ROHM EM6M2 Technical data

T
EM6M2
zStructure zDimensions (Unit : mm) Silicon N-channel MOSFET / Silicon P-channel MOSFET
zFeatures
1) Nch MOSFET and Pch MOSFET are put in EMT6 package.
2) High-speed switching.
3) Low voltage drive (1.2V drive).
4) Built-in G-S Protection Diode.
zApplications zInner circuit
Switching
zPackaging specifications
Package
Type
EM6M2
Code Basic ordering unit (pieces)
Taping
T2R
8000
zAbsolute maximum ratings (Ta=25°C)
20
±
8
±200 ±400
Limits
Tr2 : P-ch
20
±10 ±200 ±400
150 120
Parameter
Drain-source voltage Gate-source voltage
Drain current
Continuous Pulsed
Total power dissipation Channel temperature
Range of storage temperature
1 Pw 10µs, Duty cycle 1%2 Each terminal mounted on a recommended land
Symbol
DSS GSS
D
1
DP
2
P
D
Tr1 : N-ch
EMT6
(6)
2
1
(1)
1 ESD PROTECTION DIODE2 BODY DIODE
Unit
VV
VV mAI mAI
mW / TOTAL
mW / ELEMEN
°CTch 150 °CTstg −55 to +150
Each lead has same dimensions
Abbreviated symbol : M02
(5)
1
(2)
(4)
(3)
2
(1) Tr1 Source (2) Tr1 Gate (3) Tr2 Drain (4) Tr2 Source (5) Tr2 Gate (6) Tr1 Drain
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2009 ROHM Co., Ltd. All rights reserved.
2009.07 - Rev.A
G D Z G
S r
F I O R T R T F
G D Z G
S r
F I O R T R T F
N-ch zElectrical characteristics (Ta=25°C)
Parameter Symbol
ate-source leakage
rain-source breakdown voltage
V
(BR) DSS
ero gate voltage drain current
ate threshold voltage
tatic drain-source on-state
esistance
V
R
orward transfer admittance
nput capacitance
utput capacitance everse transfer capacitance urn-on delay time ise time urn-off delay time all time
Pulsed
zBody diode characteristics (Source-drain) (Ta=25°C)
Parameter Symbol
Pulsed
P-ch zElectrical characteristics (Ta=25°C)
Parameter Symbol
ate-source leakage rain-source breakdown voltage
V
(BR) DSS
ero gate voltage drain current
ate threshold voltage
tatic drain-source on-state
esistance
V
R
orward transfer admittance
nput capacitance
utput capacitance everse transfer capacitance urn-on delay time ise time urn-off delay time all time
Pulsed
zBody diode characteristics (Source-drain) (Ta=25°C)
Parameter Symbol
Pulsed
Min.
I
GSS
Typ. Max.
−−±10 µAV
Unit
= ±8V, VDS=0V
GS
20 −−VID= 1mA, VGS=0V
I
DSS
GS (th)
DS (on)
Y
C
C C
t
d (on)
t
d (off)
V
I
GSS
−−1 µAVDS= 20V, VGS=0V
0.3 1.0 V VDS= 10V, ID= 1mA
0.7 1.0 I
0.8 1.2
1.0 1.4 ID= 200mA, VGS= 1.8V
1.2 2.4 ΩΩI
1.6 4.8 I
0.2 −−SVDS= 10V, ID= 200mA
fs
25 pF VDS= 10V
iss
1010− pF VGS= 0V
oss
rss
t
r
t
−−ns
f
pF f=1MHz
5
ns
10
ns
15
ns
10
Min. Typ. Max.
SD
−−1.2 V IS= 100mA, VGS=0VForward voltage
Min.
Typ. Max.
−−±10 µAV
= 200mA, VGS= 4.0V
D
I
= 200mA, VGS= 2.5V
D
= 40mA, VGS= 1.5V
D
= 20mA, VGS= 1.2V
D
VDD 10V
ID= 150mA
GS
V R
L
R
G
= 10
Unit
Unit
GS
= 4.0V
= ±10V, VDS=0V
20 −−VID= 1mA, VGS=0V
I
DSS
GS (th)
DS (on)
Y
C
C C
t
d (on)
t
d (off)
V
−−−1 µAVDS= −20V, VGS=0V
0.3 −−1.0 V VDS= −10V, ID= −100µA
0.8 1.2 I
1.0 1.5
1.3 2.2 ID= −100mA, VGS= −1.8V
1.6 3.5 ΩΩI
2.4 9.6 I
0.2 −−SV
fs
115 pF VDS= 10V
iss
106− pF VGS= 0V
oss
rss
t
r
−−ns
t
f
pF f=1MHz
ns
6 4
ns
17
ns
17
Min. Typ. Max.
SD
−−−1.2 V IS= 200mA, VGS=0VForward voltage
= 200mA, VGS= 4.5V
D
= 100mA, VGS= 2.5V
I
D
= 40mA, VGS= 1.5V
D
= 10mA, VGS= 1.2V
D
= 10V, ID= 200mA
DS
V
DD
ID= 100mA
GS
= 4.5V
V R
L
R
G
= 10
Unit
Conditions
67
Conditions
Conditions
10V
100
Conditions
Data Sheet EM6M2
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2009 ROHM Co., Ltd. All rights reserved.
2009.07 - Rev.A
.5
V
V
V
N-ch zElectrical characteristic curve
0.5
0.4
[A]
D
0.3
0.2
DRAIN CURRENT : I
0.1
0
00.20.40.60.81
Fi g.1 Typical Output Charac terist ics(Ⅰ)
VGS= 4.5 VGS= 2.5 VGS= 1.8
DRAIN-SOURCE VOLTAGE : VDS[V] DRAIN-SOURCE VOLTAGE : VDS[V]
VGS= 1.5V
VGS= 1.3V
Ta= 25°C Pulsed
VGS= 1. 2V
0.5
VGS= 2.5V
= 1.8V
V
GS
0.4
[A]
D
0.3
0.2
DRAIN CURRENT : I
0.1
0
024 6810
Fi g.2 T ypic al Output C haracter ist ics(Ⅱ)
VGS= 1. 5V
VGS= 1.3V
VGS= 1.2V
Ta= 25°C Pulsed
1
V
DS
=10V
Pulsed
0.1
(A)
D
0.01
0.001
0.0001
DRAIN CURRENT : I
0.00001
0.0 0.5 1.0 1
GATE-SOURCE VOLTAGE : VGS (V)
Ta=125°C
25°C
Fig.3 Typical transfer characteristics
75°C 25°C
Data Sheet EM6M2
10000
Ta= 25°C Pulsed
]
(on) [m
DS
1000
RESIST ANCE : R
STATIC DRAIN-SOURCE ON-STATE
100
0.001 0.01 0.1 1
DRAIN-CURRENT : ID[A]
Fi g.4 Stat ic Dr ain- Source O n-State
Resi stance vs. D rai n Curr ent(Ⅰ)
10000
VGS= 1. 8V Pulsed
]
(on) [m
DS
1000
RESISTANCE : R
STATIC DRAIN-SOURCE ON-STATE
100
0.001 0 .01 0.1 1
DRAIN-CURRENT : ID[A]
Fi g.7 Stat ic Dr ain- Source O n-State
Resi stance vs. D rai n Curr ent(Ⅲ)
VGS= 1. 2V
= 1. 5V
V
GS
V
= 1. 8V
GS
V
= 2. 5V
GS
V
= 4. 0V
GS
Ta= 125°C Ta=75°C Ta=25°C Ta= -25°C
10000
VGS= 4. 0V Pulsed
]
(on) [m
DS
1000
RESIST ANCE : R
STATIC DRAIN-SOURCE ON-STATE
100
0.001 0. 01 0.1 1
DRAIN-CURRENT : ID[A]
Fi g.5 Static Drain- Source On- State
Resi stance vs. D rai n Curr ent(Ⅱ)
10000
VGS= 1. 5V Pulsed
]
(on) [m
DS
1000
Ta= 125°C
Ta= 75°C
RESIST ANCE : R
STATI C DRAIN -SOUR CE ON- STATE
100
0.001 0. 01 0.1 1
DRAIN-CURRENT : ID[A]
Fi g.8 St atic D rai n-Sourc e On-Stat e
Resistance vs. Drain Curr ent(Ⅳ)
Ta= 25°C
Ta= -25°C
Ta= 125°C Ta= 75°C Ta= 25°C Ta= -25°C
10000
VGS= 2.5V Pulsed
]
(on) [m
DS
1000
RESIST ANCE : R
STATIC DRAIN-SOURCE ON-STATE
100
0.001 0. 01 0.1 1
DRAIN-CURRENT : I
Fi g.6 Stat ic D rain- Source O n-State
Resi stance vs. D rai n Curr ent(Ⅱ)
10000
VGS= 1.2V Pulsed
]
(on)[m
DS
1000
RESIST ANCE : R
STATIC DRAIN-SOURCE ON-STATE
100
0.001 0.01 0.1 1
DRAIN-CURRENT : I
Fig .9 Static Dr ain-Source On-State
Resi stance vs. D rai n Curr ent(Ⅴ)
Ta=125°C
Ta=75°C Ta=25°C
Ta= -25°C
Ta= 125°C Ta=75°C Ta=25°C Ta= -25°C
[A]
D
[A]
D
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2009 ROHM Co., Ltd. All rights reserved.
2009.07 - Rev.A
1
.5
Data Sheet EM6M2
1
VDS= 10V Puls ed
Ta= -25°C Ta=25°C
FOR WAR D TRAN SFER
ADMI TTANC E : |Yfs| [S]
0.1
0.01 0.1 1
DRAIN-CURRENT : ID[A]
Fi g.10 F orward T ransf er A dmittanc e vs. Drai n Curr ent
1000
100
10
SWITHING TIME : t (ns)
1
0.01 0.1 DRAIN CURRENT : ID (A)
Ta=75°C Ta= 125°C
Fig.13 Switching characteristics
Ta
V V R Pulsed
t
d(off)
t
f
t
d(on)
t
r
DD GS
G
=25°C
=10V =4V
=10
1
(A)
S
Ta=125°C
0.1
SOURCE CURRENT : I
0.01
SOURCE-DRAIN VOLTAGE : VSD (V)
Fig.11 Source current vs.
source-drain voltage
10.50.0
100
Ciss
10
CAPACITANCE : C [pF]
Crss
Coss
Ta= 25°C f=1MH z
=0V
V
GS
1
0.01 0.1 1 10 100
DRAIN-SOURCE VOLTAGE : V
Fi g.14 T ypical Capac itanc e vs. Drain- Source Voltage
V
Pulsed
75°C 25°C
25°C
GS
=0V
1
[V]
DS
2.5
2
]
(ON)[
1.5
DS
1
RESISTAN CE : R
0.5
ID= 0.02A
STAT IC D RAIN- SOURC E ON -ST ATE
0
0246810
Fi g.12 Stati c Dr ain- Sour ce On- State Resi stance vs. Gate Sourc e Voltage
ID= 0. 2A
GATE- SOURC E VOLTAGE : VGS[V]
Ta=25°C Pulsed
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2009.07 - Rev.A
P-ch zElectrical characteristic curve
0.2
VGS= - 10.0V V
VGS= -1.5V
VGS= -1.2V
GS
V
GS
0.15
[A]
D
0.1
0.05
DRAIN CURRENT : -I
0
0 0.2 0.4 0.6 0.8 1
DRAIN-SOURCE VOLTAGE : -VDS[V] DR AIN-SOU RCE VOLT AGE : -VDS[V]
Fi g.1 T ypical output char acter isti cs(Ⅰ) Fig .2 Typical output char acteris tics (Ⅱ)
= -4.5V = -3.2V
Ta=25°C Pulsed
VGS= -2.5V V
= -2.0V
GS
V
= -1.8V
GS
VGS= -1.0V
0.2
[A]
D
0.15
0.1
DRAIN CURRENT : -I
0.05
0
VGS= -4.5V
VGS= -2.5V V
= -1.8V
GS
V
= -1.5V
GS
0246 810
VGS= -1.2V
VGS= -1.0V
Ta= 25°C Pulsed
1
VDS= -10V Pulsed
[A]
0.1
D
Ta= 125°C
Ta= 75°C
0.01 Ta= 25°C
Ta= - 25°C
0.001
DRAIN CURRENT : -I
0.0001
00.5 11.5
GATE- SOURC E VOLTAGE : - VGS[V]
Fi g.3 T ypical Trans fer C haract eris tics
Data Sheet EM6M2
10000
Ta=25°C Pulsed
]
(ON)[m
DS
1000
RESIST ANCE : R
STATIC DRAIN-SOU RCE ON- STATE
100
0.001 0.01 0.1 1
DRAIN-CURRENT : -I
Fi g.4 Stati c Dr ain-Sour ce On-St ate Resi stance vs. Dr ain Current(Ι)
10000
VGS= -1.8V Pulsed
]
(ON)[m
DS
1000
RESIST ANCE : R
STATIC DRAIN-SOURCE ON-STATE
100
0.001 0.01 0.1 1
DRAIN-CURRENT : -ID[A]
Fi g.7 Stati c Drai n-Sourc e On-State
Resi stance vs. Dr ain Current(Ⅳ)
VGS= -1.2V V
= -1.5V
GS
V
= -1.8V
GS
V
= -2.5V
GS
V
= -4.5V
GS
[A]
D
Ta= 125°C Ta=75°C Ta=25°C Ta= -25°C
10000
VGS= -4.5V Pulsed
]
(ON)[m
DS
1000
RESIST ANCE : R
STATIC DRAIN-SOURCE ON-STATE
100
0.001 0.0 1 0. 1 1
DRAIN-CURRENT : -ID[A]
Fi g.5 St atic D rai n-Sour ce On- State Resi stance vs. Dr ain Current(Π)
10000
VGS= -1.5V Pulsed
]
(ON)[m
DS
1000
RESIST ANCE : R
STATIC DRAIN-SOURCE ON-STATE
100
0.001 0.01 0.1
Fi g.8 Stati c Dr ain-Sour ce On-Stat e
Resi stance vs. Dr ain Current(Ⅴ)
Ta= 125°C Ta= 75°C Ta= 25°C Ta= -25°C
DRAIN-CURRENT : -I
Ta= 125°C Ta=75°C Ta=25°C Ta= -25°C
[A]
D
10000
VGS= -2.5V Pulsed
]
(ON)[m
DS
1000
RESIST ANCE : R
STATIC DRAIN-SOU RCE ON- STATE
100
0.001 0.01 0.1 1
DRAIN-CURRENT : -ID[A]
Fi g.6 Stati c Dr ain-Sour ce On-Stat e
Resi stance vs. Dr ain Current(Ⅲ)
10000
VGS= -1.2V Pulsed
]
(ON)[m
DS
1000
RESIST ANCE : R
STATI C DRAIN -SOUR CE ON- STATE
100
0.001 0. 01 0.1
DRAIN-CURRENT : -I
Fi g.9 St atic D rai n-Sour ce On- State
Resi stance vs. Dr ain Current(Ⅵ)
Ta= 125°C Ta=75°C Ta=25°C Ta= -25°C
Ta= 125°C Ta= 75°C Ta= 25°C Ta= -25°C
[A]
D
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2009.07 - Rev.A
Data Sheet EM6M2
1.0 VDS= - 10V
Pulsed
Ta= -25°C Ta= 25°C Ta= 75°C Ta= 125°C
0.1
FOR WARD TRANSF ER ADM ITTANC E : |Yfs| [S]
0.01 0.1 1
DRAIN-CURRENT : -ID[A]
Fi g.10 For ward Tr ansfer Admi ttance vs. Drain Curr ent
1000
td(off)
t
100
10
SWITC HING TIME : t [ns]
t
r
1
0.01 0.1 1
Fig.13 Switching Characteristics
f
td(on)
DRAIN-CURRENT : -ID[A]
Ta= 25°C
= - 10V
V
DD
V
=-4.5V
GS
=10
R
G
Pulsed
1
VGS=0V Pulsed
0.1
REVERSE DRAIN CURRENT : -Is [A]
0.01
00.511.5
SOUR CE-D RAIN VOLT AGE : -VSD [V]
Fi g.11 Rever se Drai n Curr ent vs. Sourse- Drain Voltage
5
[V]
4
GS
3
2
1
GATE- SOURC E VOLTAGE : -V
0
00.511.5
TOTAL GATE CH ARGE : Qg [nC]
Fi g.14 D ynamic I nput Charac teris tics
Ta= 125°C Ta=75°C Ta=25°C Ta= -25°C
Ta= 25°C V
= - 10V
DD
= -0.2A
I
D
=10
R
G
Pulsed
5
]
4
(ON)[
DS
3
2
RESIST ANCE : R
1
STATIC DRAIN-SOURCE ON-STATE
0
1000
100
10
CAPAC ITANCE : C [pF]
1
0.01 0. 1 1 10 100
ID= -0.2A
ID= - 0.01A
0246810
GATE-SOU RCE VOLTAGE : - VGS[V]
Fi g.12 Stati c Dr ain-Sour ce On-St ate Resistance vs. Gate Source Voltag e
Ta=25°C f=1M Hz
=0V
V
GS
Coss
DR AIN-SOU RCE VOLT AGE : -V
Fi g.15 Typic al Capaci tance vs. Drain-Source Voltag e
Ciss
Crss
Ta= 25°C Pulsed
DS
[V]
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2009.07 - Rev.A
Fig.2-1 Switching Time Measurement circuit
V
Fig.2-2 Switching Waveforms
N-ch zMeasurement circuit
Data Sheet EM6M2
Pulse Width
V
R
G
I
D
GS
D.U.T.
Fig.1-1 Switching Time Measurement circuit
P-ch zMeasurement circuit
V
GS
I
D
R
G
90%
90%
t
t
d
off
d(off)
t
50%
off
50%
10%
90%
t
f
t
off
10%
90%
t
f
V
V
DS
R
L
V
DD
V
GS
V
DS
R
L
V
DD
V
50%
GS
10%
t
d(on)
10%
90%
t
r
t
on
DS
Fig.1-2 Switching Waveforms
Pulse Width
10%
50%
10%
DS
t
d
on
90%
t
r
t
on
zNotice
This product might cause chip aging and breakdown under the large electrified environment. Please consider to design ESD protection circuit.
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2009.07 - Rev.A
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd.
The content specied herein is subject to change for improvement without notice.
The content specied herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specications, which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specied in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage.
The technical information specied herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual proper ty or other rights held by ROHM and other par ties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information.
Notice
The Products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, commu­nication devices, electronic appliances and amusement devices).
The Products specied in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injur y, re or any other damage caused in the event of the failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transpor tation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing.
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