A
High-performance Clock Generator Series
Compact 1ch
Clock Generators for Digital Cameras
BU7344HFV,BU7345HFV,BU7346GUL
No.11005EAT06
●Description
These Clock Generators incorporates compact package compared to oscillators, which provides the generation of
high-frequency CCD clocks necessary for digital still cameras and digital video cameras.
●Features
1) SEL pin allowing for the selection of frequencies
2) Selection of OE (PDB) pin enabling Power-down function
3) Crystal-oscillator-level clock precision with high C/N characteristics and low jitter
4) Micro miniature Package incorporated
5) Single power supply of 3.3 V
●Applications
Digital Still Camera, Digital Video Camera, and others
●Line up matrix
Parameter BU7344HFV BU7345HFV BU7346GUL
Supply voltage
Operating temperature range
2.7V～3.6V 2.7V～3.6V 2.7V～3.6V
-5 ℃～75 ℃ -5 ℃～75 ℃ -5 ℃～75 ℃
Reference input clock
Output clock
Standby current(MAX.)
Operating current (TYP)
Package
27.0000MHz 27.0000MHz 27.0000MHz
40.5000MHz 38.0000MHz 38.0000MHz
36.0000MHz 36.0000MHz 36.0000MHz
1.0μA 1.0μA 1.0μA
4.0mA 3.5mA 3.5mA
HVSOF6 HVSOF6
VCSP50L1
1.5mm×1.0mm
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.01 - Rev.
BU7344HFV,BU7345HFV,BU7346GUL
A
●Absolute maximum ratings (Ta=25 ℃)
Parameter Symbol Ratings Unit
Supply voltage VDD -0.3 ~ 4.0 V
Input voltage VIN -0.3 ~ VDD+0.3 V
Storage temperature range Tstg -55 ~ 125 ℃
Technical Note
410(BU7344HFV,BU7345HFV)
Power dissipation Pd
460(BU7346GUL)*2
*1 Mounted on 70mm * 70mm * 1.6mm Glass-epoxy PCB. Derating: 4.1mW / ℃ at Ta > 25°C
*2 Mounted on 50mm * 58mm * 1.75mm Glass-epoxy PCB. Derating: 4.6mW / ℃ at Ta > 25°C
* Operating is not guaranteed.
* The radiation-resistance design is not carried out.
●Operating conditions
Parameter Symbol Ratings Unit
Supply voltage VDD 2.7 ~ 3.6 V
Input H voltage VINH 0.8VDD ~ VDD V
Input L voltage VINL 0.0 ~ 0.2VDD V
Operating temperature Topr -5 ~ 75 ℃
Output load CL 15(MAX.) pF
●Electrical characteristics
○BU7344HFV (Ta=25
℃, VDD=3.3V, Crystal frequency=27.0000MHz, unless otherwise specified.)
Limits
Parameter Symbol
Min. Typ. Max.
*1
mW
Unit Conditions
Output H voltage VOH 2.8 - VDD V IOH = -3.0mA
Output L voltage VOL 0.0 - 0.5 V IOL = 3.0mA
Standby current IDDst - - 1.0 μA OE = L
Consumption current 1 IDD1 - 4.0 5.2 mA
Consumption current 2 IDD2 - 3.5 4.6 mA
40.5000MHz output
SEL = L
36.0000MHz output
SEL = H
Pull-down load Rpd 50 100 200 kΩ input PIN, pull-down load value
Output frequency
OUT1 CLK40.5 40.5000 MHz IN*12/4/2, SEL = L
OUT2 CLK36 36.0000 MHz IN*8/3/2, SEL = H
* The output frequency is determined by the arithmetic (frequency division) expression of a frequency input to IN.
If the input frequency is set to 27.0000MHz, the output frequency will be as listed above.
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.01 - Rev.
BU7344HFV,BU7345HFV,BU7346GUL
A
○BU7345HFV (Ta=25 ℃, VDD=3.3V, Crystal frequency=27.0000MHz, unless otherwise specified.)
Limits
Parameter Symbol
Unit Conditions
Min. Typ. Max.
Output H voltage VOH 2.8 - VDD V IOH = -3.0mA
Output L voltage VOL 0.0 - 0.5 V IOL = 3.0mA
Standby current IDDst - - 1.0 μA OE = L
Technical Note
Consumption current 1 IDD1 - 3.5 4.6 mA
Consumption current 2 IDD2 - 3.5 4.6 mA
38.0000MHz output
SEL = L
36.0000MHz output
SEL = H
Pull-down load Rpd 50 100 200 kΩ input PIN, pull-down load value
Output frequency
OUT1 CLK38 38.0000 MHz IN*76/27/2, SEL = L
OUT2 CLK36 36.0000 MHz IN*8/3/2, SEL = H
* The output frequency is determined by the arithmetic (frequency division) expression of a frequency input to IN.
If the input frequency is set to 27.0000MHz, the output frequency will be as listed above.
○BU7346GUL (Ta=25
℃, VDD=3.3V, Crystal frequency=27.0000MHz, unless otherwise specified.)
Limits
Parameter Symbol
Unit Conditions
Min. Typ. Max.
Output H voltage VOH 2.8 - VDD V IOH = -3.0mA
Output L voltage VOL 0.0 - 0.5 V IOL = 3.0mA
Standby current IDDst - - 1.0 μA PDB = L
Consumption current 1 IDD1 - 3.5 4.6 mA
Consumption current 2 IDD2 - 3.5 4.6 mA
38.0000MHz output
SEL = L
36.0000MHz output
SEL = H
Pull-down load Rpd 50 100 200 kΩ input PIN, pull-down load value
Output frequency
OUT1 CLK38 38.0000 MHz XIN*76/27/2, SEL = L
OUT2 CLK36 36.0000 MHz XIN*8/3/2, SEL = H
* The output frequency is determined by the arithmetic (frequency division) expression of a frequency input to XIN.
If the input frequency is set to 27.0000MHz, the output frequency will be as listed above.
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3/13
© 2011 ROHM Co., Ltd. All rights reserved.
2011.01 - Rev.
BU7344HFV,BU7345HFV,BU7346GUL
A
●Reference data (BU7344HFV basic data)
1V/div
Fig.1 40.5MHz output waveform
5nsec/div
(CL=15pF,Ta=25
℃)
1V/div
Fig.4 36MHz output waveform
5nsec/div 500psec/div
(CL=15pF,Ta=25
℃)
●Reference data (BU7345HFV basic data)
1V/div
5nsec/div
Fig.7 38MHz output waveform
(CL=15pF,Ta=25
℃)
1V/div
Fig.10 36MHz output waveform
(CL=15pF,Ta=25
5nsec/div
℃)
1V/div
500psec/div
Fig.2 40.5MHz Period-Jitter
(CL=15pF,Ta=25
1V/div
℃)
Fig.5 36MHz Period-Jitter
(CL=15pF,Ta=25 ℃)
1V/div
500psec/div
Fig.8 38MHz Period-Jitter
(CL=15pF,Ta=25 ℃)
1V/div
500psec/div
Fig.11 36MHz Period-Jitter
(CL=15pF,Ta=25 ℃)
Technical Note
RBW:1kHz
RBW:1kH
VBW:100Hz
VBW:100Hz
10dB/div
10kHz/div
Fig.3 40.5MHz spectrum
(CL=15pF,Ta=25 ℃)
RBW:1kHz
VBW:100Hz
10dB/div
10kHz/div
Fig.6 36MHz spectrum
(CL=15pF,Ta=25 ℃)
RBW:1kHz
VBW:100Hz
10dB/div
10kHz/div
Fig.9 38MHz
(CL=15pF,Ta=25 ℃)
RBW:1kHz
VBW:100Hz
10dB/div
Fig.12 36MHz
(CL=15pF,Ta=25 ℃)
spectrum
10kHz/div
spectrum
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.01 - Rev.
BU7344HFV,BU7345HFV,BU7346GUL
A
●Reference data (BU7346GUL basic data)
0.5V/div
Fig.13 38MHz output waveform
5nsec/div
(CL=15pF,Ta=25 ℃)
0.5V/div
Fig.16 36MHz output waveform
5nsec/div 500psec/div
(CL=15pF,Ta=25
℃)
0.5V/div
500psec/div
Fig.14 38MHz Period-Jitter
(CL=15pF,Ta=25
0.5V/div
℃)
Fig.17 36MHz Period-Jitter
(CL=15pF,Ta=25 ℃)
Technical Note
RBW:1kHz
VBW:100Hz
10dB/div
10kHz/div
Fig.15 38MHz
(CL=15pF,Ta=25 ℃)
RBW:1kHz
VBW:100Hz
10dB/div
10kHz/div
Fig.18 36MHz
(CL=15pF,Ta=25 ℃)
spectrum
spectrum
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5/13
© 2011 ROHM Co., Ltd. All rights reserved.
2011.01 - Rev.
BU7344HFV,BU7345HFV,BU7346GUL
A
Technical Note
●Reference data (BU7344HFV Temperature and Supply voltage variations data)
55
54
53
52
51
50
49
Duty:Duty [% ]
48
47
46
45
VDD=3.3V
-25 0 25 50 75 100
VDD=2.7V
temperat ure:T [℃]
Fig.19 40.5MHz
Temperature－Duty
VDD=3.6
5
4
3
2
Ris e tim e:tr [nsec]
1
0
-25 0 25 50 75 100
VDD=2.7V
VDD=3.3V
VDD=3.6V
temperat ure:T [℃]
Fig.20 40.5MHz
Temperature－Rise-time
5
4
VDD=2.7V
3
2
Fall time:tf [nsec]
1
0
-25 0 25 50 75 100
VDD=3.6V
temperat ure:T [℃]
Fig.21 40.5MHz
Temperature－Fall-time
100
90
80
70
60
50
40
30
Period- Jitter 1s :JsSD [psec]
20
10
0
-25 0 25 50 75 100
Temperature－Period-Jitter 1σ
VDD=2.7V
temperat ure:T [℃]
Fig.22 40.5MHz
55
54
53
52
51
50
49
Duty:Duty [%]
48
47
46
45
-25 0 25 50 75 100
100
90
80
70
60
50
40
30
Period-J itter 1s:JsSD [psec]
20
10
0
-25 0 25 50 75 100
VDD=3.3V
temperat ure:T [℃]
VDD=2.7V
Fig.24 36MHz
Temperature－Duty
VDD=2.7V
temperat ure:T [℃]
VDD=3.3V
VDD=3.6V
VDD=3.6V
VDD=3.3V
VDD=3.6V
600
500
400
300
200
100
Period-Jitter MIN-MAX:JsABS [psec]
0
-25 0 25 50 75 100
temperat ure:T [℃]
VDD=3.3V VDD=2.7V
VDD=3.6V
Fig.23 40.5MHz
Temperature－Period-Jitter MIN-MAX
5
4
3
2
Ri se time:tr [nsec]
1
0
VDD=2.7V
VDD=3.6V
-25 0 25 50 75 100
temperat ure:T [℃]
VDD=3.3V
Fig.25 36MHz
Temperature－Rise-time
600
500
400
300
200
100
Period- Jitter M IN-MAX:JsABS [psec]
0
-25 0 25 50 75 100
VDD=2.7V
VDD=3.3V
temperat ure:T [℃]
VDD=3.6V
5
4
3
2
Fall time:tf [nsec]
1
0
-25 0 25 50 75 100
VDD=2.7V
VDD=3.6V
temperature:T [℃]
VDD=3.3V
Fig.26 36MHz
Temperature－Fall-time
Fig.27 36MHz
Temperature－Period-Jitter 1σ
Temperature－Period-Jitter MIN-MAX
Fig.28 36MHz
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.01 - Rev.
VDD=3.3V
BU7344HFV,BU7345HFV,BU7346GUL
A
●Reference data (BU7345HFV Temperature and Supply voltage variations data)
55
54
53
52
51
50
49
Duty:Duty [%]
48
47
46
45
-25 0255075100
VDD=3.3V
temperature:T [℃]
VDD=2.7V
Fig.29 38MHz
Temperature－Duty
VDD=3.6V
5
4
3
2
Rise time :tr [nse c]
1
0
-2 5 0 25 5 0 75 10 0
VDD=2.7V
VDD=3.3V
VDD=3.6V
temperature: T [℃]
Fig.30 38MHz
Temperature－Rise-time
100
90
80
70
60
50
40
30
Period-Jitter 1s:JsSD [psec]
20
10
0
-25 0 25 50 75 100
Temperature－Period-Jitter 1σ
VDD=2.7V
temperature:T [℃]
Fig.32 38MHz
VDD=3.3V
VDD=3.6V
600
500
400
300
200
100
Peri od-J itter M IN- MAX:JsABS [psec]
0
-25 0 25 50 75 100
VDD=2.7V
VDD=3.6V
temperat ure:T [℃]
VDD=3.3V
Fig.33 38MHz
Temperature－Period-Jitter MIN-MAX
55
54
53
52
51
50
49
Du ty:Du ty [%]
48
47
46
45
-25 0 25 50 75 100
100
90
80
70
60
50
40
30
Period- Jitter 1s :JsSD [psec]
20
10
0
-25 0 25 50 75 100
VDD=3.3V
temperature:T [℃]
Fig.34 36MHz
Temperature－Duty
VDD=2.7V
temperat ure:T [℃]
Fig.37 36MHz
Temperature－Period-Jitter 1σ
VDD=3.6V
VDD=2.7V
VDD=3.3V
VDD=3.6V
5
4
3
2
Rise time :tr [nse c]
1
0
VDD=2.7V
VDD=3.6V
-2 5 0 2 5 50 75 1 00
temperature:T [℃]
VDD=3.3V
Fig.35 36MHz
Temperature－Rise-time
600
500
400
300
200
100
Period- Jitter M IN-MAX:JsABS [psec]
0
-25 0 25 50 75 100
VDD=2.7V
temperat ure:T [℃]
VDD=3.3V
VDD=3.6V
Fig.38 36MHz
Temperature－Period-Jitter MIN-MAX
Technical Note
5
4
VDD=2.7V
3
2
Fall time:tf [nsec]
1
0
VDD=3.6V
-25 0 25 50 75 100
temperature:T [℃]
Fig.31 38MHz
Temperature－Fall-time
5
4
3
2
Fall time:tf [nsec]
1
0
-25 0 25 50 75 100
VDD=2.7V
VDD=3.6V
temperat ure:T [℃]
Fig.36 36MHz
Temperature－Fall-time
VDD=3.3V
VDD=3.3V
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.01 - Rev.
BU7344HFV,BU7345HFV,BU7346GUL
A
Technical Note
●Reference data (BU7346GUL Temperature and Supply voltage variations data)
55
54
53
52
51
50
49
Du ty:Du ty [%]
48
47
46
45
-25 0 25 50 75 100
100
90
80
70
60
50
VDD=3.6V
40
30
20
Period- Jitter 1s :JsSD [psec]
10
0
-25 0 25 50 75 100
Temperature－Period-Jitter 1σ
VDD=3.3V
temperature:T [℃]
Fig.39 38MHz
Temperature－Duty
VDD=3.3V
temperat ure:T [℃]
Fig.42 38MHz
55
54
53
52
51
50
49
Duty:Duty [%]
48
47
46
45
100
90
80
70
60
50
40
30
20
Period- Jitter 1s :JsSD [psec]
10
0
-25 0 25 50 75 100
VDD=3.3V
-25 0 25 50 75 100
VDD=2.7V
temperat ure:T [℃]
Fig.44 36MHz
Temperature－Duty
VDD=3.6V
VDD=3.3V
temperat ure:T [℃]
Fig.47 36MHz
Temperature－Period-Jitter 1σ
VDD=3.6V
VDD=2.7V
VDD=2.7V
VDD=3.6V
VDD=2.7V
5
4
3
2
Ris e time :tr [nsec]
1
0
-25 0 25 50 75 10 0
VDD=2.7V
VDD=3.6V
temperature:T [℃]
VDD=3.3V
Fig.40 38MHz
Temperature－Rise-time
600
500
400
300
200
100
Peri od-J itter M IN- MAX:Js ABS [psec]
0
-25 0 25 50 75 100
VDD=2.7V
VDD=3.3V
temperat ure:T [℃]
VDD=3.6V
Fig.43 38MHz
Temperature－Period-Jitter MIN-MAX
5
VDD=2.7V
4
3
2
Ris e tim e:tr [nsec]
1
0
VDD=3.6V
-25 0 25 50 75 100
temperat ure:T [℃]
VDD=3.3V
Fig.45 36MHz
Temperature－Rise-time
600
500
400
300
200
100
Period-Ji tter MIN -MAX:Js ABS [psec]
0
-25 0 25 50 75 100
VDD=2.7V
VDD=3.6V
temperat ure:T [℃]
VDD=3.3V
Fig.48 36MHz
Temperature－Period-Jitter MIN-MAX
5
4
3
2
Fall time:tf [nsec]
1
0
-25 0 25 50 75 100
VDD=2.7V
VDD=3.6V
temperat ure:T [℃]
VDD=3.3V
Fig.41 38MHz
Temperature－Fall-time
5
4
VDD=2.7V
3
2
Fa ll tim e:tf [nsec]
1
0
VDD=3.6V
-25 0 25 50 75 10 0
temperature: T [℃]
VDD=3.3V
Fig.46 36MHz
Temperature－Fall-time
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.01 - Rev.
BU7344HFV,BU7345HFV,BU7346GUL
A
r
r
2
2
L
A
A
L
T
A
B
2
2
●Block diagram, pin assignment/functions
○BU7344HFV
1:VD D
2:VSS
3:OU T
6:IN
5：SEL
4：OE
6pin:IN
5pin:SEL
4pin:OE
PLL
DATA1
DATA2
1/
3pin:OUT
Fig.49 Pin assignment Fig.50 Block diagram
PIN No. PIN Name Function
1 VDD Power supply
2 VSS GND
3 OUT Clock output terminal (SEL=L:40.5000MHz, SEL=H:36.0000MHz)
-down pin (L:disable, H:enable), equipped with Pull-down function, output set to L
4 OE
Powe
at disable
5 SEL Output selection (L:40.5000MHz, H:36.0000MHz)
6 IN Clock input pin (27.0000MHz input)
○BU7345HFV
1:VD D
2:VSS
3:OU T
6:IN
5：SEL
4：OE
6pin:IN
5pin:SEL
4pin:OE
PLL
DATA1
DATA2
1/
Fig.51 Pin assignment Fig.52 Block diagram
PIN No. PIN Name Function
1 VDD Power supply
2 VSS GND
3 OUT Clock output terminal (SEL=L:38.0000MHz, SEL=H:36.0000MHz)
4 OE
Power-down pin (L:disable, H:enable), equipped with Pull-down function, output set to L
at disable
5 SEL Output selection (L:38.0000MHz, H:36.0000MHz)
6 IN Clock input pin (27.0000MHz input)
○BU7346GUL
VDD VSS OUT
B
PL
1:XIN
DATA1
DATA
1/
XIN SEL PDB
A
2:SE
Fig.53 Pin assignment Fig.54 Block diagram
1 2 3
Bottom view
3:PD
PIN No. PIN Name Function
A1 XIN Clock input pin (27.0000MHz input)
A2 SEL Output selection (L:38.0000MHz, H:36.0000MHz)
-down pin (L:disable, H:enable), equipped with
A3 PDB
Powe
Pull-down function, output set to L at disable
B1 VDD Power supply
B2 VSS GND
B3 OUT Clock output terminal (SEL=L:38.0000MHz, SEL=H:36.0000MHz)
Technical Note
3pin:OUT
B3:OU
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.01 - Rev.
BU7344HFV,BU7345HFV,BU7346GUL
A
●Application circuit example
VDD
VSS
L : 40.5000MHz
H : 36.0000MHz
OUT
IN
SEL
OE
Technical Note
27.0000MHz
L : 40.5000MHz
H : 36.0000MHz
L : disable
H : enable
Fig.55 Application circuit example(BU7344HFV)
* For VDD and VSS, insert a bypass capacitor of approx. 0.1μF as close as possible to the pin.Bypass capacitors with
good high-frequency characteristics are recommended. Even though we believe that the typical application circuit is
worth of a recommendation, please be sure to thoroughly recheck the characteristics before use.
●Equivalent circuit
Pin name Pin number Equivalent circuit
OUT 3, B3
From the inside of IC
IC内部から
OE(PDB)
SEL
4, A2
5, A3
To the inside of IC
IC内部へ
From the
IC内部から
inside of IC
IN(XIN) 6, A1
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10/13
© 2011 ROHM Co., Ltd. All rights reserved.
From the
IC内部から
inside of IC
To the inside of IC
IC内部へ
2011.01 - Rev.
BU7344HFV,BU7345HFV,BU7346GUL
A
Technical Note
●Appearance of Marker
(Dimension including burr: Max. 1.8)
1.6±0.1
Marker
3.0±0.1
○○
burr: Max. 2.8)
2.6±0.1
(Dimension including
(1.5)
(1.2)
(1.4)
(0.45)
(0.15)
0.145±0.05
LOT No.
0.75MAX
Marker lists
0.22±0.05 0.5
(Unit：mm)
Fig.56 HVSOF6 Appearance of Marker
product name marker
BU7344HFV
BU7345HFV
Marker
AN
AP
○○○
LOT No.
Marker lists
(Unit：mm)
Fig.57 VCSP50L1 Appearance of Marker
product name marker
BU7346GUL
AA8
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11/1 3
© 2011 ROHM Co., Ltd. All rights reserved.
2011.01 - Rev.
BU7344HFV,BU7345HFV,BU7346GUL
A
●Notes for use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as applied voltage (VDD or VIN), operating temperature range (Topr),
etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit.
If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical
safety measures including the use of fuses, etc.
(2) Recommended operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the
breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s
power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines.
In this regard, for the digital block power supply and the analog block power supply, even though these power supplies
has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus
suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the
wiring patterns. For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At
the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to
be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the
constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals
a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage
to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a singl
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
e ground at the reference point of the set PCB so that
Technical Note
www.rohm.com
12/13
© 2011 ROHM Co., Ltd. All rights reserved.
2011.01 - Rev.
BU7344HFV,BU7345HFV,BU7346GUL
A
●Ordering part number
B D 7 3 4 4 H F V - T R
Technical Note
Part No Part No
Package
7344 7345
7346
HVSOF6
1.6±0.1
(MAX 1.8 include BURR)
0.1
3.0±0.1
2.6±
(MAX 2.8 include BURR)
0.75Max.
0.5
456
321
0.22±0.05
(1.2)
(1.4)
S
0.1 S
(1.5)
(0.45)
(0.15)
0.145±0.05
(Unit : mm)
<Tape and Reel information>
VCSP50L1
(BU7346GUL)
1PIN MARK
<Tape and Reel information>
1.00±0.05
1.50±0.05
0.10±0.05
0.55MAX
S
(φ0.15)INDEX POST
6-φ0.25±0.05
0.05
0.25±0.05
0.06 S
BA
B
A
B
A
1
P=0.5×2
0.25±0.05
0.5
3
2
HFV: HVSOF6
GUL: VCSP50L1
Embossed carrier tapeTape
Quantity
Direction
of feed
Quantity
Direction
of feed
3000pcs
TR
The direction is the 1pin of product is at the upper right when you hold
()
reel on the left hand and you pull out the tape on the right hand
Reel
Embossed carrier tapeTape
3000pcs
E2
The direction is the 1pin of product is at the upper left when you hold
()
reel on the left hand and you pull out the tape on the right hand
Reel
Packaging and forming specification
TR: Embossed tape and reel
(HVSOF6)
E2: Embossed tape and reel
(VCSP50L1)
1pin
Direction of feed
Order quantity needs to be multiple of the minimum quantity.
∗
1pin
Order quantity needs to be multiple of the minimum quantity.
∗
Direction of feed
www.rohm.com
13/13
© 2011 ROHM Co., Ltd. All rights reserved.
2011.01 - Rev.
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specied herein is subject to change for improvement without notice.
The content specied herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specied in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specied herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specied in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, ofce-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specied in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, re or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specied herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Notice
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Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
R1120
A
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