Datasheet QS6K21 Datasheet (ROHM)

C
QS6K21
zStructure zDimensions (Unit : mm) Silicon N-channel MOSFET
zFeatures
1) Low on-state resistance with fast switching.
2) Low voltage drive (2.5V).
zApplication zInner circuit
Switching
zPackaging specifications
Type
QS6K21
Package Code Basic ordering unit (pieces)
Taping
TR
3000
zAbsolute maximum ratings (Ta=25°C)
Parameter Drainsource voltage Gatesource voltage
Drain current
Source current (Body diode)
Continuous Pulsed Continuous
Pulsed Total power dissipation Channel temperature
Range of Storage temperature
1 Pw10µs, Duty cycle1%2 When mounted on a ceramic board
Symbol
DSS
V V
GSS
I
D
I
DP
I
S
I
SP
P
D
Tch
Tstg
Limits Unit
45 12
±1.0
1
±2.0
0.8
1
2
2.0
1.25
0.9
150
55 to +150
zThermal resistance
Parameter Symbol Limits Unit
100
hannel to ambient
When mounted on a ceramic board
Rth (ch-a)
TSMT6
(6)
1 ESD protection diode2 Body diode
V V A A A A
W / TOTAL
W / ELEMENT
°C °C
°C / W / TOTAL
°C / W / ELEMENT139
(1)
1pin mark
2
2.9
1.9
0.950.95
(6)
(5)
(4)
(1)
(2)
0.4
Abbreviated symbol : K21
(5) (5)
1
(2) (3)
Each lead has same dimensions
1.0MAX
0.85
0.7
2.8
1.6
0.16
0~0.1
0.6
~
0.3
2
(1) Tr1 Gate (2) Tr2 Source (3) Tr2 Gate (4) Tr2 Drain (5) Tr1 Source (6) Tr1 Drain
(3)
1
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2009 ROHM Co., Ltd. All rights reserved.
2009.03 - Rev.A
zElectrical characteristics (Ta=25°C)
Parameter
Symbol Gate-source leakage Drain-source breakdown voltage
V
(BR) DSS
Zero gate voltage drain current Gate threshold voltage
Static drain-source on-state resistance
V
R
Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge
Pulsed
zBody diode characteristics (Source-drain) (Ta=25°C)
Parameter Symbol
Pulsed
I
GSS
I
DSS
GS (th)
DS (on)
Y
fs
C
iss
C
oss
C
rss
t
d (on)
t
r
t
d (off)
t
f
Q
Q
gs
Q
gd
V
SD
g
Min.
Typ. Max.
−−10
45 −−VID=1mA, VGS=0V
−−1
0.5 1.5
300 420 I
310 435 mΩmΩID=1.0A, VGS=4.0V
415 585 mID=1.0A, VGS=2.5V
1.2 −−SV
95
20
−−
10
16
1.5
0.4
0.4
6 8
7
2.1
Min. Typ. Max.
−−1.2 VForward voltage IS= 0.8A, VGS=0V
Unit
µA
V
GS
µA
VDS=45V, VGS=0V
V
VDS=10V, ID=1mA
=1.0A, VGS=4.5V
D
DS
pF
VDS=10V
pF
VGS=0V
pF
f=1MHz
ns
VDD 25V
ID=0.5A
ns
GS
V
ns
L
R
ns
R
G
nC
V
DD
nC
VGS=4.5V R
L
nC
Unit
Data Sheet QS6K21
Conditions
=12V, VDS=0V
=10V, ID=1A
=4.5V 50Ω =10
25V, ID=1.0A
25, RG=10
Conditions
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2009 ROHM Co., Ltd. All rights reserved.
2009.03 - Rev.A
V
V
V
V
zElectrical characteristics curves
Data Sheet QS6K21
1
VGS= 10
0.8
[A]
D
0.6
0.4
DRAIN CURRENT : I
0.2
0
00.20.40.60.81
DRAIN-SOURCE VOLTAGE : VDS[V] DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.1 Typical Output Characteristics(Ⅰ) Fig.2 Typical Output Characteristics(Ⅱ)
10000
Ta= 25°C Pulsed
]
(on) [m
DS
1000
RESIST ANCE : R
STATI C DRAIN -SOUR CE ON- STATE
100
0.01 0.1 1 10
DRAIN-CURRENT : I
Fi g.4 Stat ic Dr ain- Source On- State
R esistance vs. D rain C urrent(Ⅰ)
VGS= 4.5 VGS= 4.0 VGS= 2.5
VGS= 1.8V
VGS= 1.5V
VGS= 2. 5V
= 4. 0V
V
GS
= 4. 5V
V
GS
[A]
D
Ta=25°C Pulsed
1
0.8
[A]
D
0.6
0.4
DRAIN CURRENT : I
0.2
0
0246810
10000
VGS= 4.5V Pulsed
]
(on)[m
DS
1000
RESIST ANCE : R
STATIC DRAIN-SOURCE ON-STATE
100
0.01 0.1 1 10
Fi g.5 Stat ic Dr ain- Source On- State
Resistance vs. Drain Current(Ⅱ)
VGS= 4.5V
= 2.5V
V
GS
VGS= 1. 8V
VGS= 1. 5V
Ta= 125°C Ta= 75°C Ta= 25°C Ta= -25°C
DRAIN-CURRENT : ID[A]
Ta= 25°C Pulsed
10
VDS= 10V Pulsed
[A]
D
1
Ta= 125°C
Ta= 75°C
0.1
Ta= 25°C
DRAIN CURRENT : I
]
(on) [m
RESIST ANCE : R
STATI C DRAIN -SOUR CE ON- STATE
Ta= - 25°C
0.01
0.001
00.511.522.5
GATE-SOURCE VOLTAGE : VGS[V]
Fi g.3 T ypical Tran sfer C haracter isti cs
10000
VGS= 4. 0V Pulsed
Ta= 125°C
DS
1000
100
0.01 0.1 1 10
DRAIN-CURRENT : ID[A]
Fi g.6 Stat ic Dr ain- Source On- State
Resistance vs. Drain Curr ent(Ⅲ)
Ta= 75°C Ta= 25°C Ta= -25°C
10000
VGS= 2.5V Pulsed
]
(on)[m
DS
1000
RESIST ANCE : R
STATIC DRAIN-SOURCE ON-STATE
100
0.01 0.1 1 10
DRAIN-CURRENT : ID[A]
Fi g.7 Stat ic Dr ain- Source On- State
R esistance vs. D rain C urrent(Ⅳ)
Ta=125°C
Ta=75°C Ta=25°C
Ta= -25°C
10
VDS= 10V Pulsed
1
FOR WARD T RANSF ER
ADM ITTANCE : |Yfs | [S]
0.1
0.01 0.1 1 10
DRAIN-CURRENT : ID[A]
Fi g.8 F orward T ransfer Admitta nce vs. D rain Curr ent
Ta= -25°C Ta= 25°C Ta= 75°C Ta= 125°C
10
VGS=0V Pulsed
1
0.1
REVER SE DRAIN C URR ENT : Is [A]
0.01
00.511.5
SOUR CE-D RAIN VOLTAGE : VSD [V]
Fig.9 Reverse Drain Current vs. Sourse- Drain Voltag e
Ta= 125°C
Ta= 75°C Ta= 25°C
Ta= -25°C
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2009 ROHM Co., Ltd. All rights reserved.
2009.03 - Rev.A
F
it
%
V V
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
V
zMeasurement circuits
1000
]
800
(ON)[m
DS
600
400
RESISTANCE : R
200
STATIC DRAIN- SOURCE ON -STATE
0
0246810
Fi g.10 Stati c Dr ain-Sour ce On-Stat e Resistance vs. Gate Source Voltage
1000
Ta= 25°C f=1M Hz V
GS
100
10
CAPACITANCE : C [pF]
1
0.01 0.1 1 10 100
VGS
RG
ID= 0.5A
ID= 1.0A
GATE-SOUR CE VOLTAGE : VGS[V]
=0V
Crss
DRAIN-SOURCE VOLTAGE : V
Fi g.13 T ypical Capaci tance vs. Drain-Source Voltag e
D
I
Ciss
Coss
VDS
RL
D.U.T.
VDD
Ta=25°C Pulsed
[V]
DS
1000
td(off)
t
100
10
SWITC HING TIME : t [ns]
1
0.01 0.1 1 10
Fig.11 Switching Characteristics
f
td(on)
DRAIN-CURRENT : ID[A]
t
r
Pulse Width
50%
10%
GS DS
10% 10
90%
90% 90%
t
d(on)
t
on
t
t
r
d(off)
Ta=25°C
= 25V
V
DD
=4.5V
V
GS
=10
R
G
Pulsed
50%
t
off
Data Sheet QS6K21
5
[V]
GS
4
3
2
1
GATE-SOU RCE VOLTAGE : V
0
0 0.5 1 1.5 2
TOTAL GATE CHARGE : Qg [nC]
Fi g.12 Dynamic Input Charac teris tics
t
f
Ta=25°C V
= 25V
DD
= 1.0A
I
D
=10
R
G
Puls ed
ig.1-1 Switching Time Measurement Circu
V
GS
I
(Const.)
G
R
G
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2009 ROHM Co., Ltd. All rights reserved.
D
I
D.U.T.
V
DS
R
L
V
DD
Fig.1-2 Switching Waveforms
V
G
Q
g
GS
Q
gs
Q
gd
Charge
2009.03 - Rev.A
Notes
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