EMD6 / UMD6N / IMD6A
Transistors
EMD6 / UMD6N / IMD6A
zFeatures
1)Both the DTA143T chip and DTC143T chip in an EMT or UMT or SMT package.
2)Mounting possible with EMT3 or UMT3 or SMT3 automatic mounting machines.
3)Transistor elements are independent, eliminating interference.
4)Mounting cost and area can be cut in half.
zStructure
A PNP and NPN digital transistor (each with a single built in resistor)
The following characteristics apply to both the DTr1 and DTr2, however, the “ −” sign on DTr2 values for the PNP type have been omitted.
zEquivalent circuit
EMD6 / UMD6N |
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IMD6A |
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(3) |
(2) |
(1) |
(4) |
(5) |
(6) |
R1 |
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R1 |
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DTr2 |
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DTr1 |
DTr2 |
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DTr1 |
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R1=4.7kΩ |
R1 |
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(3) |
R1 |
R1=4.7kΩ |
(4) |
(5) |
(6) |
(2) |
(1) |
zAbsolute maximum ratings (Ta = 25°C)
Parameter |
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Symbol |
Limits |
Unit |
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Collector-base voltage |
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VCBO |
50 |
V |
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Collector-emitter voltage |
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VCEO |
50 |
V |
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Emitter-base voltage |
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VEBO |
5 |
V |
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Collector current |
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IC |
100 |
mA |
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Collector |
EMD6, UMD6N |
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PC |
150 (TOTAL) |
mW |
1 |
power |
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2 |
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IMD6A |
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300 (TOTAL) |
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dissipation |
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Junction temperature |
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Tj |
150 |
˚C |
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Storage temperature |
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Tstg |
−55+150 |
˚C |
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1 120mW per element must not be exceeded.2 200mW per element must not be exceeded.
zExternal dimensions (Units : mm)
EMD6
0.22 |
(5) |
(2) |
0.50.5 |
1.0 |
1.6 |
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(4) |
(3) |
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(6) |
(1) |
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1.2 |
0.13 |
1.6 |
0.5 |
Each lead has same dimensions
ROHM : EMT6
Abbreviated symbol : D6
UMD6N |
(4) |
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(3) |
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0.65 |
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0.2 |
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(2) |
1.3 |
2.0 |
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(5) |
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(6) |
(1) |
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0.65 |
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1.25 |
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2.1 |
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0.15 |
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0to0.1 |
0.7 |
0.9 |
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0.1Min. |
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Each lead has same dimensions
ROHM : UMT6
EIAJ : SC-88
Abbreviated symbol : D6
IMD6A
0.3 |
(6) |
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(1) |
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0.950.95 |
1.9 |
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2.9 |
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(5) |
(2) |
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(4) |
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(3) |
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1.6 |
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2.8 |
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0.15 |
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0to0.1 |
0.8 |
1.1 |
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0.3to0.6 |
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Each lead has same dimensions
ROHM : SMT6
EIAJ : SC-74
Abbreviated symbol : D6
Rev.A 1/2
EMD6 / UMD6N / IMD6A
Transistors
zElectrical characteristics (Ta = 25°C)
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Symbol |
Min. |
Typ. |
Max. |
Unit |
Conditions |
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Collector-base breakdown voltage |
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BVCBO |
50 |
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− |
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− |
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V |
IC=50µA |
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Collector-emitter breakdown voltage |
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BVCEO |
50 |
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− |
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V |
IC=1mA |
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Emitter-base breakdown voltage |
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BVEBO |
5 |
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− |
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− |
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V |
IE=50µA |
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Collector cutoff current |
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ICBO |
− |
− |
0.5 |
µA |
VCB=50V |
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Emitter cutoff current |
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IEBO |
− |
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0.5 |
µA |
VEB=4V |
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Collector-emitter saturation voltage |
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VCE (sat) |
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0.3 |
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V |
IC/IB=5mA/0.25mA |
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DC current transfer ratio |
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hFE |
100 |
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250 |
600 |
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VCE=5V, IC=1mA |
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Transition frequency |
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fT |
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250 |
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MHz |
VCE=10V, IE=−5mA, f=100MHz |
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Input resistance |
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R1 |
3.29 |
4.7 |
6.11 |
kΩ |
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Transition frequency of the transistor |
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zPackaging specifications |
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Package |
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Taping |
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Code |
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T2R |
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TR |
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T108 |
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Type |
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Basic ordering |
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8000 |
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3000 |
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3000 |
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unit (pieces) |
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EMD6 |
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UMD6N |
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IMD6A |
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zElectrical characteristic curves
DTr1 (NPN)
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1k |
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VCE=5V |
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500 |
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FE |
200 |
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: h |
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Ta=100˚C |
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GAIN |
100 |
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25˚C |
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50 |
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−40˚C |
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CURRENT |
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20 |
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10 |
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DC |
5 |
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2 |
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1 |
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100 200 |
500 1m |
2m |
5m |
10m 20m |
50m100m |
COLLECTOR CURRENT : IC (A)
Fig.1 DC current gain vs. collector current
(V) |
1 |
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lC/lB=20 |
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VCE (sat) |
500m |
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200m |
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Ta=100˚C |
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VOLTAGE |
100m |
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25˚C |
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−40˚C |
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50m |
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SATURATION |
20m |
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10m |
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5m |
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COLLECTOR |
2m |
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1m |
200 500 1m |
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100 |
2m |
5m |
10m |
20m 50m 100m |
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COLLECTOR CURRENT : IC (A) |
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Fig.2 Collector-emitter saturation voltage vs. collector current
DTr2 (PNP)
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1k |
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VCE=−5V |
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500 |
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hFE |
200 |
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Ta=100˚C |
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GAIN |
100 |
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25˚C |
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50 |
−40˚C |
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CURRENT |
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20 |
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10 |
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DC |
5 |
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2 |
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1 |
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−100µ −200µ −500µ −1m −2m |
−5m −10m −20m −50m−100m |
COLLECTOR CURRENT : IC (A)
Fig.3 DC current gain vs. collector current
(V) |
−1 |
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lC/lB=20 |
(sat) |
−500m |
Ta=100˚C |
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: VCE |
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25˚C |
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−200m |
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−40˚C |
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VOLTAGE |
−100m |
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−50m |
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SATURATION |
−20m |
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−10m |
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−5m |
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COLLECTOR |
−2m |
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−1m |
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−100µ −200µ −500µ −1m |
−2m |
−5m −10m −20m −50m−100m |
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COLLECTOR CURRENT : IC (A) |
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Fig.4 Collector-emitter saturation voltage vs. collector current
Rev.A 2/2