ROHM BD95371MUV Technical data

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STRUCTURE Silicon Monolithic Integrated Circuit
TYPE Step down DC/DC converter Controller IC for NOTE PC
PRODUCT SERIES

BD95371MUV

FEATURES ・Built in H3Reg DC/DC controller

・Switching Frequency Variable (f=200kHz～500kHz)

○ ABSOLUTE MAXIMUM RATINGS（Ta=25℃）

Parameter Symbol Limit Unit
Input Voltage 1 VCC 7
Input Voltage 2 VDD 7
Input Voltage 3 VIN 28
BOOT Voltage BOOT 35
BOOT-SW Voltage BOOT-SW 7
HG-SW Voltage HG-SW 7
LG Voltage LG VDD V
Output Voltage VOUT/Is+/Is- VCC V
EN Input Voltage EN 7
Power Dissipation 1 Pd1 0.34
Power Dissipation 2 Pd2 0.70
Power Dissipation 3 Pd3 2.20
Power Dissipation 4 Pd4 3.56
Operating Temperature Range Topr -10～+100 ℃
Storage Temperature Range Tstg -55～+150 ℃
Maximum Junction Temperature Tjmax +150 ℃

*1 Not to exceed Pd.
*2 Instantaneous surge voltage, back electromotive force and voltage under less than 10% duty cycle.
*3 Reduced by 2.7mW/℃ for each increase in Ta of 1℃ over 25℃. (when don’t mounted on a heat radiation board )
*4 Reduced by 5.6mW/℃ for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70.0mm×1.6mm 1-layer Glass-epoxy PCB,

copper foil area: 10.29mm

*5 Reduced by 17.6mW/℃ for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70.0mm×1.6mm 4-layer Glass-epoxy PCB,

copper foil area: 10.29mm

*6 Reduced by 28.5mW/℃ for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70.0mm×1.6mm 4-layer Glass-epoxy PCB,

copper foil area: 5505mm

2

)

2

2,3-layer copper foil area: 5505mm2)

2

)

○ OPERATING CONDITIONS（Ta=25℃）

Parameter Symbol MIN MAX Unit
Input Voltage 1 VCC 4.5 5.5 V
Input Voltage 2 VDD 4.5 5.5 V
Input Voltage 3 VIN 4.5 25 V
BOOT Voltage BOOT 4.5 30 V
SW Voltage SW -0.7 25 V
BOOT-SW Voltage BOOT-SW 4.5 5.5 V
EN Input Voltage EN 0 5.5 V
Is Input Voltage Is+/Is- 0.7 2.7 V
MIN ON Time Tonmin - 80 ns

★ This product is not designed for protection against radioactive rays.

2

＊1＊

V

2

＊1＊

V

2

＊1＊

V

2

＊1＊

V

2

＊1＊

V

2

＊1＊

V

1

＊

V

3

＊

W

4

＊

W

5

＊

W

6

＊

W

REV. A

2/4

[

[

p

_

[

[

[

p

[

p

[

[

[

]

[

[

○ELECTRICAL CHARACTERISTICS （unless otherwise noted, Ta=25℃ VCC=5V,VDD=5V,EN=3V,VIN=12V,VOUT=1.05V,RFS=36kΩ）

Parameter Symbol

Standard Value

MIN TYP MAX

Unit Condition

Whole Device]
VCC Bias Current
VCC Standby Current
VIN Bias Current
VIN Standby Current
EN Low Voltage

EN HighVoltage
(Forced Continuous mode)

EN HighVoltage (SLLM Mode)
EN Bias Current

Icc

Iccstb

Iin

Iinstb

EN_low

V

V

ENth_con
ENth_sllm

V

Ien

- 1500 1800 μA

-010μA EN＝0Ｖ

-3080μA

-010μA EN＝0Ｖ

GND - 0.8 V

2.3 - 3.8 V

4.5 - 5.5 V

-1525μA EN=3V

Under Voltage Locked Out ]
VCC threshold voltage Vcc_UVLO 3.7 4.0 4.3 V VCC:Sweep u
VCC hysteresis voltagedVcc

UVLO 100 160 220 mV VCC:Sweep down

H3REG Control]
ON Time Ton 194 219 244 ns
MAX ON Time Tonmax - 3.5 -

μs

MIN OFF Time Toffmin - 490 700 ns

FET Driver]
HG Higher side ON resistor HGhon - 3.0 6.0 Ω
HG Lower side ON resistor HGlon - 2.0 4.0 Ω
LG Higher side ON resistor LGhon -

3.0 6.0

Ω

LG Lower side ON resistor LGlon - 0.5 1.0 Ω

SCP]
SCP strat-up Voltage Vsc

0.345 0.420 0.495

SCP delay time Tscp - 2.5 - ms

V

OVP]
FB threshold voltage Vov

0.825 0.900 0.975

V

Soft start]
Charge current Iss 1 2 3 μA
Standby voltage Vss_stb - - 50 mV

Current Limit Block]
Setting Current Iilim - 10 -

μA

Current limit threshold Ilim 75 100 125 mV RILIM=100kΩ

Output Voltage setting
VOUT typical voltage

REF 0.743 0.750 0.757 V
Is+ Input current IIs+ -1 0 1 μA Is+=1.05V
Is- Input current IIs- -1 0 1 μA Is-=1.05V

Power Good]

FB Power Good V

PGOOD

0.38 0.47 0.56

V

Discharge ON resistor Ronpgood - 50 150 Ω

BOOT Diode]

VF voltage

VF 0.4 0.5 0.6 V IF=1mA

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○ PHYSICAL DIMENSIONS ○ Pin Number Pin Name

C0.2

○ BLOCK DIAGRAM

EN/SLLM

OUT

4.0

±0.1

4.0

1.0Max.

0.08 S

2.1±0.1

15

20

0.4±0.1

16

1.0

0.5

2

REF×0.56

SS×0.56

VOUT

18

FB

5

SS

REF

7

FREQ

±0.1

95371

Lot.No

1pin mark

S

-0.02

+0.03

(0.22)

0.02

6

2.1±0.1

10

1115

+0.05

0.25

-0.04

VQFN020V4040 (Unit:mm)

VDD

CC

V

4

Reference

Block

FB

EN/UVLO

­+
+

9

ls-

BG

REF

­+

10

Is+ VOUT

+

-

BG

2.5ms Delay

ls+

+

-

UVLO

UVLO

SCP

H3RegTM

Controller

Block

ILIM
SCP
TSD

VIN

17

VIN

EN

FS

Thermal

Protection

­+

ILIM

8

TSD

SLLM

REF×1.2

FB

Q

R

S

Current Limit

+

Is+

6

Pin

number

PIN name

1 SS
2 EN/SLLM
3 ILIM
4 VCC
5 FB
6 VOUT
7 FREQ
8 FS

9 Is­10 Is+
11 PGND
12 LG
13 VDD
14 SW
15 HG
16 BOOT
17 VIN
18 OUT
19 PGOOD
20 GND

reverse FIN

Please connect FIN to GND.

1

­+

SLLM

SLLM

3

SS

Soft Start Block

OVP

×0.56

ILIM

REF

20

SS

Driver
Circuit

OVP

FB

GND

VDD

PGND

+

-

BOOT

HG

SW

VDD

LG

16

15

14

13

12

11

19

PGOOD

VIN

VOUT

REV. A

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●Operation Notes

1. Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc.,
can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit.
If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,
such as fuses.

2. Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power
supply lines. An external direction diode can be added.

3. Power supply lines
Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply
line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all po wer supply
terminals to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic
capacitors in the circuit, not that capacitance characteristic values are reduced at low temperatures.

4. GND voltage
The potential of GND pin must be minimum potential in all operating conditions.

5. Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
conditions.

6. Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boar ds. The IC may be damaged if there is any
connection error or if pins are shorted together.

7. Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong e lectromagnetic field as doing so may cause the IC to
malfunction.

8. ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.

9. Thermal shutdown circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is
designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its
operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation
of this circuit is assumed.

10. Ground Wiring Pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of a pplication so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change
the GND wiring pattern of any external components, either.

11. Heat sink (FIN)
Since the heat sink (FIN) is connected with the Sub, short it to the GND.

TSD on temperature [°C] (typ.) Hysteresis temperature [°C](typ.)

BD95371MUV 175 15

REV. A

Notes

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Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
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