ROHM BU3071HFV Technical data

High-performance Clock Generator Series

Compact 1ch Clock Generators
for Digital Cameras

BU3071HFV,BU3072HFV,BU3073HFV,BU3076HFV,BU7322HFV,BU7325HFV

●Description

These Clock Generators incorporates compact package compared to oscillators, which provides the generation of
high-frequency CCD, USB, VIDEO clocks necessary for digital still cameras and digital video cameras.

●Features

1) SEL pin allowing for the selection of frequencies

2) Selection of OE pin enabling Power-down function

3) Crystal-oscillator-level clock precision with high C/N characteristics and low jitter

4) Micro miniature HVSOF6 Package incorporated

5) Single power supply of 3.3 V

●Applications

Digital Still Camera, Digital Video Camera, and others

●Lineup

Parameter BU3071HFV BU3072HFV BU3073HFV BU3076HFV BU7322HFV BU7325HFV

Supply voltage 3.0 V ~ 3.6V 3.0 V ~ 3.6V 3.0 V ~ 3.6V 2.85 V ~ 3.6V 2.85 V ~ 3.6V 2.85 V ~ 3.6V

Operating temperature range -5℃ ~ 70℃ -5℃ ~ 70℃ -5℃ ~ 70℃ -5℃ ~ 75℃ -5℃ ~ 75℃ -30℃ ~ 85℃

Reference input clock 28.6363MHz 48.0000MHz 48.0000MHz 27.0000MHz 27.0000MHz 27.0000MHz

Output clock

Power-down function Provided Provided Provided Provided Provided Provided

Operating current (Typ.) 10mA 11mA 11mA 12mA 10mA 12mA

Package HVSOF6 HVSOF6 HVSOF6 HVSOF6 HVSOF6 HVSOF6

●Absolute Maximum Ratings(Ta=25℃)

Parameter Symbol Ratings Unit

Supply voltage VDD -0.3 ~ 4.0 V

Input voltage VIN -0.3 ~ VDD+0.3 V

Storage temperature range Tstg -30 ~ 125 ℃

Power dissipation Pd 410 mW

*1 Operating is not guaranteed.
*2 In the case of exceeding Ta = 25℃, 4.1mW should be reduced per 1℃.
*3 The radiation-resistance design is not carried out.
*4 Power dissipation is measured when the IC is mounted to the printed circuit board.

●Recommended Operating Range

Parameter Symbol Limits Unit

Supply voltage VDD 3.0 ~ 3.6 V

Input H voltage VINH 0.8VDD ~ VDD V

Input L voltage VINL 0.0 ~ 0.2VDD V

Operating temperature Topr -5 ~ 70 ℃

Output load CL 15(MAX) pF

54.0000MHz 27.0000MHz 24.3750MHz 54.0000MHz 49.5000MHz 48.0000MHz

- 36.0000MHz 24.5454MHz 67.5000MHz 36.0000MHz 78.0000MHz

No.09005EAT01

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© 2009 ROHM Co., Ltd. All rights reserved.

1/21

2009.04 - Rev.A

BU3071HFV,BU3072HFV,BU3073HFV,BU3076HFV,BU7322HFV,BU7325HFV

Technical Note

●Electrical Characteristics

BU3071HFV(Ta=25℃, VDD=3.3V,Crystal frequency=28.6363MHz, unless otherwise specified.)

Parameter Symbol

Min. Typ. Max.

Limits

Unit Conditions

Output H voltage VOH 2.8 - - V IOH=-4.0mA
Output L voltage VOL - - 0.5 V IOL=4.0mA
Consumption current 1 IDD1 - 10 15 mA OE=H, at no load
Consumption current 2 IDD2 - 1 1.3 mA OE=L
Output frequency - 54.0000 - MHz IN*264/35/4

The following parameters represent design guaranteed performance.

Duty Duty 45 50 55 % Measured at a voltage of 1/2 of VDD
Period-Jitter 1σ PJsSD - 50 - psec ※1
Period-Jitter MIN-MAX PJsABS - 300 - psec ※2

Period of transition time required for the

Rise time tr - 2.5 - nsec

output to reach 80% from 20% of VDD.
Provided with 15pF output load.

Period of transition time required for the

Fall time tf - 2.5 - nsec

output to reach 20% from 80% of VDD.
Provided with 15pF output load.

Output Lock time tLOCK - - 1 msec ※3

Note) The output frequency is determined by the arithmetic (frequency division) expression of a frequency input to IN.
If the input frequency is set to 28.6363MHz, the output frequency will be as listed above.

BU3072HFV(Ta=25℃, VDD=3.3V, Crystal frequency=48.0000MHz, unless otherwise specified.)

Parameter Symbol

Min. Typ. Max.

Limits

Unit Conditions

Output H voltage VOH 2.8 - - V IOH=-4.0mA
Output L voltage VOL - - 0.5 V IOL=4.0mA
Consumption current 1 IDD1 - 11 16 mA PD=H, at no load
Consumption current 2 IDD2 - - 5 µA PD=L

Output frequency

CLK_27 - 27.0000 - MHz SEL=L, IN*18/8/4
CLK_36 - 36.0000 - MHz SEL=H, IN*24/8/4

The following parameters represent design guaranteed performance.

Duty Duty 45 50 55 % Measured at a voltage of 1/2 of VDD
Period-Jitter 1σ PJsSD - 35 - psec ※1
Long-Term-Jitter

MIN-MAX

LTJsABS - 0.9 1.5 nsec

MIN-MAX of long-term jitter
(100 µsec from trigger)
Period of transition time required for the

Rise time tr - 2.5 - nsec

output to reach 80% from 20% of VDD.
Provided with 15pF output load.

Period of transition time required for the

Fall time tf - 2.5 - nsec

output to reach 20% from 80% of VDD.
Provided with 15pF output load.

Output Lock time tLOCK - - 1 msec ※3

Note) The output frequency is determined by the arithmetic (frequency division) expression of a frequency input to IN.
If the input frequency is set to 48.0000MHz, the output frequency will be as listed above.

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2/21

2009.04 - Rev.A

BU3071HFV,BU3072HFV,BU3073HFV,BU3076HFV,BU7322HFV,BU7325HFV

Technical Note

BU3073HFV(Ta=25℃, VDD=3.3V, Crystal frequency=48.0000MHz, unless otherwise specified.)

Parameter Symbol

Min. Typ. Max.

Limits

Unit Conditions

Output H voltage VOH 2.8 - - V IOH=-4.0mA
Output L voltage VOL - - 0.5 V IOL=4.0mA
Consumption current 1 IDD1 - 11 16 mA PD=H, at no load
Consumption current 2 IDD2 - - 5 mA PD=L

Output frequency

CLK_375 - 24.3750 - MHz SEL=L, IN*65/16/8
CLK_545 - 24.5454 - MHz SEL=H, IN*45/11/8

The following parameters represent design guaranteed performance.

Duty Duty 45 50 55 % Measured at a voltage of 1/2 of VDD
Period-Jitter 1σ PJsSD - 45 - psec ※1
Long-Term-Jitter

MIN-MAX

LTJsABS - 0.9 1.5 nsec

MIN-MAX of long-term jitter
(100 µsec from trigger)
Period of transition time required for the

Rise time tr - 2.5 - nsec

output to reach 80% from 20% of VDD.
Provided with 15pF output load.

Period of transition time required for the

Fall time tf - 2.5 - nsec

output to reach 20% from 80% of VDD.
Provided with 15pF output load.

Output Lock time tLOCK - - 1 msec ※3

Note) The output frequency is determined by the arithmetic (frequency division) expression of a frequency input to IN.
If the input frequency is set to 48.0000MHz, the output frequency will be as listed above.

BU3076HFV(Ta=25℃, VDD=3.3V, Crystal frequency=27.0000MHz, unless otherwise specified.)

Parameter Symbol

Min. Typ. Max.

Limits

Unit Conditions

Output H voltage VOH 2.8 - - V IOH=-4.0mA
Output L voltage VOL - - 0.5 V IOL=4.0mA
Pull-down resistance Rpd 25 50 100 KΩ Pull-down resistance on input pin
Consumption current 1 IDD1 - 10 15 mA 54MHz output, at no load
Consumption current 2 IDD2 - 12 18 mA 67.5MHz output, at no load
Standby current IDDst - - 1 µA OE=L

Output frequency

CLK_54 - 54.0000 - MHz SEL=L, IN*48/6/4

CLK_67.5 - 67.5000 - MHz SEL=H, IN*60/6/4

The following parameters represent design guaranteed performance.

Duty Duty 45 50 55 % Measured at a voltage of 1/2 of VDD
Period-Jitter 1σ PJsSD - 50 - psec ※1
Period-Jitter MIN-MAX PJsABS - 300 - psec ※2

Period of transition time required for the

Rise time tr - 1.5 - nsec

output to reach 80% from 20% of VDD.
Provided with 15pF output load.

Period of transition time required for the

Fall time tf - 1.5 - nsec

output to reach 20% from 80% of VDD.
Provided with 15pF output load.

Output Lock time tLOCK - - 200 µsec ※3

Note) The output frequency is determined by the arithmetic (frequency division) expression of a frequency input to IN.
If the input frequency is set to 27.0000MHz, the output frequency will be as listed above.

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3/21

2009.04 - Rev.A

BU3071HFV,BU3072HFV,BU3073HFV,BU3076HFV,BU7322HFV,BU7325HFV

Technical Note

BU7322HFV(Ta=25℃, VDD=3.3V, Crystal frequency=27.0000MHz, unless otherwise specified.)

Parameter Symbol

Min. Typ. Max.

Limits

Unit Conditions

Output H voltage VOH 2.8 - - V IOH=-4.0mA
Output L voltage VOL - - 0.5 V IOL=4.0mA
Pull-down resistance Rpd 25 50 100 kΩ Pull-down resistance on input pin
Consumption current 1 IDD - 10 13.5 mA 49.5MHz output, at no load
Consumption current 2 IDD2 - 9.5 13.0 mA 36.0MHz output, at no load
Standby current IDDst - - 1 µA OE=L

Output frequency

CLK_49.5 - 49.5000 - MHz SEL=L, IN*66/6/6

CLK_36 - 36.0000 - MHz SEL=H, IN*64/6/8

The following parameters represent design guaranteed performance.

Duty Duty 45 50 55 % Measured at a voltage of 1/2 of VDD
Period-Jitter 1σ PJsSD - 50 - psec ※1
Period-Jitter MIN-MAX PJsABS - 300 - psec ※2

Period of transition time required for the

Rise time tr - 2.5 - nsec

output to reach 80% from 20% of VDD.
Provided with 15pF output load.

Period of transition time required for the

Fall time tf - 2.5 - nsec

output to reach 20% from 80% of VDD.
Provided with 15pF output load.

Output Lock time tLOCK - - 200 µsec ※3

Note) The output frequency is determined by the arithmetic (frequency division) expression of a frequency input to IN.
If the input frequency is set to 27.0000MHz, the output frequency will be as listed above.

BU7325HFV(Ta=25℃, VDD=3.3V, Crystal frequency=27.0000MHz, unless otherwise specified.)

Parameter Symbol

Min. Typ. Max.

Limits

Unit Conditions

Output H voltage VOH 2.8 - - V IOH=-4.0mA
Output L voltage VOL - - 0.5 V IOL=4.0mA
Pull-down resistance Rpd 25 50 100 kΩ Pull-down resistance on input pin
Consumption current 1 IDD1 - 11 15 mA OE=H, SEL=L, at no load
Consumption current 2 IDD2 - 12 16.5 mA OE=H, SEL=H, at no load
Standby current IDDst - - 1 µA OE=L

Output frequency

CLK_48 - 48.0000 - MHz SEL=L, IN*96/9/6
CLK_78 - 78.0000 - MHz SEL=H, IN*104/9/4

The following parameters represent design guaranteed performance.

Duty Duty 45 50 55 % Measured at a voltage of 1/2 of VDD
Period-Jitter 1σ PJsSD - 50 - psec ※1
Period-Jitter MIN-MAX PJsABS - 300 - psec ※2

Period of transition time required for the

Rise time tr - 1.5 - nsec

output to reach 80% from 20% of VDD.
Provided with 15pF output load.

Period of transition time required for the

Fall time tf - 1.5 - nsec

output to reach 20% from 80% of VDD.
Provided with 15pF output load.

Output Lock time tLOCK - - 200 µsec ※3

Note) The output frequency is determined by the arithmetic (frequency division) expression of a frequency input to IN.
If the input frequency is set to 27.0000MHz, the output frequency will be as listed above.

Common to BU3071HFV, BU3072HFV, BU3073HFV, BU3076HFV, BU7322HFV, BU7325HFV

※1 Period-Jitter 1σ
This parameter represents standard deviation (=1σ) on cycle distribution data at the time when the output clock cycles are sampled 1000 times

consecutively with the TDS7104 Digital Phosphor Oscilloscope of Tektronix Japan, Ltd.

※2 Period-Jitter MIN-MAX
This parameter represents a maximum distribution width on cycle distribution data at the time when the output clock cycles are sampled 1000 times

consecutively with the TDS7104 Digital Phosphor Oscilloscope of Tektronix Japan, Ltd.

※3 Output Lock Time
This parameter represents elapsed time after power supply turns ON to reach a voltage of 3.0 V, after the system is switched from Power-Down state to

normal operation state, or after the output frequency is switched, until it is stabilized at a specified frequency, respectively.

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4/21

2009.04 - Rev.A

BU3071HFV,BU3072HFV,BU3073HFV,BU3076HFV,BU7322HFV,BU7325HFV

●Reference data (BU3071HFV basic data)

RBW:1kHz

VBW:100Hz

Technical Note

1V/div

5nsec/div

Fig.1 54MHz output waveform

(VDD=3.3V,CL=15pF,Ta=25℃)

●Reference data (BU3072HFV basic data)

1V/div

10nsec/div

Fig.4 27MHz output waveform

(VDD=3.3V,CL=15pF,Ta=25℃)

1V/div

500psec/div

Fig.2 54MHz Period-Jitter

(VDD=3.3V,CL=15pF,Ta=25℃)

1V/div

500psec/div

Fig.5 27MHz Period-Jitter

(VDD=3.3V,CL=15pF,Ta=25℃)

10dB/div

10kHz/div

Fig.3 54MHz spectrum

(VDD=3.3V,CL=15pF,Ta=25℃)

RBW:1kHz

VBW:100Hz

10dB/div

10kHz/div

Fig.6 27MHz spectrum

(VDD=3.3V,CL=15pF,Ta=25℃)

RBW:1kHz

VBW:100Hz

1V/div

5nsec/div

Fig.7 36MHz output waveform

(VDD=3.3V,CL=15pF,Ta=25℃)

1V/div

500psec/div

Fig.8 36MHz Period-Jitter

(VDD=3.3V,CL=15pF,Ta=25℃)

10dB/div

10kHz/div

Fig.9 36MHz spectrum

(VDD=3.3V,CL=15pF,Ta=25℃)

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5/21

2009.04 - Rev.A

BU3071HFV,BU3072HFV,BU3073HFV,BU3076HFV,BU7322HFV,BU7325HFV

●Reference data (BU3073HFV basic data)

RBW:1kHz

VBW:100Hz

Technical Note

1V/div

10nsec/div

Fig.10 24.375MHz output waveform

(VDD=3.3V,CL=15pF,Ta=25℃)

1V/div

10nsec/div

Fig.13 24.5454MHz output waveform

(VDD=3.3V,CL=15pF,Ta=25℃)

●Reference data (BU3076HFV basic data)

1V/div

500psec/div

Fig.11 24.375MHz Period-Jitter
(VDD=3.3V,CL=15pF,Ta=25℃)

1V/div

500psec/div

Fig.14 24.5454MHz Period-Jitter

(VDD=3.3V,CL=15pF,Ta=25℃)

10dB/div

10kHz/div

Fig.12 24.375MHz spectrum

(VDD=3.3V,CL=15pF,Ta=25℃)

RBW:1kHz

VBW:100Hz

10dB/div

10kHz/div

Fig.15 24.5454MHz spectrum

(VDD=3.3V,CL=15pF,Ta=25℃

RBW:1kHz

VBW:100Hz

1V/div

5nsec/div

Fig.16 54MHz output waveform

(VDD=3.3V,CL=15pF,Ta=25℃)

1V/div

500psec/div

Fig.17 54MHz Period-Jitter

(VDD=3.3V,CL=15pF,Ta=25℃)

10dB/div

10kHz/div

Fig.18 54MHz spectrum

(VDD=3.3V,CL=15pF,Ta=25℃)

RBW:1kHz

VBW:100Hz

10dB/div

10kHz/div

Fig.21 67.5MHz spectrum

(VDD=3.3V,CL=15pF,Ta=25℃)

1V/div

2nsec/div

Fig.19 67.5MHz output waveform

(VDD=3.3V,CL=15pF,Ta=25℃)

1V/div

500psec/div

Fig.20 67.5MHz Period-Jitter

(VDD=3.3V,CL=15pF,Ta=25℃)

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6/21

2009.04 - Rev.A

BU3071HFV,BU3072HFV,BU3073HFV,BU3076HFV,BU7322HFV,BU7325HFV

●Reference data (BU7322HFV basic data)

RBW:1kHz

VBW:100Hz

Technical Note

1V/div

5nsec/div

Fig.22 49.5MHz output waveform

(VDD=3.3V,CL=15pF,Ta=25℃)

1V/div

10nsec/div

Fig.25 36MHz output waveform

(VDD=3.3V,CL=15pF,Ta=25℃)

●Reference data (BU7325HFV basic data)

1V/div

500psec/div

Fig.23 49.5MHz Period-Jitter

(VDD=3.3V,CL=15pF,Ta=25℃)

1V/div

500psec/div

Fig.26 36MHz Period-Jitter

(VDD=3.3V,CL=15pF,Ta=25℃)

10dB/div

10kHz/div

Fig.24 49.5MHz spectrum

(VDD=3.3V,CL=15pF,Ta=25℃)

RBW:1kHz

VBW:100Hz

10dB/div

10kHz/div

Fig.27 36MHz spectrum

(VDD=3.3V,CL=15pF,Ta=25℃)

RBW:1kHz
VBW:100Hz

1V/div

5nsec/div

1V/div

500psec/div

10dB/div

10kHz/div

Fig.28 48MHz output waveform

(VDD=3.3V,CL=15pF,Ta=25℃)

Fig.29 48MHz Period-Jitter

(VDD=3.3V,CL=15pF,Ta=25℃)

Fig.30 48MHz spectrum

(VDD=3.3V,CL=15pF,Ta=25℃

RBW:1kHz

VBW:100Hz

1V/div

10nsec/div

1V/div

500psec/div

10dB/div

10kHz/div

Fig.31 78MHz output waveform

(VDD=3.3V,CL=15pF,Ta=25℃

Fig.32 78MHz Period-Jitter

(VDD=3.3V,CL=15pF,Ta=25℃)

Fig.33 78MHz spectrum

(VDD=3.3V,CL=15pF,Ta=25℃)

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7/21

2009.04 - Rev.A

BU3071HFV,BU3072HFV,BU3073HFV,BU3076HFV,BU7322HFV,BU7325HFV

Technical Note

●Reference data (BU3071HFV Temperature and Supply voltage variations data)

55

54
53

52

51

50
49

48

Duty:Duty[%]

47
46

45

VDD=3.7V

VDD=2.9V

-25 0 25 50 75 100

temperature:T[℃]

VDD=3.3V

Fig.34 54MHz

Duty temperature characteristics

100

5

4

3

2

VDD=3.3V

Fall time:tf [nsec]

VDD=2.9V

1

0

-25 0 25 50 75 100

temperature:T [℃]

VDD=3.7V

Fig.35 54MHz

Rise-time temperature characteristics

600

5

4

3

2

VDD=2.9V

VDD=3.3V

Rise time:tr [nsec]

1

0

-25 0 25 50 75 100

temperature:T [℃]

VDD=3.7V

Fig.36 54MHz

Fall-time temperature characteristics

80

500

400

60

40

20

Period-Jitter 1σ:JsSD [psec]

VDD=3.7V

0

-25 0 25 50 75 100

VDD=3.3V

VDD=2.9V

temperature:T [℃]

Fig.37 54MHz Period-Jitter 1σ

temperature characteristics

300

200

100

Period-Jitter MIN-MAX:JsABS [psec]

VDD=2.9V

0

-25 0 25 50 75 100

temperature:T [℃]

Fig.38 54MHz Jitter-Min Max

temperature characteristics

=

VDD=3.3V

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8/21

2009.04 - Rev.A

BU3071HFV,BU3072HFV,BU3073HFV,BU3076HFV,BU7322HFV,BU7325HFV

●Reference data (BU3072HFV Temperature and Supply voltage variations data)

55

54

53

52

51

50
49

Duty:Dyty [%]

48

47

46

45

-25 0 25 50 75 100

VDD=2.9V

temperature:T [℃]

VDD=3.7V

VDD=3.3V

Fig.39 27MHz Duty

temperature characteristics

5

4

3

2

Rise time:tr [nsec]

1

0

-25 0 25 50 75 100

VDD=2.9V

VDD=3.7V

temperature:T [℃]

VDD=3.3V

Fig.40 27MHz Rise-time

temperature characteristics

5

4

3

2

Fall time:tf [nsec]

1

0

-25 0 25 50 75 100

Fig.41 27MHz Fall-time

temperature characteristics

100

90

80

70

60

50
40

30

20

10

Period-Jitter 1σ:JsSD [psec]

55

54
53

52

51

50
49

48

Duty:Duty [%]

47
46

45

100

90
80

70
60

50
40

30
20

10

Period-Jitter 1σ:JsSD [psec]

VDD=3.7V

VDD=2.9V

0

-25 0 25 50 75 100

temperature:T [℃]

VDD=3.3V

Fig.42 27MHz Period-Jitter 1σ

temperature characteristics

VDD=3.7V

VDD=2.9V

VDD=3.3V

-25 0 25 50 75 100

temperature:T [℃]

Fig.44 36MHz Duty

temperature characteristic

VDD=2.9V

VDD=3.3V

VDD=3.7V

0

-25 0 25 50 75 100

temperature:T [℃]

Fig.47 36MHz Period-Jitter 1σ

temperature characteristic s

600

500

400

300

200

100

0

Period-Jitter MIN-MAX:JsABS [psec]

-25 0 25 50 75 100

VDD=2.9V

temperature:T [℃]

Fig.43 27MHz Jitter-MinMax

temperature characteristics

5

4

3

2

Rise time:tr [nsec]

1

0

-25 0 25 50 75 100

VDD=2.9V

VDD=3.7V

temperature:T [℃]

Fig.45 36MHz Rise-time

temperature characteristics

600

500

400

300

200

100

0

Period-Jitter MIN-MAX:JsABS [psec]

-25 0 25 50 75 100

VDD=2.9V

VDD=3.7V

temperature:T [℃]

Fig.48 36MHz Jitter-Min Max

temperature characteristics

VDD=3.7V

VDD=3.3V

VDD=3.3V

VDD=3.3V

5

4

3

2

Fall time:tf [nsec]

1

0

-25 0 25 50 75 100

Fig.46 36MHz Fall-time

temperature characteristics

Technical Note

VDD=2.9V

VDD=3.7V

temperature:T [℃]

VDD=2.9V

temperature:T [℃]

VDD=3.3V

VDD=3.7V

VDD=3.3V

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9/21

2009.04 - Rev.A

BU3071HFV,BU3072HFV,BU3073HFV,BU3076HFV,BU7322HFV,BU7325HFV

Technical Note

●Reference data (BU3073HFV Temperature and Supply voltage variations data)

55

54

53
52

51

50

49

48

Duty:Duty [%]

47

46

45

-25 0 25 50 75 100

temperature:T [℃]

VDD=3.7V

VDD=3.3V

VDD=2.9V

Fig.49 24.375MHz Duty

temperature characteristics

100

90

80

Period-Jitter 1σ:JsSD [psec]

70

60

50

40

30
20

10

0

-25 0 25 50 75 100

temperature:T [℃]

VDD=3.7V

VDD=3.3V

VDD=2.9V

Fig.52 24.375MHz Period-Jitter 1σ

temperature characteristics

55

54

53
52

51

50

49

48

Duty:Duty [%]

47

46

45

VDD=2.9V VDD=3.3V

-25 0 25 50 75 100
temperature:T [℃]

VDD=3.7V

Fig.54 24.5454MHz Duty

temperature characteristics

100

90

80
70

60

50

40

30
20

10

Period-Jitter 1σ:JsSD [psec]

0

-25 0 25 50 75 100

temperature:T [℃]

VDD=2.9V

VDD=3.7V

VDD=3.3V

5

4

3

VDD=2.9V

2

Rise time:tr [nsec]

1

VDD=3.7V

0

-25 0 25 50 75 100

temperature:T [℃]

VDD=3.3V

Fig.50 24.375MHz Rise-time

temperature characteristics

600

500

400

300

[psec]

200

100

Period-Jitter MIN-MAX:JsABS

0

-25 0 25 50 75 100

VDD=3.7V

VDD=2.9V

temperature:T [℃]

VDD=3.3V

Fig.53 24.375MHz Jitter-Min Max

temperature characteristics

5

4

3

2

Rise time:tr [nsec]

1

0

VDD=3.7V

-25 0 25 50 75 100

temperature:T [℃]

VDD=2.9V

VDD=3.3V

Fig.55 24.5454MHz Rise-time

temperature characteristics

600

500

400

300

200

100

0

Period-Jitter MIN-MAX:JsABS [psec]

-25 0 25 50 75 100

VDD=3.7V

VDD=2.9V

temperature:T [℃]

VDD=3.3V

Fig.57 24.5454MHz Period-Jitter 1σ

temperature characteristics

Fig.58 24.5454MHz Jitter-MinMax

temperature characteristics

5

4

3

2

Fall time:tf [nsec)]

1

0

-25 0 25 50 75 100

VDD=2.9V

VDD=3.7V

temperature:T [℃]

VDD=3.3V

Fig.51 24.375MHz Fall-time

temperature characteristics

5

4

3

2

Fall time:tf [nsec]

1

0

VDD=3.7V

-25 0 25 50 75 100

temperature:T [℃]

VDD=2.9V

VDD=3.3V

Fig.56 24.5454MHz Fall-time

temperature characteristics

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© 2009 ROHM Co., Ltd. All rights reserved.

10/21

2009.04 - Rev.A

BU3071HFV,BU3072HFV,BU3073HFV,BU3076HFV,BU7322HFV,BU7325HFV

●Reference data (BU3076HFV Temperature and Supply voltage variations data)

Period-Jitter 1σ:JsSD [psec]

55

54

53
52

51

50

49

48

Duty:Duty [%]

47

46

45

-25 0 25 50 75 100

VDD=3.7V

VDD=2.9V

temperature:T [℃]

Fig.59 54MHz Duty

temperature characteristics

100

90

80

70

60

50

40

30

20

10

0

-25 0 25 50 75 100

VDD=2.9V

VDD=3.7V

temperature:T [℃]

VDD=3.3V

VDD=3.3V

5

4

3

2

Rise time:tr [nsec]

1

0

-25 0 25 50 75 100

VDD=2.9V

VDD=3.7V

temperature:T [℃]

Fig.60 54MHz Rise-time

temperature characteristics

600

500

400

300

200

100

0

Period-Jitter MIN-MAX:JsABS [psec]

-25 0 25 50 75 100

VDD=2.9V

VDD=3.7V

temperature:T [℃]

VDD=3.3V

VDD=3.3V

5

4

3

2

Fall time:tf [nsec]

1

0

VDD=3.7V

-25 0 25 50 75 100

Fig.61 54MHz Fall-time

temperature characteristics

Duty:Duty [%]

Period-Jitter 1σ:JsSD [psec]

Fig.62 54MHz Period-Jitter 1σ

temperature characteristics

55

54
53

52

51

50
49

48

47
46

45

-25 0 25 50 75 100

VDD=3.3V

temperature:T [℃]

VDD=3.7V

VDD=2.9V

Fig.64 67.5MHz

Duty temperature characteristics

70

60

50

40

30

20

10

0

-25 0 25 50 75 100

VDD=2.9V

VDD=3.7V

temperature:T [℃]

VDD=3.3V

Fig.67 67.5MHz Period-Jitter 1σ

temperature characteristics

Fig.63 54MHz Jitter-Min Max

temperature characteristics

5

4

3

2

Rise time:tr [nsec]

1

0

-25 0 25 50 75 100

VDD=2.9V

temperature:T [℃]

VDD=3.3V

VDD=3.7V

Fig.65 67.5MHz

Rise-time temperature characteristics

600

500

400

300

200

100

0

Period-Jitter MIN-MAX:JsABS [psec]

VDD=2.9V

-25 0 25 50 75 100

temperature:T [℃]

VDD=3.7V

VDD=3.3V

Fig.68 67.5MHz Jitter-MinMax

temperature characteristics

5

4

3

2

Fall time:tf [nsec]

1

0

-25 0 25 50 75 100

Fig.66 67.5MHz

Fall-time temperature characteristics

Technical Note

VDD=2.9V

VDD=3.3V

tem perature:T [℃]

VDD=2.9V

VDD=3.7V

temperature:T [℃]

VDD=3.3V

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© 2009 ROHM Co., Ltd. All rights reserved.

11/21

2009.04 - Rev.A

BU3071HFV,BU3072HFV,BU3073HFV,BU3076HFV,BU7322HFV,BU7325HFV

Technical Note

●Reference data (BU7322HFV Temperature and Supply voltage variations data)

55

54

53

52

51

50

49

48

Duty:Duty [%]

47

46

45

-25 0 25 50 75 100

VDD=3.7V

VDD=2.75V

temperature: T [℃]

Fig.69 49.5MHz Duty

temperature characteristics

100

90

80

70

60

50

40

30

20

10

Period-Jitter 1σ:JsSD [psec]

0

-25 0 25 50 75 100

VDD=3.7V

temperature:T [℃]

Fig.72 49.5MHz Period-Jitter 1σ

temperature characteristics

55

54
53

Duty:Duty [%]

52

51

50
49

48

47
46

45

VDD=3.7V

VDD=2.75V

-25 0 25 50 75 100

temperature:T [℃]

Fig.74 36MHz Duty

temperature characteristics

70

60

50

40

30

20

Period-Jitter 1σ:JsSD [psec]

10

0

VDD=3.3V

-25 0 25 50 75 100

temperature:T [℃]

Fig.77 36MHz Period-Jitter 1σ

temperature characteristics

VDD=3.3V

VDD=2.75V

VDD=3.3V

VDD=3.3V

VDD=2.75V

VDD=3.7V

5

4

3

2

Rise time:tr [nsec]

1

0

-25 0 25 50 75 100

VDD=2.75V

VDD=3.7V

temperature:T [℃]

Fig.70 49.5MHz Rise-time

temperature characteristics

600

500

400

300

200

100

0

Period-Jitter MIN-MAX:JsABS [psec]

VDD=3.7V

VDD=3.3V

-25 0 25 50 75 100

temperature:T [℃]

Fig.73 49.5MHz Jitter-Min Max

temperature characteristics

5

4

3

2

Rise time:tr [nsec]

1

0

-25 0 25 50 75 100

VDD=2.75V

VDD=3.7V

temperature:T [℃]

Fig.75 36MHz Rise-time

temperature characteristics

600

500

400

300

[psec]

200

100

Period-Jitter MIN-MAX:JsABS

0

-25 0 25 50 75 100

VDD=3.3V

temperature:T [℃]

Fig.78 36MHz Jitter-MinMax

temperature characteristics

VDD=3.3V

VDD=2.75V

VDD=3.3V

VDD=2.75V

VDD=3.7V

5

4

3

2

Fall time:tf [nsec]

1

0

-25 0 25 50 75 100

VDD=2.75V

VDD=3.7V

tem perature:T [℃]

VDD=3.3V

Fig.71 49.5MHz Fall-time

temperature characteristics

5

4

3

2

Fall time:tf [nsec]

1

0

-25 0 25 50 75 100

VDD=2.75V

VDD=3.7V

temperature:T [℃]

VDD=3.3V

Fig.76 36MHz Fall-time

temperature characteristics

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12/21

2009.04 - Rev.A

BU3071HFV,BU3072HFV,BU3073HFV,BU3076HFV,BU7322HFV,BU7325HFV

Technical Note

●Reference data (BU7325HFV Temperature and Supply voltage variations data)

55

54
53

52

51

50
49

48

Duty:Duty [%]

47
46

45

100

90

80

70

60

50

40

30

20

10

Period-Jitter 1σ:JsSD [psec]

0

-25 0 25 50 75 100

55

54
53

52

51

50
49

48

Duty:Duty [%]

47
46

45

70

60

50

40

30

20

10

Period-Jitter 1σ:JsSD [psec]

0

VDD=3.7V

VDD=3.3V

-25 0 25 50 75 100

temperature:T [℃]

VDD=2.75V

Fig.79 48MHz

Duty temperature characteristics

VDD=2.75V

VDD=3.3V

temperature:T [℃]

VDD=3.7V

Fig.82 48MHz Period-Jitter 1σ

temperature characteristics

VDD=3.7V

VDD=3.3V

-25 0 25 50 75 100

temperature:T [℃]

VDD=2.75V

Fig.84 78MHz Duty

temperature characteristics

VDD=2.75V

VDD=3.3V

-25 0 25 50 75 100

temperature:T [℃]

VDD=3.7V

Fig.87 78MHz Period-Jitter 1σ

temperature characteristics

5

4

3

2

Rise time:tr [nsec]

1

0

-25 0 25 50 75 100

VDD=3.7V

VDD=3.3V

VDD=2.75V

temperature:T [℃]

Fig.80 48MHz

Rise-time temperature characteristics

600

500

400

VDD=3.3V

VDD=3.7V

-25 0 25 50 75 100

Period-Jitter MIN-MAX:JsABS [psec]

300

200

100

0

VDD=2.75V

temperature:T [℃]

Fig.83 48MHz Jitter-Min Max

temperature characteristics

5

4

3

2

Rise time:tr [nsec]

1

0

-25 0 25 50 75 100

VDD=2.75V

VDD=3.3V

temperature:T [℃]

VDD=3.7V

Fig.85 78MHz Rise-time

temperature characteristics

600

500

400

300

200

100

0

Period-Jitter MIN-MAX:JsABS [psec]

VDD=2.75V

-25 0 25 50 75 100

temperature:T [℃]

VDD=3.3V

VDD=3.7V

Fig.88 78MHz Jitter-MinMax

temperature characteristic

5

4

3

2

Fall time:tf [nsec]

1

0

-25 0 25 50 75 100

temperature:T [℃]

VDD=2.75V

VDD=3.7V

VDD=3.3V

Fig.81 48MHz

Fall-time temperature characteristics

5

4

3

VDD=2.75V

2

Fall time:tf [nsec]

1

0

VDD=3.3V

-25 0 25 50 75 100

temperature:T [℃]

VDD=3.7V

Fig.86 78MHz Fall-time

temperature characteristics

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© 2009 ROHM Co., Ltd. All rights reserved.

13/21

2009.04 - Rev.A

BU3071HFV,BU3072HFV,BU3073HFV,BU3076HFV,BU7322HFV,BU7325HFV

●Block diagram, pin assignment/functions

(BU3071HFV)

1：VDD

2：VSS

　　6：

　　5：

IN

TEST

6pin:IN

PLL

1/4

3：OUT

　　4：

OE

4pin:OE

Fig.89 Fig.90

PIN
NO.

PIN

name

Function

1 VDD Power supply
2 VSS GND
3 OUT Clock output terminal
4 OE Output enable (L: disable, H: enable), equipped with Pull-down function, output fixed to L at disable
5 TEST TEST pin, equipped with Pull-down function
6 IN Clock input pin (28.6363 MHz input)

(BU3072HFV)

1：VDD

2：VSS

3：OUT

IN

　　6：

SEL

　　5：

　　4：PD

6pin:IN

5pin:SEL

PLL

DATA1
DATA2

1/4

4pin:P D

PIN
NO.

1 VDD

2 VSS

3 OUT

4 PD

5 SEL

6 IN

Fig.91

PIN

name

Fig.92

Function

Power supply

GND

Clock output terminal (L:27.0000MHz, H:36.0000MHz)

Power-down (L: Hi-Z, H: enable), equipped with Pull-down function, output set to Hi-Z at disable

Output selection (L: 27.0000 MHz, H: 36.0000 MHz)

Clock input pin (48.0000 MHz input)

(BU3073HFV)

1：VDD

2：VSS

3：OUT

Fig.93

IN

　　6：

SEL

　　5：

　　4：PD

6pin:IN

5pin:SEL

4pin:PD

PLL

DATA1
DATA2

1/8

Fig.94

PIN
NO.

1 VDD

2 VSS

3 OUT

4 PD

5 SEL

6 IN

PIN

name

Function

Power supply

GND

Clock output terminal (L:24.3750MHz, H:24.5454MHz)

Power-down (L: disable, H: enable), equipped with Pull-down function, output set to L at disable

Output selection (L:24.3750MHz, H:24.5454MHz)

Clock input pin (48.0000MHz input)

Technical Note

3pin:OUT

3pin: OUT

3pin:OUT

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14/21

2009.04 - Rev.A

BU3071HFV,BU3072HFV,BU3073HFV,BU3076HFV,BU7322HFV,BU7325HFV

(BU3076HFV)

1:VD D

2:VSS

3:OU T

6:IN

5：SEL

4：OE

PIN
NO.

1 VDD

2 VSS

3 OUT

4 OE

5 SEL

6 IN

Fig.95 Fig.96

PIN

name

Power supply

GND

Clock output terminal (L:54.0000MHz, H:67.5000MHz)

Power-down (L: disable, H: enable), equipped with Pull-down function, output set to L at disable

Output selection (L:54.0000MHz, H:67.5000MHz)

Clock input pin (27.0000MHz input)

6pin:IN

5pin:SEL

4pin:OE

Function

PLL

DATA1
DATA2

1/4

(BU7322HFV)

1:VD D

2:VSS

3:OU T

6:IN

5：SEL

4：OE

6pin:IN

5pin:SEL

PLL

DATA1
DATA2

1/6
1/8

4pin:OE

PIN
NO.

1

2

3

4

5

6

Fig.97

PIN

name

VDD

VSS

OUT

OE

SEL

IN

Fig.98

Function

Power supply

GND

Clock output terminal (L:49.5000MHz, H:36.0000MHz)

Power-down (L:disable ,H:enable) equipped with Pull-down function, disable output set to L at disable

Output selection (L:49.5000MHz, H:36.0000MHz) equipped with Pull-down function

Clock input pin (27.0000MHz input)

(BU7325HFV)

1:VD D

2:VSS

3:OU T

6:IN

5：SEL

4：OE

6pin:IN

5pin:SEL

PLL

DATA1
DATA2

1/6
1/4

PIN
NO.

1
2
3
4
5
6

Fig.99

PIN

name

VDD Power supply
VSS GND
OUT Clock output terminal (L:48.0000MHz, H:78.0000MHz)

OE Power-down (L:disable ,H:enable) equipped with Pull-down function, disable output set to L at disable

SEL Output selection (L:48.0000MHz, H:78.0000MHz)

IN Clock input pin (27.0000MHz input)

4pin:OE

Fig.100

Function

Technical Note

3pin:OUT

3pin:OUT

3pin:OUT

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© 2009 ROHM Co., Ltd. All rights reserved.

15/21

2009.04 - Rev.A

BU3071HFV,BU3072HFV,BU3073HFV,BU3076HFV,BU7322HFV,BU7325HFV

Technical Note

●Application circuit example

(BU3071HFV) (BU3072HFV)

54.0000MHz

1：VDD

2：VSS

3：OUT

Fig.101

　　6：

　　5：

　　4：

IN

TEST

OE

28.6363MHz

H:enable

L:disable

H:36.0000MHz
L:27.0000MHz

1：VDD

2：VSS

3：OUT

　　6：

　　5：

　　4：

Fig.102

IN

SEL

PD

48MHz

H:36.0000MHz

L:27.0000MHz

H:enable

L:Hi-Z

(BU3073HFV) (BU3076HFV)

H:24.5454MHz
L:24.3750MHz

1：VDD

2：VSS

3：OUT

　　6：

　　5：

　　4：

SEL

PD

H:24.5454MHz

L:24.3750MHz

48MHz

IN

Fig.103 Fig.104

H:enable

L:disable

H:67.5000MHz
L:54.00000MHz

27MHz

1:VDD

2: VSS

3: OUT

6: IN

5: SEL

4: OE

H:67.5000MHz

L:54.0000MHz

H:enable

L:disable

(BU7322HFV) (BU7325HFV)

H:36.0000MHz
L:49.5000MHz

27MHz

1:VDD

2: VSS

3: OUT

6: IN

5: SEL

4: OE

Fig.105 Fig.106

H:36.0000MHz

L:49.5000MHz

H:enable

L:disable

H:78.0000MHz
L:48.0000MHz

1:VDD

2: VSS

3: OUT

6: IN

5: SEL

4: OE

27MHz

H:78.0000MHz

L:48.0000MHz

H:enable

L:disable

 For VDD and VSS, insert a bypass capacitor of approx. 0.1 µF as close as possible to the pin.
 Bypass capacitors with good high-frequency characteristics are recommended.
 Even though we believe that the typical application circuit is worth of a recommendation, please be sure to thoroughly recheck the characteristics before use.

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16/21

2009.04 - Rev.A

BU3071HFV,BU3072HFV,BU3073HFV,BU3076HFV,BU7322HFV,BU7325HFV

●Equivalent circuit

3-pin (Output pin)

4-pin (Input pin)

Fig.107

BU3071HFV, BU3073HFV, BU3076HFV

BU7322HFV, BU7325HFV

Fig.109

From the inside of IC

Fig.108

BU3072HFV

To the inside of IC

Technical Note

From the inside of IC

PD=L ; Hi-Z
; enable

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© 2009 ROHM Co., Ltd. All rights reserved.

17/21

2009.04 - Rev.A

BU3071HFV,BU3072HFV,BU3073HFV,BU3076HFV,BU7322HFV,BU7325HFV

5-pin (Input pin)

BU3072HFV, BU3073HFV, BU3076HFV

6-pin (Input pin)

Fig.110

BU7322HFV, BU7325HFV

To the inside
of IC

To the inside
of IC

Fig.112

BU3072HFV, BU3073HFV, BU3076HF

BU7322HFV, BU7325HFV

To the inside of IC

To the inside of IC

Fig .111

BU3071HFV

From the inside of IC

To the inside of IC

To the inside of IC

Fig.113

BU3071HFV

Technical Note

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© 2009 ROHM Co., Ltd. All rights reserved.

18/21

2009.04 - Rev.A

BU3071HFV,BU3072HFV,BU3073HFV,BU3076HFV,BU7322HFV,BU7325HFV

●Appearance of Marker

3.0±0.1

0.75MAX

・List of markers

2.6±0.1

Model name Marker

BU3071HFV AB

BU3072HFV AC

BU3073HFV AD

BU3076HFV AA

BU7322HFV AE

BU7325HFV AH

(Dimension including burr: Max. 1.8)

1.6±0.1

○ ○

(Dimension including burr: Max. 2.8)

0.5

0.22±0.05

Marker

LOT No.

Fig.114

(1.2)

(1.4)

(0.45)

(1.5)

(0.15)

(UNIT：mm)

Technical Note

0.145±0.05

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© 2009 ROHM Co., Ltd. All rights reserved.

19/21

2009.04 - Rev.A

BU3071HFV,BU3072HFV,BU3073HFV,BU3076HFV,BU7322HFV,BU7325HFV

●Notes for use

1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as applied voltage (VDD or VIN), operating temperature range (Topr),
etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit.
If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical
safety measures including the use of fuses, etc.

2) Recommended operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.

3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown
due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply
terminal.

4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines.
In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has
the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus
suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the
wiring patterns. For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At
the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to
be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the
constant.

5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.

6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.

7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.

8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig.
After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition,
for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the
transportation and the storage of the set PCB.

9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a
voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to
the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.

10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.

11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.

will cause no fluctuations in voltages of the

Technical Note

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© 2009 ROHM Co., Ltd. All rights reserved.

20/21

2009.04 - Rev.A

BU3071HFV,BU3072HFV,BU3073HFV,BU3076HFV,BU7322HFV,BU7325HFV

●Ordering part number

B U 3 0 7 1 H F V - T R

Technical Note

Part No. Part No.

HVSOF6

1.6±0.1

(MAX 1.8 include BURR)

456

0.1

3.0±0.1

2.6±

(MAX 2.8 include BURR)

0.75Max.

(1.2)

(1.4)

321

S

0.1 S

0.22±0.05

0.5

3071,3072,3073
3076,7322,7325

(1.5)

(0.45)

(0.15)

0.145±0.05

(Unit : mm)

Package

HFV : HVSOF6

<Tape and Reel information>

Embossed carrier tapeTape

Quantity

Direction
of feed

3000pcs
TR

The direction is the 1pin of product is at the upper right when you hold

()

reel on the left hand and you pull out the tape on the right hand

Reel

Packaging and forming specification
TR: Embossed tape and reel

1pin

Direction of feed

Order quantity needs to be multiple of the minimum quantity.

∗

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© 2009 ROHM Co., Ltd. All rights reserved.

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2009.04 - Rev.A

Notes

No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.

The content specied herein is subject to change for improvement without notice.

The content specied herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specications,
which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information specied in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.

The technical information specied herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other par ties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.

Notice

The Products specied in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, ofce-automation equipment, commu­nication devices, electronic appliances and amusement devices).

The Products specied in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, re or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machiner y, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology specied herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.

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