ROHM BU52004GUL, BU52014HFV Technical data

Hall IC Series

Omnipolar Detection Hall ICs (Polarity detection for both S and N features dual outputs)

BU52004GUL, BU52014HFV

●Description

The BU52004GUL and BU52014HFV are bipolar Hall ICs incorporating a polarity determination circuit that enables operation (output) on both the S- and N-poles, with the polarity judgment based on the output processing configuration. These Hall IC products can be in with movie, mobile phone and other applications involving crystal panels to detect the (front-back) location or determine the rotational direction of the panel.

●Features

1) Omnipolar detection (polarity detection for both S and N features dual outputs)

2) Micropower operation (small current using intermittent operation method)

3) Ultra-compact CSP4 package(BU52004GUL)

4) Small outline package (BU52014HFV)

5) Line up of supply voltage For 1.8V Power supply voltage (BU52014HFV) For 3.0V Power supply voltage (BU52004GUL)

6) Polarity judgment and output on both poles (OUT1: S-pole output; OUT2: N-pole output)

7) High ESD resistance 8kV(HBM)

●Applications

Mobile phones, notebook computers, digital video camera, digital still camera, etc.

●Product Lineup

Supply

Product name

BU52004GUL 2.40～3.30 +/-3.7 ※ 0.8 50 8.0 CMOS VCSP50L1 BU52014HFV 1.65～3.30 +/-3.0

※Plus is expressed on the S-pole; minus on the N-pole

●Absolute Maximum Ratings

BU52004GUL (Ta=25℃)

Power Supply Voltage VDD -0.1 ~ +4.5 Output Current IOUT ±1 mA Power Dissipation Pd 420 Operating Temperature Range Topr -40 ~ +85 ℃ Storage Temperature Range Tstg -40 ~ +125 ℃

※1. Not to exceed Pd ※2. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃

(mounted on 50mm×58mm Glass-epoxy PCB)

BU52014 HFV (Ta=25℃)

Power Supply Voltage VDD -0.1 ~ +4.5 Output Current IOUT ±0.5 mA Power Dissipation Pd 536 Operating Temperature Range Topr -40 ~ +85 ℃ Storage Temperature Range Tstg -40 ~ +125 ℃

※3. Not to exceed Pd ※4. Reduced by 5.36mW for each increase in Ta of 1℃ over 25℃

(mounted on 70mm×70mm×1.6mm Glass-epoxy PCB)

voltage

(V)

PARAMETERS SYMBOL LIMIT UNIT

Operate point

(mT)

※

0.9 50 5.0 CMOS HVSOF5

Hysteresis

(mT)

Period

(ms)

Supply current

(AVG. )

(μA)

※

Output type Package

1

※

V

2

mW

3

※

V

4

mW

No.10045EDT01

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2010.01 - Rev.D

BU52004GUL, BU52014HFV

6

●Magnetic, Electrical Characteristics BU52004GUL (Unless otherwise specified, VDD＝3.0V, Ta＝25℃)

PARAMETERS SYMBOL

LIMIT

MIN TYP MAX

UNIT CONDITIONS

Power Supply Voltage VDD 2.4 3.0 3.3 V

- 3.7 5.5

B

opS

Operate Point

Release Point

Hysteresis

B

-5.5 -3.7 -

opN

0.8 2.9 -

B

rpS

B

- -2.9 -0.8

rpN

B

- 0.8 -

hysS

B

- 0.8 -

hysN

mT

Period Tp - 50 100 ms

Output High Voltage VOH

DD

-0.4

- - V

V

Output Low Voltage VOL - - 0.4 V

Supply Current I Supply Current During Startup Time I Supply Current During Standby Time I

※5. B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (T Radiation hardiness is not designed.

- 8 12 μA Average

DD(AVG)

- 4.7 - mA During Startup Time Value

DD(EN)

- 3.8 - μA During Standby Time Value

DD(DIS)

) to become definite output.

P

BU52014HFV (Unless otherwise specified, V

PARAMETERS SYMBOL

DD＝1.80V, Ta＝25℃)

LIMIT

MIN TYP MAX

UNIT CONDITIONS

Power Supply Voltage VDD 1.65 1.80 3.30 V

- 3.0 5.0

B

opS

Operate Point

Release Point

Hysteresis

B

-5.0 -3.0 -

opN

B

0.6 2.1 -

rpS

B

- -2.1 -0.6

rpN

B

- 0.9 -

hysS

B

- 0.9 -

hysN

mT

Period Tp - 50 100 ms

Output High Voltage VOH

DD

-0.2

- - V

V

Output Low Voltage VOL - - 0.2 V

Supply Current 1 I

Supply Current During Startup Time 1 I

Supply Current During Standby Time 1 I

Supply Current 2 I

Supply Current During Startup Time 2 I

Supply Current During Standby Time 2 I

※6. B = Magnetic flux density

1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (T Radiation hardiness is not designed.

DD1(AVG)

DD1(EN)

DD1(DIS)

DD2(AVG)

DD2(EN)

DD2(DIS)

) to become definite output.

P

- 5 8 μA VDD=1.8V, Average

- 2.8 - mA

- 1.8 - μA

- 8 12 μA VDD=2.7V, Average

- 4.5 - mA

- 4.0 - μA

Technical Note

OUTPUT：OUT1 (respond the south pole) OUTPUT：OUT2 (respond the north pole) OUTPUT：OUT1 (respond the south pole) OUTPUT：OUT2 (respond the north pole)

5

B

<B<B

rpN

I

=-1.0mA

OUT

B<B

opN

I

=+1.0mA

OUT

, B

rpS

<B

opS

OUTPUT：OUT1 (respond the south pole) OUTPUT：OUT2 (respond the north pole) OUTPUT：OUT1 (respond the south pole) OUTPUT：OUT2 (respond the north pole)

<B<B

B

rpN

I

=-0.5mA

OUT

B<B

opN

I

=+0.5mA

OUT

=1.8V,

V

DD

rpS

, B

<B

opS

During Startup Time Value V

=1.8V,

DD

During Standby Time Value

=2.7V,

V

DD

During Startup Time Value

=2.7V,

V

DD

During Standby Time Value

※

5

※

6

※

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2/11

2010.01 - Rev.D

BU52004GUL, BU52014HFV

●Figure of measurement circuit

Bop/Brp

Tp

Technical Note

200Ω

VDD

100μF

VDD

GND

OUT

VDD

Oscilloscope

V

Bop and Brp are measured with applying the magnetic field from the outside.

Fig.1 B

measurement circuit

op,Brp

VOH

VDD

100μF

VDD

GND

OUT

I

V

OUT

Fig.3 V

measurement circuit

OH

VOL

VDD

100μF

VDD

GND

OUT

V

I

OUT

Fig.4 V

measurement circuit

OL

The period is monitored by Oscilloscope.

Fig.2 Tp measurement circuit

Product Name I

BU52004GUL 1.0mA

BU52014HFV 0.5mA

Product Name I

BU52004GUL 1.0mA

BU52014HFV 0.5mA

VDD

GND

OUT

IDD

A

VDD

Fig.5 I

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2200μF

measurement circuit

DD

VDD

GND

OUT

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2010.01 - Rev.D

BU52004GUL, BU52014HFV

●Technical (Reference) Data BU52004GUL (VDD=2.4V～3.3V type)

8.0

6.0 V

=3.0V

DD

4.0

2.0

0.0

-2.0

-4.0

-6.0

MAGNETIC FLUX DENSITY [mT]

-8.0

-60 - 40 -20 0 20 40 60 80 100

AMBIEN T TEMPER ATU RE [℃]

Fig.6 Bop,Brp –

Ambient temperature

100

90

Ta = 25°C

80

70

60

50

40

PERIOD [ms]

30

20

10

0

2.0 2.4 2. 8 3.2 3.6

SUPPLLY VOLTAGE[V]

Fig.9 TP – Supply voltage

Bop S

Brp S

Brp N

Bop N

BU52014HFV (V

8.0

6.0

MAGNETIC FLUX DENSITY [mT]

VDD=1.8V

4.0

2.0

0.0

-2.0

-4.0

-6.0

-8.0

-60 - 40 -20 0 20 40 60 80 100

AMBIEN T TEMPER ATU RE [℃]

DD=1.65V～3.3V type)

Bop S

Brp S

Brp N

Bop N

8.0

6.0

Ta = 25°C

4.0

2.0

0.0

-2.0

-4.0

-6.0

MAGNETIC FLUX DENSITY [mT]

-8.0

2.02.42.83.23.6

SUPPLY VOLTAGE ［V

Fig.7 Bop,Brp –

Supply voltage

20.0

18.0

VDD=3.0V

16.0

14.0

12.0

10.0

8.0

6.0

4.0

2.0

0.0

AVERAGE SUPPLY CURRENT [µA]

-60 - 40 - 20 0 20 40 60 80 100

AMBIEN T TEMPER ATURE [℃]

Fig.10 IDD – Ambient

temperature

8.0

6.0

Ta = 25°C

4.0

2.0

0.0

-2.0

-4.0

-6.0

MAGNETIC FLUX DENSITY [mT]

-8.0

1.4 1.8 2.2 2.6 3.0 3. 4

SUPPLY VOLTAGE ［V

Bop S

Brp S

Brp N

Bop N

Brp N

Bop N

］

Bop S

Brp S

］

Technical Note

100

95

VDD=3.0V

90 85 80 75 70 65 60

PERIOD [ms]

55 50 45 40

-60 - 40 - 20 0 20 40 60 80 100

AMBIEN T T EMPER ATU RE [℃]

Fig.8 TP– Ambient

temperature

20.0

18.0

Ta = 25°C

16.0

14.0

12.0

10.0

8.0

6.0

4.0

2.0

AVERAGE SUPPLY CURRENT [µA]

0.0

2.0 2. 4 2.8 3.2 3. 6

SUPPLY VOLTAGE [V]

Fig.11 IDD – Supply voltage

100

90

V

=1.8V

0

-60 - 40 -20 0 20 40 60 80 100 AMBIEN T TEMPER ATURE [℃]

PERIOD [ms]

80

70

60

50

40

30

20

10

Fig.12 Bop,Brp –

Ambient temperature

100

90

Ta = 25°C

80

70

60

50

40

PERIOD [ms]

30

20

10

0

1.4 1.8 2.2 2.6 3.0 3.4 3.8

SUPPLY VOLT AGE [V]

Fig.15 TP– Supply voltage

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Fig.13 Bop,Brp – Supply voltage

20.0

18.0

VDD=1.8V

16.0

14.0

12.0

10.0

8.0

6.0

4.0

2.0

0.0

AVERAGE SUPPLY CURRENT [µA]

-60 - 40 -20 0 20 40 60 80 100

AMBIEN T TEMPER ATURE [℃]

Fig.16 IDD – Ambient

temperature

4/11

Fig.14 TP– Ambient

temperature

20.0

18.0

Ta = 25°C

16.0

14.0

12.0

10.0

8.0

6.0

4.0

2.0

AVERAGE SUPPLY CURRENT [µ A]

0.0

1.4 1.8 2.2 2.6 3.0 3.4

SUPPLY VOLTAGE[V]

Fig.17 IDD – Supply voltage

2010.01 - Rev.D

BU52004GUL, BU52014HFV

●Block Diagram

BU52004GUL

VDD

A1

TIMING LOGIC

HALL

ELEMENT

LATCH

×

OFFSET

DYNAMIC

CANCELLATION

SAMPLE

& HOLD

LATCH

Fig.18

PIN No. PIN NAME FUNCTION COMMENT

A1 VDD POWER SUPPLY

A2 GND GROUND

B1 OUT1 OUTPUT( respond the south pole)

B2 OUT2 OUTPUT( respond the north pole)

BU52014HFV

VDD

4

TIMING LOGIC

HALL

ELEMENT

×

DYNAMIC

SAMPLE

OFFSET

CANCELLATION

& HOLD

LATCH

Fig.19

PIN No. PIN NAME FUNCTION COMMENT

1 OUT2

( respond the north pole)

OUTPUT

2 GND GROUND

3 N.C. OPEN or Short to GND.

4 VDD POWER SUPPLY

5 OUT1

( respond the south pole)

OUTPUT

GND

VDD

GND

VDD

B1

B2

A2

Technical Note

0.1µF

Adjust the bypass capacitor value

as necessary, according to

voltage noise conditions, etc.

A1

B1

Surface

0.1μF

5

1

Surface

A2

A1

A2

B2

B1

Reverse

4

3

4

3

Reverse

5

2

1

OUT1

The CMOS output terminals enable direct

connection to the PC, with no external pull-up

resistor required.

OUT2

GND

Adjust the bypass capacitor

OUT1

5

value as necessary, according to voltage noise conditions, etc.

The CMOS output terminals enable direct connection to the PC, with no external pull-up resistor required.

OUT2

1

2

GND

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5/11

2010.01 - Rev.D

BU52004GUL, BU52014HFV

● Description of Operations

Micropower Operation (Small current using intermittent action)

I

DD

(Offset Cancelation)

(Magnetic Field Detection Mechanism)

Period 50ms

Startup time

Standby

Fig.20

VDD

I

B

×

GND

Fig.21

S

S N

Flux direction

The Hall IC cannot detect magnetic fields that run horizontal to the package top layer. Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer.

＋

Hall Voltage

－

The dual output bipolar detection Hall IC adopts an intermittent operation method to save energy. At startup, the Hall elements, amp, comparator and other detection circuits power ON and magnetic detection begins. During standby, the detection circuits power OFF, thereby reducing current consumption. The detection results are held while standby is active, and then output.

t

Technical Note

Reference period: 50ms (MAX100ms) Reference startup time: 48μs

The Hall elements form an equivalent Wheatstone (resistor) bridge circuit. Offset voltage may be generated by a differential in this bridge resistance, or can arise from changes in resistance due to package or bonding stress. A dynamic offset cancellation circuit is employed to cancel this offset voltage. When Hall elements are connected as shown in Fig. 21 and a magnetic field is applied perpendicular to the Hall elements, voltage is generated at the mid-point terminal of the bridge. This is known as Hall voltage. Dynamic cancellation switches the wiring (shown in the figure) to redirect the current flow to a 90˚ angle from its original path, and thereby cancels the Hall voltage. The magnetic signal (only) is maintained in the sample/hold circuit during the offset cancellation process and then released.

Fig.22

S

N

Flux direction

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2010.01 - Rev.D

BU52004GUL, BU52014HFV

OUT1

High

The OUT1 pin detects and outputs for the S-pole only. Since it is unipolar, it does not recognize the N-pole.

OUT2

High

Low

The OUT2 pin detects and outputs for the N-pole only. Since it is unipolar, it does not recognize the S-pole. The dual output Omnipolar detection Hall IC detects magnetic fields running perpendicular to the top surface of the package. There is an inverse relationship between magnetic flux density and the distance separating the magnet and the Hall IC: when distance increases magnetic density falls. When it drops below the operate point (Bop), output goes HIGH. When the magnet gets closer to the IC and magnetic density rises, to the operate point, the output switches LOW. In LOW output mode, the distance from the magnet to the IC increases again until the magnetic density falls to a point just below Bop, and output returns HIGH. (This point, where magnetic flux density restores HIGH output, is known as the release point, Brp.) This detection and adjustment mechanism is designed to prevent noise, oscillation and other erratic system operation.

S

S N

Flux

N-Pole

S

S N

Flux

Bop N Brp N

N-Pole

OUT 1[V]

High

Magnetic flux density [mT]

Fig.23 S-Pole Detection

Magnetic density [mT]

Fig.24 N-Pole Detection

0

OUT 2[V]

High

0

N

N S

Flux

Brp S

N

S

Flux

Bop S

S-Pole

Technical Note

High

Low

B

High

B

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2010.01 - Rev.D

BU52004GUL, BU52014HFV

Technical Note

●Intermittent Operation at Power ON

Power ON

VDD

Supply current

(Intermittent action)

OUT

(No magnetic field present)

(Magnetic field present)

Startup time

Indefinite

Standby time

High

Low

Startup time

Standby time

Fig.25

The dual output Omnipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during startup, as shown in Fig. 25. It outputs to the appropriate terminal based on the detection result and maintains the output condition during the standby period. The time from power ON until the end of the initial startup period is an indefinite interval, but it cannot exceed the maximum period, 100ms. To accommodate the system design, the Hall IC output read should be programmed within 100ms of power ON, but after the time allowed for the period ambient temperature and supply voltage.

●Magnet Selection

Of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume than ferrite, thereby enabling the highest degree of miniaturization, Thus, neodymium is best suited for small equipment applications. Fig. 26 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density. The graph plots the correlation between the distance (L) from three versions of a 4mm X 4mm cross-section neodymium magnet (1mm, 2mm, and 3mm thick) and magnetic flux density. Fig. 27 shows Hall IC detection distance – a good guide for determining the proper size and detection distance of the magnet. Based on the BU52014HFV operating point max 5.0 mT, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 7.6mm, 9.22mm, and 10.4mm, respectively. To increase the magnet’s detection distance, either increase its thickness or sectional area.

Y

10

9

8

7

6

5

4

3

Magnetic flux density[mT]

2

1

0

02468101214161820

X

Magnet size

Fig.27 Magnet Dimensions and

Flux Density Measuring Point

t=1mm

Distance between magnet and Hall IC [mm]

t

X=Y=4mm t=1mm,2mm,3mm

t=3mm

t=2mm

7.6mm

9.2mm

10.4mm

Fig.26

Magnet

Magnet material: NEOMAX-44H (material) Maker: NEOMAX CO.,LTD.

t

L: Variable

…Flux density measuring point

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8/11

2010.01 - Rev.D

BU52004GUL, BU52014HFV

●Position of the Hall Effect IC(Reference)

0.2

HVSOF5

0.6

HVSOF5

(UNIT：mm)

●Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition)

●Terminal Equivalent Circuit Diagram

VCSP50L1

0.55

0.35

VCSP50L1

Strings Size(Typ)

OUT1, OUT2

Fig.28

e 0.50

b3 0.25 SD 0.25 SE 0.25

Because they are configured for CMOS (inverter) output, the output pins require no external resistance and allow direct

VDD

GND

connection to the PC. This, in turn, enables reduction of the current that would otherwise flow to the external resistor during magnetic field detection, and supports overall low current (micropower) operation.

Technical Note

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2010.01 - Rev.D

BU52004GUL, BU52014HFV

●Operation Notes

1) Absolute maximum ratings Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or destruction of the IC. Because the source (short mode or open mode) cannot be identified if the device is damaged in this way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in excess of absolute rating limits.

2) GND voltage Make sure that the GND terminal potential is maintained at the minimum in any operating state, and is always kept lower than the potential of all other pins.

3) Thermal design Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

4) Pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning or orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted together, or if shorts occur between the output pin and supply pin or GND.

5) Positioning components in proximity to the Hall IC and magnet Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore the magnetic detection operation. Thus, placing magnetic components near the Hall IC and magnet should be avoided in the design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design.

6) Slide-by position sensing Fig.29 depicts the slide-by configuration employed for position sensing. Note that when the gap (d) between the magnet and the Hall IC is narrowed, the reverse magnetic field generated by the magnet can cause the IC to malfunction. As seen in Fig.30, the magnetic field runs in opposite directions at Point A and Point B. Since the dual output Omnipolar detection Hall IC can detect the S-pole at Point A and the N-pole at Point B, it can wind up switching output ON as the magnet slides by in the process of position detection. Fig. 31 plots magnetic flux density during the magnet slide-by. Although a reverse magnetic field was generated in the process, the magnetic flux density decreased compared with the center of the magnet. This demonstrates that slightly widening the gap (d) between the magnet and Hall IC reduces the reverse magnetic field and prevents malfunctions.

7) Operation in strong electromagnetic fields Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause the IC to malfunction.

8) Common impedance Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example, employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or capacitor.

9) GND wiring pattern When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same way, care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components.

10) Exposure to strong light Exposure to halogen lamps, UV and other strong light sources may cause the IC to malfunction. If the IC is subject to such exposure, provide a shield or take other measures to protect it from the light. In testing, exposure to white LED and fluorescent light sources was shown to have no significant effect on the IC.

1) Power source design

1

Since the IC performs intermittent operation, it has peak current when it’s ON. Please taking that into account and under examine adequate evaluations when designing the power source.

Magnet

Slide

d

Hall IC

L

Fig.29

Flux

A

S

N

Fig.30

B

Flux

10

8 6 4 2 0

-2

-4

-6

-8

-10

Magnetic fux density[mT]

012345678910

Horizontal distance f rom the magnet [mm]

Technical Note

Reverse

Fig.31

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10/11

2010.01 - Rev.D

BU52004GUL, BU52014HFV

)

V

Technical Note

●Ordering part number

B U 5 2 0 0 4 G U L - E 2

Part No. Part No.

Package 52004 52014

CSP50L1

HVSOF5

0.6MAX

1.6±0.05

1.2±0.05

(MAX 1.28 include BURR)

+0.03

–0.02

0.02

4-φ0.25±0.05

(BU52004GUL)

1PIN MARK

1.10±0.1

0.05

BA

B

B A

0.30±0.1

1.6±0.05

1.0±0.05

(0.05)

4

5

(0.91)

321

S

0.5

0.1 S

0.22±0.05

A

21

(0.41)

0.08 S

0.50

1.10±0.1

0.10±0.05

0.30±0.1

0.50

(0.8)

(0.3)

45

1

32

0.08

0.55MAX

M

S

(Unit : mm

0.2MAX

0.13±0.05

(Unit : mm)

Quantity

Direction of feed

Quantity

Direction of feed

Packaging and forming specification GUL: VCSP50L1 HFV: HVSOF5

E2: Embossed tape and reel

(VSCP50L1)

TR: Embossed tape and reel

(HVSOF5)

Embossed carrier tapeTape 3000pcs

E2

The direction is the 1pin of product is at the upper left when you hold

()

reel on the left hand and you pull out the tape on the right hand

Reel

Embossed carrier tapeTape 3000pcs

TR

The direction is the 1pin of product is at the upper right when you hold

()

reel on the left hand and you pull out the tape on the right hand

Reel

1pin

Order quantity needs to be multiple of the minimum quantity.

∗

Order quantity needs to be multiple of the minimum quantity.

∗

Direction of feed

1pin

Direction of feed

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11/11

2010.01 - Rev.D

Notes

No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd.

The content specied herein is subject to change for improvement without notice.

The content specied herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specications, which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information specied in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage.

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Notice

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ROHM BU52004GUL, BU52014HFV Technical data

Specifications and Main Features

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User Manual