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STRUCTURE
PRODUCTNAME
FUNCTION
Silicon Monolithic Integrated Circuit
BU7962GUW
Serial Interface for Mobile Devices Application
MSDL3(Mobile Shrink Data Link 3) De
serializer LSI
FEATURES
·Maximum transmission rate of highspeed differential interface MSDL3 is 900Mbps.
·Support LCD interface with 24bit parallel RGB video mode.
·Pixel clock frequency is 4~30MHz
Absolute maximum
1.
Parameter Symbol Rated values Unit Remarks
Power supply voltage for IOVDD IOVDD -0.3 ~ +4.5 V
Power supply voltage for DVDD DVDD -0.3 ~ +2.5 V
Power supply voltage for MSVDD MSVDD -0.3 ~ +2.5 V
-0.3 ~ IOVDD+0.3 V I/O terminals of IOVDD line
Input voltage VIN
Input current IIN -10 ~ +10 mA
Package power dissipation Pd 300 * mW Without board mounted
Preservation temperature Tstg -55 ~ +125
*
When it uses by Ta=25oC or higher, reduce by 3.0 mW/°C (for a single package).
-0.3 ~ +3.6 V XSD terminal
-0.3 ~ MSVDD+0.3 V I/O terminals of MSVDD line
°C
Operating Condition
2.
Paramete
Supply voltage for IOVDD VIOVDD 1.65 1.80 3.60 V
Supply voltage for DVDD VDVDD 1.65 1.80 1.95 V
Supply voltage for MSVDD VMSVDD 1.65 1.80 1.95 V
SubLVDS data rate DR 120 - 450 Mbps/ch
Operating temperature range Topr -30 25 +85
These goods are specific machines. Because the exclusive goods which are specially designed for the device are
considered. Whether that machine, device corresponds to strategic goods to decide as the foreign exchange and foreign
trade control law. You must have it judged.
As for contents of mention of these materials. A service in the foreign exchange and foreign trade control law
(Technology in the design, the manufacture and the use). Be careful of handling because it is likely to correspond.
This product is not designed against radioactive ray.
Symbol Min Typ Max Unit Remarks
VDVDD=VMSVDD≤VIOVDD
°C
REV. A
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ELECTRICAL CHARACTERISTICS
3.
3.1 CMOS INOUT CHARACTERISTICS
Ta =2 5℃, DVDD=MSVDD=1.80V, IOVDD=1.80V, DGND=MSGND=0.00V, unless otherwise noted
Parameter Symbol Min Typ Max Unit Conditions
‘L’ input voltage1 VIL1 DGND - 0.3*IOVDD V
‘H’ input voltage1 VIH1 0.7*IOVDD - IOVDD V
‘L’ input voltage2 VIL2 MSGND - 0.3*MSVDD V
‘H’ input voltage2 VIH2 0.7*MSVDD - MSVDD V
‘H’ input voltage3 VIH3 0.7*IOVDD - 3.6 V XSD terminal
‘L’ output voltage1 VOL1 DGND - 0.3*IOVDD V IO=1mA
‘H’ output voltage1 VOH1 0.7*IOVDD - IOVDD V IO=-1mA
‘L’ output voltage2 VOL2 DGND - 0.3*IOVDD V IO=3mA
‘H’ output voltage2 VOH2 0.7*IOVDD - IOVDD V IO=-3mA
PCLK frequency1 fPCLK1 4.0 - 15.0 MHz LS0=L
PCLK frequency2 fPCLK2 8.0 - 30.0 MHz LS0=H
POL_PCLK,
PLL_BW[1:0],
LS0, F_XS, TEST3
terminals
LS1, LS_EN terminals
F_XS=L,
PCLK, CPO,
PD[26:0]
terminals
F_XS=H,
PCLK, CPO,
PD[26:0]
terminals
PCLK
terminal
PCLK duty cycle DPCLKO 40 50 60 % PCLK terminal
Data setup to PCLK TDSO 10.0 - - ns
Data hold to PCLK tDHO 10.0 - - ns
PD[26:0] terminals
3.2 MSDL3 RX CHARACTERISTICS
Ta =2 5℃, DVDD=MSVDD=1.80V, IOVDD=1.80V, DGND=MSGND=0.00V, unless otherwise noted
Paramete
Differential voltage range Vdiff_rx 70 100 200 mVpp
Common mode voltage range Vcm_rx 0.6 0.9 1.2 V
RX pull down current Ipull_rx 12 30 90 μA
Threshold voltage of RX link
detection
SubLVDS data rate DR_rx 120 - 450 Mbps/ch
3.3 CURRENT COMSUMPTION
Paramete
Shutdown current Iop_sht_ｒx - 0.2 10.0 μAXSD=L
Standby current Iop_stb_ｒx - 41.8 90.0 μAXSD=H
Active current of
1ch27bit format
Active current of
2ch27bit format
Active current of
1ch13bit format
*1 : Total operating current(IDVDD+IMSVDD+IIOVDD) with PD[26:0] outputs toggling 0x2AAAAAA and 0x5555555.
*2 : Total operating current(IDVDD+IMSVDD+IIOVDD) with PD[26:15],PD[2] outputs toggling 0x0AAA and 0x1555.
Symbol Min Typ Max Unit Conditions
Vlink_rx 0.2 0.3 0.4 V
Ta =2 5℃, DVDD=MSVDD=1.80V, IOVDD=1.80V, DGND=MSGND=0.00V, unless otherwise noted
Symbol Min Typ Max Unit Conditions
Iop_act_ｒx1 - 17.6 24.0 mA
Iop_act_ｒx2 - 28.0 36.8 mA
Iop_act_ｒx3 - 17.6 23.5 mA
LS[1:0]=LL, PLL_BW[1:0]=HL,
fPCLK=15MHz, CL=10pF, *1
LS[1:0]=LH,
PLL_BW[1:0]=HL,
fPCLK=30MHz, CL=10pF, *1
LS[1:0]=HH,
PLL_BW[1:0]=HL,
fPCLK=30MHz, CL=10pF, *2
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4. PACKAGE VIEW
1PIN
MARK
BU7962
0.08
S
63-φ0.295±0.05
0.05
0.75±0.1
S
ABM
H
G
F
E
D
C
B
A
23456
1
VBGA063W050
6. SYSTEM BLOCK DIAGRAM
POL_PCLK
PLL_BW
5.0±0.1
P = 0.5×7
PD
CPO
PCLK
XSD
LS
F_XS
TEST
Lot No.
A
0.5
78
MAX
0.9
0.10
B
PCLK
Control
5.0±0.1
0.75±0.1
P = 0.5×7
I/F
Logic
S
5. PIN LIST
Pin
Pin
No.
name
A1 TEST0 D1 PD22 G1 CPO
A2 PD18 D2 PD20 G2 F_XS
A3 PD16 D3 POL_PCLK G3 DRVR
A4 PD15 D4 DGND G4 MSGND
A5 PD13 D5 DGND G5 MSVDD
A6 PD12 D6 IOVDD G6 LS1
A7 PD9 D7 PD3 G7 LS_EN
A8 TEST2 D8 PD4 G8 XSD
B1 E1 PD24 H1 TESTA
B2 PCLK E2 PD23 H2 D1+
B3 PD17 E3 IOVDD H3 D1B4 PD14 E4 DGND H4 CLK+
B5 PD11 E5 MSGND H5 CLKB6 PD10 E6 PLL_BW0 H6 DO+
B7 PD8 E7 PD0 H7 D0B8 PD7 E8 PD2 H8 TEST1
C1 PD21 F1 PD25
C2 PD19 F2 PD26
C3 DVDD F3 MSVDD
C4 IOVDD F4 MSGND
C5 TEST3 F5 MSVDD
(UNIT:mm)
C6 DVDD F6 LS0
C7 PD6 F7 PLL_BW1
C8 PD5 F8 PD1
Parallel
Reset
Generator
Serial
to
PLL
Rx
Link
Monitor
Error
Detection
Timing
Generator
Rx
Control
Logic
DGND MSGND
Pin
Pin
No.
name
MSVDDIOVDD DVDD
High Speed I/F
Reference
Pin
No.
D0+
D0-
D1+
D1-
CLK+
CLK-
LS_EN
DRVR
Pin
name
REV. A
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7. USAGE PRECAUTIONS
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operatingconditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as
expected. The electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown
due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply
terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines.In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same level
of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the
diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For
the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At
the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be
used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the
terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
(8) Inspection with set PCB
(9) Input terminals
(10) Ground wiring pattern
(11) External capacitor
Be noted that using ICs in the strong electromagnetic field can malfunction them.
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig.
After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition,
for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the
transportation and the storage of the set PCB.
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a
voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to
the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern
from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to
the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal
GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration
given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to
temperature, etc.
(12) No Connecting input terminals
In terms of extremely high impedance of CMOS gate, to open the input terminals causes unstable state. And unstable state
brings the inside gate voltage of p-channel or n-channel transistor into active. As a result, battery current may increase. And
unstable state can also causes unexpected operation of IC. So unless otherwise specified, input terminals not being used
should be connected to the power supply or GND line.
REV. A
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specied herein is subject to change for improvement without notice.
The content specied herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specied in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specied herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other par ties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
Notice
The Products specied in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, ofce-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specied in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, re or any other damage caused in the event of the
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shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
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The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
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