ROHM RB161L-40 Datasheet
Diodes
Schottky barrier diode
RB161L-40
RB161L-40
Applications
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High frequency rectification
For switching power supply
Features
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1) Compact power mold type. (PMDS)
2) Ultra l ow V
RM
3) V
Construction
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F
.( VF=0.35V Typ. at 1A)
=40V guarant eed.
Silicon epitaxial planar
Absolute maximum ratings
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Parameter Symbol
Peak reverse voltage
DC reverse voltage
Mean rectifying current ∗
Peak forward surge current
Junction temperature
Storage temperature
∗ When mounting on PCB
(T a=25°C)
RM
V
V
R 20 V
I
O 1A
I
FSM 70 A
Tj 125
Tstg −40∼+125
Limits
40
External dimensions
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CATHODE MARK
ROHM : PMDS
EIAJ : −
JEDEC : SOD-106
Unit
V
˚C
˚C
1.5±0.2
33
2.6±0.2
(Units : mm )
1.2±0.3
+0.02
2.0±0.2
0.1
−0.1
4.5±0.2
Date of manufacture EX. 1999.12 → 9, C
5.0±0.3
Electrical characteristics
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Parameter
Forward voltage
Reverse current
(T a=25°C)
Symbol Min. Typ. Max. Unit Conditions
V
F
I
R
−
−
−
0.40
−
1
VmAIF=1.0A
V
R
=20V
Diodes
Electrical characteristic curves
zzzz
10
A)
(
F
1
100m
10m
FORWARD CURRENT : I
C
˚
C
5
˚
2
C
5
˚
1
7
5
C
˚
2
5
2
−
1m
0 0.2 0.3 0.4 0.50.1
=
a
T
FORWARD VOLTAGE : V
Fig.1 Forward characteristics
F
(
V)
(Ta=25°C)
(A)
R
REVERSE CURRENT : I
100m
Ta=125˚C
10m
1m
100µ
10µ
1µ
02030405010
75˚C
25˚C
−25˚C
REVERSE VOLTAGE : V
Fig.2 Reverse characteristics
RB161L-40
1n
100p
TERMINAL CAPACITANCE : CT (F)
10p
0 1015202530355
R
(V)
REVERSE VOLTAGE : VR (V)
Fig.3 Capacitance between
terminals characteristics
0.5
(W)
F
0.4
0.3
0.2
D=0.05
D=0.2
D=0.1
0.1
FORWARD POWER DISSIPATION : P
0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
D=0.3
sine
D=0.5
Tp
=
D
=
Tj
AVERAGE RECTIFIED FORWARD CURRENT : IO (A)
Fig.4 Forward power dissipation
characteristics
D=0.8
I
F
I
O
T
Tp / T
Tj Max.
DC
W)
(
R
0.40
0.30
0.20
0.10
REVERSE POWER DISSIPATION : P
0
0 2 4 6 8 101214161820
V
R
Tj=Tj Max.
0
V
R
Tp
T
Tj=Tj Max.
D=Tp / T
REVERSE VOLTAGE
D=0.05
D=0.1
D=0.2
D=0.3
D=0.5
: V
DC
sine
D=0.8
R
(
V)
0.50
Fig.5 Reverse power dissipation
characteristics
2.0
A)
(
O
DC
1.5
D=0.8
D=0.5
sine
1.0
D=0.3
D=0.2
D=0.1
0.5
D=0.05
0
AVERAGE RECTIFIED FORWARD CURRENT : I
0 25 50 75 100 125
AMBIENT TEMPERATURE : Ta (˚C)
Fig.6 Derating curve
(when mounting on glass
I
F
I
O
Tp
T
=
Tp / T
D
R
=
V
RM
/ 2
V
epoxy PCBs)
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