ROHM BD6934FV Technical data

Power Management IC Series for Automotive Body Control

Antenna Driver

BD6934FV

●Description This 1ch half-bridje pre-driver for 125kHZ drive with a built-in oscillation circuit is equipped the driving current adjustment function.

●Features

1)Pre-driver for driving MOS-FET

2)4MHz ceramic resonator or external pulse are available

3)Driving current adjustment function (Dependence on power supply voltage)

4)Stand-by current 0μA（typ.）

5)Built-in the resistance between Gate to Source of FET

6)Built-in FET synchro on protect

7)Built-in thermal shutdown

8)Built-in under voltage lockout protection(UVLO)

●Applications

Usable in driving low frequency , the likes of TPMS and smart entry system.

●Absolute Maximum Ratings（Ta=25℃）

Parameter Symbol Rating Unit Supply voltage Vcc1,Vcc2 12 V Power dissipation Pd 562 ＊ mW Operating temperature range T Storage temperature range T Junction temperature T

＊Reduced by 4.496mW/℃,when mounted on a glass epoxy board (70mm×70mm×1.6mm)

●Operating range

Supply voltage Vcc1,Vcc2 3.5～8 V RP,RN voltage Vrp,Vrn VCC2 V XOUT,RT,CT voltage Vxout,Vrt,Vct VCC1 V Input voltage VIN -0.3～VCC1 V

*This product described in this specification isn’t judged whether it applies to COCOM regulations.

It should not be exported without authorization from the appropriate government.

*This product is not designed for protection against radioactive rays.

Status of this document

*

The Japanese version of this document is the formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document, formal version takes priority.

(Ta=25℃)

Parameter Symbol Operating range Unit

-40～85 ℃

opr

-55～150 ℃

stg

150 ℃

jmax

No.09039EBT03

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1/12

2009.09 - Rev.B

BD6934FV

●Electrical characteristics（Unless otherwise specified, VCC1=VCC2=3.5～8V,Ta=-40～85℃）

Technical Note

Parameter Symbol

［

Circuit current

VCC driv e cu rrent

VCC stand-by current Icc2 - - 10

］

Icc1 - 3.5 7

Min. Typ. Max.

Limit

[Output]

］

V

OHH OHL

V

OLH

OLL LH

I

LL

ON

D

ON ON

T

OSC

V

I

IH

IL

VCC-0.4 VCC-0. 2 - V I o=-5ｍAFig.33

-0.20.4V Io=5

VCC-0.4 VCC-0. 2 - V I o=-5ｍAFig.33

-0.20.4V Io=5

--10μA Vo=0V Fig.32

--10μAVo=12V Fig.32

3.5 6.84 9.17 11. 5 % VCC1=VCC2=3.5V Fig.34 4

13 15 17 % VCC1=VCC2=4V Fig.34

7 44 49 54 % VCC1=VCC2=7V Fi g.34

--8μsec * Fig.34

VCC*0.8 - - V Fig.33

IH

IL

- - 1.3 V Fig.34

10 - 150

--10μAVIN=0V Fig.32

］

2.7 3 3.3 V Fig.31

2.9 3.2 3.5 V Fig.31

0.63 0.7 0.77 V Fig.35 346 432 518 300 430 560

V

UVOFF

V

UVON

RT CTC CTD

Upper side output v oltage H

Upper side output v oltage L V L ower s ide output v oltage H

L ower si de output v oltage L V

Output leak current H I

Output leak current L

ON Duty 3.5V D

ON Duty 4V ON Duty 7V D

Oscillating st ar t time *

Input（IN,SEL

［

）］

Input voltage H

Input voltage L V Input current H

Input current L I

［

Under volt age lock out protection

UV LO ON v olt a ge V

UVLO OFF voltage

Trianglar wave generation

［

RT voltage

CT charge curr ent I

CT discharge cur r ent I

Unit

Conditions

Measurem ent

circuit

mA IN=High Fig.31

μ

A IN=Low Fig.32

AFig.33

ｍ

AFig.33

ｍ

μ

A V IN=VCC Fig.31

AVCT

μ

AVCT

μ

1.1V Fig.35

＝

1.1V Fig.35

＝

* Oscillating start time ： Time till operating output, after UVLO turn off during oscillating ceramic resonator.

◎This product is not designed for protection against radioactive rays.

●Dimension

Product No.

D6934

Lot No.

Fig.1 SSOP-B16 （UNIT:mm）

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2/12

2009.09 - Rev.B

BD6934FV

●Reference Data

5

4

3

2

ICC1[mA]

1

0

036912

VCC1,VCC2[V]

Fig.2 VCC drive current

0.0

-0.3

-0.6

V_OUTN(V)

-0.9

Ta=85℃

Ta=25℃

Ta=-40℃

Ta=25℃

Ta=85℃

4.0

3.0

2.0

ICC2[μA]

1.0

0.0

Ta=-40℃

036912

Ta=25℃

Ta=85℃

VCC1,VCC2[V]

Fig.3 VCC stand-by current

1.2

0.9

0.6

V_OUTN[V]

0.3

Ta=85℃

T=a25℃

Ta=-40℃

Technical Note

0.0

-0.3

-0.6

-0.9

V_OUTN-VCC2[V]

-1.2

V_OUTN[V]

Ta=-40℃

Ta=25℃

Ta=85℃

0 5 10 15 20

I_OUTP[mA]

Fig.4 output voltage H (Vcc3.5V)

1.2

0.9

0.6

0.3

Ta=85℃

Ta=25℃

Ta=-40℃

-1.2 0 5 10 15 20

I_OUTP[mA]

Fig.5 output voltage H (Vcc8V)

4

3

2

I_OUTP[μA]

1

0

036912

Ta=85℃ Ta=25℃

Ta=-40℃

VCC1,VCC2[V]

Fig.8 Output leak current H

OUTP

OUTN

0.0 0 5 10 15 20

I_OUTN[mA]

Fig.6 output voltage L (Vcc3.5V)

4

3

2

I_OUTP[μA]

1

0

036912

Ta=85℃ Ta=25℃ Ta=-40℃

VCC1,VCC2[V]

Fig.9 Output leak current L

OUTP

OUTN

OUTP

OUTN

0.0 0 5 10 15 20

I_OUTN[mA]

Fig.7 output voltage L (Vcc8V)

Fig.10 ON Duty3.5V

0.8

0.6

From Left Ta=-40℃

Ta=25℃

0.4

V_RT[V]

0.2

Ta=85℃

Fig.11 ON Duty4V

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Fig.12 ON Duty7V

3/12

0.0

0.00.71.42.12.83.5

V_IN[V]

Fig.13 Input voltage H / L (Vcc3.5V)

2009.09 - Rev.B

BD6934FV

0.8

0.6

0.4

V_RT[V]

0.2

0.0

0.0 1.0 2.0 3.0 4.0

Fig.14 Input voltage H / L (Vcc4V)

4

3

2

I_IN[μA]

1

0

04812

Fig.17 Input current H

1.0

0.8

0.6

0.4

V_RT[V]

0.2

0.0 036912

From Left Ta=-40℃

Ta=25℃ Ta=85℃

V_IN[V]

Ta=85℃

VCC1,VCC2[V]

Ta=85℃

Ta=25℃

Ta=-40℃

VCC1 ,VCC2[V]

Fig.20 RT voltage

0.8

0.6

From Left Ta=-40℃

Ta=25℃ Ta=85℃

0.4

V_RT[V]

0.2

0.0

0.0 2.0 4.0 6.0

V_IN[V]

Fig.15 Input voltage H / L (Vcc7V)

200

150

Ta=85℃

100

I_IN[μA]

50

0

036912

Ta=25℃

Ta=-40℃

VCC1,VCC2[V]

Fig.18 Input current L

1000

500

I_CT[μA]

-500

-1000

From Left Ta=-40℃

Ta=25℃ Ta=85℃

0

0.00.30.60.91.21.5

V_CT[V]

Fig.21 CT charge-discharge current

Technical Note

0.8

0.6

From Left Ta=-40℃

Ta=25℃

0.4

V_RT[V]

0.2

0.0

0.02.04.06.08.0

Fig.16 Input voltage H / L (Vcc8V)

4.0

3.0

2.0

V_OUTP[V]

1.0

0.0 01234

Fig.19 UVLO ON/OFF voltage

Ta=85℃

V_IN[V]

From Left Ta=85℃

Ta=25℃ Ta=-40℃

VCC1,VCC2[V]

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4/12

2009.09 - Rev.B

BD6934FV

C

UVLO

C

ounter

●Block diagram

CSTCR4M00G55B-R0

9

VCC1

On duty control / Synchro on protect

Technical Note

8

XOUT

10

CT

11

Counter

1000p

12

Triangle

Oscillator

4.8k

125kHz

1000p

SEL

13

IN 14

GND

PGND

16

XIN

XOUT

10

CT

11

RT

13

GND

PGND

100k

VCC1

TSD

1M

Triangle

Oscillator

100k

VCC1

UVLO

TSD

Fig.22 Resonator mode

VCC1

VCC2

Function

Logic OUTP

VCC2

Function

Logic

OUTN

On duty control /

Synchro on protect

VCC2

Function

Logic

OUTP

VCC2

Function

Logic

OUTN

20k

Fig.23 External pulse mode

* Product No.and constants of external devices are recommended condition.

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5/12

20k

.

N. 7

VCC1

6

VCC2 5

RP

OUTP

3

2

OUTN

1

RN 8

N.C. 7

VCC1

6

VCC2

5

4

OUTP

N.C.

2

OUTN

1

2009.09 - Rev.B

SP8M3

1u

SP8M3

BD6934FV

●Pin name PIN NO. Pin name Function

1 OUTN Nch FET GATE connection 2 N.C. N.C. 3 OUTP Pch FET GATE connection 4 RP For pull-up resistance of Pch FET Gate 5 VCC2 Power VCC terminal 6 VCC1 Signal VCC terminal 7 N.C. N.C. 8 RN For pull – down resistance of Nch FET Gate

9 XIN Resonator connection 10 XOUT Resonator connection 11 CT Capacitor connection for triangular wave generation 12 RT Capacitor connection for triangular wave generation 13 SEL Input terminal for mode selection(Resonator mode:L,External pulse mode:H) 14 IN Input terminal (Stand-by:L, Enable:H) 15 GND Signal GND terminal 16 PGND Power GND terminal

●I/O Circuit Diagram

Technical Note

VCC1

SEL

IN

XIN

GND

VCC1

GND GND GND

6.6K

100K

Fig.24 SEL(13pin) IN(14pin)

250

6K

4p

1M

VCC1

100

VCC1

3.3K

4p

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XOUT

VCC1

GND

Fig.25 XIN(9pin) XOUT(10pin)

GND GND GND GND

6/12

2009.09 - Rev.B

BD6934FV

Technical Note

RT

CT

VCC1

GND

VCC1

700

700 700

Fig.26 RT(12pin)

VCC1

GND

GND GND GND

Fig.27 CT(11pin)

VCC2

15

VCC2

OUTP OUTN

20k

Fig.28 OUTN(1pin) OUTP(3pin) RP(4pin) RN(8pin)

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7/12

PGND PGND

RP RN

PGND

2009.09 - Rev.B

BD6934FV

e

8

●Truth table

Technical Note

Pin Name XIN IN SEL OUTP OUTP

Pin No. 9 14 13 3 1

Resonator

4MHz

External signal

125KHz

●Timing chart

（4MHz）

XIN

Internal CLK

（125kHz）

CT

Input Output

4MHz L L Hiz Hiz

4MHz H L Enable Enable 125KHz L L Hiz Hiz 125KHz H H Enable Enable

H

L

period 8usec

Variation as to supply voltage

OUTP

OUTN

VCC

(=IN)

OUTP

H L

V

7V

3.2V

3.0V 0V

ON time

Hi

Fig.29

Dead time

Timing chart(driving)

Enabl

Dead time

Hiz

8/12

Enable

Hiz

2009.09 - Rev.B

OUTN

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Hi

Fig.30

VCC-OUTP・OUTN Operating range

BD6934FV

p

●Measurement circuit

Technical Note

A

4.8K

12

1000P

9

10 11

16

IIH

13 14 15

VIL

A

IIL

4.8K

12

13 14 15

BD6934FV

VCC

１

2 3 4 5 6 7 8

5K 5K

V

A

ICC1

VCC

BD6934FV

１ 2 3 4 5 6 7 8

I

A A A

I

Vo

ILH

LH

I

LL

Vo

Fig.31 ICC1,IIH,V

OVDN,VUVOFF

Fig.32 ICC2,ILH,ILL,IIL

16

VIH

1000P

4.8K

12

13 14 15

9

10 11

16

VIL

4.8K

12

13 14 15

1000P

10 11

Icc2

V

cc

1000P

ceramic rasonator

10 11

9

BD6934FV

2 3 4 5 6 7 8

１

１ 2 3 4 5 6 7 8

V

OLH

V

OLL

Fig.33 V

V

OHH

V

OHL

OHH,VOHL,VOLH,VOLL,VIH

VCC

Oscillo

DON

e

sco

T

OSC

Fig.34 DON3.5,DON4,DON7,T

VCC

OSC,VIL

16

V

VRT

4.8K

12

13 14 15

1000P

I

CTC

A

I

CTD

9

10 11

BD6934FV

１ 2 3 4 5 6 7 8

Fig.35 V

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VCC

RT,ICTC,ICTD

9/12

2009.09 - Rev.B

BD6934FV

●Operating explanation Driving current adjustment function.

This IC control the duty of output pulse in response to supply voltage(Vcc). This function is allowed to control driving current and adjust the arrival range of radio frequency. The relationship between supply voltage(Vcc) and output(OUTN) is as shown in the following figure. This data is typical , refer to the electrical characteristics in regard to variation.

Duty

(%)

49

Technical Note

External FET

Connect PchMOS to OUTP and Nch MOS to OUTN Vds＞VCC, Vgs＞VCC, Allowable current ＞ Output current There is a possibility that upper and lower FET turn on at the same time. It is recommended to use 1000pF or smaller at input capacitor of external FET. However , these characteristics change in the layout pattern and parts variation and so on. Make evaluations with using board in mass production.

Oscillation precision and condition

The oscillation precision depends on the condition of ceramic resonator. This IC is evaluated with the ceramic resonator (Product No.CSTCR4M00G55B-R0) of MURATA manufacturing. In the range of Vcc 2.2~2.7V, this IC stops its oscillation without disenabling the ceramic resonator.

OPERATING NOTES

●

1) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a specialmode where the absolute maximum ratings may be exceeded is anticipated.

2) GND potential Ensure a minimum GND pin potential in all operating conditions.

3) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

4) Pin short and mistake mounting Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improp er mounting may result in damage to the IC. Shorts between output pins and the power supply and GND pins caused by the presence of a foreign object may result in damage to the IC. Ensure a minimum GND pin potential in all operating conditions.

5) Actions in strong magnetic field Keep in mind that the IC may malfunction in strong magnetic fields.

15

9.17

3.5 4 7

Fig.36 Supply voltage (Vcc) - Output (OUTN) Duty

8

Vcc(v)

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10/12

2009.09 - Rev.B

BD6934FV

Technical Note

6) Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance su bjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure, and use similar caution when transporting or storing the IC.

7) This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a variety of parasitic elements. For example, when the resistors and transistors are connected to the pins as sho wn in the following figure,



The P/N junction functions as a parasitic diode when GND > Pin A for the resistor or GND > Pin B for the transistor(NPN).



Similarly, when GND > Pin B for the transistor (NPN), the parasitic diode described above combines with the N layer of

other adjacent elements to operate as a parasitic NPN transistor. The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable result of the IC's architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC malfunction and damage. For these reasons, it is necessary to use caution so that the IC is not used in a way that will trigger the operation of parasitic elements, such as by the application of voltages lower than the GND (P substrate) voltage to input pins. Keep in mind that the IC may malfunction in strong magnetic fields.

(Pin A)

P+

N

P

Resistor

N

P

GND

P+

N

Parasitic elements

(Pin B)

Parasitic elements or Transistors

C

P+

N

B

E

N

P

N

P substrate

GND

(Pin B)

C

B

E

GND

N

(Pin A)

Parasitic elements or

Parasitic elements

8) Ground patterns When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point s o that the pattern wiring resistance and voltage variations c aused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external parts, either.

9) Thermal shutdown circuit (TSD) This IC incorporates a built-in TSD circuit for the protection from thermal destruction. T he IC should be used within the specified power dissipation range. However, in the event that the IC continues to be operated in excess of its power dissipation limits, the attendant rise in the junction temperature (Tj) will trigger the TSD circuit to turn off all output po wer elements. The circuit automatically resets once the junction temperature (Tj) drops. Operation of the TSD circuit presumes that the IC's absolute maximum ratings have been exceeded. Application designs should never make use of the TSD circuit.

10) External parts Driving current adjustment function in use low accuracy parts (Especially, RT terminal connection resistance, CT terminal connection capacitor and resonator ) may malfunction. The external parts use highly accuracy, and be careful additional impedance and capacitor for wiring pattern.

11)RP, RN terminal The resistance is built in between OUTP and RP, and OUTN and RN to turn off external MOS - FET in stand - by. Please wire with RP=VCC2 and RN =PGND. Improper wiring may result in damage for the penetration current.

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11/12

2009.09 - Rev.B

BD6934FV

●Ordering part number

B D 6 9 3 4 F V - E 2

Part No. Part No.

SSOP-B16

5.0±0.2

16

9

4.4±0.2

6.4±0.3

1

8

0.3Min.

0.15±0.1

Package

FV: SSOP-B16

Embossed carrier tapeTape

Quantity

Direction of feed

2500pcs E2

The direction is the 1pin of product is at the upper left when you hold

()

reel on the left hand and you pull out the tape on the right hand

Packaging and forming specification E2: Embossed tape and reel

Technical Note

1.15±0.1

0.10

0.65

0.22±0.1

0.1

Direction of feed

(Unit : mm)

Reel

1pin

Order quantity needs to be multiple of the minimum quantity.

∗

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12/12

2009.09 - Rev.B

Notes

No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd.

The content specied herein is subject to change for improvement without notice.

The content specied herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specications, which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information specied in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage.

The technical information specied herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other par ties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information.

Notice

The Products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, communication devices, electronic appliances and amusement devices).

The Products specied in this document are not designed to be radiation tolerant.

While ROHM always makes effor ts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injur y, re or any other damage caused in the event of the failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing.

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ROHM BD6934FV Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual