0 1 2 3 4 5 6 7 8 9
Ta = 25ºC
VDD= -15V
ID= -4.0A
RG=10W
1
10
100
1000
10000
0.01 0.1 1 10
Ta = 25ºC
VDD= -15V
VGS= -10V
RG=10W
10
100
1000
10000
0.01 0.1 1 10 100
Ta = 25ºC
f=1MHz
VGS=0V
C
iss
C
oss
C
rss

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Data Sheet
Fig.1-1 Switching Time Measurement Circuit
Fig.1-2 Switching Waveforms
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
Fig.3-1 Avalanche Measurement Circuit Fig.3-2 Avalanche Waveform

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Data Sheet
Patterm of terminal position areas
H
E
e
A1
A2
A
c
D
b
x S A
A
y
s
S
E
A3
L1
Lp
e1
b2
l1
e
MIN MAX MIN MAX
A - 1.75 - 0.069
A1
A2 1.40 1.60 0.055 0.063
A3
b 0.30 0.50 0.012 0.02
c 0.10 0.30 0.004 0.012
D 4.80 5.20 0.189 0.205
E 3.75 4.05 0.148 0.159
e
L1 0.50 0.70 0.02 0.028
Lp 0.65 0.85 0.026 0.033
x
y
MIN MAX MIN MAX
b2 - 0.65 - 0.026
e1
l1 - 1.15 - 0.045

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R1120A