RPM871-H14 is an infrared communication module for IrDA V er. 1.2 (Low Power). The infrared LED, PIN photo diode,
waveform shaping LSI are all integrated into a single package. This module is designed with pow er dow n function and
low current consumption at stand-by mode. The ultra small p ackage makes it a perfect fit for mobile devices.
zFeatures
1) Applied to IrDA version 1.2. (Low Power)
2) Designed for low power consumption at stand-by for receiving (Typ.73 µA).
3) Suitable for sets driven by battery due to power down control function.
4) Power supply voltage range : 2.6V to 3.6V
5) Constant LED load resistance can change communication range. (Approx. 20 to 60cm)
zApplicat ions
Cellular phones, PDAs, etc.
zAbsolute maximum ratings (Ta = 25°C)
ParameterSymbolLimitsUnit
Power supply voltageV
Input voltage
Power dissipation
Operating temperature range
Storage temperature range
LED peak current
∗1 70mm×70mm, t=1.6mm, glass epoxy mounting. Derating : 2mW/°C for operation above Ta=25°C
∗2 LED peak current<90µs. ON duty<20%
CC
Vin
Pd
Topr
Tstg
I
FP
7.0
−0.3 to VCC+0.3
∗1
150
−20 to +85
−30 to +100
∗2
200
zRecommended operating conditions (Ta = 25°C)
ParameterSymbolMin.
Power supply voltage
CC
V
LEDA
V
Typ.Max.
3.0
2.8
3.6
5.5
1/7
mW
mA
Unit
V2.6
V2.6
V
V
°C
°C
Photo Link Module
zBlock diagram and application c ircuit
AMP
GND
18765432
NC
RPM871-H14
AMP
AMP
POWER
DOWN
LED
DRIVER
VCC
GND
C1
PWDOWN
RXD
TXD
LEDA
VCC (3pin) and VLEDA (8pin) can be used on
either common power source or different one.
R1
VCC
GND
PWDOWN
RXD
TXD
(LEDV
CC)
2/7
Photo Link Module
zT erminal description
Pin No
1, 4GND
Terminal
RPM871-H14
CircuitFunction
GND
Pin1 and pin4 must be connected to the
ground.
2NC
3
5
6
7
V
CC
PWDOWN
RXD
TXD
PWDOWN
This Terminal must be left open.
V
CC
For preventing from infection, connect
a capacitor between V
GND (4pin).
V
CC
V
CC
V
CC
300k
V
CC
200K
Power-down Control Terminal
H : POWERDOWN
L : OPERATION
CMOS Logic Level Input
When input is H, it will stop the receiving
circuit, Pin-PD current and transmitting
LED operation.
Receiving Data Output Terminal
CMOS Logic Level Output
When PWDOWN (5pin)=H, the RXD
output will be pulled up to V
approximately 300kΩ.
Transmitting Data Input Terminal
H : LED (PWDOWN=L)
CMOS Logic Level Input
Holding TXD="H" status, LED will be
turn off approximately 45µs.
CC
(3pin) and
CC
at
LED ANODE Terminal
8
−
LEDA
Shield Case
LED
Other power source can be used
difference between LEDV
LED current depends on LED load
resistance value.
Connect to Ground.
CC
and VCC.
3/7
Photo Link Module
RPM871-H14
CC
zElectrical characteristics (Unless otherwise noted, V
Parameter
Consumption current1
Consumption current2
Transmission rate
PWDOWN INPUT High voltage
PWDOWN INPUT Low voltage
PWDOWN INPUT High current
PWDOWN INPUT Low current
Symbol
I
CC1
ICC2
VPDH
VPDL
IPDH
IPDL
Min.Typ.Max.UnitConditions
−
−
2.4
V
CC−0.55
−
−1.0
−1.0
=2.8V , VLEDVCC=2.8V , Ta=25°C)
73
0.01
−
−
−
0
0
99
0.2
−
0.55
1.0
1.0
Stand-by for receiving At no input light
µA
PWDOWN PIN High At no input light
µA
kbps115.2
V
V
µA
PWDOWN=V
µA
PWDOWN=0 [V]
CC
[V]
<Transmitter>
TXD INPUT High voltage
TXD INPUT Low voltage
TXD INPUT High current
TXD INPUT Low current
LED ANODE current
VTXH
VTXL
ITXH
ITXL
ILEDA
V
CC−0.55
−
7
−1.0
−
−
−
14
0
144
−
0.55
28
1.0
−
V
V
µA
µA
mA
TXD=V
CC
TXD=0 [V]
R1=7.5 [Ω]
[V]
<Receiver>
IRXH=
RXD OUTPUT High voltage
RXD OUTPUT Low voltage
RXD OUTPUT rise time
RXD OUTPUT fall time
RXD OUTPUT pulse width
Receiver latency time
VRXH
VRXL
tRR
tFR
twRXD
tRT
V
CC−0.5
1.5
−
−
−
−
−
70
30
2.3
100
−
−
0.4
−
−
3.6
300
V
V
ns
ns
µs
µs
−50µA
IRXL=200µA
L
=15pF
C
L
=15pF
C
L
=15pF, 2.4 to 115.2kbps
C
zOptical characteristics (Unless otherwise noted, V
Parameter
Peak wave length
Intensity1
Half-angle
Rise time / Fall time
Symbol
λP
IE1
θL/2
Tr/Tf
Optical over shoot
Edge jitter
Irradiance in angular
INPUT Half-Angular
Maximum emitting time
1. This product is not designed for protection against radioactive rays.
2. This product dose not include laser transmitter.
3. This product includes one PIN photo diode.
4. This product dose not include optical load.
Tj
Ee
θD/2
TLEDmax
Min.Typ.Max.Unit
850
−
−
−40
0.0068
±15
10
CC
=2.8V , VLEDVCC=2.8V , Ta = 25°C)
870nm
3614.4
±18
45
900
deg
ns
%25
ns40
deg
µs
−15°≤θ
R1=7.5 [Ω]
10% to 90%
2
−15°≤θ
TXD=V
mW/Sr93.6
±30
100
−
−−
−
500
−
−
mW/cm
−
96
L
≤15°
L
≤15°
CC
Conditions
4/7
Photo Link Module
(
ly
zTiming chart
Emitting side)
TXD
(7pin)
less than 45µs
RPM871-H14
more than 45µs
(emitting)
Internal LED
(Light output)
approximately 45µs
(Detecting side)
Light input
less than 2.3µsmore than 2.3µs
RXD
(6pin)
approximately 2.3µsapproximately 2.3µs
PWDOWN
(5pin)
(emitting)
(emitting)
pull up to V
CC at approximately 300kΩ
zAtt ached compone nts
Recommended values
Part symbol
C1
R1
Recommended value
1µF, tantalum or ceramic
Ex.) TCFGA1A105M8R (ROHM)
7.5Ω±5%, 1/4W
(VLEDV
CC
=2.8V)
Notice
Bigger capacitance is recommended with much noise from power supp
2
More than 60cm distance, more than 4[µW/cm
(vs ver1.0)
More than 46cm distance, more than 6.8[µW/cm
(vs RPM871-H14)
] at detecting side.
2
] at detecting side.
In case of using R1 with different condition from the above, formula is as follow s :
LED resistance value : R1[Ω], LED average consumption current : ILED[mA], Supply voltage : VLEDV
CC
[V],
Link distance : d[cm] (Including LED’s distribution within ±15deg)
R1=T × (VLEDV
CC
−1.45) / d2−3.5 [Ω]
ILED=Duty × (VLEDVCC−1.36) / (R1+2.5) [A] Duty : LED duty at emitting
T : 17300 (vs. RPM871-H14), 29400 (vs. ver1.0)
∗ Please set up to be ILED / Duty < 200[mA] (Duty < 20%)
5/7
RPM871-H14
0
)
0
)
Photo Link Module
zNotes
CC
1) LEDV
•
2) Caution in designing board lay-out
T o get maximum potential from RPM871-H14, please keep in mind following instruction.
•
be close to photo diode side (1pin).
⇒This is to minimize feedback supplied to photo diodefrom RXD.
•
•
generates noise, such as DC / DC converter.
3) Others
•
(for < 90µsec. on duty < 20%).
•
•
by different signal format.
•
4) LED current derating and ambient temperature
The relation between LED peak current and maximum ambient temperature is shown below .
We recommend you to use within the range as indicated in below.
a) When glass-epoxy board (70×70×1.6mm) mounted.
(8pin) and VCC (3pin)
Other power source can be used difference between LEDVCC and VCC.
The line of RXD (6pin) should be connected at backside via through hole close to RPM871-H14 pin lead. Better not to
As for C1 between 3-4 pin should be placed close to RPM871-H14.
Better to be placed more than 1.0cm in radius from photo diode (pin1 side) and also away from the parts w hich
Please be sure to set up the TXD (7pin) input to be “L” (under 0.55V) except transmitting data
Power down current might increase if exposed by strong light (ex. direct sunlight) at pow er down mode.
Please use by the signal format which is specified by IrDA V er1.2 (2.4k to 1 15.2kbps). There might be on error if used
Dust or dirt on lens portion may affect the characteristics, so pay suf ficient attention.
250
200
Duty=10%
150
100
50
0
−200 2040608010
MAXIMUM LED PACK CURRENT : Iledp (mA
AMBIENT TEMPERATURE : Ta (°C)
Duty=20%
b) RPM871-H14
250
200
150
100
50
0
−200 2040608010
MAXIMUM LED PACK CURRENT : Iledp (mA
AMBIENT TEMPERATURE : Ta (°C)
Duty=10%
Duty=20%
6/7
Photo Link Module
zExternal dimensions (Unit : mm)
RPM871-H14
R1.1
2.2
8.0
PinPD
1.0
2.9
0.68±0.1
1.1
1.4
2.8
4.0
A
18
P0.95×7=6.65
0.60.48
LED
0.37±0.1
0.95
R1.0
0.15±0.1
2.67
(0.13)
2.2
0.15±0.1
0.78
2.59
0.6±0.1
NOTE
1.TOLERANCE :
2.COPLANARITY : 0.1mmMAX
UNIT : mm
0.76
A Part Size (Shield Case underside size)
ETH648
2.2
0.75
±0.2mm
7/7
Appendix
No technical content pages of this document may be reproduced in any form or transmitted by any
means without prior permission of ROHM CO.,LTD.
The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual use, therefore, please request
that specifications to be separately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
use and operation. Please pay careful attention to the peripheral conditions when designing circuits
and deciding upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams information, described herein
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of
whatsoever nature in the event of any such infringement, or arising from or connected with or related
to the use of such devices.
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or
otherwise dispose of the same, no express or implied right or license to practice or commercially
exploit any intellectual property rights or other proprietary rights owned or controlled by
ROHM CO., LTD. is granted to any such buyer.
Products listed in this document are no antiradiation design.
Notes
The products listed in this document are designed to be used with ordinary electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communications devices, electrical
appliances and electronic toys).
Should you intend to use these products with equipment or devices which require an extremely high level of
reliability and the malfunction of with would directly endanger human life (such as medical instruments,
transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other
safety devices), please be sure to consult with our sales representative in advance.
About Export Control Order in Japan
Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control
Order in Japan.
In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)
on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.
Appendix1-Rev1.1
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