System Lens Driver Series for Mobile Phone Cameras
Parallel Interface Type
Lens Drivers for Voice Coil Motor
BD6883GUL,BH6453GUL,BD6886GUL,BD6369GUL
No.12015EAT02
●Description
The BD6883GUL, and the BH6453GUL motor driver provide 1 Constant-Current Driver Half-bridge, and 1 Constant-Voltage
Driver Half-bridge channel. The BD6886GUL, and the BD6369GUL motor driver provide 1 Constant-Voltage Driver H-bridge
channel. These lens drivers are offered in an ultra-small functional lens system for use in an auto focus system using a
Voice Coil motor.
Power supply voltage VCC -0.5 to +6.5 -0.5 to +4.5 -0.5 to +6.5 -0.5 to +6.5 V
Motor power supply voltage VM - - -0.5 to +6.5 -0.5 to +6.5 V
Control input voltage VIN -0.5 to VCC+0.5-0.5 to VCC+0.5-0.5 to VCC+0.5 -0.5 to VCC+0.5V
Input voltage for
Constant-Voltage setting
Input voltage for
Constant-Current setting
Power dissipation Pd 510
Operating
temperature range
VLIM -0.5 to VCC+0.5- -0.5 to VM+0.5 -0.5 to VM+0.5V
CLIM - -0.5 to VCC+0.5- - V
1
※
430
2
※
730
3
※
730
3
※
mW
Topr -25 to +85 -25 to +85 -25 to +85 -25 to +85 °C
Junction temperature Tjmax +150 +125 +150 +150 °C
Storage temperature range Tstg -55 to +150 -55 to +125 -55 to +150 -55 to +150 °C
H-bridge output current Iout -200 to +200
1
※
Reduced by 4.08mW/°C over 25°C, when mounted on a glass epoxy board (50mm 58mm 1.75mm; 8 layers).
2
※
Reduced by 4.30mW/°C over 25°C, when mounted on a glass epoxy board (50mm 58mm 1.75mm; 8 layers).
3
※
Reduced by 5.84mW/°C over 25°C, when mounted on a glass epoxy board (50mm 58mm 1.75mm; 8 layers).
4
※
Must not exceed Pd, ASO, or Tjmax of 150°C.
5
※
Must not exceed Pd, ASO, or Tjmax of 125°C.
4
※
-300 to +300
5
※
-200 to +200
4
※
-500 to +500
4
※
mA
●Operating Conditions
Parameter Symbol
BD6883GUL BH6453GUL BD6886GUL BD6369GUL
Limit Unit
Power supply voltage VCC +2.5 to +5.5 +2.3 to +3.6 +2.5 to +5.5 +2.5 to +5.5 V
Motor power supply voltage VM - - +2.5 to +5.5 +2.5 to +5.5 V
Control input voltage VIN 0 to VCC 0 to VCC 0 to VCC 0 to VCC V
Input voltage for
Constant-Voltage setting
Input voltage for
Constant-Current setting
H-bridge output current Iout -150 to +150
6
※
Must not exceed Pd or ASO.
VLIM 0 to VCC - 0 to VM 0 to VM V
CLIM - 0 to VCC - - V
6
※
-200 to +200
6
※
-150 to +150
6
※
-400 +400
6
※
mA
●Power Dissipation Reduction
510
430
265
172
Power Dissipation:Pd[mW]
0 25 85 150
Ambient Temperature:Ta[ ° C]
Fig.1 BD6883GUL Power Dissipation Reduction Fig.2 BH6453GUL Power Dissipation Reduction
730
Power Dissipation:Pd[mW]
0
25 85
Ambient Temperature:Ta[ ° C ]
730
125
380
380
Power Dissipation:Pd[mW]
0
25
Ambient Temperature:Ta[ ° C]
Fig.3 BD6886GUL Power Dissipation Reduction Fig.4 BD6369GUL Power Dissipation Reduction
Circuit current 1 ICC - 0.9 1.4 mA PS=3V, with no signal
Circuit current 2 IM - 0.4 0.65 mA PS=3V, VLIM=5V, no load
Control input (VIN=INA, INB, SEL, PS)
High-level input voltage VINH 2.0 - VCC V
Low-level input voltage VINL 0 - 0.7 V
High-level input current IINH 15 30 60 μA VINH=3V
Low-level input current IINL -1 0 - μA VINL=0V
Pull-down resistor RIN 50 100 200 kΩ
Input for Constant-Voltage setting
Input current IVLIM -1.5 -0.5 - μA VLIM=0V
UVLO
UVLO voltage VUVLO 1.6 - 2.4 V
Constant-Voltage Drive block
Output ON-Resistance RON - 0.80 1.20 Ω
Output high-level voltage VOH 1.9×VLIM2.0×VLIM2.1×VLIMV VLIM=1V with 10Ω load
Output AC characteristic
Turn-on time ton - 1.5 5 μs Io=±150mA with 10Ω load
Turn-off time toff - 0.1 2 μs Io=±150mA with 10Ω load
Rise time tr - 2 8 μs Io=±150mA with 10Ω load
Fall time tf - 0.05 1 μs Io=±150mA with 10Ω load
1A N.C. N.C. 1CPGND Motor ground pin
2A OUTA H-bridge output pin A 2CVLIM Output high-level voltage setting pin
3A PS Power-saving pin 3CSEL Control input mode selection pin
4A N.C. N.C. 4CVCC Power supply pin
1B VM Motor power supply pin 1DN.C. N.C.
2B 2DOUTB H-bridge output pin B
3B INB Control input pin B 3DGND Ground pin
4B INA Control input pin A 4DN.C. N.C.
1) Power-saving function (all series)
When the L voltage is applied the PS pin, the IC’s inside circuit stop, and when 0V applied, the circuit current became
0μA(Typ.), especially.
When the IC drive, serial input while the PS pin applied H voltage. (See the electrical characteristics; P.3, 4, 5/16)
2) Control Input Pin
(Ⅰ)IN pin (BD6883GUL, BH6453GUL)
The IN pin is used to program and control the motor drive modes.
(See the electrical characteristics; P3, 4/16, and the I/O Truth Table; P12/16)
(Ⅱ)INA, INB, SEL pins (BD6886GUL, BD6369GUL)
The INA and INB are used to program and control the motor drive modes.
When the L voltage is applied to the SEL pin, the I/O logic can be set to EN (Enable)/IN mode, and when the H voltage is applied
to the one, the I/O logic can be set to IN/IN mode. (See the electrical characteristics; P5/16, and the I/O Truth Table; P12/16)
3) H-bridge and Half-bridge on the output stage (ALL series)
Specify maximum current applied to the H-bridge and Half-bridge within the operating range, in consideration of power dissipation.
(See the Operating Conditions; P.2/16)
4) Drive system of Linear Constant-Voltage H-bridge (BD6883GUL, BD6886GUL, and BD6369GUL)
To set up the output H voltage, when the voltage input to the VLIM pin, the output H voltage is two times as high as the voltage.
(Ⅰ)BD6883GUL
The output H voltage VOH [V] = 2.0×VLIM [V] (When VLIM [V] > , Output H voltage is about VCC voltage)
(Ⅱ)BD6886GUL, BD6369GUL
The output H voltage VOH [V] = 2.0×VLIM [V] (When VLIM [V] > , Output H voltage is about VM voltage)
For example, the output voltage is 2.0V±5%, if 1.0V is applied to the VLIM pin.
If the VLIM pin is shorted to the VM pin (or the same voltage level as the VM is applied), you can be used as a Full-ON Drive
H-bridge.
VCC [V]
2
VM [V]
2
5) Drive system of Linear Constant-Current H-bridge (BH6453GUL)
To detect the output current and the output current settings
The BH6453GUL built in resistor for output current detect. The output current is kept constant by comparing it with the CLIM
voltage. In addition, impress a highly accurate voltage form the outside of IC to the CLIM terminal, when you do the output current
setting accuracy or more good.
Output current I
SINK
[A] =
CLIM [V]
2×2(Typ) [Ω]
If the CLIM pin applied 0.8V, Output current is 200mA±10%.
7) Setting of PWM signal input VLIM and CLIM terminals (all series)
It is also possible to compose filters outside the IC, change an input voltage for output voltage and output current setting terminals
such as VLIM and CLIM terminals by the DUTY control using an PWM signal, etc., and use them as set values for control.
In this case, however, ensure the smoothing of the signals, heeding the constant number of the low-pass filter as stated below.
A cutoff frequency F
Cutoff frequency F
Set the cutoff frequency F
For example, if the cutoff frequency F
above:
Cutoff frequency F
When C
=0.1[μF], according to the formula above:
IN
R
INA
Where, an effective value of PWM signal as a DC current, according to crest values V
is as follows:
V
PWM
An actual voltage V
is as follows according to resistance potential division of R
V
LIM
For example, when an PWM signal with crest values V
above is:
V
LIM
(Ⅰ)BD6883GUL, BD6886GUL, and BD6369GUL
Where, to specify an output voltage VOH=2[V], a value VLIM=1.0[V] according to the formula in the previous page. And then,
according to the formula above, VLIM=1.0[V].
VLIM=1.0[V]=V
Therefore, R
INA
⑩
According to ⑥ and ⑩, R
(Ⅱ)BH6453GUL
Where, to specify an output current I
③, CLIM=0.4[V], and according to the formula above ⑨:
CLIM=0.4[V]=V
R
INA
According to ⑥ and ⑪: R
V
MAX
V
PWM
(-3dB attenuation frequency) of the low-pass filter in Fig25 is calculated by the formula mentioned below.
C
[Hz] = [Hz]
C
at 1/100 or below of the PWM frequency F
C
[Hz] =
C
//R
=3.2[kΩ]
INB
[V]= V
[V]= ×V
[V]= × 3[V]× 50[%]
=0.5R
=2.75R
[V]× ON DUTY[%]
MAX
input to terminals that specify output current and voltages, such as VLIM and CLIM terminals
LIM
R
INB
R
R
INB
INB
INA+RINB
R
INB
INA+RINB
R
INB
= ×3[V]×50[%]
LIM
R
INA+RINB
・・・・・
=4.8kΩ, R
INA
SINK
R
= ×3[V]×50[%]
LIM
F
PWM
INB
R
INA+RINB
=11.9kΩ, R
INA
1
2πC
(R
//R
INA
INB
)
when the PWM frequency F
PWM
IN
is set at 1/100 of F
C
1
2πC
(R
//R
)
INA
INB
=3[V] and DUTY [%]=5[%] is input, a V
MAX
PWM
IN
[V]
=9.6kΩ.
INB
=100[mA], the following formula is derived according to the formula in the previous page
=4.3kΩ
INB
R
INA
V
R
INB
Fig.25 Example PWM signal input
Technical Note
.
PWM
=50[kHz], according to the formula
PWM
1
= ×F
100
and R
INA
Output voltage / Constant current voltage terminals
L: Low, H: High, X: Don’t care, Z: Hi impedance
Sink is a direction of current flowing into the driver, and Source is a direction of current flowing out the driver.
When it is sink, which drive FULL ON.
7
※
Z at the Constant-Voltage driver output L voltage for connect feedback resistance (20kΩ Typ.) for output H voltage setting between OUT pin and GND.
But output Power MOS is OFF condition.
INPUT OUTPUT
PS IN OUT
OUTPUT MODE
L L Sink
H H Source
7
※
Standby
BH6453GUL I/O Truth Table
MODE
- H
INPUT OUTPUT
PS IN OUT
OUTPUT MODE
H L Sink
L H Source
- L X Z Standby
L: Low, H: High, X: Don’t care, Z: Hi impedance
Sink is a direction of current flowing into the driver, and Source is a direction of current flowing out the driver.
When it is source, which drive FULL ON.
BD6886GUL, BD6369GUL I/O Truth Table
MODE
EN/IN
PS SEL INA INB OUTA OUTB
INPUT OUTPUT
L X Z
L
H L H L Forward rotation
※
H H L H Reverse rotation
H
IN/IN H
- L X X X Z
L: Low, H: High, X: Don’t care, Z: Hi impedance
At forward rotation, current flows from OUTA to OUTB. At reverse rotation, current flows from OUTB to OUTA.
8
※
Z at the Constant-Voltage driver output L voltage for connect feedback resistance (20kΩ Typ.) for output H voltage setting between OUT pin and GND.
But output Power MOS is OFF condition.
L L L L Brake
L H L H Reverse rotation
H L H L Forward rotation
H H Z
1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings, such as the applied voltage (VCC, VM) or operating temperature
range (Topr), may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or
open mode) when such damage is suffered. A physical safety measure, such as a fuse, should be implemented when
using the IC at times where the absolute maximum ratings may be exceeded.
2) Storage temperature range (Tstg)
As long as the IC is kept within this range, there should be no problems in the IC’s performance. Conversely, extreme
temperature changes may result in poor IC performance, even if the changes are within the above range.
3) Power supply and wiring
Be sure to connect the power terminals outside the IC. Do not leave them open. Because a return current is
generated by a counter electromotive force of the motor, take necessary measures such as putting a Capacitor
between the power source and the ground as a passageway for the regenerative current. Be sure to connect a
Capacitor of proper capacitance (0.1μF to 10μF) between the power source and the ground at the foot of the IC, and
ensure that there is no problem in properties of electrolytic Capacitors such as decrease in capacitance at low
temperatures. When the connected power source does not have enough current absorbing capability, there is a
possibility that the voltage of the power source line increases by the regenerative current an exceeds the absolute
maximum rating of this product and the peripheral circuits.
Therefore, be sure to take physical safety measures such as putting a zener diode for a voltage clamp between the
power source an the ground.
4) Ground terminal and wiring
The potential at GND terminals should be made the lowest under any operating conditions. Ensure that there are no
terminals where the potentials are below the potential at GND terminals, including the transient phenomena. The
motor ground terminals PGND, and the small signal ground terminal GND are not interconnected with one another
inside the IC. It is recommended that you should isolate the large-current RNF pattern and PGND pattern from the
small-signal GND pattern, and should establish a one-point grounding at a reference point of the set, to avoid
fluctuation of small-signal GND voltages caused by voltage changes due to pattern wire resistances and large
currents. Also prevent the voltage variation of the ground wiring patterns of external components. Use short and thick
power source and ground wirings to ensure low impedance.
5) Thermal design
Use a proper thermal design that allows for a sufficient margin of the power dissipation (Pd) at actual operating
conditions.
6) Pin short and wrong direction assembly of the device.
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if positive and ground power supply terminals are reversed. The IC may also be damaged if pins
are shorted together or are shorted to other circuit’s power lines.
7) Avoiding strong magnetic field
Malfunction may occur if the IC is used around a strong magnetic field.
8) ASO
Ensure that the output transistors of the motor driver are not driven under excess conditions of the absolute maximum
ratings and ASO.
9) TSD (Thermal Shut Down) circuit
If the junction temperature (Tjmax) reaches 175°C (but the BH6453GUL is 150°C), the TSD circuit will operate, and
the coil output circuit of the motor will open. There is a temperature hysterics of approximately 25°C (but the
BH6453GUL is 20°C). The TSD circuit is designed only to shut off the IC in order to prevent runaway thermal
operation. It is not designed to protect the IC or guarantee its operation. The performance of the IC’s characteristics is
not guaranteed and it is recommended that the device is replaced after the TSD is activated.
When testing the IC on an application board, connecting a Capacitor to a pin with low impedance subjects the IC to
stress. Always discharge Capacitors after each process or step. Always turn the IC's power supply off before
connecting it to, or removing it from a jig or fixture, during the inspection process. Ground the IC during assembly
steps as an antistatic measure. Use similar precaution when transporting and storing the IC.
11) Regarding the input pin of the IC
This monolithic IC contains P
+
isolation and P substrate layers between adjacent elements to keep them isolated. P-N
junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic
diode or transistor. For example, the relation between each potential is as follows:
When GND > Pin A, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic diode and transistor.
Parasitic elements can occur inevitably in the structure of the IC. The operation of parasitic elements can result in
mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic
elements operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should
not be used.
※When you order , please order in times the amount of package quantity.
16/16
1Pin
Direction of feed
2012.03 - Rev.
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illustrate the standard usage and operations of the Products. The peripheral conditions must
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