ROHM QS5U28 Technical data

Transistor
d.

2.5V Drive Pch+SBD MOS FET

QS5U28

zStructure zExternal dimensions (Unit : mm) Silicon P-channel MOS FET
Schottky Barrier DIODE
zFeatures
1) The QS5U28 combines Pch MOS FET with a Schottky barrier diode in TSMT5 package.
2) Low on-state resistance with fast switching.
3) Low voltage drive (2.5V).
4) Built-in schottky barrier diode has low forward voltage.
zApplic ations
Load switch, DC/DC conversion
zPackaging specifications zEquivalent circuit
Type
QS5U28
Package Code Basic ordering unit (pieces)
Taping
TR
3000
TSMT5
2.9
1.9
0.950.95
(5)
(1)
0.4
Abbreviated symbol : U28
(5) (4)
1
(1) (2) (3)
1 ESD protection diode2 Body diode
A protection diode has been buitt in between the gate and
the source to protect against static electricity when the product is in use. Use the protection circuit when rated voltages are exceede
1.0MAX
0.85
0.7
(4)
2.8
1.6
(3)(2)
2
0~0.1
0.16
Each lead has same dimensions
(1)Gate (2)Source (3)Anode (4)Cathode (5)Drain
QS5U28
0.6
~
0.3
Rev.A 1/4
Transistor
zAbsolute maximum ratings (Ta=25°C)
<
MOSFET
Drain-source voltage Gate-source voltage
Drain current Source current
(Body diode)
>
Parameter
Continuous Pulsed Continuous Pulsed
Symbol
DSS GSS
D
DP
S
SP
Limits Unit
20 ±12
1
1
±2.0 ±8.0
1.0
8.0
Channel temperature
3
Power dispation
D
P
0.9
<Di>
Parameter Symbol Limits Unit
FSM
RM
R
F
2
Repetitive peak reverse voltage Reverse voltage Forward current Forward current surge peak Junction temperature
3
P
Power dispation
<
MOSFET AND Di
>
D
Parameter Symbol Limits Unit
Total power dispation
3
P
D
Range of strage temperature
1 Pw10µs, Duty cycle1% 2 60Hz•1cyc. 3 Mounted on a ceramic board.
zElectrical characteristics (Ta=25°C)
<
MOSFET
Gate-source leakage
Drain-source breakdown voltage Zero gate voltage drain current
Gate threshold voltage
Static drain-source on-starte resistance
Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time
Total gate charge
Gate-source charge Gate-drain charge
Pulsed
>
Parameter Symbol
I
GSS
(BR) DSS
V
I
DSS
V
GS (th)
R
DS (on)
Y
fs
C
iss
C
oss
C
rss
t
d (on)
t
r
t
d (off)
f
t
Q
g
Q
gs
gd
Q
Min.
−−±10 µAV
20 −−VID= −1mA, VGS= 0V
−−−1 µAVDS= −20V, VGS= 0V
0.7 −−2.0 V VDS= −10V, ID= −1mA
90 125 mI
97 135 mID= −2A, VGS= −4.0V
175 245 mI
1.6 −−SV
450 pF VDS= −10V
7052− pF VGS= 0V
−−nC
25 20
1.0
3.0
0.7
1.25
Typ. Max.
10 16 32 15
4.8
1.0
1.3
VV VV AI AI AI AI
°CTch 150
W/ELEMENT
VV VV AI AI
°CTj 150
W/ELEMENT
W/TOTAL
°CTstg 55 to +150
Unit
GS
= ±12V, VDS= 0V
D
= 2A, VGS= 4.5V
D
= 1A, VGS= 2.5V
DS
= 10V, ID= 1A
pF f=1MHz
V
ns
ns
ns
ns
nC
nC
DD
GS
V
D
= 1A
I R
L
R
G
V
DD
V
GS
I
D
= 2A
R
L G
R
= 4.5V
= 15
= 10
= 4.5V
= 7.5
= 10
15
15
V
V
Conditions
QS5U28
<
MOSFET> Body diode (Source-drain)
Parameter Symbol
Forward voltage
Min. Typ. Max.
SD
−− V
Unit
1.2V
IS= 1.0V , VGS= 0V
Conditions
<Di>
Parameter Symbol
Forward voltage Reverse current
Rev.A 2/4
Min. Typ. Max.
F
−− V
R
−− µA
Unit
0.45V 200I
IF= 1.0V
VR= 20V
Conditions
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