4V Drive Nch + Pch MOSFET
QS8M13
Data Sheet
Structure
Silicon N-channel MOSFET/
Silicon P-channel MOSFET
Features
1) Low on-resistance.
2) High power package(TSMT8).
3) Low voltage drive(4V drive).
Application
Switching
Packaging specifications
Package Taping
Type
Code TCR
Basic ordering unit (pieces) 3000
QS8M13
Absolute maximum ratings (Ta = 25C)
Parameter
Drain-source voltage V
Gate-source voltage V
Drain current
Source current
(Body Diode)
Continuous I
Pulsed I
Continuous I
Pulsed I
Power dissipation
Symbol
DSS
GSS
D
DP
s
sp
P
D
Tr1 : N-ch Tr2 : P-ch
*1
*1
*2
Channel temperature Tch C
Range of storage temperature Tstg C
*1 Pw10s, Duty cycle1%
*2 Mounted on a ceramic board.
Limits
Unit
30 30 V
20 20 V
6 5A
18 18 A
1.0
1.0 A
18 18 A
1.5
1.25
W / TOTAL
W / ELEMENT
150
55 to 150
Dimensions (Unit : mm)
TSMT8
(8) (7) (5)(6)
(1) (2) (4)(3)
Abbreviated symbol : M13
Inner circuit
(8) (7)
(1) Tr1 Source
(2) Tr1 Gate
(3) Tr2 Source
(4) Tr2 Gate
(5) Tr2 Drain
(6) Tr2 Drain
(7) Tr1 Drain
(8) Tr1 Drain
∗2
(1) (2)
∗1 ESD PROTECTION DIODE
∗2 BODY DIODE
(6) (5)
∗2
∗1
∗1
(3) (4)
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© 2011 ROHM Co., Ltd. All rights reserved.
1/10
2011.05 - Rev.A
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Data Sheet
QS8M13
Electrical characteristics (Ta = 25 C)
<Tr1(Nch)>
Symbol Min. Typ. Max. Unit
Gate-source leakage I
Drain-source breakdown voltage V
Zero gate voltage drain current I
Gate threshold voltage V
Static drain-source on-state
resistance
R
GSS
(BR)DSS
DSS
GS (th)
DS (on)
--10 AVGS=20V, VDS=0V
30 - - V ID=1mA, VGS=0V
--1AVDS=30V, VGS=0V
1.0 - 2.5 V VDS=10V, ID=1mA
-2028 I
*
-2535 I
m
ConditionsParameter
=6A, VGS=10V
D
=6A, VGS=4.5V
D
28 39 ID=6A, VGS=4.0V
Forward transfer admittance l Yfs l 3.0 - - S VDS=10V, ID=6A
Input capacitance C
Output capacitance C
Reverse transfer capacitance C
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
Total gate charge Q
Gate-source charge Q
Gate-drain charge Q
*Pulsed
iss
oss
rss
d(on)
d(off)
gd
*
- 390 - pF VDS=10V
- 150 - pF VGS=0V
- 70 - pF f=1MHz
-8-nsI
*
*
- 40 - ns VGS=10V
*
*
r
- 35 - ns RL=5
*
*
-7-nsR
*
*
f
- 5.5 - nC ID=6A, VDD 15V
*
*
g
- 1.5 - nC VGS=5V
*
*
gs
- 2.1 - nC
*
*
=3A, VDD 15V
D
=10
G
Body diode characteristics (Source-Drain) (Ta = 25C)
Parameter Conditions
Forward Voltage V
*Pulsed
Symbol Min. Typ. Max. Unit
*
SD
- - 1.2 V Is=6A, VGS=0V
2/10
2011.05 - Rev.A
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Data Sheet
QS8M13
Electrical characteristics (Ta = 25 C)
<Tr2(Pch)>
Parameter Conditions
Gate-source leakage I
Drain-source breakdown voltage V
Zero gate voltage drain current I
Gate threshold voltage V
Static drain-source on-state
resistance
Forward transfer admittance l Yfs l3 - - SVDS=10V, ID=5A
Input capacitance C
Output capacitance C
Reverse transfer capacitance C
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
Total gate charge Q
Gate-source charge Q
Gate-drain charge Q
*Pulsed
Symbol Min. Typ. Max. Unit
GSS
(BR)DSS
DSS
GS (th)
--10 AVGS=20V, VDS=0V
30 - - V ID=1mA, VGS=0V
- 1 AVDS=30V, VGS=0V
1.0 - 2.5 V VDS=10V, ID=1mA
-2839 I
*
*
R
DS (on)
-4056 I
m
-4563 I
*
iss
oss
rss
d(on)
r
d(off)
f
g
gs
gd
- 1100 - pF VDS=10V
- 150 - pF VGS=0V
- 130 - pF f=1MHz
-9-nsI
*
*
- 40 - ns VGS=10V
*
*
- 90 - ns RL=6
*
*
- 55 - ns RG=10
*
*
- 10 - nC ID=5A, VDD 15V
*
*
- 3.6 - nC VGS=5V
*
*
- 3.0 - nC
*
*
=5A, VGS=10V
D
=2.5A, VGS=4.5V
D
=2.5A, VGS=4.0V
D
=2.5A, VDD 15V
D
Body diode characteristics (Source-Drain) (Ta = 25C)
Parameter
Forward Voltage V
*Pulsed
Symbol Min. Typ. Max. Unit
*
SD
--1.2 V Is=5A, VGS=0V
Conditions
3/10
2011.05 - Rev.A
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© 2011 ROHM Co., Ltd. All rights reserved.
Data Sheet
Electrical characteristic curves (Ta=25C)
0
1
2
3
4
5
6
0 0.2 0.4 0.6 0.8 1
Drain Current : I
D
[A]
Drain-Source Voltage : VDS [V]
Fig.1 Typical Output Characteristics (Ⅰ)
0
1
2
3
4
5
6
0 2 4 6 8 10
Drain Current : I
D
[A]
Drain-Source Voltage : VDS [V]
Fig.2 Typical Output Characteristics (Ⅱ)
1
10
100
1000
0.01 0.1 1 10 100
Static Drain-Source On-State Resistance
R
DS(on)
[mΩ]
Drain Current : ID [A]
Fig.3 Static Drain-Source On-State Resistance vs. Drain Current
1
10
100
1000
0.01 0.1 1 10
Static Drain-Source On-State Resistance
R
DS(on)
[mΩ]
Drain Current : ID [A]
Fig.4 Static Drain-Source On-State Resistance vs. Drain Current
Ta= 125℃
Ta= 75°C
Ta= 25°C
Ta= - 25°C
1
10
100
1000
0.01 0.1 1 10
Static Drain-Source On-State Resistance
R
DS(on)
[mΩ]
Drain Current : ID [A]
Fig.5 Static Drain-Source On-State Resistance vs. Drain Current
Ta= 125℃
Ta= 75°C
Ta= 25°C
Ta= - 25°C
1
10
100
1000
0.01 0.1 1 10
Static Drain-Source On-State Resistance
R
DS(on)
[mΩ]
Drain Current : ID [A]
Fig.6 Static Drain-Source On-State Resistance vs. Drain Current
Ta= 125℃
Ta= 75°C
Ta= 25°C
Ta= - 25°C