System Switching Regulator ICs
with Built-in FET (10V)
BD9739KN, BD9740KN
●Description
The 7-channel switching regulators include built-in FETs, and are designed for use in digital still cameras.
They feature built-in power FETs and soft start functionality, reducing the number of external components.
●Features
1) Wide supply voltage range: 1.5 V to 10 V
2) High-precision reference voltage: ± 1%
3) Built-in shutdown circuit for overload (timer-latch type)
4) Oscillator frequency is user-adjustable
5) Built-in thermal shutdown circuit
6) Standby mode current: 0 μA
7) Built-in load switch circuit
8) Selectable step-up/step-down mode
9) Supports inverting circuit for negative output voltage
10) Support a constant-current LED drive for backlight applications
11) Includes multiple synchronous rectification channels
●Applications
Digital still cameras, portable DVD players, and digital video cameras.
●Product lineup
No.10036EAT07
Parameter BD9739KN BD9740KN
Input voltage 1.5 V to 10 V 1.5 V to 10 V
Reference voltage precision 1 V ± 1% 1 V ± 1%
Operating frequency range 100 k to 1.2 MHz100 k to 1.2 MHz
Step-up 3CH 2CH
Step-down 2CH 1CH
Step-up/step-down switch regulator 1CH 3CH
Inverting 1CH 1CH
Built-in FET 3CH 1CH
Synchronous rectification 3CH 2CH
Load switching 3CH —
Operating temperature range -20℃ to +85℃ -20℃ to +85℃
Package UQFN64 UQFN48
OUT1B -0.3 to +20 -0.3 to +20 V
OUT2B -0.3 to +17 ― V
SWOUT1,4,PGIN1,PG2,3-0.3 to +12 ― V
SWIN* -0.3 to +20 ― V
UQFN64 UQFN48
Power dissipation Pd
550
1000
*1-2
*2-2
500
760
Operating temperature range Topr -25~+85 ℃
Storage temperature range Tstg -55~+125 ℃
Junction temperature T
*1: IC without heat sink operation. Reduce by 5.5 mW/℃ (1-2), or 5.0 mW/℃ (1-3) when Ta ≥ 25℃.
*2: When mounted on a PCB (70 mm 70 mm 1.6 mm (thickness), glass epoxy).
Reduced by 10.0 mW/℃ (2-2), or 7.6 mW/℃ (2-3), when Ta ≥ 25℃.
+125 ℃
jmax
●Recommended operating ranges
Parameter Symbol
BD9739KNBD9740KN
Ratings
VBAT 1.5 to 10 1.5 to 10 V
Supply voltage
VCC, PVCC 1.5 to 10 2.8 to 10 V
PVCCL, PVCCH 4.0 to 14 4.0 to 14 V
Parameter Symbol
Min. Typ. Max.
Ratings
Unit Conditions
[Oscillator]
Oscillating frequency f
0.1 — 1.2 MHz
OSC
[Driver block]
DRAIN pin input voltage V
N-channel FET output current
(step-down)
N-channel FET output current
(step-up)
LED channel output current I
Driver output current I
Driver peak current I
Startup NPN TR sink current I
— — 10 V
DRAIN
— — 700 mA
I
OFET1
— — 300 mA
I
OFET2
— — 40 mA
OLED
— — 30 mA External FET drive circuit
OUT
— — 200 mA External FET drive circuit
PEAK
— — 500 mA
NPNSINK
[Positive/negative regulators]
SWOUT1 pin sink current I
PGOUT1 pin source current I
PG23 pin sink current I
SWOUT4 pin source current I
SWOUT6 pin source current I
SWOUT7 pin source current I
[Reference voltage, reference voltage for inverting]
Output voltage V
0.99 1.0 1.01 V
REF2
Line regulation DVLI -4.0 12.5 mVVCC = 3.0 V to 9.5 V
Load regulation DVLO -1.0 7.5 mVIREF = 10 μA to 100 μA
Output current when shorted IOS 0.2 1 -mAVREF = 0 V
[Internal regulator]
Output voltage REGA V
2.4 2.5 2.6 V IREG = 1 mA
REGA
[Under voltage lockout circuit]
Detection threshold voltage 1 V
Hysteresis width 1 ΔV
Detection threshold voltage 2 V
Hysteresis width 2 ΔV
Detection threshold voltage 3 V
Hysteresis width 3 ΔV
3.45 3.6 3.75 V PVCCL monitor
STD1
- 300 - mV
ST1
2.3 2.4 2.5 V VCC monitor
STD2
- 200 - mV
ST2
- 2.0 - V VREGA monitor
STD3
- 50 - mV
ST3
[Startup circuit block]
Oscillating frequency f
Operation start VBAT voltage V
Soft start charge current I
50 120 220 kHz
START
1.5 - -V VBAT pin monitor
ST1
1.1 2.2 3.3 µAVSS1 = 0 V
SS1
[Short protection circuit ]
Timer threshold voltage VTC 2.1 2.2 2.3 V FB pin monitor
SCP pin source current I
SCP pin detection voltage V
SCP pin standby voltage V
SCP
TSC
SSC
0.5 1.0 1.5 µAVSCP = 0.1 V
2 4 6 (BD9740KN)
0.45 0.50 0.55 V
0.9 1.0 1.1 (BD9740KN)
- 22 170 mV
[Triangular waveform oscillator]
Oscillating frequency f
450 500 550 kHzRT = 11 k, CT = 180 pF
OSC1
Frequency stability Df -0.3 2 % VCC = 3.0 V to 9.5 V
RT pin voltage VRT 0.78 1.00 1.22 V
[Soft start 23 block] (BD9738KN, BD9739KN)
Soft start charge current I
5 10 15 µAVSS23 = 0 V
SS23
[Error amp]
Low-level output voltage VOL - 1.3 -V INV = 2 V
High-level output voltage VOH V
- 0.3- -V INV = 0 V
REGA
Output sink current IOI 36 72 -µAFB = 1.7 V, VINV = 1.1 V
Output source current IOO 36 72 -µAFB = 1.7 V, VINV = 0.9 V
DTC pin upper resistance R
DTC pin lower resistance R
NON pin input range I
Non-inverted pin reference volt age V
20 30 40 kΩ(BD9740KN)
DTCU
65 95 125 kΩ(BD9740KN)
DTCD
-0.3 - 1.5 V
RES
- 0.2 - V
NON7
[PWM comparator]
V
- 1.49 - V 0% duty
Input threshold voltage
MAX DUTY D
MAX DUTY (step-up operation) D
T0
V
- 1.95 - V 100% duty
T100
77 85 93 % VINV = 0.9 V, VSCP = 0 V
MAX1
77 85 93 %
MAX2
VINV = 0.9 V,
VSCP, UDSEL = 0 V
[Output circuit]
High-level output voltage V
Low-level output voltage V
UnitConditions
[Power on switching block] (BD9739KN)
SWOUT1
SWOUT4
SWOUT4,6
SWOUT7
Output voltage V
Leak current I
Output voltage V
Leak current I
Output voltage V
Leak current I
Output voltage V
Leak current I
-0.1 0.3 V IO = 1 mA
SAT
-0 5 µASTB = 0 V
LEAK
-0.1 0.3 V IO = 100 μA
SAT
-0 5 µASTB = 0 V
LEAK
V
SAT
-0 5 µASTB = 0 V
LEAK
V
SAT
-0 5 µASTB = 0 V
LEAK
SWIN6
SWIN7
- 0.3 V
- 0.3 V
- 0.1- V
SWIN6
- 0.1- V
SWIN7
IO = 20 mA
VSWIN = 5 V
IO = 10 mA
VSWIN = 10 V
[Soft start block] (BD9740KN)
VCC = PVCC = 5V,
mse
Soft start time of CH4 T
Soft start time of CH2, 3 T
CH2, CH3 soft start
INV4 threshold voltage at start
1.8 3.6 6.0
SS1
1.8 3.6 6.0
SS2
V
0.72 0.80 0.88 V
PG4
PVCCH = 5.0V
c
STB 0→3 V
VCC = PVCC = 5V,
mse
STB = 3 V
c
INV4 = 0→1.2 V
VCC = PVCC = 5 V
PVCCH = 5.0 V
[STB1 to STB7]
STB pin control voltage
ON V
OFF V
STB pin pull-down resistance R
2.0 - 11 V STB
STBH
-0.3 - 0.3 V
STBL
250 400 700 kΩSTB
STB
[Circuit current]
Standby current 1
(VBAT pin sink current)
Standby current 2
(VCC, PVCC pin sink current)
Circuit current at startup
(VBAT pin sink current)
Circuit current 1
(VBAT pin sink current)
Circuit current 2
(VCC, PVCC pin sink current)
Note: This IC is not designed to be radiation-resistant.
I
--5 µASTB1 to STB7 = 0 V
STB1
--5 µASTB1 to STB7 = 0 V
I
STB2
I
- 30 100 mA
ST
-100 300 µACT = 1.7 V
I
CC1
I
- 5 15 mA
CC2
CT = 1.7 V
VCC = 0 V
CT = 1.7 V
INV = 2.5 V
●PVCCH and PVCCL input voltages
PVCCH
Synchronous rectification channels with built-in FETs include, N-channel FETs
for both the high-side and low-side configuration. The driver block's power
source is supplied to the PVCCL pin for the low-side and the PVCCH pin for
PVCCL
the high-side. (For the BD9740KN, both sides are supplied to the PVCCH pin.)
In order to turn the FET on, a potential of at least 4 V must be supplied to the
DRAINH
PVCCL pin, and a potential of at least, DRAINH pin voltage + 4 V, must be
supplied to the PVCCH pin.
Note:
DRAINL
The breakdown voltage for the PVCCL and PVCCH pins is 15 V.
For applications that with voltages exceeding 15 V, add a zener diode, or other
Vo
components, to provide overvoltage protection.
Shorting the DRAINH pin with the ground, while a charge remains in the output
capacitor, may cause unexpected current flow, resulting in damage to the IC.
PGND
Add an external protective diode for applications where this possibility exists.
●Block diagram explanation and setting periphera l IC components
1. Voltage reference (VREF)
VREF is the reference voltage source of 1.0V output voltage.
Connect a capacitor to prevent oscillation. Set the capacitance from 1.0 μF to 10 μF.
2. REGA
REGA and REGD are regulators with output voltages of 2.5 V. REGA is used as the power supply for the IC's internal
blocks.Connect a capacitor to prevent oscillation. Set the capacitance from 4.7 μ to 10 μF.
3. UDSEL
To enable step-up mode, connect VCC to the UDSEL pin. To enable step-up mode connect 0V to the UDSEL pin.
When using the startup circuit, set the pin to step-up mode. Because the pin uses COMS inverter input, you must connect
the pin to either GND or VCC in order to prevent undefined input.
4. On/off logic
The voltage applied to the STB pins can be controlled whether each channel is on or off.
CH1, CH4, and CH5 can be controlled independently, while CH2 and CH3 can be controlled simultaneously.
Applying a voltage of over 2 V turns on the corresponding channel(s), while leaving the pin open or app lying 0 V turns off
the corresponding channel(s).
Turning off all channels causes the IC to be in a standby state.
Each pin is connected to GND by a 400 k pull-down resistor.
5. Setting the short protection detection time
The detection time can be set when the capacitor is connected to the SCP pin.
When the detection time is reached, the latch circuit operates, turning off the output for all channels.
To reset the latch circuit, turn all STB pins off, and then back on again.
6. Setting the oscillating frequency
The oscillating frequency can be set by connecting the res istance value to the RT pin and connecting the capacitance
value to the CT pin.
Oscillating frequency = VRT / (CT RT) (Unit: Hz)
*Set the resistance value, connected to the RT pin, from 4.7 k to 30 k
*Set the capacitance value, connected to the CT pin, from 100 pF to 10,000 pF.
Fig. 4 Oscillating Frequency Versus RT Pin Resistance
100pF
180pF
330pF
100
11kΩ
20kΩ
30kΩ
100
OSCILATING FREQUENCY: fosc [kHz]
100
CT pin CAPACITANCE [pF]
1000
Fig. 5 Oscillating Frequency Versus CT Pin Capacitance
7. Startup channel soft-start operation
The startup channel's soft start can be controlled by the capacitor connected to the SS1 pin.
Times can be determined with the following equation:
Startup time (sec) = (VSS / ISS) CSS
(VSS = SS pin voltage [= 0.7 V], ISS = soft start charge current [= approximately 2.0 μA]; CSS = capacitor capacitance)
Example: When CSS = 0.01 μF, startup time = 0.7 / (2.0 10-6) (0.01 10-6) = 3.5 ms
*Set the capacitance value, connected to the SS1 pin, from 0.001 μF to 2.2 μF.
VCC output voltage waveform
STBY1
SS1
(Startup block repeat
oscillation prohibited)
(Startup block Main)
Approximately
0.5 V
Approximately 1.0 V
Approximately 0.7 V
OSC
VCC
VREGA
SS pin voltage
waveform
Fig. 6 Startup Channel Startup Waveform
(Reference Data)
VCC
VREGA
OUT1B
DRAIN1L
Startup OSC
(approximately 100 kHz)
VREF=1.0 V
Fig. 7 Timing Chart
8. SWOUT1 pin (BD9734KN/BD9738KN/BD9739KN)
To prevent current from flowing from VOUT1 to the feedback resistor, during standby operation, connect the ground side of
CH1's feedback resistor to SWOUT1.
9. Soft start operation depending on SS pins (BD9739KN)
Soft start operation for CH2 and CH3 can be controlled by the capacitor connected to the SS23 pins.
Times can be determined with the following equation:Startup time (sec) = (VSS / ISS) CSS23
(VSS: SS pin voltage [= 1.0 V]; ISS: soft start charge current [= approximately 10 μA]; CSS: capacitance)
*Startup of CH2 begins when CH3 output reaches approximately 70%.
*Set the capacitance value, connected to each SS23 pin, from 0.005 μF to 1.0 μF.
10. Setting MAX DUTY
The DTC voltage is determined by the internal R1 and R2 resistance values. The DTC voltage can be changed by
connecting resistance values that are from 1 to 2 digits smaller than the internal R1 (30 k) and R2 (93 k) resistors, to
the RA and RB pins.
*The resistors connected to the RA and RB pins should be at least 5 k. Avoid shorting the VREGA and DTC pins.
*When VCC falls to 2.8 V or below, a protection circuit will operate to limit MAX DUTY in order to prevent the IC from
malfunctioning when VREGA (the internal circuit power supply) drops.
11. Soft start operation triggered by the DTC pin
Soft start operation can be set by connecting a capacitor to the DTC pin. Setting the STBY pin to high will cause the
capacitor connected to the DTC pin to be charged by the internal pull-up resistor.
Startup will begin when this voltage reaches the minimum voltage of the CT pin's triangular waveform.
*Set the capacitance connected to each DTC pin to 10 μF or less.
12. Internal soft start operation
Soft start times are set internally for CH4, CH6, and CH7 (BD9739KN); and CH2 to CH4 (BD9740KN).
BD9739KN CH4, 6, 7: 2.7 ms
BD9740KN CH2 to CH4: 3.6 ms
(Soft start operation of CH2 and CH3 is delayed until CH4 reaches approximately 80%.)
13. Setting the error amp feedba ck resistance
(1) Feedback resistance order (BD9739KN, BD9740KN)
Error amp differential input is formed by a PNP transistor, with the base current of this input flowing into the lower
voltage divider resistor. In the worst case, this current may reach 0.2 μA. For this reason, when the resistance of the
lower resistor is increased, the base current may cause an error in the output voltage. For example, resistance values
of 40 k, 20 k, and 10 k result in errors of 1%, 0.5%, and 0.25%, respectively. Refer to these values when setting
the resistance value.
(2) Setting the inverted channel (BD9739KN, BD9740KN)
For the BD9739KN, connect the CH5 error amp reference voltage (INV5) to the ground.
For the BD9740KN, the CH6 error amp reference voltage is grounded internally.
*It is recommended to use a 10 k resistor between VREF and CH5 output. Use a resistance value from 5 k to 20 k.
1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any
over rated values will expect to exceed the absolute maximum ratings, consider ad ding circuit protection devices, such as
fuses.
2) Reverse polarity co nnection of the power supply
Connecting the of power supply in reverse polarity can damage IC. Take precautions when connecting the power supply
lines. An external direction diode can be added.
3) Power supply lines
Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line,
separate the ground section and supply lines of the digital a nd analog bl ocks. F urthermore, for all p ower supply termina ls
to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the
circuit, note that capacitance characteristic values are reduced at low temperatures.
4) GND voltage
Ground-GND potential should maintain at the minimum ground voltage level. Furthermore, no terminals should be l ower
than the GND potential voltage including an electric transients.
5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
6) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if positive and ground power supply terminals are reversed. The IC may also be damaged if pins are
shorted together or are shorted to other circuit’s power lines.
7) Operation in a strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
8) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
9) Thermal shutdown circuit (TSD circuit)
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is
designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect the IC or guar antee its
operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of
this circuit is assumed.
10) Capacitors connected between output and ground pins
If a large capacitance value is connected between the output and ground pins, and if the VCC falls to 0 V or becomes
shorted with the ground pin, the current stored in the capacitor may flow to the output pin. This can cause damage to the
IC. Set capacitors connected between the output and ground pins to values that fall within the recommended range.
11) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to, or
removing it from a jig or fixture, during the inspection process. Ground t he IC during assembly steps as an antistatic
measure. Use similar precaution when transporting and storing the IC.
12) Reg arding input pin of the IC (Fig 11)
This monolithic IC contains P
junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or
transistor. For example, the relation between each potential is as follows:
When GND > Pin A and GND > Pin B, the P–N junction operates as a parasitic diode.
When Pin B > GND > Pin A, the P–N junction operates as a parasitic transistor.
Parasitic diodes can occur inevitably in the structure of the IC. The operation of parasitic diodes can result in mut ual
interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes
operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.
+
isolation and P substrate layers between adjacent elements to keep them isolated. P–N
13) Ground wiring patterns
The power supply and ground lines must be as short and thick as possible to reduce line impedanc e. Fluctuating voltage
on the power ground line may damage the device.
14) STB pin voltage
Set the STB pin voltage to 0.3 V or lower when setting channels to a standby state, or to 2.0 V or higher when setting
channels to an operational state. Do not lengthen transition times or fix the STB pin voltage to values h igher than 0.3 V or
lower than 2.0 V. Doing so may cause the IC to malfunction.
15) Common supply voltage
Use a common supply voltage for both the driver block and the main block. The IC is not compatible with applications
requiring the driver block to be used while applying user-selected voltages.
16) Setting the MAX DUTY
MAX DUTY limitations may not operate when using the IC at high frequencies. When using the IC in such applications ,
allow for sufficient margins when setting external components.
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