ROHM EMB10, IMB10A, UMB10N Schematic [ru]

EMB10 / UMB10N / IMB10A
Transistors
General purpose (dual digital transistors)
EMB10 / UMB10N / IMB10A
1) Two DTA123J chips in a EMT or UMT or SMT package.
2) Mounting possible with EMT3 or UMT3 or SMT3 automatic mounting machines.
3) Transistor elements are independent, eliminating interference.
4) Mounting cost and area can be cut in half.
zStructure
Epitaxial planar type PNP silicon transistor (Built-in resistor type)
The following characteristics apply to both DTr
2.
DTr
1 and
zEquivalent circuit
EMB10 / UMB10N IMB10A
(3) (2) (1)
R
1
R
2
R
R
1
=2.2k
2
=47k
DTr
2
R
2
R
(4) (5) (6)
DTr
1
(4) (5) (6)
R
1
R
2
DTr
1
DTr
2
(3) (2) (1)
1
1
=2.2k
R
R
2
R2=47k
R
1
zAbsolute maximum ratings (Ta = 25°C)
IN
Limits
12 5
150 (TOTAL) 300 (TOTAL)
Parameter Symbol
Supply voltage
Input voltage
Output current
Power dissipation
Junction temperature Storage temperature
1 120mW per element must not be exceeded.
2 200mW per element must not be exceeded.
EMB10, UMB10N IMB10A
I
V
CC −50 V
V
O −100
I
C (Max.) −100
Pd
Tj 150 ˚C
Tstg 55 to +150 ˚C
Unit
V
mA
mW
zDimensions (Unit : mm)
EMB10
ROHM : EMT6
UMB10N
ROHM : UMT6 EIAJ : SC-88
IMB10A
ROHM : SMT6 EIAJ : SC-74
1
2
(6) (5) (4)
(1) (2) (3)
Each lead has same dimensions
Abbreviated symbol : B10
(6) (5)(4)
(1) (2)(3)
Each lead has same dimensions
Abbreviated symbol : B10
(4) (5) (6)
(3) (2) (1)
Each lead has same dimensions
Abbreviated symbol : B10
Rev.C 1/2
EMB10 / UMB10N / IMB10A
Transistors
zElectrical characteristics (Ta = 25°C)
Parameter Symbol
Input voltage
Output voltage Input current Output current DC current gain Transition frequency Input resistance Resistance ratio
Transition frequency of the device
R2 / R
zPackaging specifications
Package
Type
Code TN T110 Basic ordering
unit (pieces) EMB10 UMB10N IMB10A
zElectrical characteristic curves
100
50
20
(V)
10
I (on)
5
Ta=40˚C
25˚C
2
100˚C
1
500m
INPUT VOLTAGE : V
200m
100m
100µ
1m 10m 100m
200µ−2m −20m500µ−5m −50m
OUTPUT CURRENT : I
O
(A)
Fig.1 Input voltage vs. output current
(ON characteristics)
1
500m
200m
(V)
100m
O (on)
50m
20m
10m
5m
OUTPUT VOLTAGE : V
-2m
1m
100µ
200µ−2m −20m500µ−5m −50m
OUTPUT CURRENT : I
Fig.4 Output voltage vs. output
Ta=100˚C
25˚C
40˚C
1m 10m 100m
O
(A)
current
I (off)
V V
I (on)
V
O (on)
I
I
I
O (off)
G
T
R
1
VO=0.3V
lO/lI =20
Min.
Typ. Max. Unit Conditions
V
CC
=
5V, I
O
=
0.5
1.1
I
1.54
1
0.1
0.3
80
f
17
0.5
250 V
2.86
2.2 21
V
O
=
V
mA
µA
MHz
V
O/II
=
I V
I
=
5V
CC
V
O
=
V
CE
=
3.6
k
26
−−
100µA
0.3V, I
O
=
5mA
5mA/0.25mA
=
50V, V
I
=
0V
5V, I
O
=
10mA
10V, I
E
=
5mA, f=100MHz
Taping
T2R
8000
3000 3000
10m
5m
2m
1m
(A)
500µ
200µ
100µ
50µ
20µ
10µ
5µ
OUTPUT CURRENT : Io
2µ
1µ
0 3
Ta=100˚C
0.5 1 1.5 2 2.5
INPUT VOLTAGE : V
Fig.2 Output current vs. input voltage
(OFF characteristics)
25˚C
40˚C
VCC=5V
I (off)
(V)
1k
500
I
200 100
DC CURRENT GAIN : G
Ta=100˚C
25˚C
40˚C
50
20 10
5
2 1
100µ−1m −10m −100m
200µ−2m −20m500µ−5m −50m
OUTPUT CURRENT : I
VO=5V
O
(A)
Fig.3 DC current gain vs. output
current
Rev.C 2/2
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