ROHM DTA114TE, DTA114TKA, DTA114TM, DTA114TSA, DTA114TUA Schematic [ru]

DTA114TM / DTA114TE / DTA114TUA

Transistors DTA114TKA / DTA114TSA

-100mA / -50V Digital transistors (with built-in resistors)

DTA114TM / DTA114TE / DTA1 14TUA DTA114TKA / DTA114TSA
Inverter, Interface, Driver
zFeatures
1) Built-in bias resistors en able the configuration of an inverter circuit without connecting external input resistors (see equivalent circuit).
2) The bias resistors consist of thin-film resistors with complete isolatio n to allow pos itive biasi ng of the in put. They also have the advantage of almost completely eliminating parasitic effects.
3) Only the on/off conditions need to be set for operation, making the device design easy .
zStructure
PNP epitaxial planar silicon transistor (Resistor built-in type)
zExternal dimensions (Unit : mm)
DTA114TM
ROHM : VMT3
DTA114TUA
ROHM : UMT3 EIAJ : SC-70
DTA114TSA
1.2
0.32
0.2
(3)
1.2
0.8
(2)
(1)
0.22
Abbreviated symbol : 94
2.0
(3)
(2)
0.65
1.3
Abbreviated symbol : 94
3.0
0.2
0.40.4
0.8
0.2
0.3
1.25
(1)
0.65
4.0 2.0
3Min.
2.1
0.13
0.5
0.9
0.7
0.15
Each lead has same dimensions Each lead has same dimensions
(1) Base (2) Emitter (3) Collector
(1) Emitter
0.1Min.
(2) Base (3) Collector
DTA114TE
ROHM : EMT3
DTA114TKA
ROHM : SMT3 EIAJ : SC-59
1.6
0.3
(3)
0.8
(2)
(1)
0.2
0.2
0.5
0.5
1.0
Abbreviated symbol : 94
2.9
0.4
(3)
(2)
(1)
0.95 0.95
1.9
Abbreviated symbol : 94
0.7
0.55
1.6
0.15
1.1
0.8
1.6
2.8
0.15
0.1Min.
0.3Min.
(1) Emitter (2) Base (3) Collector
(1) Emitter (2) Base (3) Collector
0.45
(15Min.)
0.45
0.5
(1) Emitter (2) Collector (3) Base
ROHM : SPT EIAJ : SC-72
2.5
5.0
(1) (2) (3)
Abbreviated symbol : A114TS
Rev.A 1/2
DTA114TM / DTA114TE / DTA114TUA
Transistors DTA114TKA / DTA114TSA
zPackaging specifications zEquiv alent circuit
T2L
CE
EMT3
Taping
CBO
V V
CEO
V
EBO
C
I
P
C
Tj
Tstg
BV BV BV
V
TL
3000
CBO
CEO
I
CBO
I
EBO
CE(sat)
h
FE
R
f
UMT3
Taping
T106
3000
SMT3
Taping
T146
3000
Limits
DTA114TEDTA114TM
DTA114TUA DTA114TKA DTA114TSA
50
50
5
100
150 200 300
150
55 to +150
Max. Unit Conditions
Typ.
Min.
250
10
250
0.5
0.5
0.3
600
13
EBO
1
T
50
50
5
100
7
SPT
Taping
TP
5000
VI V V
µA µA
V
k
MHz
B
B : Base C : Collector E : Emitter
R
1
=10k
C
=−50µA
I
C
=−1mA
I
E
=−50µA
V
CB
=−50V
V
EB
=−4V
C/IB
=−10mA/1mA
I V
CE
=−5V, IC=−1mA
V
CE
=−10V, IE=5mA, f=100MHz
Unit
mA
mW
°C °C
C
R1
E
V V V
=−
5V
1
(V)
500m
CE(sat)
200m
100m
50m
20m
10m
5m
2m
1m
COLLECTOR SATURATION VOLTAGE : V
100µ−1m −10m −100m
200µ−2m −20m500µ−5m −50m
Ta=100°C
25°C
40°C
COLLECTOR CURRENT : I
lC/lB=20
C
(A)
Fig.2 Collector-emitter saturation
voltage vs. collector current
VMT3
Taping
8000
Part No. DTA114TM
DTA114TE DTA114TUA DTA114TKA DTA114TSA
Package Package type
Code Basic ordering
unit (pieces)
zAbsolute maximum ratings (Ta=25°C)
Parameter Symbol
Collector-base voltage Collector-emitter voltage Emitter-base voltage Collector current Collector power dissipation Junction temperature Storage temperature
zElectrical characteristics (Ta=25°C)
Parameter Symbol
Collector-base breakdown voltage Collector-emitter breakdown voltage Emitter-base breakdown voltage Collector cutoff current Emitter cutoff current Collector-emitter saturation voltage DC current transfer ratio Input resistance Transition frequency
Characteristics of built-in transistor
zElectrical characteristic curves
1k
500
FE
200 100
50
20 10
5
DC CURRENT GAIN : h
2 1
100µ−1m 10m 100m
Ta=100°C
25°C
40°C
200µ−2m −20m500µ−5m −50m
COLLECTOR CURRENT : I
Fig.1 DC current gain vs. collector
current
V
C
(A)
Rev.A 2/2
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