Datasheet QS8J4 Datasheet (ROHM)

Page 1
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4V Drive Pch + Pch MOSFET
(8) (7)
(1) (2)
(6) (5)
(3) (4)
QS8J4
Structure Dimensions (Unit : mm)
Silicon P-channel MOSFET
Features
2) High power package(TSMT8).
3) Low voltage drive(4V drive).
Application
Switching
TSMT8
(8) (7) (5)(6)
(1) (2) (4)(3)
Abbreviated symbol : J04
Packaging specifications
Package Taping
Type
Code TR Basic ordering unit (pieces) 3000
QS8J4
Absolute maximum ratings (Ta = 25C)
Parameter Drain-source voltage V Gate-source voltage V
Drain current Source current
(Body Diode)
Continuous I Pulsed I Continuous I Pulsed I
Power dissipation
Symbol Limits Unit
DSS GSS
DP
P
D
*1
s
sp
D
30 V20 V
4A
16 A
1A
*1
16 A
*2
1.5 W / TOTAL
1.25 W / ELEMENT Channel temperature Tch 150 C Range of storage temperature Tstg 55 to +150 C
*1 Pw10s, Duty cycle1% *2 Each terminal mounted on a ceramic board.
Inner circuit
(1) Tr1 Source (2) Tr1 Gate (3) Tr2 Source (4) Tr2 Gate (5) Tr2 Drain (6) Tr2 Drain (7) Tr1 Drain (8) Tr1 Drain
2
1 ESD PROTECTION DIODE2 BODY DIODE
2
1
1
Thermal resistance
Parameter
Channel to Ambient Rth (ch-a)
* Each terminal mounted on a ceramic board.
Symbol Limits Unit
83.3 °C / W /TOTAL
*
100 °C / W /ELEMENT
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2010.04 - Rev.A
Page 2
Data Sheet
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QS8J4
Electrical characteristics (Ta = 25C)
<It is the same ratings for Tr1 and Tr2.>
Symbol Min. Typ. Max. Unit Gate-source leakage I Drain-source breakdown voltage V Zero gate voltage drain current I Gate threshold voltage V
GSS
(BR)DSS
DSS
GS (th)
--10 AVGS=20V, VDS=0V
30 - - V ID=1mA, VGS=0V
--1 AVDS=30V, VGS=0V
1.0 - 2.5 V VDS=10V, ID=1mA
-4056 I
Static drain-source on-state resistance
R
DS (on)
*
-5577 I
m
-6084 I
iss
oss
rss
d(on)
d(off)
gd
*
- 800 - pF VDS=10V
- 120 - pF VGS=0V
- 110 - pF f=1MHz
-8-nsI
*
*
- 20 - ns VGS=10V
*
*
r
- 80 - ns RL=7.5
*
* *
*
*
*
f
g
gs
- 50 - ns RG=10
*
*
*
*
- 8.4 - nC ID=4A, VDD 15V
*
*
*
*
- 3.0 - nC VGS=5V
- 3.5 - nC RL=3.8,RG=10
*
*
*
*
Forward transfer admittance l Yfs l3 - -SI Input capacitance C Output capacitance C Reverse transfer capacitance C Turn-on delay time t Rise time t Turn-off delay time t Fall time t Total gate charge Q Gate-source charge Q Gate-drain charge Q
*Pulsed
ConditionsParameter
=4A, VGS=10V
D
=2A, VGS=4.5V
D
=2A, VGS=4V
D
=4A, VDS=10V
D
=2A, VDD 15V
D
Body diode characteristics (Source-Drain) (Ta = 25C)
<It is the same ratings for Tr1 and Tr2.>
Parameter Symbol Min. Typ. Max. Unit
Forward Voltage V
*Pulsed
SD
*
--1.2 V Is=4A, VGS=0V
Conditions
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2010.04 - Rev.A
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Data Sheet
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QS8J4
Electrical characteristic curves
10
Ta=25°C Pulsed
8
[A]
D
6
4
2
DRAIN CURRENT : -I
0
0 0.2 0.4 0.6 0.8 1
DRAIN-SOURCE VOLTAGE : -VDS[V]
Fig.1 Typical Output Characteristics( ) Fig.2 Typical Output Characteristics( ) Fig.3 Typical Transfer Characteristics
1000
Ta=25°C Pulsed
(on)[mΩ]
100
DS
10
RESISTANCE : R
STATIC DRAIN-SOURCE ON-STATE
1
0.1 1 10
DRAIN-CURRENT : -ID[A]
Fig.4 Static Drain-Source On-State Resistance vs. Drain Current( )
VGS= -10V
VGS= -4.5V
VGS= -4.0V
VGS= -3.0V
VGS= -2.5V
VGS= -4.0V
VGS= -4.5V
VGS= -10V
10
8
[A]
D
6
4
2
DRAIN CURRENT : -I
0
0246810
1000
(on)[mΩ]
100
DS
10
RESISTANCE : R
STATIC DRAIN-SOURCE ON-STATE
1
0.1 1 10
VGS= -10V
VGS= -4.5V
VGS= -4.0V
VGS= -3.0V
VGS= -2.5V
DRAIN-SOURCE VOLTAGE : -VDS[V]
VGS= -10V
Pulsed
DRAIN-CURRENT : -ID[A]
Fig.5 Static Drain-Source On-State Resistance vs. Drain Current( )
Ta=125°C Ta=75°C Ta=25°C Ta= -25°C
Ta=25°C Pulsed
10
VDS= -10V
Pulsed
[A]
1
D
DRAIN CURRENT : -I
0.001
1000
(on)[mΩ]
DS
RESISTANCE : R
STATIC DRAIN-SOURCE ON-STATE
Ta= 125°C
Ta= 75°C Ta= 25°C
0.1 Ta= - 25°C
0.01
0123
GATE-SOURCE VOLTAGE : -VGS[V]
VGS= -4.5V
Pulsed
100
10
1
0.1 1 10
DRAIN-CURRENT : -ID[A]
Fig.6 Static Drain-Source On-State Resistance vs. Drain Current( )
Ta=125°C Ta=75°C Ta=25°C Ta= -25°C
1000
VGS= -4.0V
Pulsed
(on)[mΩ]
100
DS
10
RESISTANCE : R
STATIC DRAIN-SOURCE ON-STATE
1
0.1 1 10
DRAIN-CURRENT : -ID[A]
Fig.7 Static Drain-Source On-State Resistance vs. Drain Current( )
Ta=125°C Ta=75°C Ta=25°C Ta= -25°C
100
VDS= -10V
Pulsed
10
1
0.1
0.01 0.1 1 10
FORWARD TRANSFER ADMITTANCE : |Yfs| [S]
DRAIN-CURRENT : -ID[A]
Fig.8 Forward Transfer Admittance vs. Drain Current
Ta= -25°C Ta=25°C Ta=75°C Ta=125°C
10
[A]
VGS=0V
s
Pulsed
1
0.1
SOURCE CURRENT : -I
0.01
0 0.5 1 1.5
SOURCE-DRAIN VOLTAGE : -VSD [V]
Fig.9 Reverse Drain Current vs. Sourse-Drain Voltage
Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
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2010.04 - Rev.A
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Data Sheet
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QS8J4
f
150
ID= -2.0A
(ON)[mΩ]
100
DS
50
Ta=25°C
RESISTANCE : R
STATIC DRAIN-SOURCE ON-STATE
Pulsed
0
0 5 10 15
GATE-SOURCE VOLTAGE : -VGS[V]
Fig.10 Static Drain-Source On-State Resistance vs. Gate Source Voltage
10000
Ta=25°C f=1MHz VGS=0V
1000
100
CAPACITANCE : C [pF]
Crss
10
0.01 0.1 1 10 100
DRAIN-SOURCE VOLTAGE : -VDS[V]
Fig.13 Typical Capacitance vs. Drain-Source Voltage
ID= -4.0A
Coss
Ciss
10000
t
1000
100
SWITCHING TIME : t [ns]
d(off)
t
t
d(on)
10
1
0.01 0.1 1 10
DRAIN-CURRENT : -ID[A]
Fig.11 Switching Characteristics
t
r
Ta=25°C VDD= -15V
VGS= -10V
RG=10
Pulsed
10
[V]
8
GS
6
4
2
0
GATE-SOURCE VOLTAGE : -V
0 1 2 3 4 5 6 7 8 9 101112131415
TOTAL GATE CHARGE : Qg [nC]
Fig.12 Dynamic Input Characteristics
Ta=25°C VDD= -15V
ID= -4.0A
RG=10
Pulsed
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2010.04 - Rev.A
Page 5
Data Sheet
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QS8J4
Measurement circuits
VGS
RG
Fig.1-1 Switching Time Measurement Circuit
VGS
IG(Const.)
RG
Fig.2-1 Gate Charge Measurement Circuit
D.U.T.
I
D.U.T.
D
I
RL
VDD
D
RL
VDD
VDS
VDS
Pulse Width
V
GS
10%
50%
V
DS
90% 90%
t
d(on)
t
on
90%
10% 10%
t
d(off)
t
r
Fig.1-2 Switching Waveforms
V
G
Q
g
V
GS
QgsQ
gd
Fig.2-2 Gate Charge Waveform
50%
t
off
Charge
t
f
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2010.04 - Rev.A
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Notes
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