Power Management Switch ICs for PCs and Digital Consumer Products
1ch High Side Switch ICs
for USB Devices and Memory Cards
BD82061FVJ,BD82065FVJ
●Description
Single channel high side switch IC for USB port is a high side switch having over-current protection used in power supply
line of universal serial bus (USB).
N-channel power MOSFET of low on-resistance and low supply current are realized in this IC.
And, over-current detection circuit, thermal shutdown circuit, under-voltage lockout and soft-start circuit are built in.
●Features
1) Low On-Resistance 70mΩ MOSFET Switch
2) Current Limit Threshold 2.4A
3) Control Input Logic
Active “Low” Control Logic : BD82061FVJ
Active “High” Control Logic : BD82065FVJ
4) Soft-Start Circuit
5) Over-Current Protection
6) Thermal Shutdown
7) Under-Voltage Lockout
8) Open-Drain Error Flag Output
9) Reverse Current Protection When Power Switch Off
10) Power Supply Voltage Range 2.7V~5.5V
11) TTL Enable Input
12) 0.8ms Typical Rise Time
13) 1μA Max Standby Current
●Applications
PC, PC peripheral equipment, USB hub in consumer appliances, Car accessory, and so forth
●Line Up Matrix
No.11029EBT21
Parameter BD82061FVJ BD82065FVJ
Current limit threshold (A) 2.4 2.4
Control input logic Low High
Number of channnels 1ch 1ch
Package TSSOP-B8J TSSOP-B8J
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1/16
2011.05 - Rev.B
BD82061FVJ,BD82065FVJ
●Absolute maximum ratings(Ta=25℃)
Parameter Symbol Ratings Unit
Supply voltage VIN -0.3 ~ 6.0 V
Enable input voltage VEN -0.3 ~ 6.0 V
/OC voltage V/OC -0.3 ~ 6.0 V
/OC sink current IS/OC ~ 5 mA
OUT voltage VOUT -0.3 ~ 6.0 V
Storage temperature TSTG -55 ~ 150 ℃
Power dissipation Pd 587.5*1 mW
*1 Mounted on 70mm*70mm*1.6mm glass-epoxy PCB. Derating : 4.7mW/℃ above Ta=25℃
* This product is not designed for protection against radioactive rays.
●Operating conditions
Technical Note
Parameter Symbol
Operating voltage VIN 2.7 - 5.5 V
Operating temperature TOPR -40 - 85 ℃
Min. Typ. Max.
Ratings
Unit
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2/16
2011.05 - Rev.B
BD82061FVJ,BD82065FVJ
●Electrical Characteristics
Technical Note
○BD82061FVJ (Unless otherwise specified V
Parameter Symbol
IN = 5.0V, Ta = 25℃ )
Limits
Min. Typ. Max.
Unit Condition
Operating current IDD - 110 160 μA V/EN = 0V , OUT=OPEN
Standby current ISTB - 0.01 1 μA V/EN = 5V , OUT=OPEN
/EN 2.0 - - V High input
/EN input voltage
V
V/EN - - 0.8 V Low input
/EN input current I/EN -1.0 0.01 1.0 μA V/EN = 0V or V/EN = 5V
/OC output low voltage V/OCL - - 0.5 V I/OC = 0.5mA
/OC output leak current IL/OC - 0.01 1 μA V/OC = 5V
/OC delay time T/OC 10 15 20 ms
On-resistance RON - 70 110 mΩ IOUT = 500mA
Switch leak current ILSW - - 1.0 μA V/EN = 5V, VOUT = 0V
Reverse leak current ILREV - - 1.0 μA VOUT = 5.5V, VIN = 0V
Current limit threshold ITH 1.5 2.4 3.0 A
OUT = 0V
Short circuit current ISC 1.1 1.5 2.1 A
V
L = 47μF (RMS)
C
Output rise time TON1 - 0.8 10 ms RL = 10Ω
Output turn-on time TON2 - 1.1 20 ms RL = 10Ω
Output fall time TOFF1 - 5 20 μs RL = 10Ω
Output turn-off time T OFF2 - 10 40 μs RL = 10Ω
TUVH 2.1 2.3 2.5 V Increasing VIN
UVLO threshold
V
VTUVL 2.0 2.2 2.4 V Decreasing VIN
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3/16
2011.05 - Rev.B
BD82061FVJ,BD82065FVJ
●
Technical Note
○BD82065FVJ (Unless otherwise specified V
Parameter Symbol
IN = 5.0V, Ta = 25℃)
Limits
Min. Typ. Max.
Unit Condition
Operating current IDD - 110 160 μA VEN = 5V , OUT=OPEN
Standby current ISTB - 0.01 1 μA VEN = 0V , OUT=OPEN
EN 2.0 - - V High input
EN input voltage
V
VEN - - 0.8 V Low input
EN input current IEN -1.0 0.01 1.0 μA VEN = 0V or VEN = 5V
/OC output low voltage V/OCL - - 0.5 V I/OC = 0.5mA
/OC output leak current IL/OC - 0.01 1 μA V/OC = 5V
/OC delay time T/OC 10 15 20 ms
On-resistance RON - 70 110 mΩ IOUT = 500mA
Switch leak current ILSW - - 1.0 μA VEN = 0V, VOUT = 0V
Reverse leak current ILREV - - 1.0 μA VOUT = 5.5V, VIN = 0V
Current limit threshold ITH 1.5 2.4 3.0 A
OUT = 0V
Short circuit current ISC 1.1 1.5 2.1 A
V
L = 47μF (RMS)
C
Output rise time TON1 - 0.8 10 ms RL = 10Ω
Output turn-on time TON2 - 1.1 20 ms RL = 10Ω
Output fall time TOFF1 - 5 20 μs RL = 10Ω
Output turn-off time T OFF2 - 10 40 μs RL = 10Ω
TUVH 2.1 2.3 2.5 V Increasing VIN
UVLO threshold
V
VTUVL 2.0 2.2 2.4 V Decreasing VIN
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4/16
2011.05 - Rev.B
BD82061FVJ,BD82065FVJ
A
/
A
/
T
A
●Measurement Circuit
Technical Note
V
IN
1µF
GND
IN
IN
EN(/EN)
VEN(V
)
/EN
Operating current
OUT
OUT
OUT
/OC
V
IN
1µF
VEN(V
/EN
GND
IN
IN
EN(/EN)
)
OUT
OUT
OUT
OC
EN, /EN input voltage, Output rise, fall time
Inrush current
VIN
10kΩ
RL C
L
VIN VIN
10kΩ
1µF
GND
IN
IN
EN(/EN)
VEN(V
)
/EN
OUT
OUT
OUT
OC
C
I
L
OU
1µF
VEN(V
/EN
V
IN
GND
IN
IN
EN(/EN)
OUT
OUT
OUT
/OC
V
IN
I
/OC
)
On-resistance
Over-current detection
Fig.1 Measurement circuit
●Timing Diagram
○BD82061FVJ ○BD82065FVJ
T
ON1
90% 90%
V
OUT
10%
V
/EN
50%
T
ON2
50%
T
OFF1
T
OFF2
V
Fig.2 Timing diagram
/OC output low voltage
T
OFF1
T
ON1
90%
OUT
10%
T
ON2
V
EN
50%
90%
50%
T
OFF2
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5/16
2011.05 - Rev.B
BD82061FVJ,BD82065FVJ
w
Technical Note
●Electrical Characteristic Curves (Reference Data)
140
Ta= 2 5° C
120
100
80
60
40
Oper ating Cur rent : I D D [µ A]
20
0
23456
Supply Vol tag e : VIN[V]
Fig.3 Operating current
EN,/EN enable
140
IN=5.0V
V
120
100
80
60
40
Oper ating Cur rent : I D D [µ A]
20
0
-50 0 50 100
Ambient Temperature : Ta[℃]
Fig.4 Operating current
EN,/EN enable
1.0
Ta= 2 5°
0.8
0.6
0.4
0.2
Standby C urr ent : I ST B [µA]
0.0
23456
Supply Vol tag e : VIN[V]
Fig.5 Standby current
EN,/EN disable
1.0
V
IN=5.0V
0.8
0.6
0.4
0.2
Standby C urr ent : I ST B [µA]
0.0
-50 0 50 100
200
150
Ambient Temperature : Ta[℃]
Fig.6 Standby current
EN,/EN disable
Ta= 2 5° C
100
2.0
Ta= 2 5° C
Low to High
1.5
High to Low
1.0
0.5
Enable I nput Vol tage : V EN [V]
0.0
23456
Supply Vol tag e : VIN[V]
2.0
IN=5.0V
V
1.5
1.0
0.5
Enable I nput Vol tage : V EN [V]
0.0
-50 0 50 100
Low to High
High to Lo
Ambient Temperature : Ta[℃]
Fig.7 EN,/EN input voltage Fig.8 EN,/EN input voltage
200
150
100
V
IN=5.0V
2.4
2.2
2.0
1.8
Ta= 2 5° C
50
ON Resistsnce : R ON [m O]
0
23456
Supply Vol tag e : VIN[V]
Fig.9 On-resistance
50
ON Resistsnce : R ON [mO]
0
-50 0 50 100
Ambient Temperature : Ta[℃]
Fig.10 On-resistance Fig.11 Current limit threshold
1.6
Curr ent Limi t Threshold : I TH [A]
1.4
23456
Supply Vol tag e : VIN[V]
2.4
V
IN=5.0V
2.2
2.0
Ta= 2 5° C
1.8
2.0
IN=5.0V
V
1.8
2.0
1.8
1.6
1.4
1.6
1.4
1.6
Curr ent Limi t Threshold : I TH[A]
1.4
-50 0 50 100
Ambient Temperature : Ta[℃]
Fig.12 Current limit threshold Fig.13 Short circuit current Fig.14 Short circuit current
1.2
Short-C ir cuit Current : I SC [A]
1.0
23456
Supply Vol tag e : VIN[V]
1.2
Short-C ir cuit C urrent : I SC [A]
1.0
-50 0 50 100
Ambient Temperature : Ta[℃]
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6/16
2011.05 - Rev.B
UVLO
Th
h
ld
V
V
L
BD82061FVJ,BD82065FVJ
100
Ta= 2 5° C
[mV]
/OC
80
100
VIN=5.0V
[mV]
80
/OC
60
40
20
/OC Output Low Volt age : V
0
23456
Fig.15 /OC output low voltage Fig.16 /OC output low voltage
Supply Vol tag e : VIN[V]
60
40
20
0
/OC Out put Low Voltage : V
-50 0 50 100
Ambient Temperature : Ta[℃]
1.0
[V]
HYS
0.8
0.6
5.0
Ta= 2 5° C
4.0
3.0
0.4
0.2
UVLO H ys teres is Voltage : V
0.0
-50 0 50 100
Fig.18 UVLO hysteresis voltage
Ambient T emperatur e : Ta[
]
℃
2.0
Rise Tim e : TON1[m s]
1.0
0.0
23456
Supply Voltag e : VIN[V]
Fig.19 Output rise time
5.0
Ta= 2 5° C
4.0
5.0
V
IN=5.0V
4.0
3.0
3.0
2.0
Turn ON T im e : TON2[m s]
1.0
2.0
Turn ON T ime : TON2[m s]
1.0
0.0
23456
Fig.21 Output turn-on time
Supply Vol tag e : VIN[V]
0.0
-50 0 50 100
Ambient Temperature : Ta[℃]
Fig.22 Output turn-on time
5.0
IN=5.0V
V
4.0
10.0
Ta= 2 5° C
8.0
3.0
2.0
Fall Time : TOFF1[µs]
1.0
6.0
4.0
Turn OFF Time : TOFF2[µs]
2.0
0.0
-50 0 50 100
Ambient Temperature : Ta[℃]
Fig.24 Output fall time
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0.0
23456
Supply Vol tag e : VIN[V]
Fig.25 Output turn-off time
7/16
Technical Note
2.5
TUV
,
2.4
TUVH
2.3
:
o
2.2
res
2.1
2.0
5.0
4.0
3.0
2.0
Rise Tim e : TON1[m s]
1.0
0.0
5.0
4.0
3.0
2.0
Fall Time : TOFF1[µs]
1.0
0.0
10.0
8.0
6.0
4.0
2.0
Turn OFF Time : TOFF2[µs]
0.0
TUVH
V
V
TUVL
-50 0 50 100
Ambient Temperature : Ta[℃]
Fig.17 UVLO threshold voltage
V
IN=5.0V
-50 0 50 100
Ambient Temperatur e: Ta[℃ ]
Fig.20 Output rise time
Ta= 2 5° C
23456
Supply Vol tag e : VIN[V]
Fig.23 Output fall time
VIN=5.0V
-50 0 50 100
Ambient T emperatur e : Ta[℃]
Fig.26 Output turn-off time
2011.05 - Rev.B
BD82061FVJ,BD82065FVJ
]
]
20
18
Ta= 2 5° C
16
14
/OC Del ay Tim e : T /OC[ms
12
10
23456
Supply Vol tag e : VIN[V]
Fig.27 /OC delay time
20
VIN=5.0V
18
16
14
12
/OC Delay Time : T /OC [ms
10
-50 0 50 100
Ambient Temperature : Ta[℃]
Fig.28 /OC delay time
Technical Note
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8/16
2011.05 - Rev.B
BD82061FVJ,BD82065FVJ
●Waveform Data(BD82065FVJ)
VEN
(5V/div.)
V
/OC
(5V/div.)
V
OUT
(5V/div.)
I
IN
(1.0A/div.)
Fig.29 Output rise characteristic
TIME(1ms/div.)
V
IN=5V
L=5Ω
R
CL=100μF
OUT
V
(5V/div.)
V
/OC
(5V/div.)
OUT
I
(1.0A/div.)
VEN
(5V/div.)
Fig.32 Over-current response
TIME(10ms/div.)
ramped load
VIN=5V
L=100μF
C
V
/OC
(5V/div.)
OUT
V
(5V/div.)
I
OUT
(1.0A/div.)
VIN
(5V/div.)
Fig.34 Over-current response
TIME(5ms/div.)
enable to shortcircuit
V
CL=100μF
OUT
V
(5V/div.)
/OC
V
(5V/div.)
I
OUT
(1.0A/div.)
TIME(10ms/div.)
Fig.37 UVLO response
increasing VIN
R
CL=100μF
IN=5V
L=5Ω
VEN
(5V/div.)
V
/OC
(5V/div.)
V
OUT
(5V/div.)
IN
I
(1.0A/div.)
OUT
V
(5V/div.)
V
/OC
(5V/div.)
OUT
I
(1.0A/div.)
V/OC
(5V/div.)
OUT
V
(5V/div.)
OUT
I
(1.0A/div.)
VIN
(5V/div.)
OUT
V
(5V/div.)
V
/OC
(5V/div.)
OUT
I
(1.0A/div.)
Fig.30 Output fall characteristic
TIME(1ms/div.)
Fig.33 Over-current response
TIME(2ms/div.)
ramped load
Fig.35 Over-current response
1Ωload connected at enable
TIME(5ms/div.)
TIME(10ms/div.)
Fig.38 UVLO response
decreasing V
IN
IN=5V
V
L=5Ω
R
CL=100μF
VIN=5V
L=100μF
C
IN=5V
V
CL=100μF
R
L=5Ω
CL=100μF
VEN
(5V/div.)
V
/OC
(5V/div.)
I
IN
(1.0A/div.)
/OC
V
(5V/div.)
OUT
V
(5V/div.)
OUT
I
(1.0A/div.)
Technical Note
C
L=220µF
L=100µF
C
L=47µF
C
IN=5V
V
L=5Ω
R
Fig.31. Inrush current response
Fig.36 Thermal shutdown
1Ωload connected at enable
TIME(1ms/div.)
Thermal Shutdown
TIME(200ms/div.)
VIN=5V
CL=100μF
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9/16
2011.05 - Rev.B
BD82061FVJ,BD82065FVJ
●Block Diagram
GND
UVLO IN
Charge
Pump
OCD
OUT
OUT
Technical Note
GND
1
OUT
8
IN
IN
2
3
4
EN
/EN
IN
Gate
Logic
TSD
OUT
/OC
EN(/EN)
Top View
Fig.39 Block diagram Fig.40 Pin configuration
●Pin Configuration
Pin No. Symbol I / O Pin function
1 GND - Ground.
Power supply input.
2, 3 IN -
Input terminal to the power switch and power supply input terminal of the internal circuit.
At use, connect each pin outside.
Enable input.
4 EN , /EN I
Power switch on at Low level.(BD82061FVJ)
Power switch on at High level.(BD82065FVJ)
High level input > 2.0V, Low level input < 0.8V.
Error flag output.
5 /OC O
Low at over-current, thermal shutdown.
Open drain output.
OUT
7
OUT
6
/OC
5
6, 7, 8 OUT O
●I/O Circuit
Symbol Pin No Equivalent circuit
EN(/EN) 4
/OC 5
OUT 6,7,8
Power switch output.
At use, connect each pin outside.
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10/16
2011.05 - Rev.B
BD82061FVJ,BD82065FVJ
●Functional Descriptions
1. Switch operation
IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. And the IN
terminalis used also as power source input to internal control circuit.
When the switch is turned on from EN, /EN control input, IN terminal and OUT terminal are connected by a 70mΩ switch.
In on status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of IN terminal,
current flows from OUT terminal to IN terminal.
Since a parasitic diode between the drain and the source of switch MOSFET is canceled, in the off status, it is possible to
prevent current from flowing reversely from OUT to IN.
2. Thermal shutdown circuit (TSD)
If over-current would continue, the temperature of the IC would increase drastically. If the junction temperature were
beyond 170℃ (typ.) in the condition of over-current detection, thermal shutdown circuit operates and makes power
switch turn off and outputs error flag (/OC). Then, when the junction temperature decreases lower than 150℃ (typ.),
power switch is turned on and error flag (/OC) is cancelled. Unless the fact of the increasing chips temperature is
removed or the output of power switch is turned off, this operation repeats.
The thermal shutdown circuit operates when the switch is on (EN,/EN signal is active).
3. Over-current detection (OCD)
The over-current detection circuit limits current (I
MOSFET exceeds a specified value. There are three types of response against over-current. The over-current detection
circuit works when the switch is on (EN,/EN signal is active).
3-1. When the switch is turned on while the output is in shortcircuit status
When the switch is turned on while the output is in shortcircuit status or so, the switch gets in current limit status
soon.
3-2. When the output shortcircuits while the switch is on
When the output shortcircuits or large capacity is connected while the switch is on, very large current flows until the
over-current limit circuit reacts. When the current detection, limit circuit works, current limitation is carried out.
3-3. When the output current increases gradually
When the output current increases gradually, current limitation does not work until the output current exceeds the
over-current detection value. When it exceeds the detection value, current limitation is carried out.
4. Under-voltage lockout (UVLO)
UVLO circuit prevents the switch from turning on until the V
the switch turns on, then UVLO shuts off the power switch. UVLO has hysteresis of a 100mV(Typ.).
Under-voltage lockout circuit works when the switch is on (EN,/EN signal is active).
5. Error flag (/OC) output
Error flag output is N-MOS open drain output. At detection of over-current, thermal shutdown, low level is output.
Over-current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at
switch on, hot plug from being informed to outside.
SC) and outputs error flag (/OC) when current flowing in each switch
IN exceeds 2.3V(Typ.). If the VIN drops below 2.2V(Typ.) while
Technical Note
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11/16
2011.05 - Rev.B
BD82061FVJ,BD82065FVJ
V/EN
Technical Note
V
OUT
OUT
I
/OC
V
VEN
V
OUT
OUT
I
V/OC
Output shortcircuit
Thermal shut down
delay
Fig.41 Over-current detection, thermal shutdown timing
(BD82061FVJ)
Output shortcircuit
Thermal shut down
delay
Fig.42 Over-current detection, thermal shutdown timing
(BD82065FVJ)
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12/16
2011.05 - Rev.B
BD82061FVJ,BD82065FVJ
r
(
/EN)
●Typical application Circuit
5V(typ.)
IN
Regulator
OUT
10k~
USB
Controlle
●Application Information
When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC,
and may cause bad influences upon IC actions. In order to avoid this case, connect a bypath capacitor by IN terminal and
GND terminal of IC. 1μF or higher is recommended.
Pull up /OC output by resistance 10kΩ ~ 100kΩ.
Set up value which satisfies the application as CL and Ferrite Beads.
This system connection diagram doesn’t guarantee operating as the application.
The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account
external parts or dispersion of IC including not only static characteristics but also transient characteristics.
100kΩ
IN
C
Fig.43 Typical application circuit
GND
IN
EN
OUT
OUTIN
OUT
/OC
+
C
L
-
Technical Note
Ferrite
Beads
VBUS
D+
D-
GND
Ferrite
Beads
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13/16
2011.05 - Rev.B
BD82061FVJ,BD82065FVJ
●Power Dissipation Character
(TSSOP-B8J)
600
500
400
300
200
POWER DISSIPATION: Pd[mW]
100
Technical Note
0
0 25 50 75 100 125 150
AMBIENT TEMPERATURE: Ta [℃]
Fig.44 Power dissipation curve (Pd-Ta Curve)
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14/16
2011.05 - Rev.B
BD82061FVJ,BD82065FVJ
●Cautions On Use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the
breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s
power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At
the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be
used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals
a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage
to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to us
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a
switch OFF. The thermal shutdown circuit is aimed at isolating the LSI from thermal runaway as much as possible. Do not
continuously use the LSI with this circuit operating or use the LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual
states of use.
e a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
Technical Note
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15/16
2011.05 - Rev.B
BD82061FVJ,BD82065FVJ
●Ordering part number
B D 8 2 0 6 1 F V J - E 2
Part No.
TSSOP-B8J
Part No.
82061
82065
3.0± 0.1
(MAX 3.35 include BURR)
3.0± 0.1
4.9± 0.2
1234
0.525
1.1MAX
0.85±0.05
0.1±0.05
0.65
578
6
1PIN MARK
+0.05
0.32
−0.04
S
0.08 S
0.08
4 ± 4
0.45± 0.15
0.145
M
0.95± 0.2
+0.05
−0.03
(Unit : mm)
Package
FVJ : TSSOP-B8J
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
2500pcs
E2
The direction is the 1pin of product is at the upper left when you hold
()
reel on the left hand and you pull out the tape on the right hand
1pin
Reel
Packaging and forming specification
E2: Embossed tape and reel
Order quantity needs to be multiple of the minimum quantity.
∗
Technical Note
Direction of feed
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16/16
2011.05 - Rev.B
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specied herein is subject to change for improvement without notice.
The content specied herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specied in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specied herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specied in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, of ce-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specied in this document are not designed to be radiation tolerant.
While ROHM always makes effor ts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, re or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specied herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Notice
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Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
R1120
A
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