ROHM BD6974FV Technical data

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STRUCTURE Silicon Monolithic Integrated Circuit

PRODUCT SERIES Single-Phase Full-Wave Motor Driver for Fan Motor

TYPE

ＢＤ６９７４ＦＶ

FEATURES Pre-driver compatible for external Tr

Speed controllable by DC/PWM input

PWM soft switching drive

〇ABSOLUTE MAXIMUM RATINGS

Parameter

Symbol Limit Unit

Supply voltage Vcc 20 V
Power dissipation Pd 874.7＊ mW
Operating temperature Topr -40 to +100 °C
Storage temperature Tstg -55 to +150 °C
High side output voltage VOH 36 V
Low side output voltage VOL 15 V
Low side output current IOL 10 mA
AL output current
AL output voltage
REF current ability
HB current ability

IAL 10 mA

VAL 20 V

IREF 12 mA

IHB 12 mA
Input voltage(H+, H-, TH, MIN, CS, SS) VIN 7 V
Junction temperature Tjmax 150 °C

＊Reduce by 7.0mW/°C over Ta=25°C.

(On 70.0mm×70.0mm×1.6mm glass epoxy board)

〇OPERATING CONDITIONS

Parameter

Symbol

Limit Unit

Operating supply voltage range Vcc 4.3 to 17.0 V

Hall input voltage range VH

0 to Vcc-2.0 V

0 to 7.0 V
TH input voltage range VTH 0 to REF V
MIN input voltage range VMIN 0 to REF V

＊This product is not designed for production against radioactive rays.

＊This document may be strategic data subject to COCOM regulations.

less than Vcc=9.0V
more than Vcc=9.0V

REV. B

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〇ELECTRICAL CHARACTERISTICS (Unless otherwise specified Ta=25°C, Vcc=12V)

Parameter

Symbol

Min. Typ. Max.

Limit

Unit Conditions

Circuit current Icc 3 5 8 mA
Hall input hysteresis VHYS ±5 ±10 ±15 mV
High side output current IH 9.0 12.0 16.5 mA VOH=12V
High side output leak current IHL - - 10 μA VOH=36V
Low side output high voltage VLH 9.3 9.5 - V IOL=-5mA
Low side output low voltage VLL - 0.5 0.7 V IOL=5mA
Lock detection ON time TON 0.2 0.3 0.45 s
Lock detection OFF time TOFF 4.0 6.0 9.0 s
AL output low voltage VALL - - 0.3 V IAL=5mA
AL output leak current IALL - - 10 μA VAL=17V
OSC low voltage VOSCL 0.8 1.0 1.2 V
OSC high voltage VOSCH 2.3 2.5 2.7 V
OSC charge current ICOSC -55 -40 -25 μA
OSC discharge current IDOSC 25 40 55 μA

VTH=VREF×0.26

Output ON duty 1 DUTY1 75 80 85 %

(H side pull up R=1kΩ,
COSC=470pF)
VTH=VREF×0.35

Output ON duty 2 DUTY2 45 50 55 %

(H side pull up R=1kΩ,
COSC=470pF)
VTH=VREF×0.44

Output ON duty 3 DUTY3 15 20 25 %

(H side pull up R=1kΩ,

COSC=470pF)
REF voltage VREF 4.8 5.0 5.2 V IREF=-2mA
Hall bias voltage VHB 1.10 1.26 1.50 V IHB=-2mA
Current limit voltage VCL 120 150 180 mV
SS charge current ISS 50 120 300 nA VSS=0V
TH bias current ITH - - 0.2 μA
MIN bias current IMIN - - 0.2 μA
CS bias current ICS - - 0.2 μA

REV. B

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A

A

〇PACKAGE OUTLINES

6.4 ± 0.3

0.2

±

4.4

5.0 ± 0.2

D6974

9

8

Lot No.

16

1

0.3Min.

0.15 ± 0.1

1.15 ± 0.1

0.65

0.1

0.22 ± 0.1

0.1

SSOP-B16 (UNIT: mm)

〇BLOCK DIAGRAM 〇TERMINAL NAME

AL

1

OSC

2

MIN

3

TH

4

REF

5

SIGNAL

OUTPUT

OSC

REF

+

-

+

-

SOFT

START

SOFT

SWITCH

MIN
PWMCOMP

TH
PWMCOMP

CONTROL

LOGIC

QUICK
START

LOCK

PROTECTION

HALL
COMP

CURRENT
LIMIT
COMP

HB

-

+

+
+

-

TSD

VCL

Vcc

6

A1H

7

PRE DRIVER

GND

16

H-

15

HB

14

H+

13

SS

12

CS

11

2H

10

PIN No.

1 AL
2 OSC
3 MIN
4 TH
5 REF
6 Vcc
7 A1H
8 A1L

9 A2L
10 A2H
11 C S
12 SS
13 H+
14 HB
15 H­16 GND

A1L

8

2L

9

Terminal

name

REV. B

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〇CAUTIONS ON USE

1) Absolute maximum ratings

An excess in the absolute maximum rations, such as supply voltage, temperature range of operating conditions, etc., can break down

the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will

expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.

2) Connecting the power supply connector backward

Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An

external direction diode can be added.

3) Power supply line

Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a capacitor

between power supply and GND for routing regenerated current. And fully ensure that the capacitor characteristics have no problem

before determine a capacitor value. (when applying electrolytic capacitors, capacitance characteristic values are reduced at low

temperatures)

4) GND potential

It is possible that the motor output terminal may deflect below GND terminal because of influence by back electromotive force of motor.

The potential of GND terminal must be minimum potential in all operating conditions, except that the levels of the motor outputs

terminals are under GND level by the back electromotive force of the motor coil. Also ensure that all terminals except GND and motor

output terminals do not fall below GND voltage including transient characteristics. Malfunction may possibly occur depending on use

condition, environment, and property of individual motor. Please make fully confirmation that no problem is found on operation of IC.

5) Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

6) Inter-pin shorts and mounting errors

Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or

if pins are shorted together.

7) Actions in strong electromagnetic field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.

8) ASO

When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO.

9) Thermal shut down circuit

The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175°C (typ.) and has a hysteresis width

of 25°C (typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an open state. TSD circuit is

designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not

continue to use the IC after operation this circuit or use the IC in an environment where the operation of this circuit is assumed.

10) Testing on application boards

When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always

discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or removing it from a jig

or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when

transporting or storing the IC.

11) GND wiring pattern

When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single

ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by larg

do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external

components, either.

12) Capacitor between output and GND

When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it is possible that the

current charged in the capacitor may flow into the output resulting in destruction. Keep the capacitor between output and GND below

100uF.

13) IC terminal input

When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below GND is applied

to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic element causes mutual

interference between circuits, resulting in malfunction as well as destruction in the last. Do not use in a manner where parasitic

element is actuated.

e currents

REV. B

Notes

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Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
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