Parameter
Drain-source voltage
Gate-source voltage
Drain current
Source current
(Body Diode)
Continuous
Pulsed
Continuous
Pulsed
Avalanche Current
Avalanche Energy
Total power dissipation (Tc=25°C)
Channel temperature
Range of storage temperature
∗1 Pw≤10μs, Duty cycle≤1%
∗2 L 500μH, V
∗3 Limited only by maximum temperature allowed
DD
=50V, RG=25Ω, Starting, Tch=25°C
Bulk
−
500
∗3
∗1
∗3
∗1
∗2
∗2
−55 to +150
Limits
500
±30
±21
±84
21
84
10.5
29.6
50
150
Symbol
V
DSS
V
GSS
I
D
I
DP
I
S
SP
I
AS
I
E
AS
P
D
Tch
Tstg°C
Inner circuit
Unit
V
V
A
A
A
A
A
mJ
W
°C
(1)(2)(3)
(1) Gate
(2) Drain
(3) Source
∗1
∗1 Body Diode
1/5
Transistors
z
z
z
Thermal resistance
Parameter
Channel to case
z
Electrical characteristics (Ta=25qC)
Parameter
Gate-source leakage
Drain-source breakdown voltage
Zero gate voltage drain current
Gate threshold voltage
Static drain-source on-state resistance
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Total gate charge
Gate-source charge
Gate-drain charge
∗ Pulsed
z
Body diode characteristics (Source-drain) (Ta=25qC)
ParameterSymbol
V
SD
∗ Pulsed
SymbolLimitsUnit
Rth(ch-c)
Symbol
I
V
(BR)DSS
I
V
R
| Y
C
C
t
t
Q
GSS
DSS
GS(th)
DS(on)
fs
C
iss
oss
rss
d(on)
t
r
d(off)
f
t
g
Q
Q
gs
gd
Min.
−
500
−
2.5
∗
−
∗
|
7
−
−
−
∗
−
∗
−
∗
−
∗
−
∗
−
∗
−
∗
−
Min.Typ. Max.
∗
−−1.5VIS= 21A, VGS=0VForward voltage
2.5
Max.UnitConditions
Typ.
±100
−
−
−
100
−
4.5
−
0.21
0.16
−
−
2300
1000
200
−
−
−
70
−ns
47
−VGS=10Vns
70
−RL=23.8Ωns
−RG=10Ωns
70
−VDD250V
64
−nC
11
−nC
27
Unit
°C/W
nAV
V
μA
V
Ω
S
pF
pF
pF
nC
GS
D
=1mA, VGS=0V
I
DS
V
V
DS
D
=10.5A, VGS=10V
I
I
D
=10.5A, VDS=10V
V
DS
V
GS
f=1MHz
I
D
=10.5A, VDD 250V
I
D
=21A
V
GS
R
L
=11.9Ω / RG=10Ω
Conditions
R5021ANX
=±30V, VDS=0V
=500V, VGS=0V
=10V, ID=1mA
=25V
=0V
=10V
2/5
Transistors
z
Electrical characteristiccurves
100
Oper ation in thi s
area i s li mited by
R
DS(ON)
10
(A)
D
1
0.1
DRAIN CURREN T : I
Ta = 25°C
Sing le Pulse
0.01
0.11101001000
DR AIN-SOU RCE VOLT AGE : VDS ( V )
Fi g.1 M aximum Safe Oper ating Aera
100
VDS= 10V
Pulsed
10
(A)
Ta= 125°C
D
Ta= 75°C
1
Ta= 25°C
Ta= -25°C
0.1
DRAIN CURRENT : I
0.01
0.001
0.01.53.04.56.0
GATE- SOURC E VOLTAGE : VGS (V)
Fi g.4 T ypical Transf er Char acteri stic s
PW= 100us
PW= 1ms
PW= 10ms
DC operati on
40
10V
8.0V6.5V
30
(A)
D
20
10
DRAIN CURRENT: I
0
01020304050
6
VDS= 10V
(V)
I
5
GS(th)
4
3
2
1
GATE TH RESHOLD VOLTAGE: V
0
-50050100150
7.0V
6.0V
5.5V
5.0V
VGS= 4.5V
DRAIN -SOUR CE VOLTAGE: VDS (V)
Fig.2: Typical Output Characteristics(㸇)
= 1mA
D
CHANNEL TEMPERATURE: Tch (°C)
Fi g.5 Gat e Thres hold Volt age
vs. Channel Temperatu re
䇭䇭䇭䇭
Ta= 25°C
Pulsed
R5021ANX
20
Ta= 25°C
Pulsed
15
(A)
D
10
5
DRAIN CURRENT: I
0
10
(ȍ)
1
DS(on)
0.1
RESISTAN CE : R
STATIC DRAIN-SOURCE ON-STATE
0.01
0.1110100
6.5V
012345
DRAIN-SOURCE VOLTAGE: VDS (V)
Fi g.3: Typical Output Charac teri stics (㸈)
VGS= 10V
Pulsed
DRAIN CURRENT : ID (A)
Fi g.6 Stat ic D rai n-Sour ce On- State
Resistance vs. Drain Current
䇭䇭䇭䇭
7.0V
5.5V
8.0V
VGS= 4. 5V
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= -25°C
10V
6.0V
5.0V
0.6
0.5
(ȍ)
0.4
DS(on)
0.3
0.2
RESISTAN CE : R
STAT IC DRA IN- SOURC E ON-ST ATE
ID= 10. 5A
0.1
0
051015
GATE- SOURC E VOLTAGE : VGS (V)
Fi g.7 Stat ic D rain- Source On-State
Resistance vs. Gate Source Voltage
䇭䇭䇭㩷
ID= 21.0A
Ta= 25°C
Pulsed
0.6
VGS= 10V
Pulsed
0.5
) (ȍ)
0.4
DS(on
0.3
0.2
RESIST ANCE : R
0.1
STAT IC DR AIN-SOU RCE ON -STAT E
0
-50050100150
Fi g.8 St atic D rain- Sourc e On-State
䇭䇭䇭䇭
ID= 21.0A
CHANNEL TEMPERATURE: Tch (°C)
Res istanc e vs. Channel Temperatur e
ID= 10.5A
100
VDS= 10V
Pulsed
10
1
|Yfs| (S)
0.1
FORW ARD T RANSF ER ADMIT TANC E :
0.01
0.010.1110100
DRAIN CURRENT : ID (A)
Fi g.9 F orward T ransfer Admittanc e
vs. Dr ain C urrent
䇭䇭䇭䇭
Ta= -25°C
Ta= 25°C
Ta= 75°C
Ta= 125°C
3/5
Transistors
R5021ANX
100
VGS= 0V
(A)
Pulsed
DR
10
1
0.1
REVERSE DRAIN CURRENT : I
0.01
00.511.5
SOURCE-DRAIN VOLTAGE : VSD (V)
Fi g.10 R evers e Drai n Cur rent vs.
Sourse-Drain Voltage
䇭䇭䇭䇭㩷
1000
(ns)
rr
100
Ta= 25°C
di / dt = 100A / μs
V
= 0V
GS
REVERSE RECOVERY TIME: t
10
0.1110100
Pulsed
REVERSE DRAIN CURRENT : IDR (A)
F ig .1 3 R ever se Re co ver y Ti me
vs.Reverse Dr ain Curr ent
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= -25°C
10000
1000
100
C
Ta= 25°C
10
CAPACITANCE : C (pF)
f= 1MH z
V
= 0V
GS
1
0.11101001000
rss
DRAIN-SOURCE VOLTAGE : VDS (V)
Fig.11 Typical Capacitance vs.
Drain-Source Voltage
10000
t
f
1000
t
d( o ff)
100
10
SWIT CHING TI ME : t (ns )
1
t
r
0.1110100
DRAIN CURRENT : ID (A)
Fi g.14 Swi tching䇭Char acteri stics
C
iss
C
Ta= 25°C
V
= 250V
DD
V
= 10V
GS
R
= 10ȍ
G
Pulsed
t
d(on)
15
Ta= 25°C
V
(V)
GS
oss
= 250V
DD
I
= 21A
D
R
= 10ȍ
G
10
Pulsed
5
GATE- SOURC E VOLTAGE : V
0
0 102030405060708090
TOTAL GATE CHARGE : Q
(nC)
g
Fi g.12 D ynamic Input Char acteri stic s
10
Ta = 25°C
Sing le Pul se : 1Uni t
1
Rth䋨ch-a䋩䋨t䋩 = 䌲䋨t䋩×Rth䋨ch-a
Rth䋨ch-a䋩 = 45.9°C/W
䋩
0.1
0.01
RESIST ANCE : r (t)
0.001
NOR MARIZ ED TR ANSIEN T THER MAL
0.0001
0.00010.0010.010.11101001000
PULSE WIDT H : Pw(s)
Fi g.15 Nor malized T ransient T hermal Res istance vs. Puls e Width
4/5
Transistors
z
Switching characteristics measurement circuit
Fig.1-1 Switching Time Measurement Circuit!Fig.1-2 Switching Waveforms
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