ROHM BU52001GUL, BU52011HFV, BU52021HFV, BU52015GUL, BU52025G Technical data

Hall IC Series / Hall IC(Latch type)

Bipolar Detection Hall ICs

BU52001GUL, BU52011HFV, BU52021HFV,
BU52015GUL, BU52025G, BU52051NVX, BD7411G

٨Description

The bipolar Hall ICs are magnetic switches that can operate both S-and N-pole , upon which the output goes from Hi to Low.
In addition to regular single-output Hall ICs, We offers a line up of dual-output units with a reverse output terminal (active
High).

٨Features

1) Bipolar detection

2) Micropower operation (small current using intermittent operation method)(BD7411G is excluded.)

3) Ultra-compact CSP4 package (BU52001GUL,BU52015GUL)

4) Ultra-Small outline package HVSOF5 (BU52011HFV,BU52021HFV)

5) Ultra-Small outline package SSON004X1216 (BU52051NVXV)

6) Small outline package (BU52025G,BD7411G㧕

7) Line up of supply voltage

For 1.8V Power supply voltage㧔BU52011HFV,BU52015GUL,BU52051NVX)

 For 3.0V Power supply voltage (BU52001GUL)
 For 3.3V Power supply voltage (BU52021HFV,BU52025G)
 For 5.0V Power supply voltage (BD7411G)

8) Dual output type (BU52015GUL)

9) High ESD resistance 8kV(HBM)

٨Applications

Mobile phones, notebook computers, digital video camera, digital still camera, white goods etc.

٨Product Lineup

Supply

Product name

BU52001GUL 2.40㨪3.30 +/-3.7 0.8 50 8.0㱘 CMOS VCSP50L1
BU52015GUL 1.65㨪3.30 +/-3.0 0.9 50 5.0㱘 CMOS VCSP50L1
BU52051NVX 1.65㨪3.30 +/-3.0 0.9 50 5.0㱘 CMOS SSON004X1216
BU52011HFV 1.65㨪3.30 +/-3.0 0.9 50 5.0㱘 CMOS HVSOF5
BU52021HFV 2.40㨪3.60 +/-3.7 0.8 50 8.0㱘 CMOS HVSOF5

BU52025G 2.40㨪3.60 +/-3.7 0.8 50 8.0㱘 CMOS SSOP5

BD7411G 4.50㨪5.50 +/-3.4 0.4 - 2.0m CMOS SSOP5

㶎Plus is expressed on the S-pole; minus on the N-pole

voltage

(V)

Operate

point
(mT)

Hysteresis

(mT)

Period

(ms)

Supply
current

(AVG)

(A)

Output

type

Package

Jul. 2008

٨Absolute Maximum Ratings

BU52001GUL (Ta=25㷄) BU52015GUL (Ta=25㷄)

PARAMETERS SYMBOL LIMIT UNIT PARAMETERS SYMBOL LIMIT UNIT

1



Power Supply Voltage

Output Current

V

I

OUT

Power Dissipation Pd

Operating Temperature Range T

Storage Temperature Range T

DD

opr

stg

-0.1㨪+4.5

r1

2



420

-40㨪+85 

-40㨪+125 

㶎1. Not to exceed Pd
㶎2. Reduced by 4.20mW for each increase in Ta of 1㷄 over 25㷄

䋨mounted on 50mm㬍58mm Glass-epoxy PCB䋩

V

mA

mW

Power Supply Voltage

Output Current

Power Dissipation Pd

Operating Temperature Range T

Storage Temperature Range T

㶎3. Not to exceed Pd
㶎4. Reduced by 4.20mW for each increase in Ta of 1㷄 over 25㷄

䋨mounted on 50mm㬍58mm Glass-epoxy PCB䋩

BU52051NVX (Ta=25㷄) BU52011HFV (Ta=25㷄)

PARAMETERS SYMBOL LIMIT UNIT PARAMETERS SYMBOL LIMIT UNIT

5



Power Supply Voltage

Output Current

V

I

OUT

Power Dissipation Pd

Operating Temperature Range T

Storage Temperature Range T

DD

-0.1㨪+4.5

r0.5

6



2049

opr

stg

-40㨪+85 

-40㨪+125 

V

mA

mW

Power Supply Voltage

Output Current

Power Dissipation Pd

Operating Temperature Range T

Storage Temperature Range T

㶎5. Not to exceed Pd
㶎6. Reduced by 20.49mW for each increase in Ta of 1㷄 over 25㷄

䋨mounted on 70mm㬍70 mm㬍1.6mm Glass-epoxy PCB䋩

㶎7. Not to exceed Pd
㶎8. Reduced by 5.36mW for each increase in Ta of 1㷄 over 25㷄

䋨mounted on 70mm㬍70 mm㬍1.6mm Glass-epoxy PCB䋩

BU52021NVX (Ta=25㷄) BU52025G (Ta=25㷄)

PARAMETERS SYMBOL LIMIT UNIT PARAMETERS SYMBOL LIMIT UNIT

9



Power Supply Voltage

V

DD

-0.1㨪+4.5

V

Power Supply Voltage

V

I

V

I

V

OUT

OUT

3



DD

-0.1㨪+4.5

r0.5

4



420

opr

stg

DD

-40㨪+85 

-40㨪+125 

-0.1㨪+4.5

r0.5

8



536

opr

stg

-40㨪+85 

-40㨪+125 

-0.1㨪+4.5

DD

11

V

mA

mW

7



V

mA

mW



V

I

Output Current

OUT

Power Dissipation Pd

Operating Temperature Range T

Storage Temperature Range T

opr

stg

r1

10



536

-40㨪+85 

-40㨪+125 

㶎9. Not to exceed Pd
㶎10. Reduced by5.36mW for each increase in Ta of 1㷄 over 25㷄

䋨mounted on 70mm㬍70 mm㬍1.6mm Glass-epoxy PCB䋩

mA

mW

Output Current

Power Dissipation Pd

Operating Temperature Range T

Storage Temperature Range T

㶎11. Not to exceed Pd
㶎12. Reduced by 5.40mW for each increase in Ta of 1㷄 over 25㷄

䋨mounted on 70mm㬍70 mm㬍1.6mm Glass-epoxy PCB䋩

BD7411G (Ta=25㷄)

PARAMETERS SYMBOL LIMIT UNIT

13

Power Supply Voltage

Output Current

V

I

OUT

Power Dissipation Pd

Operating Temperature Range T

Storage Temperature Range T

DD

opr

stg

-0.3㨪+7.0

-55㨪+150 



r1

14



540

-40㨪+85 

㶎13. Not to exceed Pd
㶎14. Reduced by 5.40mW for each increase in Ta of 1㷄 over 25㷄

䋨mounted on 70mm㬍70 mm

㬍1.6mm Glass-epoxy PCB䋩

V

mA

mW

I

OUT

r1

12



540

opr

stg

-40㨪+85 

-40㨪+125 

mA

mW

2/20

٨Magnetic, Electrical Characteristics

BU52001GUL (Unless otherwise specified, V

PARAMETERS SYMBOL

Power Supply Voltage

Operate Point

Release Point

Hysteresis

2.4 3.0 3.3 V

V

DD

B

- 3.7 5.5

opS

B

opN

0.8 2.9 -

B

rpS

B

rpN

B

hysS

B

hysN

䋽3.0V, Ta䋽25㷄) 㩷㩷㩷㩷 㩷㩷㩷㩷㩷

DD

LIMIT

MIN TYP MAX

-5.5 -3.7 -

- -2.9 -0.8

- 0.8 -

- 0.8 -

UNIT CONDITIONS

mT

mT

mT

Period Tp - 50 100 ms

V

Output High Vol䌴age V

OH

DD

-0.4

- - V

Output Low Voltage VOL - - 0.4 V

Supply Current I
Supply Current
During Startup Time
Supply Current
During Standby Time

- 8 12 ǴA Average

DD(AVG)

I

- 4.7 - mA During Startup Time Value

DD(EN)

- 3.8 - 㱘A During Standby Time Value

I

DD(DIS)

B

<B<B

rpN

=-1.0mA

I

OUT

B<B

opN,BopS

=+1.0mA

I

OUT

15

rpS

<B  15

㶎15 B = Magnetic flux density 㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷

1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to
the branded face of the sensor.

After applying power supply, it takes one cycle of period (T

) to become definite output.

P

Radiation hardiness is not designed.

3/20

BU52015GUL (Unless otherwise specified,

PARAMETERS SYMBOL

㪭㪛㪛䋽㪈㪅㪏㪇㪭㪃㩷㪫㪸䋽㪉㪌㷄㪀

LIMIT

MIN TYP MAX

UNIT CONDITIONS

Power Supply Voltage VDD 1.65 1.80 3.30 V

B

- 3.0 5.0

Operate Point

Release Point

opS

mT

B

-5.0 -3.0 -

opN

B

0.6 2.1 -

rpS

mT

B

- -2.1 -0.6

rpN

Hysteresis

B

hysS

B

hysN

- 0.9 ­mT

- 0.9 -

Period Tp - 50 100 ms

OUT1: B
OUT2: B<B
I

Output High Vol䌴age V

OH

V

DD

-0.2

- - V

OUT1: B<B

Output Low Voltage VOL - - 0.2 V

OUT2: B
I

Supply Current 1 I

Supply Current
During Startup Time 1
Supply Current
During Standby Time 1

Supply Current 2 I

Supply Current
During Startup Time 2
Supply Current
During Standby Time 2

DD1(AVG)

I

DD1(EN)

I

DD1(DIS)

DD2(AVG)

I

DD2(EN)

I

DD2(DIS)

- 5 8 㱘A VDD=1.8V, Average

- 2.8 - mA

- 1.8 - 㱘A

VDD=1.8V,
During Startup Time Value
VDD=1.8V,
During Standby Time Value

- 8 12 㱘A VDD=2.7V, Average

- 4.5 - mA

- 4.0 - 㱘A

VDD=2.7V,
During Startup Time Value
V
During Standby Time Value

OUT

OUT

DD

=2.7V,

<B<B

rpN

opN

= -0.5mA

opN

<B<B

rpN

= +0.5mA

, B

, B

rpS

opS

opS

rpS



㶎16 B = Magnetic flux density 㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷

1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to
the branded face of the sensor.
After applying power supply, it takes one cycle of period (T

) to become definite output.

P

Radiation hardiness is not designed.

16

㩷㩷㩷 㩷

<B

<B 16

4/20

BU52051NVX , BU52011HFV (Unless otherwise specified, V

LIMIT

PARAMETERS SYMBOL

MIN TYP MAX

䋽1.80V, Ta䋽25㷄)㩷㩷

DD

UNIT CONDITIONS

Power Supply Voltage VDD 1.65 1.80 3.30 V

Operate Point

Release Point

Hysteresis

opS

B

-5.0 -3.0 -

opN

B

0.6 2.1 -

rpS

B

- -2.1 -0.6

rpN

- 0.9 -

B

hysS

B

- 0.9 -

hysN

mT

mT

mT

- 3.0 5.0

B

Period Tp - 50 100 ms

Output High Vol䌴age V

OH

DD

-0.2

- - V

V

Output Low Voltage VOL - - 0.2 V

Supply Current 1 I

Supply Current
During Startup Time 1
Supply Current
During Standby Time 1

Supply Current 2 I

Supply Current
During Startup Time 2
Supply Current
During Standby Time 2

DD1(AVG)

I

DD1(EN)

I

DD1(DIS)

DD2(AVG)

I

DD2(EN)

I

DD2(DIS)

- 5 8 㱘A VDD=1.8V, Average

-

-

-

-

2.8

1.8

-

8

4.5

4.0

- mA

- 㱘A

12 㱘A VDD=2.7V, Average

- mA

- 㱘A

B

<B<B

rpN

=-0.5mA

I

OUT

B<B

opN

=+0.5mA

I

OUT

V

=1.8V,

DD

 17

rpS

, B

<B17

opS

During Startup Time Value
VDD=1.8V,
During Standby Time Value

VDD=2.7V,
During Startup Time Value
V

=2.7V,

DD

During Standby Time Value

BU52021HFV,BU52025G (Unless otherwise specified, VDD䋽3.0V, Ta䋽25㷄) 㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷

PARAMETERS SYMBOL

MIN TYP MAX

LIMIT

UNIT CONDITIONS

Power Supply Voltage VDD 2.4 3.0 3.6 V

B

- 3.7 5.5

Operate Point

Release Point

Hysteresis

opS

B

-5.5 -3.7 -

opN

B

0.8 2.9 -

rpS

B

- -2.9 -0.8

rpN

B

hysS

B

hysN

- 0.8 -

- 0.8 -

mT

mT

mT

Period Tp - 50 100 ms

Output High Vol䌴age V

OH

DD

-0.4

- - V

V

Output Low Voltage VOL - - 0.4 V

I

Supply Current

Supply Current
During Startup Time
Supply Current
During Standby Time

DD(AVG)

I

-

DD(EN)

I

-

DD(DIS)

-

8

4.7

3.8

12 ǴA Average

- mA During Startup Time Value

- 㱘A During Standby Time Value

B

<B<B

rpN

=-1.0mA

I

OUT

B<B

opN

=+1.0mA

I

OUT

 17

rpS

, B

<B 17

opS



㶎17 B = Magnetic flux density 㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷

1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to
the branded face of the sensor.
After applying power supply, it takes one cycle of period (T

) to become definite output.

P

Radiation hardiness is not designed.

5/20

BD7411G (Unless otherwise specified, V

PARAMETERS SYMBOL

䋽5.0V, Ta䋽25㷄)

DD

LIMIT

MIN TYP MAX

UNIT CONDITIONS

Power Supply Voltage V

Operate Point

Release Point

B

Hysteresis

B

Output High Vol䌴age V

Output Low Voltage V

Supply Current I

B

B

B

B

DD

opS

opN

rpS

rpN

hysS

hysN

OH

OL

DD

4.5 5.0 5.5

- 3.4 5.6

-5.6 -3.4 -

1.5 3.0 -

- -3.0 -1.5

- 0.4 -

- 0.4 -

4.6

- -

- - 0.4

- 2 4

V

mT

mT

mT

B

V

V

rpN

I

OUT

B<B
I

OUT

mA

<B<B

rpS

=-1.0mA

, B

opN

opS

=+1.0mA

18

<B 18

㶎18 B = Magnetic flux density 㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷㩷

1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to
the branded face of the sensor.
Radiation hardiness is not designed.

6/20

٨Figure of measurement circuit



Bop/B

rp

T

p

200ǡ

VDD

VDD

100ǴF

OUT

GND

Bop and Brp are measured with applying the magnetic field

from the outside.

Fig.1 Bop,Brp measurement circuit

V

OH

VDD

VDD

Fig.3 V

100ǴF

measurement circuit

OH

OUT

GND

VDD

Oscilloscope

OUT

GND

V

The period is monitored by Oscilloscope.

VDD

Fig.2 T

measurement circuit

p

Product Name I

OUT

BU52001GUL, BU52021HFV, BU52025G, BD7411G 1.0mA

BU52015GUL, BU52051NVX, BU52011HFV 0.5mA

I

V

OUT

V

OL

VDD

I

DD

VDD

Fig.4 V

A

100ǴF

measurement circuit

OL

C

VDD

GND

VDD

GND

OUT

OUT

Product Name I

OUT

BU52001GUL, BU52021HFV, BU52025G, BD7411G 1.0mA

BU52015GUL, BU52051NVX, BU52011HFV 0.5mA

V

I

OUT

Product Name C

BU52001GUL,BU52015GUL,BU52051NVX,

2200㱘F

BU52011HFV, BU52021HFV, BU52025G

BD7411G

100㱘F

Fig.5 IDDmeasurement circuit

7/20

٨ Technical (Reference) Data

BU52001GUL (V

8.0

6.0

4.0

2.0

0.0

-2.0

-4.0

-6.0

MAGNETIC FLUX DENSITY [mT]

-8.0

-60 - 40 - 20 0 20 40 60 80 100

=2.4V㨪3.3V type)

DD

V

=3.0V㩷

DD

AMBI ENT TEMPER ATURE [㷄]

Bop S

Brp S

Brp N

Bop N

Fig.6 Bop,Brp–

Ambient temperature

8.0

6.0

Ta = 25°C

4.0

2.0

0.0

-2.0

-4.0

-6.0

MAGNETIC FLUX DENSITY [mT]

-8.0

2.02.4 2.83.23.6

SUPPLY VOLT AGE 䌛V

Bop S

Brp S

Brp N

Bop N

䌝

Fig.7 Bop,Brp– Supply voltage

100

90

VDD=3.0V

80

70

60

50

40

PERIOD [ms]

30

20

10

0

-60 - 40 - 20 0 20 40 60 80 100

AMBIEN T TEMPERATUR E [㷄]

Fig.8 T

– Ambient

P

temperature

100

90

Ta = 25°C

80

70

60

50

40

PERIOD [ms]

30

20

10

0

2.0 2. 4 2.8 3. 2 3.6

SUPPLY VOLTAGE [V]

Fig.9 TP– Supply voltage

BU52015GUL, BU52051NVX, BU52011HFV (V

8.0

6.0

=1.8V

V

DD

4.0

2.0

0.0

-2.0

-4.0

-6.0

MAGNETIC FLUX DENSITY [mT]

-8.0

- 60 - 40 - 20 0 20 40 60 80 100

AMBIENT TEM PERAT UR E [㷄]

Bop S

Brp S

Brp N

Bop N

Fig.12 Bop,Brp–

Ambient temperature

14.0

12.0

VDD=3.0V

10.0

8.0

6.0

4.0

2.0

0.0

AVERAGE SUPPLY CURRENT [µA]

-60 -40 -20 0 20 40 60 80 100

AMBIEN T TEMPERATUR E [㷄]

Fig.10 I

– Ambient

DD

temperature

=1.65V㨪3.3V type)

DD

8.0

6.0

Ta = 25°C

4.0

2.0

0.0

-2.0

-4.0

-6.0

MAGNETIC FLUX DENSITY [mT]

-8.0

㪈㪅㪋 㪈㪅 㪏 㪉㪅 㪉 㪉㪅㪍 㪊㪅 㪇 㪊㪅 㪋 㪊㪅㪏

SUPPLY VOLT AGE 䌛V

Bop S

Brp S

Brp N

Bop N

䌝

Fig.13 Bop,Brp– Supply voltage

14.0

12.0

Ta = 25°C

10.0

8.0

6.0

4.0

2.0

AVERAGE SUPPLY CURRENT [µA]

0.0

2.0 2.4 2.8 3.2 3.6

SUPPLY VOLT AGE [V]

Fig.11 IDD – Supply voltage

100

90

VDD=1.8V

80

70

60

50

40

PERIOD [ms]

30

20

10

0

- 60 -40 - 20 0 20 40 60 80 100

AMBIENT TEM PERATU RE [㷄]

Fig.14 T

– Ambient

P

temperature

100

90

Ta = 25°C

80

70

60

50

40

PERIOD [ms]

30

20

10

0

1.4 1.8 2.2 2.6 3.0 3.4 3.8

SUPPLY VOLTAGE [V]

Fig.15 T

– Supply voltage

P

14.0

12.0

VDD=1.8V

10.0

8.0

6.0

4.0

2.0

0.0

AVERAGE SUPPLY CURRENT [µA]

-60 -40 -20 0 20 40 60 80 100

AMBI ENT TEMPER ATURE [㷄]

Fig.16 I

– Ambient

DD

temperature

8/20

14.0

12.0

Ta = 25°C

10.0

8.0

6.0

4.0

2.0

AVERAGE SUPPLY CURRENT [µA]

0.0

1.4 1.8 2.2 2.6 3.0 3.4 3.8

SUPPLY VOLT AGE [V]

Fig.17 I

– Supply voltage

DD

BU52021HFV, BU52025G (V

=2.4V㨪3.6V type)

DD

8.0

6.0

=3.0V

V

DD

4.0

2.0

0.0

-2.0

-4.0

-6.0

MAGNETIC FLUX DENSITY [mT]

-8.0

-60 - 40 -20 0 20 40 60 80 100

AMBIEN T TEMPER ATURE [㷄]

Bop S

Brp S

Brp N

Bop N

Fig.18 Bop,Brp–

Ambient temperature

100

90

Ta = 25°C

80

70

60

50

40

PERIOD [ms]

30

20

10

0

2.0 2. 4 2.8 3.2 3. 6 4.0

SUPPLY VOLTAGE [V]

Fig.21 T

– Supply voltage

P

8.0

6.0
Ta = 25°C

4.0

2.0

0.0

-2.0

-4.0

-6.0

MAGNETIC FLUX DENSITY [mT]

-8.0

2.0 2.4 2.8 3.2 3. 6 4.0

SUPPLY VOLTAGE 䌛V

Bop S

Brp S

Brp N

Bop N

䌝

Fig.19 Bop,Brp– Supply voltage

14.0

12.0

VDD=3.0V

10.0

8.0

6.0

4.0

2.0

0.0

AVERAGE SUPPLY CURRENT [µA]

-60 -40 -20 0 20 40 60 80 100

AMBIEN T TEMPER ATURE [㷄]

Fig.22 I

– Ambient

DD

temperature

100

90

80

VDD=3.0V

70

60

50

40

30

20

10

0

AVERAGE SUPPLY CURRENT [µA]

-60 - 40 - 20 0 20 40 60 80 100

AMBI ENT TEMPER ATURE [㷄]

Fig.20 T

– Ambient

P

temperature

14.0

12.0

Ta = 25°C

10.0

8.0

6.0

4.0

2.0

0.0

AVERAGE SUPPLY CURRENT [µA]

2.0 2.4 2.8 3.2 3.6 4.0

SUPPLY VOLATAGE [V]

Fig.23 I

– Supply voltage

DD

BD7411G (V

8.0

6.0

4.0

2.0

0.0

-2.0

-4.0

-6.0

MAGNETIC FLUX DENSITY [mT]

-8.0

=4.5V㨪5.5V type)

DD

V

=5.0V㩷

DD

- 60 - 40 - 20 0 20 40 60 80 100

AMBIEN T TEMPER ATURE [㷄]

Fig.24 Bop,Brp–

Ambient temperature

6.0

5.0

Ta = 25°C

4.0

3.0

2.0

1.0

0.0

AVERAGE SUPPLY CURRENT [mA]

4.0 4.5 5.0 5.5 6.0

SUPPLY VOLTAGE [V]

Fig.27 I

DD

Bop S

Brp S

Brp N

Bop N

– Supply voltage

8.0

6.0

Ta = 25°C

4.0

2.0

0.0

-2.0

-4.0

-6.0

MAGNETIC FLUX DENSITY [mT]

-8.0

4.04.5 5.05.56.0

SUPPLY VOLTAGE 䌛V

Bop S

Brp S

Brp N

Bop N

䌝

6.0

5.0

VDD=5.0V

4.0

3.0

2.0

1.0

0.0

AVERAGE SUPPLY CURRENT [mA]

-60 -40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE [㷄]

Fig.25 Bop,Brp– Supply voltage Fig.26 I

temperature

– Ambient

DD

9/20

٨Block Diagram





BU52001GUL

㨂DD

A1

HALL

ELEMENT

TIMING LOGIC

SAMPLE

OFFSET

DYNAMIC

CANCELLATION

& HOLD

Fig.28

PIN No. PIN NAME FUNCTION COMMENT

A1

A2

B1

B2

VDD

GND

OUT

N.C.

POWER SUPPLY 㩷

GROUND 㩷

OUTPUT 㩷

 OPEN or Short to GND.

LATCH

B1

A2

0.1ǴF

Adjust the bypass capacitor

value as necessary, according

to voltage noise conditions, etc.

The CMOS output terminals enable direct

OUT

connection to the PC, with no external pull-up

resistor required.

GND

A1

B1

Surface

A2

B2

A2㩷

B2

Reverse

A1

B1㩷

㩷

BU52015GUL

VDD

B2

HALL

ELEMENT

TIMING LOGIC

OFFSET

DYNAMIC

CANCELLATION

SAMPLE

& HOLD

LATCH

Fig.29

PIN No. PIN NAME FUNCTION COMMENT

A1 OUT1 Output pin (Active Low)

A2 OUT2 Output pin (Active High)

B1 GND GROUND

B2 VDD Power Supply Voltage

GND

VDD

0.1ǴF

Adjust the bypass capacitor

value as necessary, according

A1

OUT1

The CMOS output terminals enable direct

connection to the PC, with no external pull-up

resistor required.

A2

OUT2

B1

GND

A1

B1

Surface

to voltage noise conditions, etc.

A2

B2

A2㩷

B2 B1㩷

Reverse

A1

㩷

10/20

BU52051NVX





㨂DD

4

HALL

ELEMENT

TIMING LOGIC

OFFSET

DYNAMIC

CANCELLATION

SAMPLE

& HOLD

Fig.30

PIN No. PIN NAME FUNCTION COMMENT

1

2

3

4

OUT OUTPUT

GND GROUND

N.C. OPEN or Short to GND.

VDD POWER SUPPLY

LATCH

0.1ǴF

Adjust the bypass capacitor

value as necessary, according

to voltage noise conditions, etc.

The CMOS output terminals enable direct

connection to the PC, with no external pull-up

OUT

1

resistor required.

2

GND

4 3

3 4

1 2

Surface

Reverse

2 1

BU52011HFV,BU52021HFV

㨂DD

4

HALL

ELEMENT

TIMING LOGIC

OFFSET

DYNAMIC

CANCELLATION

SAMPLE

& HOLD

Fig.31

PIN No. PIN NAME FUNCTION COMMENT

1

2

3

N.C. OPEN or Short to GND.

GND GROUND

N.C. OPEN or Short to GND.

LATCH

0.1ǴF

Adjust the bypass capacitor

value as necessary, according

to voltage noise conditions, etc.

The CMOS output terminals enable direct

connection to the PC, with no external pull-up

OUT

5

2

resistor required.

GND

5

4

4

5

4

5

VDD POWER SUPPLY

OUT OUTPUT

1

Surface

2

3

3

2

Reverse

1

11/ 20

BU52025G





㨂DD

4

HALL

ELEMENT

TIMING LOGIC

OFFSET

DYNAMIC

CANCELLATION

SAMPLE

& HOLD

Fig.32

PIN No. PIN NAME FUNCTION COMMENT

1

2

3

4

5

N.C. OPEN or Short to GND.

GND GROUND

N.C. OPEN or Short to GND.

VDD POWER SUPPLY

OUT OUTPUT

LATCH

0.1ǴF

Adjust the bypass capacitor

value as necessary, according

to voltage noise conditions, etc.

The CMOS output terminals enable direct

connection to the PC, with no external pull-up

OUT

5

2

resistor required.

GND

5

1

2

Surface

4

3

4

3

5

2

1

Reverse

BD7411G

㨂DD

5

REG

HALL

ELEMENT

TIMING LOGIC

OFFSET

DYNAMIC

CANCELLATION

SAMPLE

& HOLD

Fig.33

PIN No. PIN NAME FUNCTION COMMENT

1

2

3

N.C. OPEN or Short to GND.

GND GROUND

N.C. OPEN or Short to GND.

LATCH

0.1ǴF

Adjust the bypass capacitor

value as necessary, according

to voltage noise conditions, etc.

The CMOS output terminals enable direct

connection to the PC, with no external pull-up

resistor required.

OUT

4

2

GND

5

4

4

5

4

5

OUT OUTPUT

VDD POWER SUPPLY

1

Surface

2

3

3

2

1

Reverse

12/20

٨Description of Operations

(Micropower Operation)

I

DD

Period

Startup time

Standby

Fig.34

(Offset Cancelation)

V

DD

I

B

㬍

GND

Fig.35

䋫

Hall Voltage

䋭

The bipolar detection Hall IC adopts an intermittent
operation method to save energy. At startup, the Hall
elements, amp, comparator and other detection circuits
power ON and magnetic detection begins. During standby,
the detection circuits power OFF, thereby reducing current
consumption. The detection results are held while standby
is active, and then output.



t

Reference period: 50ms (MAX100ms)
Reference startup time: 48Ǵs

BD7411G don’t adopts an intermittent operation method.

The Hall elements form an equivalent Wheatstone (resistor)
bridge circuit. Offset voltage may be generated by a
differential in this bridge resistance, or can arise from
changes in resistance due to package or bonding stress. A
dynamic offset cancellation circuit is employed to cancel this
offset voltage.
When Hall elements are connected as shown in Fig. 35 and a
magnetic field is applied perpendicular to the Hall elements,
voltage is generated at the mid-point terminal of the bridge.
This is known as Hall voltage.
Dynamic cancellation switches the wiring (shown in the
figure) to redirect the current flow to a 90˚ angle from its
original path, and thereby cancels the Hall voltage.
The magnetic signal (only) is maintained in the sample/hold
circuit during the offset cancellation process and then
released.

13/20

(Magnetic Field Detection Mechanism)

S
N

S

Flux

Fig.36

S

S

N

N

Flux

The Hall IC cannot detect magnetic fields that run horizontal to the package top layer.
Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer.

Low

The bipolar detection
relationship between magnetic flux density and the distance separating the magnet and the Hall IC: when distance increases
magnetic density falls. When it drops below the operate point (Bop), output goes HIGH. When the magnet gets closer to the IC
and magnetic density rises, to the operate point, the output switches LOW. In LOW output mode, the distance from the magnet to
the IC increases again until the magnetic density falls to a point just below Bop, and output returns HIGH. (This point, where
magnetic flux density restores HIGH output, is known as the release point, Brp.) This detection and adjustment mechanism is
designed to prevent noise, oscillation and other erratic system operation.

High

Bop N Brp N

Hall IC detects magnetic fields running perpendicular to the top surface of the package. There is an inverse

S

S
N

Flux

N-Pole

OUT [V]

High

0

Magnetic flux density [mT]

Fig.37

N

N

S

Flux

Brp S

High

Bop S

S-Pole

Low

B

14/20

٨Intermittent Operation at Power ON

Power ON

VDD

Startup time

Supply current

(Intermittent action)

Standby time

Startup time

Standby time

OUT

Indefinite

(No magnetic
field present)

Indefinite

(Magnetic
field present)

High

Low

Fig.38

The bipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during startup, as
shown in Fig. 38. It outputs to the appropriate terminal based on the detection result and maintains the output condition
during the standby period. The time from power ON until the end of the initial startup period is an indefinite interval, but it
cannot exceed the maximum period, 100ms. To accommodate the system design, the Hall IC output read should be
programmed within 100ms of power ON, but after the time allowed for the period ambient temperature and supply voltage.

BD7411G don’t adopts an intermittent operation method.

٨Magnet Selection

Of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume
than ferrite, thereby enabling the highest degree of miniaturization, Thus, neodymium is best suited for small equipment
applications. Fig. 39 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density. The
graph plots the correlation between the distance (L) from three versions of a 4mm X 4mm cross-section neodymium magnet
(1mm, 2mm, and 3mm thick) and magnetic flux density. Fig. 40 shows Hall IC detection distance – a good guide for
determining the proper size and detection distance of the magnet. Based on the BU52011HFV, BU52015GUL operating
point max 5.0 mT, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 7.6mm, 9.22mm, and

10.4mm, respectively. To increase the magnet’s detection distance, either increase its thickness or sectional area.

10

9

8

7

t=1mm

t=3mm

t=2mm

6

5

4

3

㪤㪸㪾㫅㪼㫋㫀㪺㩷㪽㫃㫌㫏㩷㪻㪼㫅㫊㫀㫋㫐㪲㫄㪫㪴

2

1

0

7.6mm

9.2mm

10.4mm

02468101214161820

㪛㫀㫊㫋㪸㫅㪺㪼㩷㪹㪼㫋㫎㪼㪼㫅㩷㫄㪸㪾㫅㪼㫋㩷㪸㫅㪻㩷㪟㪸㫃㫃㩷㪠㪚㩷㩷㪲㫄㫄㪴

Magnet material: NEOMAX-44H (material)

Y

X

t

X=Y=4mm
t=1mm,2mm,3mm

Magnet size

Fig.39

Magnet

t

L: Variable

Flux density measuring point

Maker: NEOMAX CO.,LTD.

Fig.40 Magnet Dimensions and

Flux Density Measuring Point

15/20

٨Position of the Hall Effect IC(Reference)

(

)

(

)

VCSP50L1

0.55

0.55

0.35

٨Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition)

VCSP50L1

SSON004X1216

0.6

0.8

0.2

SSON004X1216

HVSOF5

0.6

0.2

HVSOF5

SSOP5

0.8

1.45

0.6

UNIT㧦mm

SSOP5

٨Terminal Equivalent Circuit Diagram

OUT , OUT1, OUT2

VDD

UNIT㧦mm

Because they are configured for CMOS (inverter) output, the
output pins require no external resistance and allow direct
connection to the PC. This, in turn, enables reduction of the
current that would otherwise flow to the external resistor
during magnetic field detection, and supports overall low
current (micropower) operation.

GND

Fig.41

16/20

䃂Operation Notes
1䋩 Absolute maximum ratings

Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or
destruction of the IC. Because the source (short mode or open mode) cannot be identified if the device is damaged in this
way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in
excess of absolute rating limits.

2) GND voltage
Make sure that the GND terminal potential is maintained at the minimum in any operating state, and is always kept lower
than the potential of all other pins.

3) Thermal design
Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

4) Pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning or
orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted
together, or if shorts occur between the output pin and supply pin or GND.

5) Positioning components in proximity to the Hall IC and magnet
Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore the
magnetic detection operation. Thus, placing magnetic components near the Hall IC and magnet should be avoided in the
design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and
evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design.



6) Slide-by position sensing
Fig.42 depicts the slide-by configuration employed for position sensing. Note that when the gap (d) between the magnet and
the Hall IC is narrowed, the reverse magnetic field generated by the magnet can cause the IC to malfunction. As seen in
Fig.43, the magnetic field runs in opposite directions at Point A and Point B. Since the bipolar detection Hall IC can detect
the S-pole at Point A and the N-pole at Point B, it can wind up switching output ON as the magnet slides by in the process of
position detection. Fig. 44 plots magnetic flux density during the magnet slide-by. Although a reverse magnetic field was
generated in the process, the magnetic flux density decreased compared with the center of the magnet. This demonstrates
that slightly widening the gap (d) between the magnet and Hall IC reduces the reverse magnetic field and prevents
malfunctions.






Magnet

Slide

d





L

Hall IC



Fig.42

7) Operation in strong electromagnetic fields

Flux

A

S

N

Fig.43

B

Flux

10

8
6
4
2
0

-2

-4

-6

-8

-10

Magnetic fux density[mT]

012345678910

Horizontal distance f rom the magnet [mm]

Reverse

Fig.44

Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause
the IC to malfunction.

8) Common impedance
Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example,
employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or
capacitor.

9) GND wiring pattern
When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set
PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes
due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same way,
care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components.

17/20

10) Exposure to strong light

p

Exposure to halogen lamps, UV and other strong light sources may cause the IC to malfunction. If the IC is subject to such
exposure, provide a shield or take other measures to protect it from the light. In testing, exposure to white LED and
fluorescent light sources was shown to have no significant effect on the IC.

11) Power source design
Since the IC performs intermittent operation, it has peak current when it’s ON. Please taking that into account and under
examine adequate evaluations when designing the power source.

㩷

٨Product Designations (Selecting a model name when ordering)

B

U

502

0

1

GU L

E2

ROHM model

VCSP50L1

<Dimensions>

1PIN MARK

4-φ0.25±0.05

0.05

A

0.30±0.1 0.50

SSON004X1216

<Dimensions>

Part number

1.10±0.1

S

0.08

B

A

B

A

12

1.10±0.10.10±0.05

0.55MAX

0.30±0.10.50

B

(Unit: mm)

Package type

VSCP50L1
SSON004X1216
HVSOF5
SSOP5

< Tape/Reel Info >

S

< Tape/Reel Info >

Tape

Quantity

Direction
of feed

Tape

Quantity

Direction
of feed

TR, E2 = Reel-wound embossed taping

: GUL
: NVX
: HFV
: G

VSCP50L1
SSON004X1216
HVSOF5
SSOP5

Embossed carrier tape

3000pcs

E2

(Correct direction: With reel in the left hand, the 1pin of the product should be
at the upper left. Pull tape out with the right hand)

1234 1234 1234 1234 1234

Reel

1pin

㶎Orders are available in complete units only.

Embossed carrier tape

cs

5000

TR
(Correct direction: With reel in the left hand, the 1pin of the product
should be at the upper left. Pull tape out with the right hand)

: E2
: TR
: TR
: TR

1234

Direction of feed

Feed direction

(Unit:mm)

Reel

1pin

㶎Orders are available in complete units only.

18/20

SSOP5

p

p

<Dimensions>

HVSOF5

<Dimensions>

1.0±0.05

2.8±0.2

1.25Max.

1.1±0.05

2.9±0.2

5

+0.2

−0.1

1.6

12

0.95

0.05±0.05

1.6±0.05

(0.05)

5

4

0.05

±

123

1.6

0.05

±

1.2

(MAX 1.28 include BURR)

4

3

0.42

0.3

(0.91)

0.1

0.8

45

321

(0.41)

+0.05

−0.04

< Tape/Reel Info >

Tape

°

+

6

°

4

°

−

4

Quantity

Direction
of feed

0.2Min.

+0.05

0.13

−0.03

(Unit:mm)

Embossed carrier tape

cs

3000

TR
(Correct direction: With reel in the left hand, the 1pin of the product
should be at the upper left. Pull tape out with the right hand)

XXX
XXX

XXX
XXX

1pin

XXX
XXX

XX X
XX X

X X X
XX X

Feed direction

Reel

㶎Orders are available in complete units only.

< Tape/Reel Info >

0.2Max.

0.13±0.05

Tape

Quantity

Direction
of feed

Embossed carrier tape

3000

cs

TR
(Correct direction: With reel in the left hand, the 1pin of the product
should be at the upper left. Pull tape out with the right hand)

XXX
XXX

XXX
XXX

XXX
XXX

XX X
XX X

X X X
XX X

0.6Max.

0.5

0.22

±0.05

(Unit: mm)

Reel

1pin

㶎Orders are available in complete units only.

Feed direction

19/20

20/20

Catalog No.08T155A '08.7 ROHM ©