System Motor Driver ICs for CD / DVD / Blu-ray Drive and Recorder
System Motor Driver IC
for Half Height Drive (Sensor less)
BD7755RFV
●Description
BD7755RFV are ICs, developed for the spindle motor, actuator coil, tilt coil, stepping motor, SA stepping motor and the
loading motor drive of the desktop Blu-ray drive and Blu-ray recorder. Spindle driver adopted sensorless drive system, and
the hall sensor (3 pieces) of the motor position detection is not needed, it is suitable for making of flexible cable conserve
wiring and the reductions of external parts. The low rotation mode is built in, and stability and low-speed a rotation is
achieved. The spindle, stepping and SA stepping use power MOSFET to reduce power consumption and the actuator, tilt,
and loading driver use a linear BTL drive system to reduce noise.
●Features
1) The low-speed stability rotation is achieved with built-in the low rotation mode.
2) The hall sensor is unnecessary according to 3 aspect sensorless drive system.
3) The spindle motor driver achieves stability high speed start by ROHM's own energizing method.
4) Highly effective spindle, stepping and SA stepping is achieved by PWM control driver. And the output current detection
resistance of stepping and SA stepping is unnecessary by built-in internal detection circuit.
5) The actuator, tilt and loading driver achieve low noise by using linear BTL drive system.
6) ON/OFF of loading and other channels, brake mode of spindle driver and standby mode are selectable by the two
control terminals.
Preblock/BTL power block power supply voltage Vcc, AVM, LDVM15
PWM control block power supply voltage DVcc 7
Power dissipation Pd 1.5
Operating temperature range Topr -20 ~ 70
Storage temperature Tstg -55 ~ 150
Junction temperature Tjmax 150
#1 POWER MOS output terminals (40~43pin, 46~48pin) are contained.
#2 POWER MOS output terminals (35~38pin) are contained.
#3 PCB mounting (70mmX70mmX1.6mm, occupied copper foil is less than 3%, glass epoxy standard board).
Reduce by 12mW/℃ over 25℃
(Set the power supply voltage with consideration to power dissipation)
Parameter Symbol
Spindle / Sled motor driver power block power
supply voltage
Min. Typ. Max.
SPVM,SLVM - Vcc
Ratings
#4
- V
Pre block power supply voltage Vcc 10.8 12 13.2 V
Loading driver power block supply voltage LDVM 4.3 5.0 Vcc V
Unit
SA, Actuator driver power block
power supply voltage
SAVM,AVM 4.3 5.0 5.5 V
PWM control block power supply voltage DVcc 4.3 5.0 5.5 V
Spindle driver output current Iosp - 1.0 2.5 #5A
Actuator, SA, sled, loading motor driver
output current
#4 Set the same supply voltage to SPVM, SLVM and Vcc.
#5 The current is guaranteed 3.5A in case of the Short-circuit braking mode and the current which is turned on/off in
a duty-ratio of less than 1/10 with a maximum on-time of 5msec
Quiescent current 1 IQ1 - 14 30 mA Vcc(Loading OFF)
Quiescent current 2 IQ2 - 7.5 16 mA Vcc(Loading ON)
Quiescent current 3 IQ3 - 7 14 mA DVcc
Standby-on current 1 IST1 - 1.1 2.4 mA Vcc
Standby-on current 2 IST2 - 0.16 0.4 mA DVcc
Sled driver block
Input dead zone (one side) VDZSL0 30 80 mV
Input output gain gmSL 0.75 1.0 1.25 A/V
Output On resistor
(top and bottom)
Output limit current ILIMSL0.8 1.1 1.4 A
Input dead zone (one side)1 VDZSP120 55 90 mV VLRPM=L
Input dead zone (one side)2 VDZSP220 240 450 mV VLRPM=H
Input output gain 'H' gmSPH2.68 3.5 4.32 A/V VLRPM=L
Input output gain 'L' gmSPL0.53 0.7 0.87 A/V VLRPM=H
Output On resistor (top and bottom) RONSP- 1.0 1.7 Ω IL=500mA
Output limit current ILIMSP1.35 1.6 1.85 A RSPLIM=1.5kΩ
PWM frequency fosc - 167 - kHz
FG output, PRTFLG output
High voltage VOH - 4.9 - V 100kΩ pull up to DVcc
Low voltage VOL - 0.1 - V
Focus / Tracking / Tilt driver block
Output offset voltage VOFA -50 0 50 mV
Output saturation voltage (top and bottom) VOHA - 0.9 1.8 V IL=500mA
Voltage gain H GVAH 19.6 21.6 23.6 dB VLRPM=L
Voltage gain L GVAL 13.6 15.6 17.6 dB VLRPM=H
SA stepping driver block
Input dead zone (one side) VDZSA40 80 160 mV
Input output gain gmSA 0.15 0.2 0.25 A/V
Output On resistor (top and bottom) RONSA- 1.3 2.5 Ω IL=200mA
Output limit current ILIMSA0.28 0.4 0.52 A
PWM frequency fosc - 100 - kHz
Loading driver block
Output offset voltage VOFLD-50 0 50 mV
Output saturation voltage (top and bottom) 1 VOLD1- 0.7 1.6 V IL=500mA LDVM=5V
Output saturation voltage (top and bottom) 2 VOLD2- 2.1 3.6 V IL=500mA LDVM=12V
Voltage gain GVLD 15.5 17.5 19.5 dB
CTL1,CTL2, LRPM
Input high voltage VIH 2.5 - 3.7 V
Input low voltage VIL GND- 0.5 V
Others
VC drop-muting VMVC 0.4 0.7 1.0 V
Vcc drop-muting VMVcc3.45 3.85 4.25 V
*This product is not designed to be radiation-resistant.
1-1. Driver logic control terminal 1and 2 (CTL1,2)
All drivers and spindle-drive braking modes can be switched on/off by inputting combinations of H-level signal (higher
than 2.5V and lower than 3.7V), L-level signal (lower than 0.5V) and HiZ signal (open) to these terminals.
・Driver ON/OFF logic table
mode
①
②
③
④
⑤
・Spindle braking mode table
mode
③
④
⑤
1-2.Spindle output mode
The spindle output changes as follows by the setting of LRPM and SPIN. (CTL1=H,CTL2=H or HiZ)
Rotation speed 0rpm 400rpm 4500rpm
1-3.Gain switching mode
CTL1 CTL2 SP SL(2ch) ACT(3ch) SA(2ch) LOADING
L, HiZ L, HiZ × × × × ×
H L × ○ × × ○
H HiZ ○ ○ ○ × ×
L, HiZ H ○ ○ ○ ○ × ○:ON
H H ○ ○ ○ ○ × ×:OFF
① Stand-by mode The IC is brought into stand-by mode, and its power dissipation can be limited.
② Drivers muting All output channels, except the loading and sled motor are muted and their outputs are turned off.
③SA mute mode The loading and SA driver are muted.
④⑤ Loading OFF mode
Only the loading driver is muted.
CTL1 CTL2 SPIN > VC SPIN < VC
H HiZ
L, HiZ H
H H
③⑤Reverse-rotation braking mode (spindle)
When SPIN < VC, all output are shorted to SPVM in 4500rpm (Typ.) or more, in less than
4500rpm (Typ.) the output become reverse-rotation braking mode.
Rotation speed is less than 140rpm when SPIN < VC, all the output are shorted to SPVM.
(However, the above-mentioned rotational speed is expressed in the case of 12pole motor.)
④Short-circuit braking mode (spindle) All the spindle driver outputs are shorted to SPVM when SPIN < VC.
Normal mode
LRPM=Low
⑥
LRPM mode
LRPM=High
* PWM frequency becomes 30kHz (Typ.) in LRPM mode.
The torque at SPIN<VC becomes a counter torque
⑥Low rotation mode Please make to low rotation mode (LRPM=HI) after it starts in normal mode (LRPM=L).
Spindle driver and actuator driver can be switched on/off by inputting combinations of H-level signal (higher than
2.5V and lower than 3.7V), L-level signal (lower than 0.5V) and HiZ signal (open) to LRPM terminal.
LRPM SP Gain ACT Gain (3ch)
L H gain (3.5A/V±0.82A/V)H gain (21.6dB±2dB)
HiZ L gain (0.7A/V±0.17A/V) H gain (21.6dB±2dB)
H L gain (0.7A/V±0.17A/V) L gain (15.6dB±2dB)
Forward-rotation mode
SPIN>VC 120°energizing 150°energizing
SPIN<VC 120°energizing 150°energizing Short brake
SPIN>VC 120°energizing
The relation between (the torque command inputs) and (Iosp or Ioo) is expressed in the figure below: The gain is defined
by the inclination between two points. (Please exclude the dead zone from the input voltage when calculating Iop. )
Iop
Forward rotation
Input dead zone +
Input dead zone -
Gain
SPIN
SLIN1,2
VC
SAIN1,2
4. FG output (FG)
3FG output begins after 900°degrees in electric angle, after the start mode ends and the BEMF detection starts. When
the rotational speed becomes 24rpm (Max.) or less in case of brake, the FG output is fixed to high.
The above-mentioned rotation speed applies to the 12 pole motor.
It is a function to mute the actuator outputs when the IC outputs the current more than the setting threshold value IPRTLIM
for 1.2sec because of the protection for the focus, the tracking, and the tilt coil. Outputs are muted similarly when the
output current of two or three CHs continuously exceed the threshold for 1.2sec.
It returns to normal operation by setting CTL2=L.
IPRTLIM =
A
RPRTLIM(Ω)
(A)
A = 8750
PRTFLG(OUTPUT) Actuator output (FCO/TKO/TLO)
H OFF
L active
MIN. TYP. MAX. Unit
Time until protection function operates 1.0 1.2 1.4 s
FCIN10
Current between
FCO outputs
Current between
TLO outputs
Current between
TKO outputs
CTL2
High
Low
FCIN1
0
0
0
reset
1.2secmute1.2secmute
threshold current
threshold current
threshold current
Current between
FCO outputs
Current between
TLO outputs
Current between
TKO outputs
CTL2
High
Low
0
0
0
0
threshold current
threshold current
threshold current
7. Protect system 2
Function to protect against destruction of output terminal when output pin connects to GND or Vcc.
PRTFLG(OUTPUT) Spindle, Sled motor driver output
H OFF
L active
・Spindle, Sled motor
・When SINK side POWER transistor has been turned on, if the output voltage (SPVM/2&SLVM/2<TYP> or more) are
detected, the channel concerned will be turned off.
・When SOURCE side POWER transistor has been turned on, if the output voltage (SPVM/2&SLVM/2<TYP> or less ) are
detected, the channel concerned will be turned off.
BEMF of the motor is monitored according to timing for the sled input signal to pass VC, and Sled is detected reaching the
inner. The judgment voltage of BEMF can be set according to the voltage input to the terminal SLDET. If BEMF below the
judgment voltage is detected twice continuously, it becomes SLDETOUT=L. The inner detection function can be turned off
with SLDET<0.5V. When the motor starts, the terminal SLDETOUT might become L because BEMF is unstable. Please
take measures such as installing the time of the mask when it starts for the detection prevention.
Judgment voltage Vbemf =2.1 × (SLDET - VC) + 0.49
SLIN1 SLIN2
VC
Motor
SLDETOUT
X
Instability
Stop
:Detection point
BEMF < Vbemt
:Detection point
BEMF > Vbemt
Technical Note
SLDET
9. PWM oscillation frequency
The PWM oscillation for driving the spindle and sled is free running.
The sled and SA oscillating frequency is 100kHz (Typ.)
The spindle oscillating frequency is 167kHz (Typ.)
10. Muting functions
a) VC-drop muting
When the voltage at VC terminal drops to a value lower than 0.7V (Typ.), the outputs of all the channels are turned off.
Set the VC terminal voltage higher than 1.0V.
b) Vcc-drop muting
When the voltage at DVcc terminal and Vcc terminal drop to lower than 3.85V (Typ.), the outputs of all the channels
are turned off.
c) Over voltage protection circuit
When the voltage at SPVM terminal exceed 14.1V (Typ.), only the spindle block output is turned off.
11. Thermal-shut down
Thermal-shutdown circuit (over-temperature protection circuit) is built in to prevent the IC from thermal breakdown. Use
the IC according to the thermal loss allowed in the package. In case the IC is left running over the allowed loss, the
junction temperature rises, and the thermal-shutdown circuit works at a junction temperature of 175℃(Typ.) (All other
channel outputs are turned off)
When the junction temperature drops to 150℃ (Typ.) the IC resumes operation.
1. Absolute maximum ratings
We are careful enough for quality control about this IC. So, there is no problem under normal operation, excluding that it
exceeds the absolute maximum ratings. However, this IC might be destroyed when the absolute maximum ratings, such
as impressed voltages (Vcc, PVcc) or the operating temperature range(Topr), is exceeded, and whether the destruction is
short circuit mode or open circuit mode cannot be specified. Please take into consideration the physical countermeasures
for safety, such as fusing, if a particular mode that exceeds the absolute maximum rating is assumed.
2. Power supply line
Due to switching and EMI noise generated by magnetic components (inductors and motors), using electrolytic and ceramic
suppress filter capacitors(0.1μF) close to the IC power input terminals (Vcc and GND) is recommended. Please note: the
electrolytic capacitor value decreases at lower temperatures. Current rush might flow momentarily by the order of turning
on the power supply and the delay in IC with two or more power supplies. Note the capacity of the power supply coupling,
width and drawing the power supply and the GND pattern wiring.Please make the power supply lines (where large current
flow) wide enough to reduce the resistance of the power supply patterns, because the resistance of power supply pattern
might influence the usual operation (output dynamic range etc…).
3. GND line
The ground line is where the lowest potential and transient voltages are connected to the IC.
4. Thermal design
Do not exceed the power dissipation (Pd) of the package specification rating under actual operation, and please design
enough temperature margins.
5. Short circuit mode between terminals and wrong mounting
Do not mount the IC in the wrong direction and be careful about the reverse-connection of the power connector. Moreover,
this IC might be destroyed when the dust short the terminals between them or GND
6. Radiation
Strong electromagnetic radiation can cause operation failures.
7. ASO(Area of Safety Operation.)
Do not exceed the maximum ASO and the absolute maximum ratings of the output driver.
8. TSD(Thermal shut-down)
The TSD is activated when the junction temperature (Tj) reaches 175℃(with 25℃ hysteresis), and the output terminal is
switched to Hi-z. The TSD circuit aims to intercept IC from high temperature. The guarantee and protection of IC are not
purpose. Therefore, please do not use this IC after TSD circuit operates, nor use it for assumption that operates the TSD
circuit.
9. Inspection by the set circuit board
The stress might hang to IC by connecting the capacitor to the terminal with low impedance. Then, please discharge
electricity in each and all process. Moreover, in the inspection process, please turn off the power before mounting the IC,
and turn on after mounting the IC. In addition, please take into consideration the countermeasures for electrostatic
damage, such as giving the earth in assembly process, transportation or preservation.
10. Earth wiring pattern
This IC is a monolithic IC, and has P+ isolation and P substrate for the element separation. Therefore, a parasitic PN
junction is firmed in this P-layer and N-layer of each element. For instance, the resistor or the transistor is connected to the
terminal as shown in the figure below. When the GND voltage potential is greater than the voltage potential at Terminals A
or B, the PN junction operates as a parasitic diode. In addition, the parasitic NPN transistor is formed in said parasitic diode
and the N layer of surrounding elements close to said parasitic diode. These parasitic elements are formed in the IC
because of the voltage relation. The parasitic element operating causes the wrong operation and destruction. Therefore,
please be careful so as not to operate the parasitic elements by impressing to input terminals lower voltage than GND(P
substrate). Please do not apply the voltage to the input terminal when the power-supply voltage is not impressed. Moreover,
please impress each input terminal lower than the power-supply voltage or equal to the specified range in the guaranteed
voltage when the power-supply voltage is impressing.
Terminal-A
+
P
Parasitic
element
Resistor
P
P-Substrate
GND
Transistor(NPN)
GND
Terminal-B
Surrounding
elements
C
B
E
Parasitic
element
GND
Terminal-B
Terminal-A
+
P
Parasitic
element
CB
+
P
Parasitic
element
E
P
P-Substrate
GND
+
P
Simplified structure of IC
11. Earth wiring pattern
Use separate ground lines for control signals and high current power driver outputs. Because these high current outputs
that flows to the wire impedance changes the GND voltage for control signal. Therefore, each ground terminal of IC must
be connected at the one point on the set circuit board. As for GND of external parts, it is similar to the above-mentioned.
12. Reverse-rotation braking
In the case of reverse-rotation braking from high speed rotation, pay good attention to reverse electromotive force.
Furthermore, fully check the voltage to be applied to the output terminal and consider the revolutions applied to the
reverse-rotation brake.
13. About the capacitor between SPVM and SPGND
The capacitor between SPVM and SPGND absorbs the change in a steep voltage and the current because of the PWM
drive, as a result, there is a role to suppress the disorder of the SPVM voltage. However, the effect falls by the influence of
the wiring impedance etc, if the capacitor becomes far from IC. Please examine the capacitor between SPVM and SPGND
to arrange it near IC.
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