CMOS LDO Regulator for Portable Equipments
Dual, Low-Dropout
Linear Regulator
BD7003NUX, BD7004NUX
●Descriptions
The BD7003NUX, BD7004NUX are dual channels, 300mA low-dropout voltage regulator output at each channel. The output
voltage range is from 1.2V to 3.3V by operating range from 2.5V to 5.5V. The output voltages, VOUT1 and VOUT2, are
determined at power up by the state of P1 and P2(see the table of “Output-Voltage Programming”). The BD7003NUX,
BD7004NUX offer 1.8% accuracy and low-dropout. The shutdown current is near the zero current which is suitable for
battery powered device. The BD7003NUX, BD7004NUX are mounted on VSON008X2020(2.0mmX2.0mmX0.6mm), which
contributes to the space-saving design of set.
●Features
1) 2-channel 300mA, CMOS-type LDOs.
2) Pin-Programmable Output Voltage.
(9 steps adjustable VO；See the Table of “Output-Voltage Programming”.)
3) LDOs Power ON/OFF Enable Control.
4) 2.0mm×2.0mm Package.
5) Small Ceramic Output Capacitors(1μF).
6) Equipped with Over Current Limiter and Thermal Shutdown Circuit(TSD) .
●Applications
Battery-powered portable equipment, etc.
No.12020ECT09
●Absolute Maximum Ratings (T a = 25℃)
Parameter Symbol Ratings Unit
Maximum Supply Voltage (VIN) VIN -0.3 ～ 7 V
Maximum Input Voltage 1 (P1,P2,EN1,EN2) VINMAX1 -0.3 ～ 7 V
Maximum Input Voltage 2 (Vout1,Vout2) VINMAX2 -0.3～Vin+0.3 V
Power Dissipation Pd 1360*1 mW
Operating Temperature Range Topr -40 ～ +85 ℃
Storage Temperature Range Tstg -55 ～ +150 ℃
*1 This is the allowable loss of when it is mounted on a ROHM specification board 40mm×40mm×1.5mmt
To use at temperature higher than 25C , derate 10.9mW per 1℃
* This product is not especially designed to be protected from radioactivity.
●Recommended Operating Range (Ta=-40～+85℃)
Parameter Symbol Ratings Unit
Input Power Supply Voltage Range VIN 2.5～5.5 V
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1/13
2012.01 - Rev.C
BD7003NUX,BD7004NUX
Technical Note
●Power Dissipation
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of IC
are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and t hrough holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original
IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability. Therefore, be
sure to prepare sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT)×IOUT(MAX.)
(VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)
Measurement conditions
Layout of Board for
Measurement
(Unit: mm)
IC
Implementation
Position
Power Dissipation 1.36W
Thermal Resistance θja=91.9℃/W
1.6
Evaluation Bor d1
1.4
1.36W
1.2
1.0
0.8
0.6
Power Dissipation : Pd (W)
0.4
0.2
0.0
0 25 50 75 100 125 150 175 20 0
Fig.1. VSON008X2020 Power dissipation heat reduction characteristics (Reference)
* Please design the margin so that PMAX becomes is than Pd (PMAXPd)
within the usage temperature range.
Evaluation Board 1 (Double-side Board)
Top Layer (Top View)
Bottom Layer (Top View)
Amb ien t Temper at ure : Ta (℃)
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© 2012 ROHM Co., Ltd. All rights reserved.
2/13
2012.01 - Rev.C
BD7003NUX,BD7004NUX
Technical Note
●Electrical Characteristics (Vin=3.7V, EN1=EN2=Vin,Ta =+25℃, unless otherwise noted.)
Parameter Symbol
Output Voltage range VOUT 1.2 - 3.3 V
Input Voltage range VIN 2.5 - 5.5 V
Output Voltage Accuracy
Maximum Output Current Imax 300 - - mA
Short Circuit Current Isc - 150 - mA VOUT = 0V
Ground Pin Current Iq
Dropout Voltage Vdrop
Line Regulation ΔVLNR - 0.02 0.2 %/V VIN=VOUT+1V to VIN=5.5V, Iout=10mA
Load Regulation ΔVLDR - 0.2 0.6 % Iout=1mA to 300mA
Ripple Rejection PSRR - 66 - dB f=100Hz,Iout=10mA@VOUT=1.5V
Output Noise en - 150 - μVrms fBW=10Hz to 100kHz;Iout=10mA
Δvouta -1.8 - 1.8 % Iout=1mA, VOUT≧1.5V
Δvoutb -30 - +30 mV Iout=1mA, VOUT=1.2V
Min Typ Max
Limits
- 55 95
- 35 65 One LDO shutdown, Iout=0mA
- 120 170
- 90 140 VIN=2.7V, VOUT=2.8V, Iout=100mA
80 130 VIN=2.9V, VOUT=3.0V, Iout=100mA
- 70 120 VIN=3.2V, VOUT=3.3V,Iout=100mA
- 360 510 VIN=2.5V, VOUT=2.6V, Iout=300mA
- 270 420 VIN=2.7V, VOUT=2.8V, Iout=300mA
240 390 VIN=2.9V, VOUT=3.0V, Iout=300mA
- 210 360 VIN=3.2V, VOUT=3.3V, Iout=300mA
Unit Condition
Iout=0mA
μA
VIN=2.5V, VOUT=2.6V, Iout=100mA
mV
●EN1, EN2
Enable Input Threshold
Enable Input Leakage Current Ien - 0.1 1 μA Ven=VIN , Ta=+25℃
Shutdown Supply Current IQSHDN - 0.1 1 μA Vout=0V , Ta=+25℃
*This product is not especially designed to be protected from radioactivity.
PIN Name
Set up
Output Voltage Programming Input (P1、P2)
Output voltages, VOUT1 and VOUT2, are determined at power up by the state of P1 and P2 (see the table of
“Output-Voltage Programming”). Subsequent charges to P1 and P2 do not change the output voltages unless the supply
power is cycled, or all EN inputs are simultaneously driven low to shutdown the device.
Shutdown (EN1, EN2)
The BD7003NUX, BD7004NUX have independ ent shutdown control inputs, EN1 and EN2. Driving both EN1 and EN2
low will shut down the entire device, reducing supply current to 1μA max. Connecting EN1 and EN2 to a logic-high or
VIN will enable the corresponding output(s). It is prohibited to open EN1, EN2 switches.
ViH 1.2 - ViL - - 0.5 Regulator shutdown
Output-Voltage Programming
BD7003NUX BD7004NUX
P1 P2 VOUT1 VOUT2 VOUT1 VOUT2
OPEN OPEN 1.50 2.80 1.20 1.50
OPEN GND 1.80 2.60 1.20 1.80
OPEN VIN 1.80 2.70 1.80 1.50
GND OPEN 1.80 2.80 1.80 1.80
GND GND 1.80 2.90 1.80 3.00
GND VIN 2.60 2.80 1.80 3.30
VIN OPEN 2.80 2.80 2.80 3.00
VIN GND 2.90 2.90 3.00 3.00
VIN VIN 2.80 3.30 3.30 3.30
Regulator enabled
V
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3/13
2012.01 - Rev.C
BD7003NUX,BD7004NUX
●Typical Application Circuit
Technical Note
BD7003NUX, BD7004NUX
VIN
CIN
1μF
VIN
P1
VOUT1
OUT1
C
1μF
P2
VIN
VIN
EN1
EN2
GND
VOUT2
COUT2
1μF
Figure2. Application Circuit
*It is prohibited to open EN1, EN2 switches.
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4/13
2012.01 - Rev.C
BD7003NUX,BD7004NUX
●Package Dimensions (VSON008X2020)
●Pin Descriptions
Device name
Lot No.
Technical Note
[Unit: mm]
Device name Marking
BD7003NUX BD7003
BD7004NUX BD7004
PIN description (Top View)
Note : Recommend connecting the Thermal Pad to the GND for excellent power dissipation.
PIN No. Name I/O
1 VIN I - O Voltage Supply
2 EN1 I - O Enable Input1
3 P2 I O O Control Output-Voltage PIN2
4 P1 I O O Control Output-Voltage PIN1
5 EN2 I - O Enable Input2
6 GND - O - GND PIN
7 VOUT2 O - O LDO1 Output1
8 VOUT1 O - O LDO2 Output2
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ESD Diode
IN GND
5/13
Function
2012.01 - Rev.C
A
A
BD7003NUX,BD7004NUX
●Equivalent Circuit
2pin, 5pin (EN)
3kΩ
8pin, 7pin (VOUT)
●Block Diagram
3pin, 4pin (P)
3kΩ
3-State
Decoder
Technical Note
H
OPEN
L
1
VIN
LDO 1
P
87VOUT
1
EN1
EN2
2
5
4
1
P
3P 2
SHUTDOWN
ND POWER-ON
CONTROL
OUTPUT
VOLTAGE
CONTROL
VREF
&
TSD
VIN
ERROR
MP
EN1
OVER CURRENT
PROTECTION
DISCHARGE
CIRCUIT
LDO2
6GND
VOUT
2
Fig.3. Block Diagram
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6/13
2012.01 - Rev.C
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BD7003NUX,BD7004NUX
●Typical Operating Characteristics
※The test conditions for the Ty pical Operating Characteristics are VIN=3.7V, CIN=1.0uF, COUT=1.0uF, Ta=25℃, Unless otherwise noted.
1.4
VOUT1=1.2V
1.2
1
Io=300mA
0.8
Io=10mA
0.6
Io=1mA
Outpu t Vo ltage(V)
0.4
Ｉo=0mA
0.2
0
00.511.522.533.544.555.5
Input Voltage(V)
Fig.4. Output Voltage
(VOUT1=1.2V)
1.6
VOUT2=1.5V
1.4
1.2
Io=300mA
1
Io=10mA
0.8
0.6
Io=1mA
Outp u t Vo l tag e(V)
Ｉo=0mA
0.4
0.2
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
Inp u t Volt ag e(V)
Fig.5. Output Voltage
(VOUT2=1.5V)
3.5
VOUT1=3.3V
3
2.5
2
1.5
Outp u t Vo ltag e(V)
1
0.5
0
0 0.5 1 1.5 2 2 .5 3 3 .5 4 4 .5 5 5 .5
Fig.6. Output Voltage
1.4
1.2
VOUT1=1.2V
1
0.8
0.6
Output Voltage(V)
0.4
0.2
0
2.53 3.544.5 55.5
Io=300mA
Input Voltage(V)
Ｉo=0mA
Io=1mA
Io=10mA
1.6
1.4
1.2
1
VOUT2=1.5V
0.8
0.6
Output Voltage(V)
0.4
0.2
0
2.5 3 3.5 4 4.5 5 5.5
Input Voltage(V)
Ｉo=0mA
Io=1mA
Io=10mA
Io=300mA
3.5
3
VOU T1=3.3V
2.5
2
1.5
Output V oltage(V)
1
0.5
0
3.7 4.2 4.7 5.2
Fig.7. Line Regulation
(VOUT1=1.2V)
Fig.8. Line Regulation
(VOUT2=1.5V)
Fig.9. Line Regulation
10
P1= P2=GND
9
P1=P2=GND
8
7
uA
6
5
4
3
G nd C u rre n t
2
1
0
00.511.522.533.544.555.5
Ta=85
℃
Ta=25
℃
Ta=-4 0
℃
Input Voltage (V)
100
P1=P2=GND
P1=P2=GND
80
uA
60
40
Gnd Current
20
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
Input Voltage (V)
Ta=85
Ta=25
Ta=-40
100
80
℃
℃
℃
uA
60
40
Gnd C urrent
20
0
00.511.522.533.544.555.5
Fig.10. Circuit Current
(VOUT1=1.8V,VOUT2=2.9V)
EN1=EN2=GND
Fig.11. Circuit Current
(VOUT1=1.8V,VOUT2=2.9
V) EN1=VIN, EN2=GND
Fig.12. Circuit Current
(VOUT1=1.8V,VOUT2=2.9V)
EN1=GND, EN2=VIN
100
P1=P2=GND
P1=P2=GND
80
uA
60
40
Ta=85
Gnd C urrent
20
0
00.511.522.533.544.555.5
℃
Ta=25
℃
Ta=-40
℃
Inpu t Voltage (V)
1.0
0.9
P1=P2=GND
0.8
0.7
uA
0.6
0.5
0.4
0.3
EN C urrent
0.2
0.1
0.0
00.511.522.533.544.555.5
Ta=85
Ta=25
Ta=-40
℃
℃
℃
Input Voltage (V)
1.0
0.9
0.8
0.7
uA
0.6
0.5
0.4
0.3
EN C urrent
0.2
0.1
0.0
Technical Note
Io=300mA
Io=10mA
Io=1mA
Ｉo=0mA
Inpu t Voltage(V)
(VOUT1=3.3V)
Io=0mA
Io=1mA
Io=10mA
Io=300mA
Input Vol tage(V)
(VOUT1=3.3V)
P1=P2=GND
P1=P2=GND
Ta=85
℃
Ta=25
℃
Ta=-40
℃
Inpuｔ Voltage (V)
P1=P2=GND
Ta=85
℃
Ta=25
℃
Ta=-40
℃
00.511.522.533.544.555.5
Input Volt age(V)
Fig.13. Circuit Current
Fig.14. EN1 Input Current
Fig.15. EN2 Input Current
(VOUT1=1.8V,VOUT2=2.9V)
EN1=EN2=VIN
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7/13
2012.01 - Rev.C
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BD7003NUX,BD7004NUX
Technical Note
2.0
P1=P
1.5
V
e
1.0
ut Volta
Out
0.5
0.0
00.511.5
EN Voltage (V)
Ta=85
Ta=25
Ta=-40℃
℃
℃
3.0
2.5
V
2.0
e
1.5
ut Volta
1.0
Out
0.5
0.0
00.511.5
EN Volt age (V)
Ta=85℃
Ta=25
Ta=-40
℃
℃
4
3.5
3
2.5
2
Vout1 [V]
1.5
1
Io=0mA
0.5
0
-40 -15 10 35 60 85
Io=0.1mA
Temp [°C]
Fig.16. EN1 Threshold
VOUT1=1.8V)
Fig.17. EN2 Threshold
(VOUT2=2.9V)
Fig.18. VOUT - Temp
(VOUT1=1.8V)
4
3.5
3
2.5
2
Vout2 [V]
1.5
1
0.5
0
-40 -15 10 35 60 85
Io=0mAIo=0.1mA
Temp [°C]
Fig.19. VOUT – Temp
VOUT2=3.0V)
10
9
P1=P2=GND
8
7
uA
6
5
4
G n d C urre n t
3
2
1
0
-40 -15 10 35 60 85
Temp (°C)
Fig.20. Icc - Temp
(VOUT1=1.8V,VOUT2=2.9V)
EN1=EN2=GND
100
P1=P2=GND
P1=P2=GND
80
60
40
Gnd Current (uA
20
0
-40 -15 10 35 60 85
Temp (°C)
Fig.21.Icc- Temp
(VOUT1=1.8V,VOUT2=2.9V)
EN1=VIN, EN2=GND
100
P1=P2=GND
P1=P2=GND
80
60
40
Gnd Current (uA
20
0
-40 -15 10 35 60 85
Temp (°C)
100
P1=P2=GND
P1=P2=GND
P1=P
80
uA
60
40
Gn d Cu rre nt
20
0
-40 -15 10 35 60 85
Temp (°C)
1.00
0.90
VIN=2.7V
0.80
0.70
0.60
0.50
0.40
DropoutVoltage(V)
0.30
0.20
0.10
0.00
0 0.05 0. 1 0.15 0. 2 0.25 0.3
Temp=85℃
Temp=25℃
IOUT(A)
Fig.22. Icc - Temp
(VOUT1=1.8V,VOUT2=2.9V)
EN1=GND, EN2=VIN
1.00
0.90
VIN=2.7V
0.80
0.70
0.60
0.50
0.40
DropoutVoltage(V)
0.30
0.20
0.10
0.00
0 0.05 0.1 0.15 0.2 0.25 0.3
Temp=85℃
IOUT(A)
Temp=25℃
Temp=-40℃
Fig.23. Icc - Temp
(VOUT1=1.8V,VOUT2=2.9V)
EN1=EN2=VIN
4
3.5
3
2.5
2
VOUT1 [V]
1.5
1
0.5
0
0 50 100 150 200 250 300
0 0.05 0.10 0.15 0.20 0.25 0.30
Temp=-40°C
Temp=25°C Temp =85°C
Iout1[A]
Fig.24. Drop Out Voltage
VOUT1=2.8V
4
3.5
3
2.5
Temp =-40 °C Temp=25 °C Temp=85°C
2
VOUT2 [V]
1.5
1
0.5
0
0 50 100 150 200 250 300
0.05 0.1 0.15 0.2 0.25 0.3
Iout2[A]
Temp=-40℃
Fig.25. Drop Out Voltage
(VOUT2=2.8V)
Fig.26. Load Regulation
(VOUT1=1.2V)
Fig.27. Load Regulation
(VOUT2=1.5V)
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8/13
2012.01 - Rev.C
BD7003NUX,BD7004NUX
4
3.5
Temp=-40 °C Temp=2 5°C
3
2.5
2
VOUT1 [V]
1.5
1
0.5
0
0 50 100 150 200 250 300
Temp=85° C
Iout1[A]
Fig.28. Load Regulation
(VOUT1=2.8V)
EN1
10μsec/div
1V/div
VOUT1
1V/div
VIN=3.7
Fig.31. Start Up Time
(VOUT1=1.8V)
IOUT=0mA
EN2
1msec/div
1V/div
VOUT2
1V/div
VIN=3.7
Fig.34. Discharge Time
(VOUT2=2.9V)
IOUT=0mA
4
3.5
Temp =-40 °
3
2.5
2
VOUT1 [V]
1.5
1
0.5
0
0 50 100 150 200 250 300
0 0.05 0.1 0.15 0.2 0.25 0.3
Temp =25°C
Iout1[A]
Temp=85°C
Fig.29. Load Regulation
(VOUT2=3.0V)
EN2
VOUT2
10μsec/div
1V/div
1V/div
VIN=3.7
Fig.32. Start Up Time
(VOUT2=2.9V)
IOUT=0mA
Fig.35. VIN Response
(VOUT1=1.2V)
IOUT=50mA
Technical Note
4
3.5
3
2.5
Temo= -40℃Temo= 25℃Temo= 85
2
VOUT2 [V]
1.5
1
0.5
0
0 50 100 150 200 250 300
0.1 0.15 0.2 0. 25 0.3
0.05
Iout2[mA]
Fig.30. Load Regulation
(VOUT2=3.3V)
EN1
VOUT1
Fig.33. Discharge Time
(VOUT1=1.8V)
IOUT=0mA
Fig.36. VIN Response
(VOUT1=1.5V)
IOUT=50mA
℃
1msec/div
1V/div
1V/div
VIN=3.7
Fig.37. VIN Response
(VOUT1=1.8V)
IOUT=50mA
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Fig.38. VIN Response
(VOUT2=3.0V)
IOUT=50mA
9/13
Fig.39. VIN Response
(VOUT2=3.3V)
IOUT=50mA
2012.01 - Rev.C
BD7003NUX,BD7004NUX
I o u t ＝ 1mA - > 1 5 0 mA
40μsec/ div
100mA/div
1.2V
Vout1
200mV/ div
Fig.40. Load Response
(VOUT1=1.2V)
IOUT=1mA→150mA
Iout＝150mA->1mA
40μsec/ div
100mA/div
Vout1
200mV/ div
3.3V
Fig.43. Load Response
(VOUT1=3.3V)
IOUT=150mA→1mA
Iout＝1mA->150mA
Vout1
3.3V
Fig.41. Load Response
(VOUT1=3.3V)
IOUT=1mA→150mA
40μsec/ div
100mA/div
200mV/ div
Technical Note
Iout＝150mA->1mA
Vout1
1.2V
Fig.42. Load Response
(VOUT1=1.2V)
IOUT=150mA→1mA
40μsec/ div
100mA/div
200mV/ div
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10/13
2012.01 - Rev.C
BD7003NUX,BD7004NUX
Technical Note
●Example of EN1&EN2 used (P1=GND,P2=OPEN, VOUT1=1.8V, VOUT2=2.8V)
Output overshoot conditions
Whenever the LDO is turned ON, LDO1 output overshoot occurs in certain boot conditions.
In CASE2, the overshoot value is minimum, which boot order is EN1→EN2.
The maximum over shoot occurs in CASE3, which boot order is EN2→EN1.
The overshoot value differs between input voltages(VIN), output voltage setting and EN1, EN2 input timing interval.
CASE1: EN1 & EN2 Pins are shorted
VIN=3.7V,EN2=EN1
EN1(5V/div)
VOUT2(0.5V/div)
VOUT1(0.5V/div)
VIN=5.5V,EN2=EN1
EN1(5V/div)
VOUT2(0.5V/div)
VOUT1(0.5V/div)
20ms/div
20ms/div
EN1 & EN2 Pins are independent
CASE2: EN1→EN2 operation(L→H)
VIN=3.7V,EN2=L(OFF)
EN1(5V/div)
VIN=5.5V,EN2=L(OFF)
EN1(5V/div)
VOUT1(0.5V/div)
VOUT1(0.5V/div)
VOUT2(0.5V/div)
20ms/div
VOUT2(0.5V/div)
20ms/div
CASE3: EN2→EN1 operation(L→H)
VIN=3.7V,EN2=H(ON)
EN1(5V/div)
VOUT2(0.5V/div)
VOUT1(0.5V/div)
VIN=5.5V,EN2=H(ON)
EN1(5V/div)
VOUT2(0.5V/div)
VOUT1(0.5V/div)
20ms/div
20ms/div
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11/13
2012.01 - Rev.C
BD7003NUX,BD7004NUX
●Notes for use
(1) Absolute maximum ratings
If applied voltage (VIN), operating temperature range (Topr), or other absolute maximum ratings are exceeded, there is
a risk of damage. Since it is not possible to identify short, open, or ot her damage modes, if special modes in which
absolute maximum ratings are exceeded are assumed, consider applying fuses or other physical safety measures.
(2) Recommended operating range
This is the range within which it is possible to obtain roughly the expected characteristics. For electrical characteristics,
it is those that are guaranteed under the conditions for each parameter. Even when these are within the recommended
operating range, voltage and temperature characteristics are indicated.
(3) Reverse connection of power supply connector
There is a risk of damaging the IC by reverse connection of the power supply connector. For protection from reverse
connection, take measures such as externally placing a diode between the power suppl y and the power supply pin of
the IC.
(4) Power supply lines
In the design of the board pattern, make power supply and GND line wiring low impedance.
When doing so, although the digital power supply and anal og power supply are the same potential, separate the digital
power supply pattern and analog power supply pattern to deter digital noise from entering the analog power supply due
to the common impedance of the wiring patterns. Similarly take pattern design into account for GND lines as well.
Furthermore, for all power supply pins of the IC, in conjunction with inserting capacitors between power supply and GND
pins, when using electrolytic capacitors, determine constants upon adequately confirming that capacitance loss
occurring at low temperatures is not a problem for various characteristics of the capacitors used.
(5) GND voltage
Make the potential of a GND pin such that it will be the lowest potential even if operating below that. In additi on,
confirm that there are no pins for which the potential becomes less than a GND by actually including transition
phenomena.
(6) Shorts between pins and misinstallation
When installing in the set board, pay adequate attention to orientation and placement discrepancies of the IC. If it is
installed erroneously, there is a risk of IC damage. There also is a risk of damage if it is shorted by a foreign substance
getting between pins , between a pin and a power supply or GND.
(7) Operation in strong magnetic fields
Be careful when using the IC in a strong magnetic field, since it may malfunction.
(8) Inspection in set board
When inspecting the IC in the set board, since there is a risk of stress to the IC when capacitors are connected to lo w
impedance IC pins, be sure to discharge for each process. Moreover, when getting it on and off of a jig in the
inspection process, always connect it after turning off the power supply, perform the inspection, and remove it after
turning off the power supply. Furthermore, as countermeasures against static electricity, use grounding in the
assembly process and take appropriate care in transport and storage.
(9) Input pins
Parasitic elements inevitably are formed on an IC structure due to potential relations hips. Because parasitic elements
operate, they give rise to interference with circuit operation and may be the cause of malfunctions as well as damage.
Accordingly, take care not to apply a lower voltage than GND to an input pin or use the IC in other ways such that
parasitic elements operate. Moreover, do not apply a voltage to an input pin when the power supply voltage is not
being applied to the IC. Furthermore, when the power supply voltage is being applied, make each input pin a voltage
less than the power supply voltage as well as within the guaranteed values of electrical characteristics.
(10) Ground wiring pattern
When there is a small signal GND and a large current GND, it is recommended that you separate the large current GND
pattern and small signal GND pattern and provide single point grounding at the reference point of the set so that voltage
variation due to resistance components of the pattern wiring and large currents do not cause the small signal GND
voltage to change. Take care that the GND wiring pattern of externally attached components also does not change.
(11) Externally attached capacitors
When using ceramic capacitors for externally attached capacitors, determine constants upon taking into account a
lowering of the rated capacitance due to DC bias and capacitance change due to factors such as temperature.
(12) Thermal shutdown circuit (TSD)
When the junction temperature becomes 180℃ (typ) or higher, the thermal shutdown circuit operates and turns the
switch OFF. The thermal shutdown circuit, which is aimed at isolating the IC from thermal runaway as much as possible,
is not aimed at the protection or guara
operating or use the IC assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins b y taking into account the permissible dissipation (Pd) in
actual states of use.
Technical Note
ntee of the IC. Therefore, do not continuously use the IC with this circuit
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© 2012 ROHM Co., Ltd. All rights reserved.
12/13
2012.01 - Rev.C
BD7003NUX,BD7004NUX
●Ordering part number
B D 7 0 0 3 N U X - E 2
Part No. Part No.
VSON008X2020
1PIN MARK
0.05 S
C0.25
0.3±0.1
0.6MAX
7003
7004
2.0±0.05
1.5±0.1
0.5±0.1
184
1.5±0.1
2.0±0.05
S
+0.03
−0.02
(0.12)
0.02
0.8±0.1
5
+0.05
0.25
−0.04
(Unit : mm)
Package
NUX: VSON008X2020
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
4000pcs
E2
The direction is the 1pin of product is at the upper left when you hold
()
reel on the left hand and you pull out the tape on the right hand
Reel
1pin
Packaging and forming specification
E2: Embossed tape and reel
Order quantity needs to be multiple of the minimum quantity.
∗
Technical Note
Direction of feed
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© 2012 ROHM Co., Ltd. All rights reserved.
13/13
2012.01 - Rev.C
Notes
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The content specied herein is subject to change for improvement without notice.
The content specied herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specied in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
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The technical information specied herein is intended only to show the typical functions of and
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The Products specied in this document are intended to be used with general-use electronic
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While ROHM always makes efforts to enhance the quality and reliability of its Products, a
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Please be sure to implement in your equipment using the Products safety measures to guard
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The Products are not designed or manufactured to be used with any equipment, device or
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R1120
A
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