BU6650NUX, BU6651NUX, BU6652NUX, BU6653NUX, BU6654NUX, BU6655NUX are high-performance 3ch FULL
CMOS regulator with 200-mA outputs, which is mounted on small package VSON008X2030(2.0 mm 3.0 mm 0.6 mm).
It has excellent noise characteristics and load responsiveness characteristics despite its low circuit current consumption of
120 A. It is most appropriate for various applications such as power supplies for logic IC, RF, and camera modules.
●Features
1) High-accuracy output voltage of 1% (25 mV on 1.5 V & 1.8 V products)
2) High ripple rejection: 70 dB (Typ., 1 kHz, VOUT≦1.8 V)
3) Compatible with small ceramic capacitor (CIN=2.2F, Co=1.0 F)
4) Low current consumption: 120 A
5) ON/OFF control pin (STBY) of output voltage
6) With built-in over current protection circuit and thermal shutdown circuit
*1 PCB (70 mm 70 mm, thickness 1.6-mm glass epoxy) a standard ROHM board is implemented. Reduced to 6.6 mW/C when used at Ta=25C or higher.
●Recommended operating range (Do not exceed Pd.)
Parameter Symbol Ratings Unit
Input power supply voltage VIN2.5 ~ 5.5 V
Maximum output current IMAX 200 mA
●Recommended operating conditions
Parameter Symbol
Input capacitor CIN 1.0*
Output capacitor CO 0.5*
*2 Set the capacity value of the capacitor so that it does not fall below the minimum value, taking temperature characteristics,
DC device characteristics, and change with time into consideration.
It is recommended to place a capacitor as close as possible to the
pins between the input terminal and GND or between the output
terminal and GND.
The capacitor between the input terminal and GND becomes valid
when source impedance increases or when wiring is long. The
larger the capacity of the output capacitor between the output
terminal and GND is, the better the stability and characteristics in
output load fluctuation become. However, please check the status
of actual implementation. Ceramic capacitors generally have
variation, temperature characteristics, and direct current bias
characteristics and the capacity value also decreases with time
depending on the usage conditions. It is recommended to select a
ceramic capacitor upon inquiring about detailed data of the related
manufacturer.
Capacity value of ceramic capacitor - DC bias characteristics
10
0
-10
-20
-30
-40
-50
-60
-70
Capacitance Change [%]
-80
-90
-100
10-V wi thstand volt age
F char acter isti cs
00.511.5 22.533.54
Example
(
DC Bias Voltage [V]
Fig.4 Capacity – bias characteristics
●About the equivalent series resistance (ESR) of a ceramic capacitor
Capacitors generally have ESR (equivalent series resistance) and it
operates stably in the ESR-IOUT area shown on the right. Since
ceramic capacitors, tantalum capacitors, electrolytic capacitors, etc.
generally have different ESR, please check the ESR of the
capacitor to be used and use it within the stability area range shown
in the right graph for evaluation of the actual application.
100
10
ESR [Ω]
0.1
0.01
Unstable area
1
050100150200
Stability area
IOUT [ mA]
Technical Note
)
10-V withstand voltag e
B1char acter ist ics
GRM 188B11A105KA61 D
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of
IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original
IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability. Therefore, be
sure to prepare sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (P
- About absolute maximum rating
Breakage may occur when absolute maximum ratings such as applied voltage and operating temperature range are
exceeded. Short mode or open mode cannot be specified at occurrence of a break, so please prepare physical safety
measures (e.g., fuse) if such special mode in which the absolute maximum rating is exceeded can be assumed.
- About GND potential
Please be sure that the potential of the GND terminal is the lowest in any operating condition.
- About thermal design
Please provide thermal design with sufficient margin, taking power dissipation (Pd) in actual usage conditions into
consideration.
- About short between pins and miss-attachment
Please be careful regarding the IC direction and misalignment at attachment onto a printed circuit board. Miss-attachment
may cause a break of IC. Short caused by foreign matter between outputs, output and power supply, or GND may also
lead to a break.
- About operation in a strong electromagnetic field
Please note that usage in a strong electromagnetic field may cause malfunction.
- About common impedance
Please give due consideration to wiring of the power source and GND by reducing common-mode ripple or making ripple
as small as possible (e.g., making the wiring as thick and short as possible, or reducing ripple by LC), etc.
- About STBY terminal voltage
Set STBY terminal voltage to 0.3 V or less to put each channel into a standby state and to 1.5 V or more to put each
channel into an operating state. Do not fix STBY terminal voltage to 0.3 V or more and 1.5 V or less or do not lengthen
the transition time. This may cause malfunction or failure.
When shorting the VIN terminal and STBY terminal for usage, the status will be “STBY=VIN=LOW” at turning the
power OFF, and discharge of the VOUT terminal cannot operate, which means voltage may remain for a certain time in
the VOUT terminal. Since turning the power ON again in this state may cause overshoot, turn the power ON for use after
the VOUT terminal is completely discharged.
- About over current protection circuit
Output has a built-in over current protection circuit, which prevents IC break at load short. Note that this protection circuit
is effective for prevention of breaks due to unexpected accidents. Please avoid usage by which the protection circuit
operates continuously.
- About thermal shutdown
Output is OFF when the thermal circuit operates since a temperature protection circuit is built in to prevent thermal
breakdown. However, it recovers when the temperature returns to a certain temperature. The thermal circuit operates at
emergency such as overheating of IC. Since it is prepared to prevent IC breakdown, please do not use it in a state in
which protection works.
- About reverse current
For applications on which reverse current is assumed to flow into IC, it is recommended to prepare a path to let the
current out by putting a bypass diode between the V
IN-VOUT terminals.
Reverse current
VIN
OUT
STBY
GND
Fig.125 Example of bypass diode connection
- About testing on a set board
When connecting a capacitor to a terminal with low impedance for testing on a set board, please be sure to discharge for
each process since IC may be stressed. As a countermeasure against static electricity, prepare grounding in the
assembly process and take sufficient care in transportation and storage. In addition, when connecting a capacitor to a jig
in a testing process, please do so after turning the power OFF and remove it after turning the power OFF.
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The content specied herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specied in this document.
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The technical information specied herein is intended only to show the typical functions of and
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