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RPM871-H12
Datasheet (ROHM)
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Datasheet RPM871-H12 Datasheet (ROHM)

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RPM871-H12

Photo Link Module

IrDA Infrared communication Module

RPM871-H12
zFeatures
1) Infrared LED, PIN photo diode, LED driv er & Receiv er freq uency form ation circ uit built in. Impr ovement of EMI noise protection because of Shield Case.
2) Applied to SIR (2.4 to 115.2kbps)
3) V
CC
supply voltage range is from 2.6V to 3.6V.
4) Surface mount type.
5) Power down function built in.
6) Adjustable communication distance by LED load resistance value. (approximately 20cm to 60cm)
zApplicat ions
Cellular phone, PDA, DVC, Digital Still Camera, Printer, Handy T erminal etc.
zAbsolute maximum ratings (Ta=25°C)
Parameter Symbol Supply voltage V Input voltage Operation temperature Storage temperature LED peak current Power dissipation
∗1 This applies to all pins basis ground pins (1.4pin) ∗2 LED peak current<90µs. ON duty<20% ∗3 When glass-epoxy board (70×70×1.6mm) mounted. In case operating environment is over 25°C,
2mW would be reduced per each 1°C stepping up.
max 7.0
in
V Topr Tstg
FP
I
Pd
Limits
∗1
−0.3 to Vcc+0.3
−20 to +85
−30 to +100
∗2
200
∗3
150
zRecommended operating conditions (Ta=25°C)
Parameter Symbol Min. Typ. Max. Unit Supply voltage LED supply voltage
V
LEDV
CC
CC
3.0 V2.6 3.6
2.8 V2.6 5.5
Unit
V V
°C °C
mA
mW
1/7
Photo Link Module
zBlock diagram and application c ircuit
AMP
GND
18765432
NC
RPM871-H12
AMP
AMP
POWER
DOWN
LED
DRIVER
VCC
GND
C1
PWDOWN
RXD
TXD
LEDA
VCC (3pin) and VLEDA (8pin) can be used on either common power source or different one
R1
VCC
GND
PWDOWN
RXD
TXD
(LEDV
CC)
2/7
Photo Link Module
zT erminal description
Pin No
1, 4 GND
Terminal
RPM871-H12
Circuit Function
GND
Pin1 and Pin4 must be connected to the ground.
2NC
3
5
6
7
CC
V
PWDOWN
RXD
TXD
PWDOWN
This Terminal must be left open.
V
CC
For preventing from infection, connect a capacitor between V GND (4pin).
V
CC
V
CC
V
CC
300k
V
CC
200K
Power-down Control Terminal
H : POWERDOWN L : OPERATION CMOS Logic Level Input
When input is H, it will stop the receiving circuit, Pin-PD current and transmitting LED operation.
Receiving Data Output Terminal
CMOS Logic Level Output When PWDOWN (5pin)=H, the RXD output will be pulled up to V approximately 300kΩ.
Transmitting Data Input Terminal
H : LED (PWDOWN=L) CMOS Logic Level Input
Holding TXD="H" status, LED will be turn off approximately 45µs.
CC
(3pin) and
CC
at
LED ANODE Terminal
8
LEDA
Shield Case
LED
Other power source can be used difference between LEDV LED current depends on LED load resistance value.
Connect to Ground.−
CC
and VCC.
3/7
RPM871-H12
Photo Link Module
zElectrical characteristics (Unless otherwise noted, V
Parameter Symbol Min. Typ. Max. Unit Conditions Consumption current1 I Consumption current2 Transmission rate PWDOWN input high voltage PWDOWN input low voltage PWDOWN input high current PWDOWN input low current
<Transmitter>
TXD input high voltage TXD input low voltage TXD input high current TXD input low current LED anode current
<Receiver>
RXD output high voltage RXD output low voltage RXD output rise time RXD output fall time RXD output pulse width Receiver latency time
zOptical characteristics (Unless otherwise noted, V
Parameter
Peak wave length Intensity1 Half-angle
Rise time / Fall time Optical over shoot Edge jitter Irradiance in angular Input half-angle Maximum emitting time
1. This product is not designed for protection against radioactive rays.
2. This product dose not include laser transmitter.
3. This product includes one PIN photo diode.
4. This product dose not include optical load.
4/7
TLEDmax
CC1
I
CC2
VPDH VPDL
IPDH IPDL
VTXH
VTXL ITXH
ITXL
ILEDA
VRXH VRXL
tRR tFR
twRXD
tRT
Symbol
λP
IE1
θL/2 Tr/Tf
Tj
Ee
θD/2
CC
=2.8V , VLEDVCC=2.8V , Ta=25°C)
−
−
2.4
V
CC−0.55
−
−1.0
−1.0
V
CC−0.55
−
7
−1.0
−
V
CC−0.5
−
−
−
1.5
−
73
0.01
−
−
−
0 0
−
−
14
0
144
−
−
70 30
2.3
100
CC
99
0.2
−
0.55
1.0
1.0
−
0.55 28
1.0
−
−
0.4
−
−
3.6
300
=2.8V , VLEDVCC=2.8V , Ta=25°C)
Min. Typ. Max. Unit
850
870 nm
900
3614.4
±18
−
−
±30
100
−
−−
45
−
500
−
−
−
120
−40
0.0068 ±15
10
µA µA
kbps115.2
V V
µA µA
V V
µA µA
mA
V
V ns ns
µs µs
mW/Sr93.6
deg
ns
%25
ns40
mW/cm
deg
µs
Stand-by for receiving At no input light PWDOWN PIN High At no input light
PWDOWN=V
CC
[V]
PWDOWN=0 [V]
TXD=V
CC
[V] TXD=0 [V] R1=7.5 [Ω]
IRXH= −50µA IRXL=200µA C
L
=15pF
C
L
=15pF
C
L
=15pF, 2.4 to 115.2kbps
Conditions
−15° ≤ θ
L
≤ 15°
R1=7.5 [Ω]
10% to 90%
2
−15deg ≤ θ
TXD=V
CC
L
≤ +15deg
Photo Link Module
(
ly
zTiming chart
Emitting side)
TXD (7pin)
less than 45µs
RPM871-H12
more than 45µs
(emitting)
Internal LED (Light output)
approximately 45µs
(Detecting side)
Light input
less than 2.3µs more than 2.3µs
RXD (6pin)
approximately 2.3µsapproximately 2.3µs
PWDOWN (5pin)
(emitting)
(emitting)
pull up to V
CC at approximately 300kΩ
zAtt ached compone nts Recommended values
Part symbol
C1
R1
Recommended value
1µF, tantalum or ceramic
Ex.) TCFGA1A105M8R (ROHM)
7.5Ω±5%, 1/4W (VLEDV
CC
=2.8V)
Notice
Bigger capacitance is recommended with much noise from power supp
2
More than 60cm distance, more than 4[µW/cm (vs ver1.0)
More than 46cm distance, more than 6.8[µW/cm (vs RPM871-H12)
] at detecting side.
2
] at detecting side.
In case of using R1 with different condition from the above, formula is as follow s : LED resistance value : R1[Ω], LED average consumption current : ILED[mA], Supply voltage : VLEDV
CC
[V],
necessary d[cm] (Including LED’s distribution within ±15deg)
R1=T × (VLEDV ILED=Duty × (VLEDV
CC
−4.45) / d2−3.5 [Ω]
CC
−1.36) / (R1+2.5) [A]
Duty : LED duty at emitting
T : 17300 (vs. RPM871-H12), 29400 (vs. ver1.0)
∗ Please set up to be ILED / Duty < 200[mA] (Duty < 20%)
5/7
RPM871-H12
0
)
0
)
Photo Link Module
zNotes
CC
1) LEDV
•
2) Caution in designing board lay-out T o get maximum potential from RPM871-H12, please keep in mind follow ing instruction.
•
be close to photo diode side (1pin).
⇒This is to minimize feedback supplied to photo diode from RXD.
•
•
generates noise, such as DC
3) Others
•
(for < 90µs, on duty < 20%).
•
•
by different signal format.
4) LED current derating and ambient temperature The relation between LED peak current and maximum ambient temperature is shown below . We recommend you to use within the range as indicated in below. a) When glass-epoxy board (70×70×1.6mm) mounted.
(8pin) and VCC (3pin)
Other power source can be used difference between LEDVCC and VCC.
The line of RXD (6pin) should be connected at backside via through hole close to RPM871-H12 pin lead. Better not to
As for C1 between 3-4 pin should be placed close to RPM871-H12. Better to be placed more than 1.0cm in radius from photo diode (pin1 side) and also away from the parts w hich
Please be sure to set up the TXD (7pin) input to be “L” (under 0.55V) except transmitting data
Power down current might increase if exposed by strong light (ex. direct sunlight) at pow erdown mode. Please use by the signal format which is specified by IrDA V er1.2 (2.4k to 1 15.2kbps). There might be on error if used
250
200
/
Duty=10%
DC converter.
150
100
50
0
−200 2040608010
MAXIMUM LED PEAK CURRENT : Iledp (mA
AMBIENT TEMPERATURE : Ta (°C)
Duty=20%
b) RPM871-H12
250
200
150
100
50
0
−200 2040608010
MAXIMUM LED PEAK CURRENT : Iledp (mA
AMBIENT TEMPERATURE : Ta (°C)
Duty=10%
Duty=20%
6/7
Photo Link Module
zExternal dimensions (Unit : mm)
3.0
0.6
3.0
8.0
LED
5.6
PinPD
2.8
2.4
0.84±0.1
1.75
2.0
0.15±0.1
RPM871-H12
2.72
0.68±0.1
0.56
1
P0.95×7=6.65
0.6±0.1
7.6
2.49
8
0.37±0.1
0.6±0.1
A
A Part Size (Shield Case underside size)
3.0
NOTE TOLERANCE ±0.2mm
COPLANARITY:0.1mmMAX UNIT:mm
ETH450
0.75
7/7
Appendix
No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request that specifications to be separately delivered. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. Products listed in this document are no antiradiation design.
Notes
The products listed in this document are designed to be used with ordinary electronic equipment or devices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). Should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of with would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance.
About Export Control Order in Japan
Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control Order in Japan. In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause) on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.
Appendix1-Rev1.1
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