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BU6655NUX
Datasheet (ROHM)
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Datasheet BU6655NUX Datasheet (ROHM)

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CMOS LDO Regulators for Portable Equipments
3ch CMOS LDO Regulators
●Description
BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX, BU6654NUX, BU6655NUX are high-performance 3ch FULL CMOS regulator with 200-mA outputs, which is mounted on small package VSON008X2030(2.0 mm 3.0 mm 0.6 mm). It has excellent noise characteristics and load responsiveness characteristics despite its low circuit current consumption of 120 A. It is most appropriate for various applications such as power supplies for logic IC, RF, and camera modules.
●Features
1) High-accuracy output voltage of 1% (25 mV on 1.5 V & 1.8 V products)
2) High ripple rejection: 70 dB (Typ., 1 kHz, VOUT≦1.8 V)
3) Compatible with small ceramic capacitor (CIN=2.2F, Co=1.0 F)
4) Low current consumption: 120 A
5) ON/OFF control pin (STBY) of output voltage
6) With built-in over current protection circuit and thermal shutdown circuit
7) With built-in output discharge circuit
8) Adopting small package VSON008X2030
●Applications
Battery-powered portable equipment, etc.
●Line up matrix
■ 200 mA BU665□NUX Series
Product Name VOUT1 VOUT2 VOUT3 Package
BU6650NUX 2.8V 2.8V 1.8V
BU6651NUX 2.8V 1.8V 1.5V
BU6652NUX 2.8V 2.8V 1.5V
BU6653NUX 2.8V 1.8V 1.8V
BU6654NUX 3.3V 1.8V 1.5V
BU6655NUX 3.3V 2.8V 1.8V
VSON008X2030
No.11020EFT06
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1/21
© 2011 ROHM Co., Ltd. All rights reserved.
2011.09 - Rev.F
BU6650NUX,BU6651NUX,BU6652NUX,BU6653NUX,BU6654NUX,BU6655NUX
Technical Note
●Absolute maximum rating
Parameter Symbol Ratings Unit
Maximum applied power voltage VMAX -0.3 ~ +6.0 V
Power dissipation Pd 660*1 MW
Maximum junction temperature TjMAX +125 °C
Operational temperature range Topr -40 ~ +85 °C
Storage temperature range Tstg -55 ~ +125 °C
*1 PCB (70 mm 70 mm, thickness 1.6-mm glass epoxy) a standard ROHM board is implemented. Reduced to 6.6 mW/C when used at Ta=25C or higher.
●Recommended operating range (Do not exceed Pd.)
Parameter Symbol Ratings Unit
Input power supply voltage VIN 2.5 ~ 5.5 V
Maximum output current IMAX 200 mA
●Recommended operating conditions
Parameter Symbol
Input capacitor CIN 1.0*
Output capacitor CO 0.5*
*2 Set the capacity value of the capacitor so that it does not fall below the minimum value, taking temperature characteristics, DC device characteristics, and change with time into consideration.
Ratings
Min. Typ. Max.
2
2.2 － μF A ceramic capacitor is recommended.
2
1.0 － μF A ceramic capacitor is recommended.
Unit Conditions
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2011.09 - Rev.F
BU6650NUX,BU6651NUX,BU6652NUX,BU6653NUX,BU6654NUX,BU6655NUX
●Electrical characteristics
(Ta=25C, VIN=VOUT+1.0 V (VIN=3.5 V on VOUT=1.8 V and1.5 V products), STBY=1.5 V, CIN=2.2 F, C O=1.0 F, unless otherwise specified)
Limits
Parameter Symbol
Min. Typ. Max.
Unit Conditions
Technical Note
VOUT
Output voltage VOUT
IIN1 - 40 95 μA
Operating current
Circuit current (at STBY) ISTBY - - 1 μA STBY=0 V
Ripple rejection RR 55
Input / Output voltage difference
Line regulation VDL - 2 20 mV
IIN2 - 80 190 μA
IIN3 - 120 285 μA
VSAT
×0.99
VOUT
-25mV
- 360 720
- 300 600
- 220 460
VOUT
70
65
VOUT
×1.01
VOUT
+25mV
- dB
V
mV
IOUT=10 μA, VOUT≥2.5 V
IOUT=10 μA, VOUT<2.5 V
IOUT=0mA STBY×1=1.5V, STBY×2=0V
IOUT=0mA STBY×2=1.5V, STBY×1=0V
IOUT=0mA STBY×3=1.5V
VRR=-20dBv, fRR=1kHz, IOUT=10 mA
1.5 V≦VOUT≦1.8 V VRR=-20dBv, fRR=1 kHz, IOUT=10 mA
2.5 V≦VOUT VOUT=2.8V
(VIN=0.98*VOUT, IOUT=200 mA) VOUT=3.3V
(VIN=0.98*VOUT, IOUT=200 mA) VOUT=3.3V
(VIN=0.98*VOUT, IOUT=150 mA) VIN=VOUT+1.0 V to 5.5 V,
IOUT=10 μA
Load regulation VDLO - 10 80 mV IOUT=0.01 mA to 100 mA
Over current protection detection current
Output short-circuit current ISHORT 20 70 150 mA Vo=0 V
Output discharge resistance RDSC 20 50 80 Ω VIN=4.0 V, STBY=0 V
Standby pull down resistance RSTB 500 1000 2000 kΩ
ON VSTBH 1.5 - 5.5 V Output Voltage ON
Control Voltage
OFF VSTBL -0.3 - 0.3 V Output Voltage OFF
* This product does not have radiation-proof design.
ILMAX 220 350 700 mA Vo=VOUT*0.8
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3/21
© 2011 ROHM Co., Ltd. All rights reserved.
2011.09 - Rev.F
BU6650NUX,BU6651NUX,BU6652NUX,BU6653NUX,BU6654NUX,BU6655NUX
●Block diagram, recommended circuit diagram, and package dimensions (VSON008X2030)
VIN
CIN
STBY1
VREF
STBY
OCP
Device Mark a
VOUT1
COUT
Lot No.
STBY2
VREF
VOUT2
STBY
COUT
OCP
STBY3
VREF
VOUT3
STBY
COUT
OCP
Fig.1 Block diagram
Technical Note
Fig.2 Package dimensions
●Pin configuration diagram
PIN No. PIN NAME DESCRIPTION
1 VIN INPUT Pin
2 STBY1
3 STBY2
4 STBY3
OUTPUT1 CONTROL Pin
( High : ON, Low : OFF )
OUTPUT2 CONTROL Pin
( High : ON, Low : OFF )
OUTPUT3 CONTROL Pin
( High : ON, Low : OFF )
Series Name Device Mark a
BU6650NUX U 6 6 5 0 BU6651NUX U 6 6 5 1 BU6652NUX U 6 6 5 2 BU6653NUX U 6 6 5 3 BU6654NUX U 6 6 5 4 BU6655NUX U 6 6 5 5
Device Mark
5 GND GROUND Pin 6 VOUT3 OUTPUT3 Pin
7 VOUT2 OUTPUT2 Pin 8 VOUT1 OUTPUT1 Pin
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4/21
© 2011 ROHM Co., Ltd. All rights reserved.
2011.09 - Rev.F
BU6650NUX,BU6651NUX,BU6652NUX,BU6653NUX,BU6654NUX,BU6655NUX
●Input/Output terminal equivalent circuit schematic
6,7,8pin (VOUT) 5pin (GND) 2,3,4pin (STBY) 1pin (VIN)
IN
V
VIN
VOUT
STBY
Fig.3 Input / Output equivalent circuit
●About input/output capacitor
It is recommended to place a capacitor as close as possible to the pins between the input terminal and GND or between the output terminal and GND. The capacitor between the input terminal and GND becomes valid when source impedance increases or when wiring is long. The larger the capacity of the output capacitor between the output terminal and GND is, the better the stability and characteristics in output load fluctuation become. However, please check the status of actual implementation. Ceramic capacitors generally have variation, temperature characteristics, and direct current bias characteristics and the capacity value also decreases with time depending on the usage conditions. It is recommended to select a ceramic capacitor upon inquiring about detailed data of the related manufacturer.
Capacity value of ceramic capacitor - DC bias characteristics
10
0
-10
-20
-30
-40
-50
-60
-70
Capacitance Change [%]
-80
-90
-100
10-V wi thstand volt age F char acter isti cs
00.511.5 22.533.54
Example
(
DC Bias Voltage [V]
Fig.4 Capacity – bias characteristics
●About the equivalent series resistance (ESR) of a ceramic capacitor
Capacitors generally have ESR (equivalent series resistance) and it operates stably in the ESR-IOUT area shown on the right. Since ceramic capacitors, tantalum capacitors, electrolytic capacitors, etc. generally have different ESR, please check the ESR of the capacitor to be used and use it within the stability area range shown in the right graph for evaluation of the actual application.
100
10
ESR [Ω]
0.1
0.01
Unstable area
1
0 50 100 150 200
Stability area
IOUT [ mA]
Technical Note
)
10-V withstand voltag e B1char acter ist ics GRM 188B11A105KA61 D
10-V wi thstand vol tage B characteristics
6.3-V withst and voltage B char acteri sti cs
10-V withstand voltag e F char acter isti cs
4-V withstand voltag e X6S characteristi cs
Fig.5 Stability area characteristics (Example)
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.09 - Rev.F
BU6650NUX,BU6651NUX,BU6652NUX,BU6653NUX,BU6654NUX,BU6655NUX
●Reference data total device (Ta=25ºC unless otherwise specified.)
Technical Note
50.00
40.00
30.00
20.00
Input Current (uA)
10.00
0.00
-40 -15 10 35 60 85
Temp ( °C)
Fig. 6 Iin1 vs. Temp
100.00
80.00
60.00
40.00
Input Current (uA)
20.00
0.00
-40 -15 10 35 60 85
Temp ( °C)
Fig. 7 Iin2 vs. Temp
1.000
0.900
0.800
0.700
0.600
0.500
0.400
0.300
0.200
Gnd Current (uA)
0.100
0.000
-0.1 00
-40 -15 10 35 60 85
Temp. (° C)
Fig. 9 Istby vs Temp (STBY)
VIN= 3.8V STBY=0V
3.50
VIN= 3.8V
3.00
2.50
2.00
1.50
1.00
Output Voltage (V)
0.50
0.00
00.511.5
Temp.= 85°C Temp.= 25°C Temp.= -40°C
STBY Voltage (V)
Fig. 10 STBY Threshold
●Reference data Vo=3.3V (Ta=25ºC unless otherwise specified.)
3.5
3.0
2.5
2.0
1.5
1.0
Output Voltage (V)
0.5
0.0
00.511.522.533.544.555.5
Fig. 11 Output Voltage
Vin V oltage (V)
IO=0uA IO=100uA IO=50mA IO=200mA
Temp.=25°C VIN = STBY
3.35
3.34
3.33
3.32
3.31
3.30
3.29
3.28
Output Voltage (V)
3.27
3.26
3.25
3.2 3.3 3.4 3.5 3.6 3.7
Vin V oltage (V)
Fig. 12 Line Regulation
IO=0uA IO=100uA IO=50mA IO=200mA
Temp=25°C VIN = STBY
150.00
120.00
90.00
60.00
Input C ur rent (u A)
30.00
0.00
-40 -15 10 35 60 85
Temp ( °C)
Fig. 8 Iin3 vs. Temp
100
80
60
40
Gnd Cur rent (uA)
20
0
00.511.522.533.544.555.5
Temp.=-40°C Temp.=25°C Temp.=85°C
Vin V oltage (V )
Fig. 13 Circuit Current IGND
IO=0uA
VIN = STBY
0.35
0.30
0.25
0.20
0.15
Temp.=-40°C
0.10
Dropout Voltage (V)
0.05
0.00
0 0.05 0.1 0.15 0.2
Temp.=25°C
Temp.=85°C
VIN=0.98 x VOUT
STBY = 1.5V
Output Current (A)
Fig. 14 Dropout Voltage
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© 2011 ROHM Co., Ltd. All rights reserved.
10
8
6
4
STBY C urr ent (uA)
2
0
00.51 1.522.533.54 4.555.5
Temp.=-40°C
V
STBY
Temp.=85°C
Temp.=25°C
VIN = STBY
Voltage (V )
Fig. 15 STBY Input Current Fig. 16 IOUT - IGND
120
110
100
90
80
70
60
Gnd Cur rent (uA)
50
40
0 0.05 0.1 0.15 0.2
Temp.=85°C
Temp.=25°C
Temp.=-40°C
Output Current (A )
2011.09 - Rev.F
VIN = 4.3V
STBY = 1.5V
BU6650NUX,BU6651NUX,BU6652NUX,BU6653NUX,BU6654NUX,BU6655NUX
Technical Note
3.35
3.34
3.33
3.32
3.31
3.30
3.29
3.28
Output Voltage (V)
3.27
3.26
3.25
0 0.05 0.1 0.15 0.2
Temp.=25°C
Temp.=85°C
Temp.=-40°C
VIN = 4.3V
STBY = 1.5V
3.50
3.00
2.50
2.00
1.50
1.00
Output Voltage (V)
0.50
0.00
0 0.1 0.2 0.3 0.4 0.5 0.6
Output Current (A)
Fig. 17 Load Regulation Fig. 19 STBY Threshold Fig. 18 OCP Threshold
3.35
3.34
3.33
3.32
3.31
3.30
3.29
3.28
Output Voltage (V)
3.27
3.26
3.25
-40 -15 10 35 60 85
Temp. ( °C)
VIN= 4.3V
STBY=1.5V
Io=0.1mA
50.00
40.00
30.00
20.00
Gnd Cur rent (uA)
10.00
0.00
-40 -15 10 35 60 85
VIN=5.5V
Output Current (A )
Temp. ( °C)
VIN=3.8V
VIN=4.3V
STBY = 1.5V
Temp=25
VIN=4. 3V
STBY=1.5V
Io=0mA
3.50
VIN= 4.3V
3.00
2.50
2.00
1.50
1.00
Output Voltage (V)
℃
0.50
0.00
00.511.5
Temp.=85°C Temp.=25°C Temp.=-40°C
STBY V oltage (V)
1.000
0.900
0.800
0.700
0.600
0.500
0.400
0.300
0.200
Gnd Cur rent (uA)
0.100
0.000
-0.1 00
-40 -15 10 35 60 85
VIN= 4.3V STBY=0V
Temp. ( °C)
80
70
60
50
40
30
20
Ripple Rejection (dB)
10
Vin= 4.3V Io=10mA Ta = 2 5℃
0
0.1 1 10 100 1000
Frequency (kHz)
Fig. 23 Ripple Rejection VS Freq.
80
f=0.1kHz
f=10kHz
f=100kHz
f=1kHz
Co= 1.0 μF Cin=none Iout=10mA temp=25℃
70
60
50
40
30
20
Ripple Rejection [dB]
10
0
3.3 4.3 5.3 Input Vo ltage VIN[V]
Fig. 24 Ripple Rejection VS VIN
Fig. 22 IGND vs Temp (STBY) Fig. 21 IGND vs Temp Fig. 20 VOUT vs Temp
1.8
1.6
1.4
1.2
Co=1.0μF Cin=1.0μF Iout=10mA temp=25℃
1
0.8
0.6
0.4
0.2
Ou tput Noise Density [μV /√ H z]
0
0.1 1 10 100 Frequency f [kHz]
Fig. 25 Output Noise Spectral
Density VS Freq.
Fig. 26 Load Response
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Fig. 27 Load Response
2011.09 - Rev.F
BU6650NUX,BU6651NUX,BU6652NUX,BU6653NUX,BU6654NUX,BU6655NUX
Fig. 28 Load Response Fig. 29 Load Response
Technical Note
Fig. 30 Load Response
Current Pulse=10kHz
Fig. 32 Load Response
Current Pulse=100kHz
Fig. 31 Load Response
Current Pulse=10kHz
Fig. 33 Load Response
Current Pulse=100kHz
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2011.09 - Rev.F
BU6650NUX,BU6651NUX,BU6652NUX,BU6653NUX,BU6654NUX,BU6655NUX
Technical Note
Fig. 34 Start Up Time
Iout = 0mA
Fig. 35 Start Up Time
Iout = 200mA
Fig. 36 Start Up Time (STBY=VIN)
Iout = 0mA
Fig. 37 Start Up Time(STBY=VIN)
Iout = 200mA
Fig. 38 Discharge Time
Iout = 0mA
Fig. 39 VIN Response
Iout = 10mA
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.09 - Rev.F
BU6650NUX,BU6651NUX,BU6652NUX,BU6653NUX,BU6654NUX,BU6655NUX
●Reference data Vo=2.8V (Ta=25ºC unless otherwise specified.)
3.5
3.0
2.5
2.0
1.5
1.0
Output Voltage (V)
0.5
0.0
00.511.522.533.544.555.5
Fig. 40 Output Voltage
Vin V oltage (V)
IO=0uA IO= 100uA IO=50mA IO=200mA
Temp.=25°C
VIN = ST BY
2.85
2.84
2.83
2.82
2.81
2.80
2.79
2.78
Output Voltage (V)
2.77
2.76
2.75
2.7 2.8 2.9 3 3.1 3.2
IO=0uA IO=100uA IO=50mA IO=200mA
Vin V oltage (V)
Fig. 41 Line Regulation
Temp.=25°C
VIN = STBY
100
IO=0uA
VIN = ST BY
80
60
40
Gnd Curr ent (uA)
20
0
00.511.522.533.544.555.5
Fig. 42 Circuit Current IGND
0.40
0.35
0.30
0.25
0.20
0.15
0.10
Dropout Voltage ( V)
0.05
0.00
0 0.05 0.1 0 .15 0.2
Temp.=25°C
Temp. = -40°C
Output Current (A )
Temp.=85°C
VIN= 0.98 x VOUT
STBY = 1.5V
10
8
6
4
STBY C urr ent (uA)
2
0
Temp. =- 40°C
00.511.522.5 33.544.555.5
Temp.=85°C
Temp.=25°C
STBY Voltage (V)
VIN = STBY
120
110
100
90
80
70
60
Gnd Curr ent (uA)
50
40
0 0.05 0.1 0.15 0.2
Fig. 43 Dropout Voltage
Fig. 44 STBY Input Current Fig. 45 IOUT - IGND
Output Voltage (V)
2.85
2.84
2.83
2.82
2.81
2.80
2.79
2.78
Output Voltage (V)
2.77
2.76
2.75
-40 -15 10 35 60 85
Fig. 46 Load Regulation Fig. 47 OCP Threshold
Fig. 48 VOUT vs Temp
80
70
60
50
40
30
20
Ripple Rejection (dB)
10
0
0.1 1 10 100 1000
Vin= 3.8V Io=10mA Ta = 25 ℃
Frequency (kHz)
80
f=0.1kHz
70
60
50
f=1kHz
f=1 0kHz
40
30
20
Ripple Rejection [dB]
f=100kHz
10
0
2.8 3.8 4.8 Input Vol tage VIN[V]
Co=1.0μF Cin=none Iout=10mA temp=25℃
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
Output Noise Density [μV/√Hz]
0
0.1 1 10 100
Fig. 49 Ripple Rejection VS Freq.
Fig. 50 Ripple Rejection VS VIN
Fig. 51 Output Noise Spectral
Density VS Freq.
Technical Note
Temp.=- 40°C
Temp.=25° C Temp.=85° C
Vin Voltage ( V)
Temp. =85°C
Temp.=25°C
Temp. =- 40°C
VIN = 3.8V
STBY = 1.5V
Output Currnt (A )
VIN= 3.8V
STBY= 1.5V
Io=0.1mA
Temp. (°C)
Co=1.0μF Cin=1.0μF Iout=10mA temp=25℃
Frequency f [kHz]
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.09 - Rev.F
BU6650NUX,BU6651NUX,BU6652NUX,BU6653NUX,BU6654NUX,BU6655NUX
Fig. 52 Load Response
Fig. 53 Load Response
Fig. 54 Load Response
Fig. 55 Load Response
⇔
⇔
Fig. 56 Load Response
Current Pulse=10kHz
Fig. 57 Load Response
Current Pulse=10kHz
⇔
⇔
Fig. 58 Load Response
Current Pulse=100kHz
Fig. 59 Load Response
Current Pulse=100kHz
Technical Note
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.09 - Rev.F
BU6650NUX,BU6651NUX,BU6652NUX,BU6653NUX,BU6654NUX,BU6655NUX
Fig. 60 Start Up Time
Iout = 0mA
Fig. 63 Start Up Time(STBY=VIN)
Iout = 200mA
Fig. 61 Start Up Time
Iout = 200mA
Fig. 64 Discharge Time
Iout = 0mA
Fig. 62 Start Up Time (STBY=VIN)
Technical Note
Iout = 0mA
Fig. 65 VIN Response
Iout = 10mA
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.09 - Rev.F
BU6650NUX,BU6651NUX,BU6652NUX,BU6653NUX,BU6654NUX,BU6655NUX
●Reference data Vo=1.8V (Ta=25ºC unless otherwise specified.)
3.5
3.0
2.5
2.0
1.5
1.0
Output Voltage (V)
0.5
0.0
00.511.522.533.544.555.5
IO=0uA IO= 100uA IO=50mA IO=200mA
Vin V oltage (V )
Temp=25°C VIN = STBY
1.85
1.84
1.83
1.82
1.81
1.80
1.79
1.78
Output Voltage (V)
1.77
1.76
1.75
1.75 1.85 1.95 2.05 2.15 2.25 2.35
Temp=25°C
VIN = STBY
IO=0uA IO= 100uA IO=50mA IO=200mA
Vin V oltage (V)
100
80
60
40
Gnd Cur rent (uA)
20
0
00.511.522.533.544.555.5
Fig. 66 Output Voltage
Fig. 67 Line Regulation
Fig. 68 Circuit Current IGND
140
120
100
80
60
40
Gnd Cur rent (uA)
20
0
00.511.522.533.544.555.5
Temp=-40°C
Temp=25°C Temp=85°C
Vin V oltage (V)
Fig. 69 Circuit Current IGND
IO=200mA
VIN = STBY
10
8
6
4
STBY C urr ent (uA)
2
0
00.51 1.522.533.54 4.555.5
Temp=-40°C
Temp=85°C
Temp=25°C
VIN = STBY
STBY Voltage (V )
Fig. 70 STBY Input Current Fig. 71 IOUT - IGND
120
110
100
90
80
70
60
Gnd Current (uA)
50
40
0 0.05 0.1 0.15 0.2
Output Voltage (V)
Output Voltage (V)
3.50
3.00
2.50
2.00
1.50
1.00
Output Voltage (V)
0.50
0.00
00.511.5
Fig. 72 Load Regulation Fig. 74 STBY Threshold Fig. 73 OCP Threshold
1.85
1.84
1.83
1.82
1.81
1.80
1.79
1.78
Output Voltage (V)
1.77
1.76
1.75
-40 -15 10 35 60 85
Temp ( °C)
VIN= 3.5V
STBY=1.5V
Io=0.1mA
50.00
40.00
30.00
20.00
Input Curr ent (uA)
10.00
0.00
-40 -15 10 35 60 85
Temp ( °C)
VIN= 3.5V
STBY= 1.5V
Io=0mA
1.000
0.900
0.800
0.700
0.600
0.500
0.400
0.300
0.200
Gnd C urrent (uA)
0.100
0.000
-0.100
-40 - 15 10 35 60 85
Technical Note
Temp=-40°C
Temp=25°C Temp=85°C
Vin V oltage (V)
Temp=25°C
Output Current (A)
Temp=85°C Temp=25°C
Temp=-40°C
STBY V oltage (V)
Temp ( °C)
Temp=85°C
Temp= -40°C
IO=0uA
VIN = STBY
VIN = 3.5V
STBY = 1.5V
VIN= 3.5V
STBY= 0V
Fig. 75 VOUT vs. Temp
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Fig. 77 IGND vs. Temp (STBY) Fig. 76 IGND vs. Temp
2011.09 - Rev.F
BU6650NUX,BU6651NUX,BU6652NUX,BU6653NUX,BU6654NUX,BU6655NUX
80
70
60
50
40
30
20
Ripple Rejection (dB)
10
0
0.1 1 10 100 1000
Vin= 3.5V Io=10mA Ta = 25℃
Frequency (kHz)
80
f=0 .1kHz
70
60
50
40
30
20
Ripple Rejection [dB]
10
0
2.5 3.5 4.5 5.5
f=1 kHz
f=10kHz
f=100kHz
Input Vol tage VIN[V]
Co=1.0μF Cin=none Iout=10mA temp=25℃
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Output Noise Density [μV/√Hz]
0
0.1 1 10 100
Fig. 78 Ripple Rejection VS Freq.
Fig. 79 Ripple Rejection VS VIN
Fig. 80 Output Noise Spectral
Density VS Freq.
Fig. 81 Load Response
Fig. 82 Load Response
Fig. 83 Load Response Fig. 84 Load Response
Technical Note
Co=1.0μF Cin=1.0μF Iout=10mA temp=25℃
Frequency f [kHz]
⇔
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Fig. 85 Load Response
Current Pulse=10kHz
Fig. 86 Load Response
Current Pulse=10kHz
2011.09 - Rev.F
BU6650NUX,BU6651NUX,BU6652NUX,BU6653NUX,BU6654NUX,BU6655NUX
⇔
Technical Note
Fig. 89 Start Up Time
Iout = 0mA
Fig. 92 Start Up Time(STBY=VIN)
Iout = 200mA
Fig. 87 Load Response
Current Pulse=100kHz
Fig. 90 Start Up Time
Iout = 200mA
Fig. 93 Discharge Time
Iout = 0mA
Fig. 88 Load Response
Current Pulse=100kHz
Fig. 91 Start Up Time (STBY=VIN)
Iout = 0mA
Fig. 94 VIN Response
Iout = 10mA
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.09 - Rev.F
BU6650NUX,BU6651NUX,BU6652NUX,BU6653NUX,BU6654NUX,BU6655NUX
●Reference data Vo=1.5V (Ta=25ºC unless otherwise specified.)
1.8
1.5
1.2
0.9
0.6
Output Voltage (V)
0.3
0.0
00.511.522.533.544.555.5
Fig. 95 Output Voltage Fig. 96 Line Regulation
IO=0uA IO=100uA IO=50mA IO=200mA
Vin V oltage (V)
Temp=25°C VIN = STBY
1.55
1.54
1.53
1.52
1.51
1.50
1.49
1.48
Output Voltage (V)
1.47
1.46
1.45
1.25 1.35 1.45 1.55 1.65 1.75 1.85 1.95 2.05 2.15 2.25
Temp= 25°C
VIN = STBY
IO=0uA IO= 100uA IO=50mA IO=200mA
Vin V oltage (V)
100
80
60
40
Gnd Cur rent (uA)
20
0
00.511.522.533.544.555.5
Fig. 97 Circuit Current IGND
Technical Note
Temp=-40°C
Temp=25°C Temp=85°C
Vin V oltage (V )
IO=0uA
VIN = STBY
140
120
100
80
60
40
Gnd Current (uA)
20
0
00.511.522.533.544.555.5
Temp=-40°C
Temp=25°C Temp=85°C
Vin V oltage (V )
IO=200mA
VIN = STBY
10
8
6
4
STBY C urr ent (uA)
2
0
00.51 1.522.533.544.555.5
Temp= -40°C
Temp=85°C
Temp=25°C
STBY V oltage ( V)
VIN = STBY
120
110
100
90
80
70
60
Gnd Cur rent (uA)
50
40
0 0.05 0.1 0.15 0.2
Output Current (A )
Fig. 98 Circuit Current IGND Fig. 99 STBY Input Current Fig. 100 IOUT - IGND
Fig. 101 Load Regulation
3.50
Temp=25℃
3.00
2.50
2.00
1.50
1.00
Output Voltage (V)
0.50
0.00
0 0.1 0.2 0.3 0.4 0.5 0.6
VIN=5.5V
VIN=2.0V
Output Current (A)
Fig. 102 OCP Threshold
VIN=3.5V
STBY=1.5V
2.00
1.75
1.50
1.25
1.00
0.75
0.50
Output Voltage (V)
0.25
0.00
00.5 11.5
STBY V oltage (V)
Fig. 103 STBY Threshold
Temp=25°C
Temp=85°C Temp=25°C
Temp=-40°C
Temp=85°C
Temp=-40°C
VIN = 3.5V
STBY = 1.5V
1.55
1.54
1.53
1.52
1.51
1.50
1.49
1.48
Output Voltage (V)
1.47
1.46
1.45
-40 -15 10 35 60 85
Temp ( °C)
VIN= 3.5V
STBY=1.5V
Io=0.1mA
50.00
40.00
30.00
20.00
Input Curr ent (uA)
10.00
0.00
-40 -15 10 35 60 85
Temp ( °C)
VIN= 3.5V
STBY=1.5V
Io=0mA
Fig. 104 VOUT vs. Temp
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1.000
0.900
0.800
0.700
0.600
0.500
0.400
0.300
0.200
Gnd Cu rrent (uA)
0.100
0.000
-0.100
-40 - 15 10 35 60 85
Temp ( °C)
Fig. 106 IGND vs. Temp (STBY) Fig. 105 IGND vs. Temp
2011.09 - Rev.F
VIN= 3.5V
STBY= 0V
BU6650NUX,BU6651NUX,BU6652NUX,BU6653NUX,BU6654NUX,BU6655NUX
f
80
70
60
50
40
30
20
Ripple Rejection (dB)
10
0
0.1 1 10 100 1000
Fig. 107 Ripple Rejection vs. Freq.
Vin= 3.5V Io=10mA Ta = 25℃
Frequency (kHz)
80
=0.1kHz
70
60
50
40
30
20
Ripple Rejection [dB]
10
0
2.5 3.5 4.5 5.5
f=1kHz
f=10kHz
f=100kHz
Input Voltage VIN[V]
Co= 1.0 μF Cin=none Iout=10mA temp=25℃
Fig. 108 Ripple Rejection vs. VIN
(Iout=10 mA)
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Output Noise Density [μV/√ Hz]
0
0.1 1 10 100
Fig. 109 Output Noise Spectral Density
Fig. 110 Load Response Fig. 111 Load Response
Fig. 112 Load Response
Fig. 113 Load Response
Fig. 114 Load Response
Current Pulse=10 kHz
Fig. 115 Load Response
Current Pulse=10 kHz
Technical Note
Co=1.0μF Cin=1.0μF Iout =10 mA temp=25℃
Frequency f [kHz]
vs. Freq.
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.09 - Rev.F
BU6650NUX,BU6651NUX,BU6652NUX,BU6653NUX,BU6654NUX,BU6655NUX
Fig. 116 Load Response
Current Pulse=100 kHz
Fig. 117 Load Response
Current Pulse=100 kHz
Fig. 118 Start-up Time
Iout = 0 mA
Fig. 121 Startup Time (STBY=VIN)
Iout = 200mA
Fig. 119 Start-up Time
Iout = 200 mA
Fig. 122 Discharge Time
Iout = 0 mA
Fig. 120 Start-up Time (STBY=VIN)
Fig. 123 VIN Response
Technical Note
Iout = 0 mA
Iout = 10 mA
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.09 - Rev.F
BU6650NUX,BU6651NUX,BU6652NUX,BU6653NUX,BU6654NUX,BU6655NUX
Technical Note
●About power dissipation (Pd)
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability. Therefore, be sure to prepare sufficient margin within power dissipation for usage. Calculation of the maximum internal power consumption of IC (P
MAX)
MAX=(VIN-VOUT1)×IOUT1(MAX.)＋(VIN-VOUT2)×IOUT2(MAX.)＋(VIN-VOUT3)×IOUT3(MAX.)
P
IN : Input voltage VOUT1,2,3 : Output voltage IOUT(MAX) : Maximum output current)
(V
0.7
0.6
0.66W
0.5
0.4
0.3
Pd [W]
0.2
0.1
0
0 25 50 75 100 125
Ta [℃]
85
* Please design the margin so that P
becomes is than Pd (PMAXPd) within the usage temperature range.
- Standard ROHM board ­Size: 70 mm 70 mm 1.6 mm Material : Glass epoxy board
MAX
Fig.124 VSON008X2030 Power dissipation heat reduction characteristics (Reference)
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.09 - Rev.F
BU6650NUX,BU6651NUX,BU6652NUX,BU6653NUX,BU6654NUX,BU6655NUX
Technical Note
●Other notes
- About absolute maximum rating Breakage may occur when absolute maximum ratings such as applied voltage and operating temperature range are exceeded. Short mode or open mode cannot be specified at occurrence of a break, so please prepare physical safety measures (e.g., fuse) if such special mode in which the absolute maximum rating is exceeded can be assumed.
- About GND potential Please be sure that the potential of the GND terminal is the lowest in any operating condition.
- About thermal design Please provide thermal design with sufficient margin, taking power dissipation (Pd) in actual usage conditions into consideration.
- About short between pins and miss-attachment Please be careful regarding the IC direction and misalignment at attachment onto a printed circuit board. Miss-attachment may cause a break of IC. Short caused by foreign matter between outputs, output and power supply, or GND may also lead to a break.
- About operation in a strong electromagnetic field Please note that usage in a strong electromagnetic field may cause malfunction.
- About common impedance Please give due consideration to wiring of the power source and GND by reducing common-mode ripple or making ripple as small as possible (e.g., making the wiring as thick and short as possible, or reducing ripple by LC), etc.
- About STBY terminal voltage Set STBY terminal voltage to 0.3 V or less to put each channel into a standby state and to 1.5 V or more to put each channel into an operating state. Do not fix STBY terminal voltage to 0.3 V or more and 1.5 V or less or do not lengthen the transition time. This may cause malfunction or failure. When shorting the VIN terminal and STBY terminal for usage, the status will be “STBY=VIN＝LOW” at turning the power OFF, and discharge of the VOUT terminal cannot operate, which means voltage may remain for a certain time in the VOUT terminal. Since turning the power ON again in this state may cause overshoot, turn the power ON for use after the VOUT terminal is completely discharged.
- About over current protection circuit Output has a built-in over current protection circuit, which prevents IC break at load short. Note that this protection circuit is effective for prevention of breaks due to unexpected accidents. Please avoid usage by which the protection circuit operates continuously.
- About thermal shutdown Output is OFF when the thermal circuit operates since a temperature protection circuit is built in to prevent thermal breakdown. However, it recovers when the temperature returns to a certain temperature. The thermal circuit operates at emergency such as overheating of IC. Since it is prepared to prevent IC breakdown, please do not use it in a state in which protection works.
- About reverse current For applications on which reverse current is assumed to flow into IC, it is recommended to prepare a path to let the current out by putting a bypass diode between the V
IN-VOUT terminals.
Reverse current
VIN
OUT
STBY
GND
Fig.125 Example of bypass diode connection
- About testing on a set board When connecting a capacitor to a terminal with low impedance for testing on a set board, please be sure to discharge for each process since IC may be stressed. As a countermeasure against static electricity, prepare grounding in the assembly process and take sufficient care in transportation and storage. In addition, when connecting a capacitor to a jig in a testing process, please do so after turning the power OFF and remove it after turning the power OFF.
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.09 - Rev.F
BU6650NUX,BU6651NUX,BU6652NUX,BU6653NUX,BU6654NUX,BU6655NUX
●Ordering part number
B U 6 5 5 0 N U X - T R
Part No. Part No.
6650 6651 6652 6653 6654 6655
VSON008X2030
2.0±0.1
0.6MAX
0.08 S
C0.25
0.3±0.1
0.25
1.5±0.1
0.5
1PIN MARK
+0.03
4
518
+0.05
0.25
−0.04
3.0±0.1
−0.02
0.02
S
(0.12)
1.4±0.1
(Unit : mm)
Package
NUX: VSON008X2030
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction of feed
4000pcs TR
The direction is the 1pin of product is at the upper right when you hold
()
reel on the left hand and you pull out the tape on the right hand
Reel
Packaging and forming specification TR: Embossed tape and reel
1pin
Order quantity needs to be multiple of the minimum quantity.
∗
Direction of feed
Technical Note
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© 2011 ROHM Co., Ltd. All rights reserved.
2011.09 - Rev.F
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd.
The content specied herein is subject to change for improvement without notice.
The content specied herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specications, which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specied in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage.
The technical information specied herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information.
The Products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, of ce-automation equipment, commu­nication devices, electronic appliances and amusement devices).
The Products specied in this document are not designed to be radiation tolerant.
While ROHM always makes effor ts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injur y, re or any other damage caused in the event of the failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel­controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specied herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
Notice
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Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us.
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