White LED Diver for
Backlight of Medium/Large-sized LCDs
BD9271KUT
General Description
BD9271KUT is a white LED diver used on backlight of
Medium/Large-sized LCDs. This IC can achieve
dimming function by SPI control. And through the SPI
correspondence, it can set the ON/OFF of each switch,
analog dimming and etc. The signals of PWM dimming
can set the frequency, ON time and delay of PWM by
inputting the external signals to the register.
BD9271KUT has equipped several protection functions
to deal with the abnormal states, including LED OPEN
protection, LED SHORT protection, external current
setting resistance SHORT protection, external MOS
transistor SHORT protection, etc. So it can be used in a
wide output voltage range and various load conditions.
Key Specifications
■ VCC power supply range: 9.0V~35.0V
■ DVDD power supply range: 3.0V~3.6V
■ CLK frequency setting range: 100~10000kHz
■ Operating Circuit current range: 2.4mA(typ.)
■ Operating temperature range: -40℃~+85℃
Applications
TV, PC display
Other LCD backlight
Ty pical A pplication Circuit
Features
■ 16-ch constant current driver (external FET(NMOS)is
equipped.)
■ LED voltage can be set externally.
■ PWM dimming and Analogue dimming can be
controlled by SPI.
■ LED Abnormal operation detection circuit (OPEN
protection/ SHORT protection) is equipped.
■ LED SHORT protection detection voltage is adjustable
(LSP terminal)
■ LED SHORT protection detection CH
■ FAIL INDICATION function is equipped by ERR_DET
terminal.
■ 3 lines serial interface
■ Package: TQFP64U
Package W(Typ.) D(Typ.) H(Max.)
TQFP64U 9.00mm×9.00mm×1.20mm
Pin Pitch 0.4mm
Figure 1. TQFP64U
Figure 2. Typical Application Circuit
○Product structure:Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays
www.rohm.com
External FET gate driving terminal of LED constant current driver, operating range : 0~5V.
(
S1-S16
D1-D16
3,6,9,12,15,18,21,24,25,28,31,34,37,40,43,46PIN
Connect to external FET’s source terminal of LED constant current driver. Through the operations of constant current
driver, all CHs of S1-S16 terminals are outputted the set voltages at addresses of 02h, 03h, and S1-S16 proceed the
constant current operation.
By monitoring the voltage of this terminal, the external resistance SHORT detection of each CH and external MOS
SHORT during Drain-Source detection proceed.
When Dimming=HIGH, external resistance SHORT detection proceeds, and output the errors.
When Dimming=LOW, external MOS Drain-Source SHORT detection proceeds, and output the errors.
The detection voltage of Sx pin for RESSHORT, MOSSHORT protection corresponds to the register value of 02h, 03h
LEDREF (the normal operation voltage of Sx pin). Please refer to the condition of protections.
At output terminal of LED constant current driver, drain of external FET is connected. By monitoring the voltage of this
terminal, LED OPEN detection and LED SHORT detection of each terminal proceed.
When Dimming=HIGH, if LED is in SHORT mode or OPEN mode, error signals are outputted.
LED OPEN protection detected voltage ・・・0.1V(typ.)
LED SHORT protection detected voltage・・・5.0V(typ.)・・・(It can be changed by setting the LSP terminal. Details are
given in LSP Pin Description.)
When Dimming = LOW, the abnormal state when Dimming = HIGH just before continues. In other words, when
Dimming=HIGH and the abnormal state is detected, the error signal is still outputted even turned to Dimming=LOW.
To prevent the mistake of detection caused by the time change of state, abnormal detection mask can be set at address
of 04h.
)
)
Normal operation
voltage
Datasheet
At D1~16 pin
① LED OPEN detection(when PWM=H)
② LED SHORT detection(when PWM=H)
At S1~16 pin
③ RESISTOR SHORT detection(when PWM=H)
④ MOS SHORT detection(when PWM=L)
are detected, then the error signals are outputted.
VREF5V (49PIN)
The VREF5V pin is used to output power (5V) to the internal block of the IC and serves as a main power supply for the
internal circuit of the IC. Install a ceramic capacitor as close to this pin as possible in order to stabilize the power supply
voltage.
In case of outputting a voltage to LSP by using the resistor divider circuit, REF5V
VIN
LSP
AGND AGND
Figure 12. Setting for LSP
CLSP
R1
LSP
R2
AGND
20
15
10
5
BSxPin LED short detec t voltage [V]
0
01234
LSP Pin voltage [V]
Figure 13. LED SHORT detect Voltage [V] vs. LSP [V]
(
VCC
51PIN)
The VCC pin is used to supply power for the IC in the range of 9 to 35V. If the VCC pin voltage reaches 7.0V (Typ.) or
more, the IC will initiate operation. If it reaches 6.7V (Typ.) or less, the IC will be shut down. Basically, insert a resistor of
approx. 10 ohms in resistance between the VCC pin and the external power supply and install a ceramic capacitor of
approx. 1uF in capacitance in the vicinity of the IC.
(
STB
52PIN)
The STB pin is used to make setting of turning ON and OFF the IC and allowed for use to reset the IC from shutdown.
Note: Set the STB pin voltage below the VCC pin voltage.
Note: The IC state is switched (i.e., the IC is switched between ON and OFF state) according to voltages input in the STB
pin. Avoid using the STB pin between two states (0.8 to 2.0V).
(
GND
53PIN)
The GND pin is an analog circuit ground pin of the IC. Set the ground pattern as close as possible to that of resistors
connected to the S1 to S16 pins.
COMP1(55PIN)
The COMP1 pin is used to feed back the state of voltage to the external power supply in order to optimize the power
supply voltage for the LED layer.
Positive feedback voltage is output to a pin having the lowest voltage out of the D1 to D8 pins. If the lowest voltage of the
D1 to D8 pins is higher than 0.6V typical voltage, the COMP1 pin will become open-circuited. If the lowest voltage of
these pins is lower than 0.6V typical voltage, the internal NPN transistor of the COMP1 pin will turn ON. The COMP1 pin
is intended to connect to the output voltage monitor pin of the DC/DC converter.
The COMP2 pin is used to feed back the state of voltage to the external power supply in order to optimize the power
supply voltage for the LED layer.
Positive feedback voltage is output to a pin having the lowest voltage out of the D9 to D16 pins. If the lowest voltage of
the D9 to D16 pins is higher than 0.6V typical voltage, the COMP2 pin will become open-circuited. If the lowest voltage of
these pins is lower than 0.6V typical voltage, the internal NPN transistor of the COMP2 pin will turn ON. The COMP2 pin
is intended to connect to the output voltage monitor pin of the DC/DC converter.
CS(57PIN), CLK(58PIN,)
These pins are used to control the IC with the CS, CLK, DI, and DO serial interfaces. Input levels are determined by the
DVDD power supply of the digital block. For data input format and timing, refer to the description of Logic block to be
hereinafter provided.
High-level input
Low-level input
VSYNC(61PIN), HSYNC(62PIN)
The VSYNC and HSYNC input signals enable the PWM light modulation signal to make setting of PWM frequency, PWM
ON time, and PWM delay time. For data input format and timing, refer to the description of Logic block to be hereinafter
provided.
ERR_DET(63PIN)
The ERR_DET pin is used to output an IC error detection signal and provides the N-MOS open-drain output function. If
this pin is pulled up to the DVDD voltage of the IC or else, it will be set to output High voltage for normal operation. If any
error is detected, the internal NMOS of the IC will be put into ON state, setting the pin to output Low voltage.
Normal operation OPEN
LED error detection GND Level
When the ERR_DET pin is put into the GND Level, the LED has already caused an error. In this case, reading the
registers located at addresses 05h to 0Ch makes it possible to recognize what channel is in what type of error state. (For
detail, refer to the description of registers to be hereinafter provided.)
DGND(56PIN)
The DGND pin is a digital circuit ground pin of the IC. Lay out the DGND pin using interconnect independent of that for
the GND pin wherever possible.
DVDD(64PIN)
The DVDD pin is used to input power in the digital block of the IC in the range of 3.0 to 3.6V. When the DVDD pin voltage
reaches 3.3V (typ.), the IC will start operating. Insert a ceramic capacitor of approx. 1uF in capacitance between the DVDD
and DGND pins in the vicinity of the IC.
The data in every register is updated in 3 ways which are showed below.
① Updated to the newest data immediately when the data is written.
② Updated to the newest data when the next VSYNC or VSYNC_REG signal rises up (positive-edge trigger).
③ Updated to the newest data when the next PWM signal rises up (positive-edge trigger).
The data in every register is updated in 3 ways which are showed below.
① Updated to the newest data immediately when the data is written.
② Updated to the newest data when the next VSYNC or VSYNC_REG signal rises up (positive-edge trigger).
③ Updated to the newest data when the next PWM signal rises up (positive-edge trigger).
LED_REF_12 to LED_REF_01 signals to analog are used with the maximum voltage of 1.0V and the minimum voltage of 0.1V,
they are converted with the decoder listed above.
The data in register is updated to the newest data immediately when the new data is written.
●ADDR=04h
MASKSET (Error signal output mask time setting register: Read/Write)
Bit 7 6 5 4 3 2 1 0
Register
Name
Default
- - - -
Minimum value (0.1V): 0.1 / 2 * 4095 = 0CDh
Maximum value (1.0V): 1 / 2 * 4095 = 800h
Default value (0.3V): 0.3 / 2 * 4095 = 266h
Note: Reg02h and 03h are synchronized with the leading edge of VSYNC input signal.
- - - - - - ERRMSK[1] ERRMSK[0]
- - - - - -
Decoder
ERRMSK[1] ERRMSK[0] ERROR MASK Count ValueERROR MASK TIME
When VSYNCDIS=1 (disable VSYNC), the written data is not reflected.
When VSYNCDIS=0 (enable VSYNC), the written data is updated when VSYNC signal rises up.
The register LEDOPDIS, LEDSHDIS, RESSHDIS, MOSSHDIS is update to the newest data when the next VSYNC signal rises
up (positive-edge trigger) after CS positive edge.
The register VSNCDIS is updated to the newest data immediately when the new data is written.
Decoder
EAMPREFC EAMPREFB EAMPREFAEAMP Ref. Voltage SettingEAMP_DAC_11~EAMP_DAC_01
This register is used to make setting of pulse duty for PWM light modulation in a total of 12 bits, i.e., Bit7-0 when
ADDR11h and Bit3-0 when ADDR12h.
to to
“1111 1111 1100” H S Y N C 4 0 93 c l o c k wi d t h
“1111 1111 1101” H S Y N C 4 0 94 c l o c k wi d t h
“1111 1111 1110” HSYNC 4095 clock widt h
“1111 1111 1111” H S Y N C 4 0 9 6 c l o c k w i dth
The data in register is updated to the newest data when the next PWM signal rises up (positive-edge trigger).
●ADDR=13h~30h
This register is used to make setting of PWM pulse width for LED2 to LED16. The setting procedure is the same as that for
LED1 with ADDR set to 11h and 12h.
The data in register is updated to the newest data when the next PWM signal rises up (positive-edge trigger).
This register is used to make setting of delay width for PWM light modulation in a total of 12 bits, i.e., Bit7-0 when
ADDR31h and Bit3-0 when ADDR32h.
The data in register is updated to the newest data when the next VSYNC signal rises up (positive-edge trigger).
●ADDR=33h~50h
This register is used to make PWM delay width setting for LED2 to LED16. The setting procedure is the same as that for
LED1 with ADDR set to 31h and 32h.
The data in register is updated to the newest data when the next VSYNC signal rises up (positive-edge trigger).
“1111 1111 1100” HS Y N C 4 0 9 2 c l o c k wi d t h
“1111 1111 1101” HS Y N C 4 0 9 3 c l o c k wi d t h
“1111 1111 1110” HSYNC 4094 clock width
“1111 1111 1111” H S Y N C 4 0 9 5 c l o c k wi d t h
By making register setting, PWM output delay and ON duty time counts of CH1 to CH16 can be controlled.
The above timing chart shows an example for CH1.
(To make delay time count setting, write 06h in address 31h. To make ON duty time count setting, write 07h in address 11h.)
The delay counter starts counting after counting three from the leading edge of VSYNC signal. When the counter reaches the
set delay count value (06h), the duty counter will start counting simultaneously when the PWM_OUT_01 signal is set to “H”.
Subsequently, when the duty counter reaches the set duty count value (07h), the PWM_OUT_01 signal will be set to ”L”.
Since then, the said sequence is continuously repeated.
The same control is also carried out for CH2 to CH16.
The delay counter counts up to FFCh. Even if the set value exceeds this maximum value, it will also count up to FFCh.
●oft-start masking function
A value set at address 10h serves as the pulse number of the VSYNC signal and masks the error signal control in the
relevant section.
There are the following four types of ERROR detection signals:
(1) LED OPEN, (2) LED SHORT, (3) REGISTER SHORT, and (4) MOS SHORT
The following section shows timing charts with the setting below:
LED OPEN
LED SHORT, REGISTER SHORT are in the same way.
(example) ERRMSK[1:0]=10b (ERR MASK count:08d)
Datasheet
zoom (A)
HSYNC
VSYNC
OPEN_ERR
PWM
ERRMSK[1:0]
ERRMSK counter
ERR judge
ERR_DET
(1)(2)(3)
Zoom (A) is the operation of ERROR detection.
(1)…When the abnormal signal OPEN_ERR(internal signal) is detected, and PWM=H, the abnormal condition is detected,
ERRMSK counter starts.
(2)…When ERRMSK counter reaches to the register ERRMSK[1:0]=10b, the condition is judged to the abnormal. The internal
signal ERR_judge=H.
(3)…The external pin ERR_DET turns to ERR_DET=L within 4 clks of HSYNC.
Zoom (B) is the operation of ERROR release.
(4)…When the abnormal signal is released (OPEN_ERR=L) and PWM=H, ERRMSK counter starts.
(5)…When ERRMSK counter reaches to the register ERRMSK[1:0] =10b, the condition is judged to the normal. The internal
signal ERR_judge=H.
(6)…The external pin ERR_DET turns to ERR_DET=HiZ (High as pulled up) within 4 clks of HSYNC.
Zoom (A) is the operation of ERROR detection.
(1)…When the abnormal signal MOSSHORT_ERR(internal signal) is detected, and PWM=L, the abnormal condition is detected,
ERRMSK counter starts.
(2)…When ERRMSK counter reaches to the register ERRMSK[1:0]=10b, the condition is judged to the abnormal. The internal
signal ERR_judge=H.
(3)…The external pin ERR_DET turns to ERR_DET=L within 4 clks of HSYNC.
Zoom (B) is the operation of ERROR release.
(4)…When the abnormal signal is released (MOSSHORT_ERR=L) and PWM=L, ERRMSK counter starts.
(5)…When ERRMSK counter reaches to the register ERRMSK[1:0] =10b, the condition is judged to the normal. The internal
signal ERR_judge=H.
(6)…The external pin ERR_DET turns to ERR_DET=HiZ (High as pulled up) within 4 clks of HSYNC.
When you light the LED by general SPI control, please follow the sequence below.
① Input the power supply of VCC.
(If the voltage of VCC pin becomes higher than 7.0V, the analog block starts operating.)
② Input the power supply of DVDD.
(If the voltage of DVDD pin becomes higher than 2.8V, reset of the logic block is released.)
③ Launch the STB from L to H.
(The voltage of VREF5V pin charged by STB=H. If the voltage of VREF5V pin becomes higher than 4.5V,
the LED driver starts operating.)
④ Write the data to the register by SPI control, then set the LED driver.
(Set of the LED driver operation.)
⑤ Input the VSYNC, HSYNC signal which is for PWM dimming.
(Set of the PWM dimming operation.)
start sequence characteristics:
◆PWM dimming mode, Boot sequence In BD9271KUT, as process mode, there is a test mode for running the LED driver, even there is no
environment for SPI control. After inputting the power supply of VCC and DVDD, by setting the STB to H, it
can be changed to PWM dimming operation mode achieved by duty control immediately. And the operating
conditions are as below
Power supply:VCC and DVDD are in normal operating range.
・VCC=9.0V~35V, DVDD=3.0V~3.6V
Settings of LED driver(Default settings of register)
・Set all CHs to ON state (LED 1CH~16CH)
・Setting voltage for LED current(Voltage of S1~S16 pin):0.30V
・Reference voltage of error amplifier:0.60V
・Soft start setting:16 count of VSYNC
Figure 20. Starting Sequence for normal operation
t1
t2
※C_vref5v = 1uF
t3
t4
timing Symbol
① - ② t1 5.0 us
② - ③ t2 1.0 us
③ - ④ t3 85.0 us
④ - ⑤
t4
Need time
min
tHSYNCCYC
(HSYNC 1cycle)
unit
-
By inputting the SPI control signal
before the PWM signal of VSYNC
and HSYNC, LED can be controlled
with register settings.
Abnormal detection
ERR_DET signal output
Abnormal detection
ERR_DET signal output
Abnormal detection
ERR_DET signal output
Datasheet
(internal)
Figure 23. LED OPEN Protection
① When PWMx=HIGH, LED OPEN error is detected. ERR_DET=LOW is outputted. If drain pin voltage is release condition, ERR_DET=HIGH is outputted.
② When PWMx=LOW, LED OPEN error is not detected.
③ When PWMx=HIGH, LED OPEN error is detected. When PWMx=LOW, If drain pin voltage is release condition,
ERR_DET output keep-hold.
・LED_SHORT protection
When PWMx=HIGH, If Drain pin becomes 5V(typ) or more (LSP=OPEN), ERR_DET = LOW is outputted and LED SHORT
error will be detected.
(internal)
① When PWMx=HIGH, LED SHORT error is detected. ERR_DET=LOW is outputted. If drain pin voltage is released, ERR_DET=HIGH is outputted.
② When PWMx=LOW, LED SHORT error is not detected.
③ When PWMx=HIGH, LED SHORT error is detected. When PWMx=LOW, even though the drain pin voltage is
・RESISTOR SHORT protection
・MOSFET SHORT protection
When PWMx=HIGH, if the voltage of Source pin becomes lower than 0.15V(typ), ERR_DET = LOW is outputted and RES
SHORT error will be detected, and this error state is realeased when the voltage of Sourse pin comes back to 0.15V(typ) or
higher. The initial value of the detect threshold of RESSHORT and MOSSHORT are 0.15V. And those correspond to the
register LEDREF.
When PWMx=LOW, if the voltage of Source pin becomes higher than 0.15V(typ), ERR_DET = LOW is outputted and RES
SHORT error will be detected, and this error state is realeased when the voltage of Sourse pin comes back to 0.15V(typ) or
lower.
(internal)
Datasheet
Figure 25. RESISTER SHORT Protection and MOSFET SHORT Protection
① When PWMx=LOW, If Source pin becomes 0.15V(typ) or more, MOS SHORT error is detected.
ERR_DET=LOW is outputted.
② If source pin voltage is release condition, ERR_DET=HIGH is outputted.
③ When PWMx=HIGH, If Source pin becomes 0.15V(typ) or lower, RES SHORT error is detected.
ERR_DET=LOW is outputted.
④ If source pin voltage is release condition, ERR_DET=HIGH is outputted.
1. About the Feedback Between External LED Power Supply for DCDC Converter and COMP Pin
By connecting the COMP1,2 which are the error amplifier outputs of BD9271KUT to the feedback pins of DCDC converter (inv
input), the state which the cathode voltages of LED bars are lower than the EAMP standard voltage (typ.0.6V) which is set by
writing the registers is transmitted to DCDC side, and the DCDC voltage can be raised.
The error amplifier outputs of D1~D8, D9~D16 pins correspond the COMP1 pin and COMP2 pin respectively.
Datasheet
Figure 26. COMP Pin feedback
Due to the COMP1,2 pins of BD9271KUT are OPEN collector pins, basically the adjustment can be only allowed on the
direction in which the DCDC output is raised. We suggest set the initial setting of the power supply of DCDC converter 10%
lower than voltage at which the LEDs work normally.
In order to achieve a feedback which has good stability and efficiency to the LED power supply, we suggest insert the CR
which practices the lead compensation to DCDC converter and the COMP output of BD9271KUT. The current-mode type DCDC
converter is used more widely because it is easy to set the response speed and so on.
If it is hard to guarantee the stability of DCDC output, it may cause the heat of the external NMOS-FET. In this case, we
suggest raise the initial value of the DCDC output, and increase the DCDC output capacity.
In BD9271KUT, the absolute maximum voltage of D pin which is connected to the drain of external MOSFET is 40V. Due to it is
necessary to raise the power supply voltage according to the VF of the used LED bar, the voltage of D pin maybe exceed the
absolute maximum when PWM is LOW. In this case, in order to secure the absolute maximum voltage of the D pin, it is
necessary to set up a clamp circuit at the drain side of the NMOSFET.
Zener Diode can be used as a solution for clamp circuit. We use the Diode of 36V (EDZ36B:ROHM) which has a lower Zener
voltage than the absolute maximum voltage. About the LED, for example, in case of the LED which needs 3.5V for lighting, 2V
cannot light it. For this, the method by using the Zener Diode is applicable when the LED supply voltage is under 80V.
When use this clamp circuit, please guarantee the absolute maximum voltage of NOMOS is lower than the absolute maximum
voltage of the clamp circuit.
Clamp circuit example
using Zener Diode
Datasheet
D3
When the LED supply voltage is over 80V, we can use the FET for clamp circuit. In this case, clamped power supply for FET
gate voltage is necessary, for example, if VCC of BD9271KUT is 12V, it can be used.
In this case, the absolute maximum voltage is the clamp voltage.
Figure 27. Clamp Circuit example using Zener Diode
1.) This product is produced with strict quality control, but might be destroyed if used beyond its absolute maximum ratings including
the range of applied voltage or operation temperature. Failure status such as short-circuit mode or open mode can not be
estimated. If a special mode beyond the absolute maximum ratings is estimated, physical safety countermeasures like fuse
needs to be provided.
2.) The circuit functionality is guaranteed within of ambient temperature operation range as long as it is within recommended
operating range. The standard electrical characteristic values cannot be guaranteed at other voltages in the operating ranges,
however the variation will be small.
3.) When this product is installed on a printed circuit board, attention needs to be paid to the orientation and position of IC. Wrong
installation may cause damage to IC. Short circuit caused by problems like foreign particles entering between outputs or
between an output and power GND also may cause damage.
4.) The pin connected a connector need to connect to the resistor for electrical surge destruction.
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply terminals.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to
the power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Datasheet
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
Figure 30. Example of monolithic IC structure
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a
reference to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority
22.Aug.2013 002 P13~19. Add comment about the update timing of the register
06.Mar.2014 003
27.Feb.2015 004
21.Apr.2015 005
22.Jul.2015 006
P4. Comment correction about Pin54,55
P9. Value correction about STB voltage
P8, 25. Add comment that RESSHORT, MOSSHORT protection is corresponds to the
register 02h, 03h.
P12. Add about AC characteristics of HSYNC and VSYNC signals
P13. The register updated timing is corrected.
P18. Add comment about the mask interval SSMASKSET
P20. Comment correction about the soft start register.
P21. Update comment that ERROR control.
P23. Add about Start-up sequence timing characteristics
P12. As for HSYNC, VSYNC adding in Ver004, the comment for the HSYNC negative
edge is deleted.
P19. The state as DLY01[11:0]=000h is corrected.
P1,P2,P29,P32 Change Package Name
P33 Change Physical Dimension Tape and Reel Information
P2 Add External Components Recommended Range
1. Our Products are designed and manufactured for applicatio n in ordinar y el ec tronic equip ments (such as AV equipment ,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equi pment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way respons ible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ
CLASSⅣ CLASSⅢ
CLASSⅢ
CLASSⅡb
CLASSⅢ
(Note 1)
, transport
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any propert y, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl
2S, NH3, SO2, and NO2
H
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verif y and confirm ch aracteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a larg e amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recomm ended. Avoid applying power
exceeding normal rated power; exceeding the power ratin g under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (T a). When used i n sealed area, co nfirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range d escribed in the product specification.
9. ROHM shall not be in any way responsible or lia ble for failure induced under deviant conditio n from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogen ous (chlori ne, bromin e, etc.) flux is used, the residue of flux ma y negatively affect product
performance and reliability.
2. In principle, the reflow soldering method mu st be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount prod ucts,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variatio ns of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and informatio n contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgmen t in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dr y condition (e.g. Gro unding of human bod y / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidit y control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderabil ity of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderabilit y before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direct ion, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is require d before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescr ibed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe an y intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or imp lied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you o r your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. T he Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. T he proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.